270-AB

**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

## **217 SERIES** 

## _**Surface Mount Heat Sinks**_ 

_D[2] PAK, TO-220, SOT-223, SOL-20_ [Po 

Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications. 

## **FEATURES AND BENEFITS:** 

- No interface material is needed 

- Copper with tin-lead plating for improved solderability and assembly 

- Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats 

- EIA standards and ESD protection are specified 

- Can be used with water soluble or no clean SMT solder creams or other pastes 

**Height Above Footprint Standard PC Board Dimensions P/N in. (mm) in. (mm)** ~~OTN~~ 217-36CT6 .390 (9.9) ~~TTT~~ .600 (15.2) x .740 (18.8) SS ~~TTT~~ 217-36CTT6 .390 (9.9) .600 (15.2) x .740 (18.8) ~~a~~ 217-36CTR6 .390 (9.9) .600 (15.2) x .740 (18.8) Material: Copper, Tin, Lead Plated 

|||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**|
|---|---|---|---|
|**Package**|**Package**|**Natural**|**Forced**|
|**Format**<br>Bulk|**Quantity**<br>1|**Convection**<br>55°C @ 1W|**Convection)**<br>16.0°C/W @ 200 LFM|
|Tube<br>Tape & Reel|20<br>250|55°C @ 1W<br>55°C@1W|16.0°C/W @ 200 LFM<br>16.0°C/W@200 LFM|



**==> picture [513 x 413] intentionally omitted <==**

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MECHANICAL DIMENSIONS 217 HEAT SINK WITH<br>THERMAL PERFORMANCE<br>DDPAK DEVICE 6 LAYER BOARD, D '  PAK<br>125°C LEAD, 40°C AMBIENT<br>ot “TT TTF TTT<br>ttt E EA<br>ae ewLLY<br>| SL YETI<br>o By lA |et<br>217-36CT6 ° ae 4<br>De Device Power Dissipation. W<br>KEY: a Device only, NC      Sd Device + HS, NC      A Device + HS, 100 lfm     o Device + HS, 200 lfm      > Device + HS, 300 lfm<br>626<br>A— 9.079<br>Ic SECTION A-A BP WAG +h<br>A= 65 | Los<br>NOTES<br>1. Material to be “ESD” TAPE DETAILS<br>2. Approximately 6 Meters per Reel<br>3. 250 Pieces per Reel.<br>a [a] _pies<br>013.00 217-36CTR6<br>7TN<br>REEL DETAILS Dimensions: in.<br>**----- End of picture text -----**<br>


~~OE~~ All other products, please contact factory for price, delivery, and minimums. 30 

Normally stocked 

**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

> **217 SERIES** _**Surface Mount Heat Sinks**_ 

**==> picture [520 x 340] intentionally omitted <==**

**----- Start of picture text -----**<br>
D [2] PAK, TO-220, SOL-20<br>MECHANICAL DIMENSIONS<br>BOARD LAYOUT RECOMMENDATIONS<br>217 SERIES<br>TUBE DETAILS 64 USE MAX COPPER TO -750<br>ALLOW MAX CONDUCTION<br>64 R 025 03 | FOR SULDER 66 NU<br>BALL TRAP 215 | |<br>195 1265 47 64<br>YY a 7 640<br>Y<br>84 //, ‘66<br>025 REF: JEDEC TO-220AB Zi,a) tb y Z<br>SOLDER MASK OPENING<br>'640 ZZ Zy<br>64 CF O RPPERHEATSINKFOOTPRINT yz Zg<br>, ¢<br>FOR SOLDER MIN COPPER<br>iaa 010BALLMINTRAP FOR HEATSINK<br>TUBE: 16.25 Inches Long,<br>Min. ESDMaterial with Nail<br>Stops<br>20 Pieces per Tube<br>217-36CTT6<br>SOL 20<br>REF: JEDEC TO-263 (DD PAK)<br>REF: JEDEC MO-169 (DD PAK) 217-36CT6<br>Dimensions: in.<br>**----- End of picture text -----**<br>


**230 AND 234 SERIES** 

## _**Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks**_ 

_TO-220_ 

|||**Height Above**|**Footprint**||||**Solderable**<br>**Thermal Performance at Typical Load**|
|---|---|---|---|---|---|---|---|
||**Standard**|**PC Board**|**Dimensions**||**Mounting**||**Tab**<br>**Mounting**<br>**Natural**<br>**Forced**|
||**P/N**|**in.(mm)**|**in.(mm)**||**Configuation**||**Option**<br>**Style**<br>**Convection**<br>**Convection)**|
||230-75AB<br>:|.750 (19.1)<br>.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)||Vert./Horiz.||No Tab<br>Clip/Mtg Hole<br>57°C @ 2W<br>7.5°C/W @ 400 LFM|
||230-75AB-01|.750 (19.1)<br>.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)||Vertical||01<br>Clip/Mtg Hole<br>57°C @ 2W<br>7.5°C/W @ 400 LFM|
|230-75AB-05<br>PATENT PENDING||.500 (12.7)<br>.750 (19.1) x .570 (14.5)|.750 (19.1) x .570 (14.5)||Horizontal||05<br>Clip/Mtg Hole<br>57°C @ 2W<br>7.5°C/W @ 400 LFM|
||230-75AB-10|.875 (22.2)<br>.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)||Vertical||10<br>Clip/Mtg Hole<br>57°C @ 2W<br>7.5°C/W @ 400 LFM|
||234-75AB|.790 (20.0)<br>.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)||Vert./Horiz||No Tab<br>Clip/Mtg Hole<br>57°C @ 2W<br>7.5°C/W @ 400 LFM|
||234-75AB-01|.790 (20.0)<br>.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)||Vertical||01<br>Clip/Mtg Hole<br>57°C @ 2W<br>7.5°C/W @ 400 LFM|
||234-75AB-05|.500(12.7)<br>.790|.790(20.0)x .570(14.5)||Horizontal||05<br>Clip/MtgHole<br>57°C@2W<br>7.5°C/W@400 LFM|
||Material: Aluminum, Black Anodized|||||||
|**MECHANICAL DIMENSIONS**<br>**230-75AB-10**<br>**230-75AB-01**<br>—e| 500 a —»|S70MAX|,<br>(ian<br>(143)<br>im-<br>a >|||**230 AND 234 SERIES**<br>—»| 570 MAX/-<br>(145)||||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>**230 SERIES**<br>**230-75AB-05**<br>|a<br>SUGGESTED<br>TAB HOLE=<br>Pa<br>S||
|**234 SERIES**<br>**234-75AB**<br>**234-75AB-01**<br>**Dimensions: in. (mm)**<br>a<br>ite<br>be<br>-! 00 -<br>>]rm| 500 -<br>(127)<br>(143)<br>(1227)<br>a)<br>|<br>y<br>4<br>720.790 ol<br>720 790 i |a<br>83)oy<br>Fj<br>83)oy FSjCa6a<br>ee<br>Peay<br>SARE<br>St<br>082<br>050<br>les<br>(tele|||**234 SERIES**<br>**234-75AB-05**<br>eee)<br>| soon<br>le—jaz} wi 1992_200_<br>400<br>600__<br>8001000<br>gE<br>(12.7)<br>x<br>aNee<br>x<br>a<br>a<br>ea<br>SUGGESTEDTABHOLE-<br>i> gj<br>ae<br>\<br>|<br>2.100<br>Ae i<br>aR<br>a<br>-——<br>25) i<br>mes<br>#2 »LOLAC eS, =o<br>aw<br>su “TamartI<br>|*<br>33<br>aryl<br>\<br>|<br>|<br>e<br>83 » LAttrLLLL) Zo<br>eo<br>oS<br>fy Pet<br>Fe<br>(08)_,.|<br>=| 500 I<br>PY<br>oo<br>0<br>Fz<br>’<br>‘<br>ec<br>oo<br>1<br>2.<br>3<br>4<br>5<br>@<br>SL. |<br>POWERDISSIPATION (WATTS)|||||



All other products, please contact factory for price, delivery, and minimums. 

31 

Normally stocked 

## **Board Level Heat Sinks** _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

PATENT PENDING 

|**233 AND 236 SERIES**<br>**_Self-Locking Wavesolderable Heat Sinks_**<br>**Height Above**<br>**Footprint**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>233-60AB<br>.600 (15.2)<br>.570 (14.5) x .500 (12.7)<br>Vert./Horiz.<br>233-60AB-01<br>.600 (15.2)<br>.570 (14.5) x .500 (12.7)<br>Vertical<br>233-60AB-05<br>.500 (12.7)<br>.600 (15.2) x .570 (14.5)<br>Horizontal<br>233-60AB-10<br>.725 (18.4)<br>.570 (14.5) x .500 (12.7)<br>Vertical<br>: A|**233 AND 236 SERIES**<br>**_Self-Locking Wavesolderable Heat Sinks_**<br>**Height Above**<br>**Footprint**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>233-60AB<br>.600 (15.2)<br>.570 (14.5) x .500 (12.7)<br>Vert./Horiz.<br>233-60AB-01<br>.600 (15.2)<br>.570 (14.5) x .500 (12.7)<br>Vertical<br>233-60AB-05<br>.500 (12.7)<br>.600 (15.2) x .570 (14.5)<br>Horizontal<br>233-60AB-10<br>.725 (18.4)<br>.570 (14.5) x .500 (12.7)<br>Vertical<br>: A|**233 AND 236 SERIES**<br>**_Self-Locking Wavesolderable Heat Sinks_**<br>**Height Above**<br>**Footprint**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>233-60AB<br>.600 (15.2)<br>.570 (14.5) x .500 (12.7)<br>Vert./Horiz.<br>233-60AB-01<br>.600 (15.2)<br>.570 (14.5) x .500 (12.7)<br>Vertical<br>233-60AB-05<br>.500 (12.7)<br>.600 (15.2) x .570 (14.5)<br>Horizontal<br>233-60AB-10<br>.725 (18.4)<br>.570 (14.5) x .500 (12.7)<br>Vertical<br>: A|**233 AND 236 SERIES**<br>**_Self-Locking Wavesolderable Heat Sinks_**<br>**Height Above**<br>**Footprint**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>233-60AB<br>.600 (15.2)<br>.570 (14.5) x .500 (12.7)<br>Vert./Horiz.<br>233-60AB-01<br>.600 (15.2)<br>.570 (14.5) x .500 (12.7)<br>Vertical<br>233-60AB-05<br>.500 (12.7)<br>.600 (15.2) x .570 (14.5)<br>Horizontal<br>233-60AB-10<br>.725 (18.4)<br>.570 (14.5) x .500 (12.7)<br>Vertical<br>: A|**233 AND 236 SERIES**<br>**_Self-Locking Wavesolderable Heat Sinks_**<br>**Height Above**<br>**Footprint**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>233-60AB<br>.600 (15.2)<br>.570 (14.5) x .500 (12.7)<br>Vert./Horiz.<br>233-60AB-01<br>.600 (15.2)<br>.570 (14.5) x .500 (12.7)<br>Vertical<br>233-60AB-05<br>.500 (12.7)<br>.600 (15.2) x .570 (14.5)<br>Horizontal<br>233-60AB-10<br>.725 (18.4)<br>.570 (14.5) x .500 (12.7)<br>Vertical<br>: A|**Solderable**<br>**Tab Options**<br>No Tab<br>01<br>05<br>10|**Mounting**<br>**Style**<br>Clip/Mtg Hole<br>Clip/Mtg Hole<br>Clip/Mtg Hole<br>Clip/Mtg Hole|_TO-220_<br>**Thermal Performance at Typical Load**<br>**Natural**<br>**Forced**<br>**Convection**<br>**Convection**<br>58°C @ 2W<br>11.0°C/W @ 400 LFM<br>58°C @ 2W<br>11.0°C/W @ 400 LFM<br>58°C @ 2W<br>11.0°C/W @ 400 LFM<br>58°C @ 2W<br>11.0°C/W @ 400 LFM|_TO-220_<br>**Thermal Performance at Typical Load**<br>**Natural**<br>**Forced**<br>**Convection**<br>**Convection**<br>58°C @ 2W<br>11.0°C/W @ 400 LFM<br>58°C @ 2W<br>11.0°C/W @ 400 LFM<br>58°C @ 2W<br>11.0°C/W @ 400 LFM<br>58°C @ 2W<br>11.0°C/W @ 400 LFM|
|---|---|---|---|---|---|---|---|---|
|236-150AB||1.500 (38.1)|.570 (14.5) x .500 (12.7)|Vert./Horiz|No Tab|Clip/Mtg Hole|58°C @ 2W|4.80°C/W @ 400 LFM|
|236-150AB-01||1.500 (38.1)|.570 (14.5) x .500 (12.7)|Vertical|01|Clip/Mtg Hole|58°C @ 2W|4.80°C/W @ 400 LFM|
|236-150AB-05|236-150AB-05<br>A|.500 (12.7)|1.500 (38.1) x .570 (14.5)|Horizontal|05|Clip/Mtg Hole|58°C @ 2W|4.80°C/W @ 400 LFM|
|236-150AB-10||1.625 (41.3)|.570(14.5)x .570(12.7)|Vetrical|10|Clip/MtgHole|58°C@2W|4.80°C/W@400 LFM|
|Material: Aluminum, Black Anodized|||||||||



**==> picture [485 x 139] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS NATURAL AND FORCED<br>—| S70MAX(14.5) |g| — | *#— CONVECTION CHARACTERISTICS AIR VELOCITY (LFM)<br>en I —>|| (127)500 [e— _,| S7OMAK(145) | ian)160 5004 we 4992200400Se [TIS TTT yt ey<br>aT 20.150 (127) E< gl | | NJ] | el<br>wanal Big”—+||<— 227A the $5 Besewi = “1<br>— ea) 01 |. 0204B 10 SoiS |peva —<br>— 1.500 236-150AB-01233-60AB-01 236-150AB-10233-60AB-10 es) 1a)08)165») i4—- FzeuGO o|of1}[Apst| SZsat| EertSe<br>(88.1) (2) ee [eetTy Pry<br>s7oMax [4 2<br>(148) j 250 a) MIN 233-60AB-05 as a ry a<br>236-150AB-05<br>|at ian” "6a POWER DISSIPATION (WATTS)<br>> C_| eto | 44<br>| 152) 236-150AB Fz SUGGESTEDTAB HOLE =<br>cl 4 —— el Ors (19) LATED)<br>233-60AB Dimensions: in. (mm) B-r-- t a<br>**----- End of picture text -----**<br>


## **MECHANICAL DIMENSIONS** 

## **233 AND 236 SERIES** 

## **275 AND 231 SERIES** 

## _**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**_ 

_TO-220_ 

||||**Height Above**||**Footprint**|||**Thermal Performance at Typical Load**|
|---|---|---|---|---|---|---|---|---|
||||**Standard**<br>**PC Board**||**Dimensions**<br>**Mounting**|**Solderable**||**Mounting**<br>**Natural**<br>**Forced**|
||||**P/N**<br>**in.(mm)**||**in.(mm)**<br>**Configuration**<br>**Tab Options**|||**Style**<br>**Convection**<br>**Convection**|
||||275-75AB<br>.750 (19.1)||.835 (21.2) x .400 (12.7)<br>Vert./Horiz.|No Tab||Clip/Mtg Hole<br>44 C @ 2W<br>7.9°C/W @ 400 LFM|
||||275-75AB-01<br>.750 (19.1)||.835 (21.2) x .400 (12.7)<br>Vertical|01||Clip/Mtg Hole<br>44°C @ 2W<br>7.9°C/W @ 400 LFM|
||||275-75AB-10<br>.875 (12.7)||.835 (21.2) x .400 (14.5)<br>Vertical|10||Clip/Mtg Hole<br>44°C @ 2W<br>7.9°C/W @ 400 LFM|
|PATENT 5381041|||231-69PAB<br>.690 (18.4)||.835 (21.2) x .400 (12.7)<br>Vert./Horiz.|No Tab||Clip/Mtg Hole<br>45°C @ 2W<br>8°C/W @ 400 LFM|
||||231-69PAB-13H<br>.400 (38.1)||.690 (17.5) x .835 (12.7)<br>Horizontal|13H||Clip/Mtg Hole<br>45°C @ 2W<br>8°C/W @ 400 LFM|
||||231-69PAB-XXX<br>.690 (38.1)||.835 (21.2) x .400 (12.7)<br>Vertical|13V, 14V, 15V|13V, 14V, 15V|Clip/Mtg Hole<br>45°C @ 2W<br>8°C/W @ 400 LFM|
||||231-75PAB<br>.750 (12.7)|.750 (12.7)|.835 (21.2) x .400 (14.5)<br>Vert./Horiz.|No Tab||Clip/Mtg Hole<br>43°C @ 2W<br>7.9°C/W @ 400 LFM|
||||231-75PAB-13H<br>.400 (41.3)||.750 (19.1) x .835 (12.7)<br>Horizontal|13H||Clip/Mtg Hole<br>43°C @ 2W<br>7.9°C/W @ 400 LFM|
||||(14V<br>) 231-75PAB-XXX<br>.750 (34.9)<br>A||.835 (21.2) x .400 (12.7)<br>Vertical|13V, 14V, 15V||Clip/Mtg Hole<br>43°C @ 2W<br>7.9°C/W @ 400 LFM|
||||231-137PAB<br>1.375 (10.2)||.835 (21.2 x .400 (12.7)<br>Vert./Horiz.|No Tab||Clip/Mtg Hole<br>32°C @ 2W<br>5.9°C/W @ 400 LFM|
||||231-137PAB-13H<br>.400 (10.2)||1.375 (34.9) x .835 (12.7)<br>Horizontal|13H||Clip/Mtg Hole<br>32°C @ 2W<br>5.9°C/W @ 400 LFM|
||||(15V<br>)231-137PAB-XXX<br>1.375(10.2)<br>A||.835(21.2)x .400(12.7)<br>Vertical|13V,14V,15V||Clip/MtgHole<br>32°C@2W<br>5.9°C/W@400 LFM|
||||Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB)||||||
|**Dimensions: in. (mm)**<br>**MECHANICAL**<br>**DIMENSIONS**<br>**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>**All versions No Tab**<br>**275 AND 231 SERIES**<br>**TAB**<br>**14V**<br>**TAB**<br>**13V**<br>**TAB 13H**<br>**TAB 13H**<br>**TAB 01**<br>**TAB 10**<br>**TAB 15V**<br>Dimple<br>on231-69,<br>275-75 Series on)<br>Di<br>jot<br>+r<br>eres<br>AIRVELOCITY(LFM)<br>Lance<br>not<br>—<br>855<br>_<br>O<br>IN<br>nau<br>ry<br>GB<br>920(08)<br>er)<br>|<br>w® jqp2__200_<br>40060600<br>100ag<br>~—<br>we<br>qtr<br>as ©<br>@® Sos<br>sol }<br>I tO<br>ey<br>TARS19,14,15V<br>es (CT er" 28<br>t 1C}<br>C)<br>ta<br>835<br>SERIES<br>SUGGESTED TABHOLES<br>#0<br>gf<br>TWoPTTT |» Be<br>Ks<br>@12)<br>FOR ALL PART NUMBERS<br>ao "CN<br>ermal 1" 22<br>it)<br>mn<br>iD<br>|<br>Q20_efe—<br>VERTICALANDHoRONTAMoWTNG). BZ [NSS<br>TT, 8B<br>L |<br>LOK<br>aso<br>|<br>|<br>(08)<br>076,18)<br>(PLATED)WTH2.100 28)PAD seus<br>OY<br>|tases<br>| |® «3<br>(33)<br>1<br>en<br>5S<br>»| LTbarre, 26<br>|<br>495 REF<br>>|<br>(TABS 199, 14V,4<br>ge “Ler<br>Be<br>12)<br>VERTICAL MOUNT<br>HORIZONTAL MOUNT<br>ay(zp<br>rrrrrr, -¥<br>400 REF<br>400 REF<br>x<br>0<br>1<br>2<br>3<br>4<br>5<br>(102),<br>(02) te—<br>inna<br>ee pPeeserTr™<br>POWER DISSIPATION (WATTS)<br>]<br>—<br>—<br>bn<br>|<br>oy<br>125<br>mB 2s<br>get<br>|<br>sjif**e** |<br>=eHa (a2) |<br>mav n<br>port<br>(5)<br>82)<br>ma<br>{<br>.250<br>315<br>032(TABO1)<br>AIRVELOCITY (LFM)<br>375<br>i<br>oso<br>if<br>es<br>t es<br>(08)<br>w® top<br>__200__400__600__800_ 1009)<br>canee (95)<br>0REF<br>sai<br>oa<br>i}<br>020(TAB10)<br>pe 80[+44<br>bedit-16gs<br>ale<br>r8)<br>i<br>i<br>Oa<br>_.<br>185<br>-125(8.2)<br>HG<br>gi<br>te<br>Py, be<br>4<br>-><br>185(47) — [seniesno.<br>[oma’<br>[Dime<br>@— Noceste014<br>es<br>PtNPC ed<br>ee<br>SUGGESTED TABHOLE<br>Fe gLlel ReLe<br>|, Sa<br>125<br>075(9)(PLATED)<br>xa {te c**t**o? 28<br>T<br>400 FEF<br>WITH4.100(28)<br>(PAD)<br>5S<br>|<br>| eet<br>, Zo<br>(102)<br>[z7=-7ea8 | 7e0cret) | — _|<br>ge "praia<br>| avers, \* BE<br>Bret<br>fydA<br>“Bn<br>iF<br>c<br>8<br>“9<br>POWERDISSIPATION(WATTS)|||||||||



All other products, please contact factory for price, delivery, and minimums. 

32 

Normally stocked 

**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

||||**235 SERIES**|**_Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks_**|**_Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks_**|**_Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks_**|**_Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks_**|**_Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks_**|||_TO-220_|_TO-220_|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||**Height Above**|**Footprint**||||||**Thermal Performance at Typical Load**||
||||**Standard**|**PC Board**|**Dimensions**|**Mounting**||**Solderable**|**Mounting**||**Natural**<br>**Forced**||
||||**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**||**Tab Options**|**Style**||**Convection**<br>**Convection**||
||||235-85AB<br>°|.850 (21.6)|1.000 (25.4) x<br>.500 (12.7)|Vert./Horiz.||No Tab|Clip/Mtg Hole||40°C @ 2W<br>6.8°C/W @ 400 LFM|6.8°C/W @ 400 LFM|
||||235-85AB-01|.850 (21.6)|1.000 (25.4) x<br>.500 (12.7)|Vertical||01|Clip/Mtg Hole||40°C @ 2W<br>6.8°C/W @ 400 LFM|6.8°C/W @ 400 LFM|
||||235-85AB-05|.500 (12.7)|.850 (21.6) x1.000 (25.4)|Horizontal||05|Clip/Mtg Hole||40°C @ 2W<br>6.8°C/W @ 400 LFM|6.8°C/W @ 400 LFM|
|PATENT 5381041|PATENT 5381041||235-85AB-10|.975(24.8)|1.000(25.4)x<br>.500(12.7)|Vertical||10|Clip/MtgHole||40°C@2W<br>6.8°C/W@400 LFM|400 LFM|
||||Material: Aluminum, Black Anodized||||||||||
|7|z|7|a|**235-85AB**|**MECHANICAL DIMENSIONS**|||**235 SERIES**|||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**||
|160<br>a<br>(12.7)|ial<br>.<br>-<br>ia||**235-85AB-05**<br>aes<br>ti<br>Ll iat)<br>500<br>janLy<br>— |<br>—<br>=<br>(oa)<br>mn<br>a<br>ae<br>call<br>850<br>(216)||**Dimensions: in. (mm)**<br>**235-85AB-10**<br>**235-85AB-01**<br>AIRVELOCITY(LFM)<br>Por] & | Pot<br>agCAEREE<br>— ee<br>Te<br>8<br>és H<br>| NPT. <br>|<br>:<br>=La = =<br>=PE<br>ese<br>—TL_#<br>4<br>LCE <br>aa<br>375<br>wi<br>mal<br>ea<br>i<br>fies<br>foem 23 HORACE) <br>—]-—08)<br>ee Meee<br>Pr<br>joie<br>3<br>wma Su<br>et ttrttre,<br>"<br>io<br>72<br>0<br>3<br>4<br>5<br>(1.5)<br>—!!«— (05)<br>2<br>0<br>1<br>2<br>parenewan<br>POWER DISS!<br>SUGGESTEDTABHOLE=<br>i<br>®<br>075 (1.9)(PLATED)<br>ia<br>WiTHa (2) (PRD)|||||||Be<br>:<br>ia<br> 8<br>z<br> ge<br>*s<br>@|
||||**243 SERIES**|**_Labor-Saving Clip-On Heat Sinks_**|||||||_TO-220_||
|||||**Height Above**|**Footprint**||||||**Thermal Performance at Typical Load**||
||||**Standard**|**PC Board**|**Dimensions**|**Mounting**||**Solderable**|**Mounting**||**Natural**<br>**Forced**||
||||**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**||**Tab Options**|**Style**||**Convection**<br>**Convection**||
||||243-1PAB|1.000 (25.4)|.800 (20.3) x .270 (6.9)|Vert./Horiz.||No Tab|Clip||50°C@ 2W<br>4.5°C/W @ 400 LFM|4.5°C/W @ 400 LFM|
||||243-3PAB<br>A|.800(20.3)|.800(20.3)x .270(6.9)|Verl./Horiz.||No Tab|Clip||78°C@2W<br>8.2°C/W@400 LFM|400 LFM|
||||Material: Aluminum, Pre-anodized Black||||||||||



**==> picture [250 x 131] intentionally omitted <==**

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NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>@9! oe©S= 1002ona200 AIR VELOCITY400 a(A 60080010004)(LFM) a<br>SECTION A-A VIEW B-B SE agee<br>Be Ne<br>22 ofLoptt |.<br>B4 S ml| phAtePeseta]?Pt,<br>[facies PART NUMBER [DIMA[9m 058 | 4a» 8WOT7 ITTre),<br>“_o“ * POWER DISSIPATION (WATTS)<br>TO-220<br>**----- End of picture text -----**<br>


**==> picture [189 x 101] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS<br>=) —<br>i 243 SERIES<br>‘s 7a<br>“E<br>é, f (112)<br>A ” Lita<br>[|_| an<br>_)<br>—<br>A Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


||**239 SERIES**|**_Snap-Down Self-Locking Heat Sinks_**|**_Snap-Down Self-Locking Heat Sinks_**|**_Snap-Down Self-Locking Heat Sinks_**|**_Snap-Down Self-Locking Heat Sinks_**||||_TO-220_|
|---|---|---|---|---|---|---|---|---|---|
|||**Height Above**||**Footprint**||||**Thermal Performance at Typical Load**||
||**Standard**|**PC Board**||**Dimensions**|**Mounting**|**Solderable**|**Mounting**|**Natural**|**Forced**|
||**P/N**|**in.(mm)**||**in.(mm)**|**Configuration**|**Tab Options**|**Style**|**Convection**|**Convection**|
||239-75AB|.750 (19.1)|1.120 (28.4) x .435 (11.0)|1.120 (28.4) x .435 (11.0)|Vert./Horiz|No Tab|Clip/Mtg Hole|38°C @ 2W|6°C/W @ 400 LFM|
||239-75AB-03|.750 (19.1)|1.120 (28.4) x .435 (11.0)|1.120 (28.4) x .435 (11.0)|Vertical|03|Clip/Mtg Hole|38°C @ 2W|6°C/W @ 400 LFM|
||239-75AB-04|.750(19.1)|1.120|1.120(28.4)x .435(11.0)|Vertical|04|Clip/MtgHole|38°C@2W|6°C/W@400 LFM|
|PATENT PENDING|Material: Aluminum, Black Anodized|||||||||



**==> picture [501 x 96] intentionally omitted <==**

**----- Start of picture text -----**<br>
239 SERIES NATURAL AND FORCED<br>MECHANICAL DIMENSIONS SECTION A-A 2.150,bai 111)435, — CONVECTION CHARACTERISTICS<br>239-75AB leib AIR VELOCITY (LFM)<br>|<br>2.150  _ S yqgX_200_ 4006080010009<br>“"<br>750 | b q \eis H | eea 6 bezs M4" TT<br>(11.0) Pf of fs | [[|]<br>: HEF,<br>anitf t = Tais 239-75AB-03 eT ———-i FaeeEz#% ft=gobstoPry2Tt |,2<br>ea (135)a 239-75AB-04 —————- 8 “ ST"<br>;  7 TABOA f (03)—+||— ee28 eeeeste EE,<br>™ " _ ©6 )  Ba1.075 (1.9)  = (1.6)i‘ Sy@ a¢ 7 7 3 r<br>**----- End of picture text -----**<br>


**Dimensions: in. (mm)** 

All other products, please contact factory for price, delivery, and minimums. 

33 

Normally stocked 

**Board Level Heat Sinks** a _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

|**273 SERIES**<br>**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**<br>_TO-218, TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>273-AB<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vert./Horiz.<br>No Tab<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-01<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vertical<br>01<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-02<br>.375(9.5)<br>.750(19.1)x .750(19.1)<br>Vertical<br>02<br>MtgHole<br>49°C@2W<br>7.2°C/W@400 LFM<br>&}~~a~~|**273 SERIES**<br>**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**<br>_TO-218, TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>273-AB<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vert./Horiz.<br>No Tab<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-01<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vertical<br>01<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-02<br>.375(9.5)<br>.750(19.1)x .750(19.1)<br>Vertical<br>02<br>MtgHole<br>49°C@2W<br>7.2°C/W@400 LFM<br>&}~~a~~|**273 SERIES**<br>**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**<br>_TO-218, TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>273-AB<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vert./Horiz.<br>No Tab<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-01<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vertical<br>01<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-02<br>.375(9.5)<br>.750(19.1)x .750(19.1)<br>Vertical<br>02<br>MtgHole<br>49°C@2W<br>7.2°C/W@400 LFM<br>&}~~a~~|**273 SERIES**<br>**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**<br>_TO-218, TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>273-AB<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vert./Horiz.<br>No Tab<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-01<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vertical<br>01<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-02<br>.375(9.5)<br>.750(19.1)x .750(19.1)<br>Vertical<br>02<br>MtgHole<br>49°C@2W<br>7.2°C/W@400 LFM<br>&}~~a~~|**273 SERIES**<br>**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**<br>_TO-218, TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>273-AB<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vert./Horiz.<br>No Tab<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-01<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vertical<br>01<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-02<br>.375(9.5)<br>.750(19.1)x .750(19.1)<br>Vertical<br>02<br>MtgHole<br>49°C@2W<br>7.2°C/W@400 LFM<br>&}~~a~~|**273 SERIES**<br>**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**<br>_TO-218, TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>273-AB<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vert./Horiz.<br>No Tab<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-01<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vertical<br>01<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-02<br>.375(9.5)<br>.750(19.1)x .750(19.1)<br>Vertical<br>02<br>MtgHole<br>49°C@2W<br>7.2°C/W@400 LFM<br>&}~~a~~|**273 SERIES**<br>**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**<br>_TO-218, TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>273-AB<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vert./Horiz.<br>No Tab<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-01<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vertical<br>01<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-02<br>.375(9.5)<br>.750(19.1)x .750(19.1)<br>Vertical<br>02<br>MtgHole<br>49°C@2W<br>7.2°C/W@400 LFM<br>&}~~a~~|**273 SERIES**<br>**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**<br>_TO-218, TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>273-AB<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vert./Horiz.<br>No Tab<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-01<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vertical<br>01<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-02<br>.375(9.5)<br>.750(19.1)x .750(19.1)<br>Vertical<br>02<br>MtgHole<br>49°C@2W<br>7.2°C/W@400 LFM<br>&}~~a~~|**273 SERIES**<br>**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**<br>_TO-218, TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>273-AB<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vert./Horiz.<br>No Tab<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-01<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vertical<br>01<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-02<br>.375(9.5)<br>.750(19.1)x .750(19.1)<br>Vertical<br>02<br>MtgHole<br>49°C@2W<br>7.2°C/W@400 LFM<br>&}~~a~~|**273 SERIES**<br>**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**<br>_TO-218, TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>273-AB<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vert./Horiz.<br>No Tab<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-01<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vertical<br>01<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-02<br>.375(9.5)<br>.750(19.1)x .750(19.1)<br>Vertical<br>02<br>MtgHole<br>49°C@2W<br>7.2°C/W@400 LFM<br>&}~~a~~|**273 SERIES**<br>**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**<br>_TO-218, TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>273-AB<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vert./Horiz.<br>No Tab<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-01<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vertical<br>01<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-02<br>.375(9.5)<br>.750(19.1)x .750(19.1)<br>Vertical<br>02<br>MtgHole<br>49°C@2W<br>7.2°C/W@400 LFM<br>&}~~a~~|**273 SERIES**<br>**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**<br>_TO-218, TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>273-AB<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vert./Horiz.<br>No Tab<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-01<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vertical<br>01<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-02<br>.375(9.5)<br>.750(19.1)x .750(19.1)<br>Vertical<br>02<br>MtgHole<br>49°C@2W<br>7.2°C/W@400 LFM<br>&}~~a~~|**273 SERIES**<br>**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**<br>_TO-218, TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>273-AB<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vert./Horiz.<br>No Tab<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-01<br>.375 (9.5)<br>.750 (19.1) x .750 (19.1)<br>Vertical<br>01<br>Mtg Hole<br>49°C @ 2W<br>7.2°C/W @ 400 LFM<br>273-AB-02<br>.375(9.5)<br>.750(19.1)x .750(19.1)<br>Vertical<br>02<br>MtgHole<br>49°C@2W<br>7.2°C/W@400 LFM<br>&}~~a~~|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||Material: Aluminum, Black Anodized||||||||
|**Dimensions: in. (mm)**<br>**MECHANICAL DIMENSIONS**<br>**273-AB**<br>**273-AB-01**<br>**273-AB-02**<br>**273 SERIES**<br>150 DIA THRU<br>,<br>3.8)<br>.050<br>Todt<br>fre<br>ron ge<br>iO} 8S<br>;<br>©.<br>q<br>!<br>can:<br>;<br>;<br>c fai<br>P<br>a<br>C<br>DP sas<br>375<br>cme<br>|<br>H<br>d iD __<br>!<br>nd<br>p33)<br>5)<br>4<br>1<br>sje<br>oe<br>———<br>Ui<br>|09<br>0<br>Dy<br>.032<br>'<br>**|**-—<br>@8)<br>050<br>|<<br>050<br>eee<br>nk<br>Sonali<br>ween<br>©<br>MSeggested Tab Hole =9.075 (1.9) (Plated) with 2.100 (2.5) pad||||||||||||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>AIRVELOCITY(LFM}<br>So<br>4.0<br>200400<br>60080010009)<br>we 100<br>LF Jigws<br>ceopt<br>tttee ie g**e**<br>Fa a =<br>4E<br>£5<br>HL semesmas<br>eTTp Be<br>Sm 6BN<br>el ee<br>0HG<br>«2<br>BONey Sa<br><a %<br>IAS<br>rr |, 32<br>nam<br>2> 3<br>Py Bo<br>28 BSSEEE fe<br>fe"AEE? #8<br>+2<br>On as 10 15 20 2530 35 404550<br>POWERDISSIPATION(|
||||||**274 SERIES**||**_Low-Cost, Low-Height Wavesolderable Heat Sinks_**|||||_TO-220_|
||||||||**Height Above**|**Footprint**||||**Thermal Performance at Typical Load**|
||||||**Standard**||**PC Board**|**Dimensions**|**Mounting**|**Solderable**||**Mounting**<br>**Natural**<br>**Forced**|
||||||**P/N**<br>274-1AB<br>~~ny~~||**in.(mm)**<br>.375 (9.5)|**in.(mm)**<br>.520 (13.2) x .750 (19.1)|**Configuration**<br>Vert./Horiz.|**Tab Options**<br>No Tab||**Style**<br>**Convection**<br>**Convection**<br>Mtg Hole<br>56°C @ 2W<br>8.0°C/W @ 400 LFM|
||||||274-1AB-01|A|.375 (9.5)|.520 (13.2) x .750 (19.1)|Vertical|01||Mtg Hole<br>56°C @ 2W<br>8.0°C/W @ 400 LFM|
||||||274-1AB-02||.375 (9.5)|.520 (13.2) x .750 (19.1)|Vertical|02||Mtg Hole<br>56°C @ 2W<br>8.0°C/W @ 400 LFM|
||||||274-2AB<br>A||.500 (12.7)|.520 (13.2) x .750 (19.1)|Vert./Horiz.|No Tab||Mtg Hole<br>50°C @ 2W<br>7.0°C/W @ 400 LFM|
||||||274-2AB-01||.500 (12.7)|.520 (13.2) x .750 (19.1)|Vertical|01||Mtg Hole<br>50°C @ 2W<br>7.0°C/W @ 400 LFM|
|Material: Aluminum,|||||274-2AB-02||.500 (12.7)|.520 (13.2) x .750 (19.1)|Vertical|02||Mtg Hole<br>50°C @ 2W<br>7.0°C/W @ 400 LFM|
|Black Anodized|Black Anodized||||274-3AB<br>A||.250 (6.4)|.520 (13.2) x .750 (19.1)|Vert./Horiz.|No Tab||Mtg Hole<br>62°C @ 2W<br>9.0°C/W @ 400 LFM|
||||||274-3AB-01||.250 (6.4)|.520 (13.2) x .750 (19.1)|Vertical|01||Mtg Hole<br>62°C @ 2W<br>9.0°C/W @ 400 LFM|
||||||274-3AB-02||.250 (6.4)|.520 (13.2) x .750 (19.1)|Vertical|02||Mtg Hole<br>62°C @ 2W<br>9.0°C/W @ 400 LFM|
||||||281-1AB||.375 (9.5)|.520 (13.2) x .750 (19.1)|Vertical|No Tab||Mtg Hole<br>56°C @ 2W<br>8.0°C/W @ 400 LFM|
||||||281-2AB||.500(12.7)|.520(13.2)x .750(19.1)|Vertical|No Tab||MtgHole<br>50°C@2W<br>7.0°C/W@400 LFM|



**NATURAL AND FORCED CONVECTION CHARACTERISTICS** 

|**MECHANICAL DIMENSIONS**<br>**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>**274-XAB-01**<br>**274-XAB-02**<br>**274 SERIES**<br>**Dimensions: in. (mm)**<br>**274 SERIES**<br>**281 SERIES**<br>AIR VELOCITY (LFM)<br>om<br>3s<br>80010005)<br>EF<br>De THA<br>S<br>0<br>200<br>400-600<br>20<br>HD<br>£<br>h<br>|<br>il<br>4<br>SeeTA4Be<br>750<br>i!<br>maa<br>— 375<br>2G oy NALLL Py raza |<br>2oS<br>|<br>(19.1) 4<br>j<br>Fy]<br>|<br>(e5)<br>3c 60PINS<br>02e<br>‘“<br>08<br>—efje—<br>(3)Nlp9<br>||P<br>ge(pe<br>Seattet f aetenje 28<br> um<br>A<br>Hi<br>(13)<br>os<br>||<br>su ares<br>6<br>0)OTH<br>(1.3)<br>032—> ||<br>(og li<br>Zz Ta<br>estte Zo<br>4<br>08)<br>a a<br>zy<br>t<br>os WELTTTTTT tTto,<br>Fs<br>@Y~—4075<br>(1.9) (plated) 0.100 (25) pad<br>*2<br>“o 05 10 15 20 25 30 35 40 45 50<br>ee<br>@ ©<br>PCBrecommended hole/oad size<br>POWERDISSIPATION (WATTS)<br>ar]<br>e|**MECHANICAL DIMENSIONS**<br>**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>**274-XAB-01**<br>**274-XAB-02**<br>**274 SERIES**<br>**Dimensions: in. (mm)**<br>**274 SERIES**<br>**281 SERIES**<br>AIR VELOCITY (LFM)<br>om<br>3s<br>80010005)<br>EF<br>De THA<br>S<br>0<br>200<br>400-600<br>20<br>HD<br>£<br>h<br>|<br>il<br>4<br>SeeTA4Be<br>750<br>i!<br>maa<br>— 375<br>2G oy NALLL Py raza |<br>2oS<br>|<br>(19.1) 4<br>j<br>Fy]<br>|<br>(e5)<br>3c 60PINS<br>02e<br>‘“<br>08<br>—efje—<br>(3)Nlp9<br>||P<br>ge(pe<br>Seattet f aetenje 28<br> um<br>A<br>Hi<br>(13)<br>os<br>||<br>su ares<br>6<br>0)OTH<br>(1.3)<br>032—> ||<br>(og li<br>Zz Ta<br>estte Zo<br>4<br>08)<br>a a<br>zy<br>t<br>os WELTTTTTT tTto,<br>Fs<br>@Y~—4075<br>(1.9) (plated) 0.100 (25) pad<br>*2<br>“o 05 10 15 20 25 30 35 40 45 50<br>ee<br>@ ©<br>PCBrecommended hole/oad size<br>POWERDISSIPATION (WATTS)<br>ar]<br>e|**MECHANICAL DIMENSIONS**<br>**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>**274-XAB-01**<br>**274-XAB-02**<br>**274 SERIES**<br>**Dimensions: in. (mm)**<br>**274 SERIES**<br>**281 SERIES**<br>AIR VELOCITY (LFM)<br>om<br>3s<br>80010005)<br>EF<br>De THA<br>S<br>0<br>200<br>400-600<br>20<br>HD<br>£<br>h<br>|<br>il<br>4<br>SeeTA4Be<br>750<br>i!<br>maa<br>— 375<br>2G oy NALLL Py raza |<br>2oS<br>|<br>(19.1) 4<br>j<br>Fy]<br>|<br>(e5)<br>3c 60PINS<br>02e<br>‘“<br>08<br>—efje—<br>(3)Nlp9<br>||P<br>ge(pe<br>Seattet f aetenje 28<br> um<br>A<br>Hi<br>(13)<br>os<br>||<br>su ares<br>6<br>0)OTH<br>(1.3)<br>032—> ||<br>(og li<br>Zz Ta<br>estte Zo<br>4<br>08)<br>a a<br>zy<br>t<br>os WELTTTTTT tTto,<br>Fs<br>@Y~—4075<br>(1.9) (plated) 0.100 (25) pad<br>*2<br>“o 05 10 15 20 25 30 35 40 45 50<br>ee<br>@ ©<br>PCBrecommended hole/oad size<br>POWERDISSIPATION (WATTS)<br>ar]<br>e|
|---|---|---|
|**240 SERIES**<br>**_Labor-Saving Twisted Fin Heat Sinks_**||_TO-220_|
|**Height Above**<br>**Footprint**||**Thermal Performance at Typical Load**|
|**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**|**Solderable**|**Mounting**<br>**Natural**<br>**Forced**|
|**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**|**Tab Options**|**Style**<br>**Convection**<br>**Convection**|
|240-118ABH-22<br>1.180 (30.0)<br>1.000 (25.4) x .500 (12.7)<br>Vertical<br>:|22|Clip/Mtg Hole<br>55°C @ 4W<br>5.3°C/W @ 400 LFM|
|240-118ABS-22<br>1.180(30.0)<br>1.000(25.4)x .500(12.7)<br>Vertical|22|Clip/MtgSlot<br>55°C@4W<br>5.3°C/W@400 LFM|
|Material: Aluminum, Black Anodized|||



**==> picture [143 x 112] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS<br>3:<br>(25.4)1.000 rae8. (38)150 ea]<br>Nara:G 400 Sb Hgi<br>8 e ne:<br>aa (10.2) s} UW 4‘i<br>Kg tad i 1<br>i LL f 240-118ABS-22 ;<br>1<br>20 A ee) :<br>950<br>ay ih BS es<br>240-118ABH-22 (24.1) Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


**240 SERIES** 

**NATURAL AND FORCED CONVECTION CHARACTERISTICS** AIR VELOCITY (LFM) 

All other products, please contact factory for price, delivery, and minimums. 

34 

Normally stocked 

**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

||||||**242 SERIES**|**_Low-Height, Low-Profile Twisted Fin Heat Sinks_**|**_Low-Height, Low-Profile Twisted Fin Heat Sinks_**|**_Low-Height, Low-Profile Twisted Fin Heat Sinks_**|**_Low-Height, Low-Profile Twisted Fin Heat Sinks_**||_TO-220_|
|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||**Height Above**||**Footprint**|||**Thermal Performance at Typical Load**|
||||||**Standard**|**PC Board**||**Dimensions**<br>**Mounting**||**Solderable**|**Mounting**<br>**Natural**<br>**Forced**|
||||||**P/N**|**in.(mm)**||**in.(mm)**<br>**Configuration**||**Tab Options**|**Style**<br>**Convection**<br>**Convection**|
||||||242-125AB-22|1.285(32.6)|.875|.875(22.2)x .250(6.4)<br>Vertical||22|MtgHole<br>48°C@2W<br>6.2°C/W@400 LFM|
||||||Material: Aluminum, Black Anodized|||||||
|fi <br>|<br>1.250<br>ao<br>_Bt<br>I<br>1<br>ay<br>moe<br>(1.9)|||ae <br>we<br>"|<br>Bt<br>Il|**Dimensions: in. (mm)**<br>**MECHANICAL DIMENSIONS**<br>**242-125AB-22**<br>**242 SERIES**<br> en<br>aes<br>L}<br>Vas<br>PC. BOARDMTG. SUR-<br>PLATED<br>gg tS<br>=<br>=<br>En<br>“2<br>me<br>i<br>|<br>|<br>~<br>i<br>i<br>o>)<br>—<br>i<br>als<br>,<br>f<br>-m—<br>U<br>a<br>38)<br>(i78)<br>700<br>on |<br>TABHOLES<br>(178) ~~<br>(08)<br>875<br>PARTIALVIEW<br>(22.2)——<br>ONLYNEARSIDEFINSSHOWN|||||||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>AIRVELOCITY(LFM)<br>w 4999<br>___200<br>Ee<br>1009)<br>EF<br>cre<br>LL<br>TTyo we<br>22 gfttPrrtt<br>te, gs<br>ge ea” 8<br>$8 gh<br>er» BE<br>a2 "Near"<br>Be<br>Fz git Setcre, fa<br>gu<br>CPeS<br>ge<br>3 nfo<br>Tec, 26<br>ee<br>[Att TTP ptr<br>ge<br>a<br>(fbrrrrrrery, =<br>=H<br>0<br>2<br>z=<br>0<br>1<br>2<br>3<br>4<br>5<br>POWER DISSIPATION (WATTS)|
||||||**232 AND 238 SERIES**<br>**_Staggered Fin Heat Sinks for Vertical Mounting_**||||||_TO-202, TO-220_|
|||||||**Height Above**||**Footprint**|||**Thermal Performance at Typical Load**|
||||||**Standard**|**PC Board**||**Dimensions**<br>**Mounting**||**Solderable**|**Mounting**<br>**Natural**<br>**Forced**|
||||||**P/N**|**in.(mm)**||**in.(mm)**<br>**Configuration**||**Tab Options**|**Style**<br>**Convection**<br>**Convection**|
||||||232-200AB|2.000 (50.8)|1.380 (35.1) x .500 (12.7)|1.380 (35.1) x .500 (12.7)<br>Vertical||2, Twisted|Clip/Mtg Hole<br>48°C @ 4W<br>3.3°C/W @ 400 LFM|
||||||232-200AB-23|2.000 (50.8)|1.380 (35.1) x .500 (12.7)|1.380 (35.1) x .500 (12.7)<br>Vertical||2, Solderable|Clip/Mtg Hole<br>48°C @ 4W<br>3.3°C/W @ 400 LFM|
|Material: Aluminum,<br>Black Anodized|||||238-200AB<br>238-200AB-23|2.000 (50.8)<br>2.000(50.8)|1.380 (35.1) x .500 (12.7)<br>1.380|1.380 (35.1) x .500 (12.7)<br>Verlical<br>1.380(35.1)x .500(12.7)<br>Verlical||2, Twisted<br>2,Solderable|Mtg Slot<br>48°C @ 4W<br>3.3°C/W @ 400 LFM<br>MtgSlot<br>48°C@4W<br>3.3°C/W@400 LFM|
|**MECHANICAL DIMENSIONS**<br>**232-200AB-23**<br>**232-200AB**<br>=<br>ee<br>f CTaeese TI<br>=<br>LA”<br>a2)<br>CI<br>1]<br>=<br>-:<br>2.000=<br>[J<br>Opfoel<br>Le<br>08)<br>a<br>eee? oS<br>Ci 0 Clee|||||||**238-200AB**<br>**238-200AB-23**<br>**238 SERIES**<br>125,<br>82*|<br>C<br>Tuejase<br>[1]<br>' [_lusese |]<br>=<br>=<br>=<br>[I<br>=<br>I<br>ios)77<br>TT<br>4d<br>=<br>=<br>Eb||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>**232 AND 238 SERIES**<br>500<br>AIRVELOCITY(LFM)<br>(tan<br>w® yq9@__200_<br>400600800 100049<br>a<br>E< gi<br>| TT Try; tT Tt<br>|), 23<br>**e**s [We DPTrtper" go<br>g<br>ofSe te|||
||||0||720<br>(25.<br>"<br>18.3)<br>a<br>Puig|iF<br>382<br>Mi<br>oo!||(4a)<br>,-700<br>’<br>17.8)<br>yO<br>+|||w<br>“1s<br>=<br>2><br>L<br>a<br>55 plat [Pet<br>g6|
|||||||||.|||Wu|
||||(54)||(4.8)<br>eae<br>33080 4¥#<br>™<br>OrderSpeedCtips ~ Separately||**Dimensions: in. (mm)**<br>—"|<br>in<br>(23<br>~ta}<br>a<br>285SC 10#||ne |<br>i<br>POWERDISSIPATION(WATTS)<br>Pr<br>rie<br>TABHOLES 190PLATED<br>ogee<br>“<br>(08)<br>xs<br>CB)<br>__ 1,380<br>QW<br>10<br>NE<br>(35.1)<br>(25.4)|||
||||||**251 SERIES**|**_Slim-Profile Heat Sinks With Integral Clips_**|||||_15 Lead Multiwatt_|
|||||||**Height Above**||**Footprint**|||**Thermal Performance at Typical Load**|
||||||**Standard**|**PC Board**||**Dimensions**<br>**Mounting**||**Solderable**|**Mounting**<br>**Natural**<br>**Forced**|
||||||**P/N**|**in.(mm)**||**in.(mm)**<br>**Configuration**||**Tab Options**|**Style**<br>**Convection**<br>**Convection**|
||||||251-62AB|.620 (15.7)|.910 (23.1) x .380 (9.7)|.910 (23.1) x .380 (9.7)<br>Vert./Horiz.||No Tab|Clip<br>66°C @ 3W<br>66°C/W @ 400 LFM|
||||||251-80AB|.845 (21.5)|.910 (23.1) x .380 (9.7)|.910 (23.1) x .380 (9.7)<br>Vert./Horiz.||No Tab|Clip<br>64°C @ 3W<br>66°C/W @ 400 LFM|
||||||251-80AB-19|.875(22.2)|.910|.910(23.1)x .380(9.7)<br>Vertical||19|Clip<br>64°C@3W<br>66°C/W@400 LFM|
||||||Material: Aluminum, Black Anodized|||||||
|**MECHANICAL DIMENSIONS**||||||||**251 SERIES**|||**NATURAL AND FORCED**|
||||||||||||**CONVECTION CHARACTERISTICS**|
|||ato<br>@31)||**251-62AB**<br>**251-80AB**<br>mi<br>a<br>se)<br>(ii<br>t<br>-<— 280<br>en<br>2.080<br>&<br>Suggested<br>Tab Holes<br>(1.87<br>|| —<br>2.075<br>(1.9)(Plated)<br>with4.100(2.5)PAD|||t<br>40<br>(16.3)<br>4<br>(38)<br>2x.170<br>(4.3)|**Dimensions: in. (mm)**<br>**251-80AB-19**<br>|<br>AIRVELOCITY(LFM)<br>Sjo<br>%__200__400_—<br>600.8014<br>200<br>geOo” we<br>20.2) 046<br>1<br>am<br>F< wl<br>|<br>|<br>| [| ere<br>Al, 23<br>(1)<br>a)<br>(51)<br>es (fT<br>TT [ergo]<br>£9<br>|<br>#G ol QL AT<br>dp BE<br>|<br>a2<br>CONSTA”<br>be<br>Fz<br>gi<br>|<br>Nwtritrr), Sa<br>t<br>0 f<br>Su “ares|” «£2<br>nar<br>IT<br>os<br>BS<br>aol<br>LAN serenspel, Fo<br>o—<br>a<br>a a<br>,<br>wy = gy<br>(Z@DET)<br>F2<br>875<br>iad<br>0<br>1<br>2<br>3<br>4<br>5<br>(22)—|<br>POWER DISSIPATION (WATTS)||||



All other products, please contact factory for price, delivery, and minimums. 

35 

Normally stocked 

**Board Level Heat Sinks** ~~Lo~~ 

## _**BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS**_ 

|**244 SERIES**|**_Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks_**|**_Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks_**|**_Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks_**|**_Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks_**|**_Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks_**||_MULTIWATT_|
|---|---|---|---|---|---|---|---|
||**Height Above**|**Footprint**|||**Thermal Performance at Typical Load**|||
|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**|**Convection**|**Convection**|**lbs.(grams)**|
|244-145AB|1.450 (36.8)|1.300 (33.0) x 480 (12.1)|Vert/Horiz,|No Tab|44°C @ 4W|4.4°C/W @ 400 LFM|.0160 (7.25)|
|244-145AB-50|1.650(41.9)|1.300(33.0)x 480(12.1)|Vertical|50|44°C@4W|4.4°C/W@400 LFM|.0170(7.20)|
|Material: Aluminum, Black Anodized||||||||



## **MECHANICAL DIMENSIONS** 

**Dimensions: in. (mm)** 

|**245 SERIES**|**_Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks_**|**_Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks_**|**_Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks_**|**_Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks_**|**_Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks_**||_MULTIWATT_|
|---|---|---|---|---|---|---|---|
||**Height Above**|**Footprint**|||**Thermal Performance at Typical Load**|||
|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**|**Convection**|**Convection**|**lbs.(grams)**|
|245-145AB|1.450 (36.8)|1.750 (44.5) x .380 (9.7)|Ver.t/Horiz.|No Tab|38°C @ 4W|3.2°C/W @ 400 LFM|.0160 (7.25)|
|245-145AB-50|1.650(41.9)|1.750(44.5)x .380(9.7)|Vertical|50|38°C@4W|3.2°C/W@400 LFM|.0170(7.20)|
|Material: Aluminum, Black Anodized||||||||



## **MECHANICAL DIMENSIONS** 

**Dimensions: in. (mm)** 

> **246 SERIES** _**Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**_ 

_MULTIWATT_ 

||**Height Above**|**Footprint**|||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|---|---|
|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**|**Convection**|**Convection**|**lbs.(grams)**|
|246-197AB|1.968 (50.0)|1.986 (50.4) x 3.75 (9.5)|Vert./Horiz.|No Tab|35°C @ 4W|2.8°C/W @ 400 LFM|.0240 (10.90)|
|246-197AB-50|2.168(55.1)|1.986(50.4)x 3.75(9.5)|Vertical|50|35°C@4W|2.8°C/W@400 LFM|.0250(11.40)|
|**Order SpeedClip™ 285SC or 330SC separately.**(See 248 Series section).||||||||



Material: Aluminum, Black Anodized 

**MECHANICAL DIMENSIONS** 

**Dimensions: in. (mm)** 

~~Fe~~ All other products, please contact factory for price, delivery, and minimums. 36 Normally stocked 

Normally stocked 

**Board Level Heat Sinks** po 

## _**BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS**_ 

|**247 SERIES**|**_Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks_**|**_Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks_**|**_Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks_**|**_Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks_**||_MULTIWATT_|
|---|---|---|---|---|---|---|
||**Height Above**<br>**Footprint**|||**Thermal Performance at Typical Load**|||
|**Standard**|**PC Board**<br>**Dimensions**|**Mounting**|**Solderable**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**<br>**in.(mm)**|**Configuration**|**Tab Options**|**Convection**|**Convection**|**lbs.(grams)**|
|247-195AB|1.950 (49.5)<br>1.900 (48.3) x .950 (24.1)|Vert./Horiz.|No Tab|25°C@ 4W|2.4°C/W @ 400 LFM|.0330 (15.10)|
|247-195AB-50|1.950(49.5)<br>1.900(48.3)x .950(24.1)|Vertical|50|25°C@4W|2.4°C/W@400 LFM|.0340(15.60)|
|**Order SpeedClip™ 285SC or 330SC separately.**(See 248 Series section).|||||||
|Material: Aluminum, Black Anodized|||||||



## **MECHANICAL DIMENSIONS** 

## **Dimensions: in. (mm)** 

## **248 SERIES** 

## _**Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks**_ 

_MULTIWATT_ 

||**Height Above**|**Footprint**|||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|---|---|
|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**|**Convection**|**Convection**|**lbs.(grams)**|
|248-162AB|1.620 (41.1)|2.000 (50.8) x .750 (19.1)|Vert/Horiz.|No Tab|35°C @ 4w|2.5°C/W @ 400 LFM|.026 (11.60)|
|248-162AB-50|1.620(41.1)|2.000(50.8)x .750(19.1)|Vertical|50|35°C@4w|2.5°C/W@400 LFM|.027(12.20)|



## **Order SpeedClip™ 285SC or 330SC separately.** 

Material: Aluminum, Black Anodized 

## **MECHANICAL DIMENSIONS** 

**Order SpeedClips™ separatley for use with Series 246, 247, 248 or 249** 

## **Dimensions: in. (mm)** 

**249 SERIES** 

## _**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**_ 

_MULTIWATT_ 

||**Height Above**|**Footprint**|||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|---|---|
|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**|**Convection**|**Convection**|**lbs.(grams)**|
|249-113AB|1.130 (28.7)|1.900 (48.3) x .950 (24.1)|Vert./Horiz,|No Tab|35°C@ 4W|3.29°C/W @ 400 LFM|.020 (8.90)|
|249-113AB-50|1.130(28.7)|1.900(48.3)x .950(24.1)|Vertical|50|35°C@4W|3.29°C/W@400 LFM|.021(9.40)|
|**Order SpeedClip™ 285SC or 330SC separately.**(See 248 Series section).||||||||



Material: Aluminum, Black Anodized 

## **MECHANICAL DIMENSIONS** 

## **Dimensions: in. (mm)** 

All other products, please contact factory for price, delivery, and minimums. 

37 

Normally stocked 

**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

|**288 SERIES**<br>**_Compact Wave-Solderable Low-Cost Heat Sinks_**|TO-220, TO-202|
|---|---|
|**Height Above**<br>**Maximum**|**Thermal Performance at Typical Load**|
|**Standard**<br>**PC Board**<br>**Footprint**|**Natural**<br>**Forced**<br>**Weight**|
|**P/N**<br>**in.(mm)**<br>**in.(mm)**|**Convection**<br>**Convection**<br>**lbs.(grams)**|
|288-1AB<br>1.250(31.8)<br>0.875(22.2)x 0.215(5.5)<br>:|85°C@4W<br>12°C/W@200 LFM<br>0.0057(2.59)|
|Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good|board space is available. The 288-1AB is a stamped aluminum heat sink, black|
|electrical connections for vertical mounting of TO-220 and TO-202 semicon-|anodized, designed for applications requiring good heat dissipation from a heat|
|ductor packages. These heat sinks are designed for use where minimum PC|sink occupying minimum space, available at minimum cost.|



## **MECHANICAL DIMENSIONS** 

## **288 SERIES** 

**==> picture [95 x 13] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>**----- End of picture text -----**<br>


**==> picture [68 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


|**271 SERIES**|**271 SERIES**|**_Top-Mount Booster Heat Sinks for Use with 270/272/280 Series_**|**_Top-Mount Booster Heat Sinks for Use with 270/272/280 Series_**|**_Top-Mount Booster Heat Sinks for Use with 270/272/280 Series_**||TO-220|
|---|---|---|---|---|---|---|
||||**Horizontal**||||
|||**Height Above**|**Mounting Footprint**|**Thermal Performance at Typical Load**|||
|**Standard**||**Semiconductor Case**|**Dimensions**|**Natural**|**Forced**|**Weight**|
|**P/N**||**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs.(grams)**|
|271-AB|271-AB<br>A|0.500 (12.7)|1.750 (44.5) x 0.700 (17.8)|62°C @ 4W (NOTE A)|5.1°C/W @ 400 LFM|0.0052 (2.36)|
|||||31 °C@4W(NOTE B)|1.8°C/W 400 LFM(NOTE B)||



Material: Aluminum, Black Anodized 

This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for improved performance. 

NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown with (2) 271-AB types added to (1) 272-AB type. 

## **MECHANICAL DIMENSIONS** 

**==> picture [250 x 39] intentionally omitted <==**

**----- Start of picture text -----**<br>
271 SERIES<br>NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS AIR VELOCITY (LFM)<br>**----- End of picture text -----**<br>


**==> picture [68 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


All other products, please contact factory for price, delivery, and minimums. 

38 

Normally stocked 

**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

> **270/272/280 SERIES** _**Small Footprint Low-Cost Heat Sinks**_ 

|**270/272/280 SERIES**|**270/272/280 SERIES**<br>**_Small Footprint Low-Cost Heat Sinks_**|**_Small Footprint Low-Cost Heat Sinks_**|**_Small Footprint Low-Cost Heat Sinks_**||||
|---|---|---|---|---|---|---|
|**270/272/280 SERIES**|**270/272/280 SERIES**<br>**_Small Footprint Low-Cost Heat Sinks_**|**_Small Footprint Low-Cost Heat Sinks_**|**_Small Footprint Low-Cost Heat Sinks_**|||_TO-220, TO-202_|
||**Height Above**|**Horizontal Mounting**||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|**Standard**|**PC Board**|**Maximum Footing**|**Solderable**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Tab Options**|**Convection**|**Convection**|**lbs.(grams)**|
|270-AB<br>272-AB<br>rn|0.375 (9.4)<br>0.375 (9.4)|1.750 (44.5) x 0.700 (17.8)<br>1.750 (44.5) x 1.450 (36.8)|—<br>01,02|70°C @ 4W<br>42°C @ 4W|6.0°C/W @ 400 LFM<br>3.6°C/W @ 400 LFM|0.0052 (2.36)<br>0.0105 (5.72)|
|280-AB|0.375(9.4)|1.750(44.5)x 0.700(17.8)|—|70°C@4W|6.0°C/W@400 LFM|0.0048(2.18)|
|Material: Aluminum, Black Anodized|||||||



pation. The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for two power semiconductors. Specify solderable tab options for the 272 Series by the addition of suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02). 

These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or TO-202 case style with a maximum height of only 0.375 in. (9.4). For added performance, a 271 Series heat sink can also be used for double-sided heat dissi- 

**==> picture [407 x 219] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>bare) (108)4 0.220(5.6) Wo 0 200 AIR VELOCITY400 600(LFM) 800 1000<br>TT0.700 + 0.530 2EcBe OTofSeeNae me [oe<br>(178)\ uw a Ok2a<br>* fig PINSbe SSTa ee<br>270 SERIES 280 SERIES<br>esee al eeeAor |te<br><8 WOT<br>az Pr rrr y<br>0.144 0 1 2 3 4 5 6 7 8 9<br>1.750 DIA THRU(3.7} POWER DISSIPATION (WATTS)<br>(5) (v2) 250 REF<br>7 om | =sa=<br>= (445) 4 = ean<br>H (36.8)ta 0.700 hfiD! ae =—4=fi<br>| [| (17.8) 050 REF =~! 050 REF<br>— O76 ae topes (reef ft<br>a 98) LS 0.040 oa<br>a (1.0) REF , ,<br>272 SERIES 272AB01 272AB02<br>**----- End of picture text -----**<br>


## **MECHANICAL DIMENSIONS** 

## **Dimensions: in. (mm)** 

## **289 AND 290 SERIES** 

## _**Low-Cost Single or Dual Package Heat Sinks**_ 

_TO-218, TO-202, TO-220_ 

**Height Above Horizontal Mounting Thermal Performance at Typical Load Standard PC Board Maximum Footing Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams)** ~~I~~ 289-AB 0.500 (12.7) 1.000 (25.4) x O.710 (18.1) 50°C @ 2W 44°C/W @ 400 LFM 0.0055 (2.49) 289-AP 0.500 (12.7) 1.000 (25.4) x 0.710 (18.1) 50°C @ 2W 44°C/W @ 400 LFM 0.0055 (2.49) 290-1AB ~~A~~ 0.500 (12.7) 1.000 (25.4) x 1.180 (30.0) 44°C @ 2W 35°C/W @ 400 LFM 0.0082 (3.72) ~~a~~ 290-2AB 0.500 (12.7) 1.000 (25.4) x 1.180 (30.0) 44°C @ 2W 35°C/W @ 400 LFM 0.0081 (3.67) Material: Aluminum, Black Anodized 

Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate one semiconductor; the 289 Series is available with a black anodized finish (289-AB) or with 

no finish (289-AP). Two semiconductors can be mounted to the 290-2AB style. 

**==> picture [403 x 137] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>289 SERIES MECHANICAL DIMENSIONS 290 SERIES CONVECTION CHARACTERISTICS<br>0.050 0.480 AIR VELOCITY (LFM)<br>(1.3) wae; (122) | o.050 es tog@-—-200__a<br>1.000 or ae| ||  oatf yp e ofTi ftLTT)TT pet<br>at < —<br>4 Ik ~t| bestest] wan PSEIL 7EA<br>pach og ono Bsw> 40“AEEat<br>OA THAU (10.2) (38) DIA THRU 42 | A SE<br>—<br>ne [aso] 009C0 ONLY oaTuy «HOM = HEN)tt suze @L“Ceres TPP<br>CF (12.7) R DISSIPATION (WATTS)<br>0.710(18.0) —|ULLwo + Dimensions: in. (mm) Powe<br>**----- End of picture text -----**<br>


All other products, please contact factory for price, delivery, and minimums. 

39 

Normally stocked 

**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

||**250 SERIES**<br>**_High-Performance Slim Profile Heat Sinks With Integral Clips_**<br>_Multiwatt_|**250 SERIES**<br>**_High-Performance Slim Profile Heat Sinks With Integral Clips_**<br>_Multiwatt_|
|---|---|---|
||**Height Above**<br>**Footprint**|**Thermal Performance at Typical Load**|
|™.<br>ro<br>a|**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in. (mm)**<br>**in. (mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>250-122AB<br>1.220 (31.0)<br>1.000 (25.4) x .500 (12.7)<br>Vert./Horiz.<br>No Tab<br>Clip<br>50°C @ 4W<br>3.7°C/W @ 400 LFM<br> ~~a~~||
||250-122AB-09<br>1.220 (31.0)<br>1.000 (25.4) x .500 (12.7)<br>Vertical|09<br>Clip<br>50°C @ 4W<br>3.7°C/W @ 400 LFM|
||250-122AB-25<br>1.380(35.1)<br>1.000(25.4)x .500(12.7)<br>Vertical|25<br>Clip<br>50°C@4W<br>3.7°C/W@400 LFM|
||Material: Aluminum, Black Anodized||
|**Dimensions: in. (mm)**<br>**MECHANICAL DIMENSIONS**<br>**250-122AB**<br>**250-122AB-09**<br>**250 SERIES**<br>1.00<br>[=<br>(25.4)a_i<br>500<br>500<br>1.00<br>|]<br>|[|<br>—-—--—® + {12.7f-<br>= (127)---— (25.4) =|<br>L<br>i<br>250-122AB-09<br>7<br>|<br>RSa<br>122<br>TWOe (42)PAD<br>h<br>1<br>!<br>{ Bi)<br>OSaaAnes<br>jo<br>ther<br>—_<br>=\<br>SUGGESTEDTABHOLE><br>ong<br>41)<br>‘B10<br>h<br>4<br>075<br>(18)PLATED)<br>,<br>a<br>=<br>Hl<br>li<br>100(2.5)<br>71<br>)CCSTT<br>]<br>j<br>;<br>:<br>|<br>‘9x2(TAB08)<br>__<br>U<br>f<br>(0.8)<br>*<br>080<br>020(TAB 25)<br>}<br>075<br>— ear<br>(08)<br>(1.8)<br>.<br>it||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>**250-122AB-25**<br>AIRVELOCITY(LFM)<br>we792200400600<br>800_<br>1000,<br>Ee<br>ce<br>CETTTTTT<br>ety<br>ws<br>2 ftttttrrr<br>ri,<br>g<br>a1<br>és "Crp<br>eet eet 2<br>(7.8)<br>ng alNECGEECC Bs<br>|<br>ge “CNetpre e ee<br>83<br>v2 af |Serr), 88<br>su “CeeRT<br>22<br>43 a»<br>TPSe, gs<br>t<br>—+|||-98<br>ga<br>[A | [Pe<br>ty<br>(1.8)<br>QejE<br>Pe ttt tty<br>-2<br>=<br>oo<br>2<br>4<br>6<br>8<br>0<br>&@<br>275<br>c<br>(7.0)<br>—<br>POWERDISSIPATION (WATTS)|
|**237 AND 252 SERIES**<br>**_High-Performance, High-Power Vertical Mount Heat Sinks_**<br>_TO-220_<br>**Height Above**<br>**Footprint**<br>**Thermal Performance at Typical Load**<br>**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in. (mm)**<br>**in. (mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>237-167AB2<br>1.675 (42.5)<br>1.000 (25-4) x 1.000 (25.4)<br>Vertical<br>2, Twisted<br>Clip/Mtg Slot<br>46°C @ 4W<br>4.5°C/W @ 200 LFM<br>237-167AB3<br>1.675 (42.5)<br>1.000 (25.4) x 1.000 (25.4)<br>Vertical<br>3, Twisted<br>Clip/Mtg Slot<br>46°C @ 4W<br>4.5°C/W @ 200 LFM<br>237-167AB2-24<br>1.675 (42.5)<br>1.000 (25.4) x 1.000 (25.4)<br>Vertical<br>2, Solderable<br>Clip/Mtg Slot<br>46°C @ 4W<br>4.5°C/W @ 200 LFM<br>252-167AB2<br>1.675 (42.5)<br>1.000 (25.4) x 1.000 (25.4)<br>Vertical<br>2, Twisted<br>Clip/Mtg Slot<br>40°C @ 4W<br>4.5°C/W @ 200 LFM<br>ate~~ee~~|||
||252-167AB3<br>1.675 (42.5)<br>1.000 (25.4) x 1.000 (25.4)<br>Vertical|3, Twisted<br>Clip/Mtg Slot<br>40°C @ 4W<br>4.5°C/W @ 200 LFM|
||252-167AB2-24<br>1.675(42.5)<br>1.000(25.4)x 1.000(25.4)<br>Vertical|2,Solderable<br>Clip/MtgSlot<br>40°C@4W<br>4.5°C/W@200 LFM|
||**Order SpeedClips™ 285SC or 330SC separately for rapid component installation, lowering manufacturing costs.**Material: Aluminum, Black Anodized||
|**MECHANICAL DIMENSIONS**<br>**227-167**<br>**252-167**<br>**237-167AB2**<br>**252-167AB2**<br>**237-167AB2-24**<br>**252-167AB2-24**<br>200<br>1.000<br>1.000||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>OrderSpeedClips™|
|**237 AND 252 SERIES**<br>———)<br>mae<br>CT<br>LS<br>=<br>we, [ee<br>| T<br>;<br>]<br>‘<br>3) 409<br>ee<br>=<br>ce||F sy0200400000010<br>ee EEE, 8<br>BE<br>gy’ £5|
|i<br>\<br>_f<br>400 REF |<br>i<br>H<br>Ma<br>t<br>ro<br>hootye<br>|<br>Ps)<br>1.000<br>125.4)|**237-167AB3**<br>**252-167AB3**<br>**237-167AB3**<br>**237 AND 252 SERIES**<br>**Dimensions: in. (mm)**<br>**252-167AB3**<br>| emstwsteD) |=<br>|emsrmsren<br>2TABS<br>i<br>wa<br>wa<br>(SOLDERABLE)<br>H<br>l<br>]<br>h (17.8)<br>450<br>450<br>{<br>TABHOLES<br>a<br>jetta)<br>it<br>oF<br>en“<br>#3<br>:<br>3TABS(TWISTED)<br>“Ff<br>ONLY<br>ATS (12.1) [—<br>3.130<br>950(24.1)_4<br>8.3)|Seleos<br>OS ONS<br>tee<br>|, 28<br>Pda ee<br>rn<br>oe es<br>BO<br>| ae2 Fo<br>ge<br>| oerear"<br>ge<br>w git | tttttt td, -<br>“2<br>oo<br>1<br>2<br>@<br>4<br>5<br>&<br>Spring Steel 2855C10#<br>POWERDISSIPATION(WATTS)|
||**291 SERIES**<br>**_Labor-Saving Clip-on Heat Sinks_**|TO-220|
||**Vertical**||
||**Height Above**<br>**Mounting Footprint**|**Thermal Performance at Typical Load**|
||**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**|**Natural**<br>**Forced**<br>**Weight**|
||**P/N**<br>**in. (mm)**<br>**in. (mm)**<br>**Style**|**Convection**<br>**Convection**<br>**lbs. (grams)**|
||291-C236AB<br>0.860 (21.)9<br>1.100 (27.0) x 0.360 (9.1)<br>TO-220 (Clip)<br>80°C @ 2W<br>24°C/W @ 600 LFM<br>0.0026 (1.18)||
||291-H36AB<br>0.860(21.9)<br>1.100(27.0)x 0.360(9.1)<br>TO-220(Mtg. Hole)<br>68°C@2W<br>16°C/W@600 LFM<br>0.0026(1.18))<br>Material: Aluminum, Black Anodized<br>~~$e~~||



Designed for mounting horizontally or vertically on a circuit board, 291 Series heat sinks employ a unique clip for attachment of TO-220 case styles. 

One type is available with a locking clip and one with a 0.140 in. (3.6) diameter mounting hole only. 

**==> picture [458 x 112] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS 291 SERIES<br>e NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>ta)oxo . ' (25.4)1.000 (12.7)0.500<br>|b- AIR VELOCITY (LFM)<br>(3.6) oT Latcastna<br>MV IS 0.140 np 1002300600900yp Aeorrseas [150<br>0.860 \ Vj ry we fot| ae I tly<br>ae y, X y, Gg ZYt eg23 ofLTTDt haA TTTT Ty ty<br>L = <a)s 0.315 L ee(is)0.465 wzSuBS of}SZTS +Awrczseas| [TT<br>0.100 | 0.420 Be oo (7 SHE<br>(2.5) (10.7) Su A ae<br>Dimensions: in. (mm) LOCKING TABS aa i) 1 2 3L{ Tt4 |,5<br>291-C2 291-H POWER DISSIPATION (WATTS)<br>**----- End of picture text -----**<br>


## **MECHANICAL DIMENSIONS** 

All other products, please contact factory for price, delivery, and minimums. 

40 

Normally stocked 

**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

**==> picture [534 x 443] intentionally omitted <==**

**----- Start of picture text -----**<br>
286 SERIES Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks TO-220<br>Height Above Thermal Performance at Typical Load<br>Standard PC Board Maximum Footprint Natural Forced Weight<br>P/N in. (mm) in. (mm) Material Convection Convection lbs. (grams)<br>286-AB  A 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) Aluminum, Anodized 58°C @ 4W 7.4°CW @ 200 LFM 0.0085 (3.86)<br>286-CBT  A 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) Copper, Black 58°C @ 4W 7.4°CW @ 200 LFM 0.0250 (11.34)<br>286-CT 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) Copper, Tinned 58°C @ 4W 7.4°CW @ 200 LFM 0.0250 (11.34)<br>Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into pre- t y. The 286 Series can be wavesoldered directly to the board. Material: 286-AB style (aluminum,<br>drilled circuit boards; scored mounting tabs may be bent after insertion to provide added stabili- black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned).<br>MECHANICAL DIMENSIONS NATURAL AND FORCED<br>286 SERIES CONVECTION CHARACTERISTICS<br>1.000<br>(25.4) AIR VELOCITY (LFM)<br>0,150 ni, us 0 100 200 300 400 500 600 700 800 9001000, , E<br>re ; 7 aa<br>fae [+ 2 aNLL.<br>ooa | ima [ aa eS eT TR zegs<br>0.700 ee |e inn Li aa gf |IN wr, ae<br>(178) a (2.0) i az a | | bet i tT PT wa<br> | I ! ] [i rw ap | tt a6 ag +4 a8<br>‘si H 0.050 26 | |“ fyTeer [$<]<br>aan a a: 3 cy At<br>“ry r 0.050 0.050 <i 49 tt ttt zx£8<br>Dimensions: in. (mm) aam a0 (13) 9390 eh) g2 ZC rrrrrrrey 2<br>. 0500 (25) . 0.500 01 2 3 4 58 6 7 8 9 W<br>(12.7) (12.7) POWER DISSIPATION (WATTS)<br>287 SERIES Wave-Solderable Low-Cost Heat Sinks TO-220<br>Height Above Maximum Thermal Performance at Typical Load<br>Standard P/N PC Board Footprint “A” Natural Forced Weight<br>Mounting Slot Mounting Hole in. (mm) in. (mm) Convection Convection lbs. (grams)<br>287-1AB  287-1ABH  1.180 (30.0) 1.000 (25.4) x 0.500 (12.7) 65°C @ 4W 7.8°CW @ 200 LFM 0.0090 (4.08)<br>al a 287-2AB  A 287-2ABH  A 1.180 (30.0) 1.000 (25.4) x 1.000 (25.4) 55°10 @ 4W 6.4°CW @ 200 LFM  0.0140 (6.35)<br>Material: Aluminum, Black Anodized<br>Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards. mounting slot allows for correct positioning of TO-220 and similar semiconductor packages.<br>Soldered, pre-tinned tabs can be wavesoldered directly to the board. A 0.375 in. (9.5 mm)<br>MECHANICAL DIMENSIONS 287 SERIES<br>NATURAL AND FORCED<br>(254) —|<br>CONVECTION CHARACTERISTICS<br>bE 1.000<br>—| TF o.80THRU apm<br>Standard P/N Dim. “A”<br>110| 00375 | (38) rey ke-—ya 287-2AB287-1AB 1.000 (25.4)0.500 (12.7) F jop°—_—200___ AIR VELOCITY4006008001000, (LFM) =<br>(30.0) (95) ; oma)i 287-1ABH 0.500 (12.7) aP< goOStN<br>a er:(178) (7a). cHi 287-2ABH 1.000 (25.4) gebi gfNNT|NSee| lettUAer rrr}T  TTo,, §e2s&e<br>———“— oe [REEDe {LAceeereea 22<br>oe Tvp.2 (n a rya mie0.017 (0.4) TYP-20.200 1) 0062 fl ge38 “CAool ZA ehrene 79 2<ue<br>387-108287-2AB er-iasn 9982 Typ2 ce "ATT? fe<br>Dimensions: in. (mm) MoonningWITH aor MOUNTING HOLEMODELS287-2ABHWITH {i02)T¥P20.400 143© a aPOWER DISSIPATION (WATTS) 1F *8<br>**----- End of picture text -----**<br>


|**MECHANICAL DIMENSIONS**<br>**287 SERIES**<br>**Standard P/N**<br>**Dim. “A”**<br>287-1AB<br>0.500 (12.7)<br>287-2AB287-1AB<br>1.000 (25.4)0.500 (12.7)<br>287-1ABH<br>0.500 (12.7)<br>287-2ABH<br>1.000 (25.4)<br>1.000<br>bE<br>(254) —|<br>—|<br>TF o.80THRUo.80THRUTHRU<br>apm<br>(38)<br>rey<br>ke-—ya a<br>-—ya<br>00375<br>|<br>i<br>(95)<br>;<br>oma)i<br> er:(178)<br>cHi<br>(178)<br>(7a).<br>i<br>:(178)<br>.<br>oe<br>———“—<br>mie0.017<br>0.200 1)<br>fl<br>rya<br>0.017 (0.4) TYP-20.200TYP-20.200<br>0062<br>387-108287-2AB<br>er-iasn<br>9982 Typ2Typ2<br>287-2AB<br>287-2ABHWITH<br>WITH aor<br>MODELS287-2ABHWITH WITH<br>0.400<br>MoonningWITH aoraor<br>MOUNTING HOLEMODELS287-2ABHWITH<br>{i02)T¥P20.400|**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>AIR VELOCITY4006008001000, (LFM)VELOCITY4006008001000, (LFM)(LFM)<br>F jop°—_—200___<br>4006008001000, (LFM) =<br>aP< OStN<br>P< goOStNtN<br>| lettUAer rrr}T To,, 2s&e<br>gebi NNT|NSee| UAer rrr}Trrr}T §e2s&e<br>bi gfNNT|NSee||NSee|<br>T<br>TTo,, , &e<br>[REEDe ceeereea<br>e<br>{LAceeereea a<br>22<br>ge38 “CAool“CAool<br>ehrene 2<ue<br>38 “CAool ool ZA<br>rene 79 ue<br>ce "ATT?? fe<br>143© a aPOWER DISSIPATIONaPOWER DISSIPATION<br>F *8<br>©<br>1F<br>POWER DISSIPATIONDISSIPATION (WATTS)|**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>AIR VELOCITY4006008001000, (LFM)VELOCITY4006008001000, (LFM)(LFM)<br>F jop°—_—200___<br>4006008001000, (LFM) =<br>aP< OStN<br>P< goOStNtN<br>| lettUAer rrr}T To,, 2s&e<br>gebi NNT|NSee| UAer rrr}Trrr}T §e2s&e<br>bi gfNNT|NSee||NSee|<br>T<br>TTo,, , &e<br>[REEDe ceeereea<br>e<br>{LAceeereea a<br>22<br>ge38 “CAool“CAool<br>ehrene 2<ue<br>38 “CAool ool ZA<br>rene 79 ue<br>ce "ATT?? fe<br>143© a aPOWER DISSIPATIONaPOWER DISSIPATION<br>F *8<br>©<br>1F<br>POWER DISSIPATIONDISSIPATION (WATTS)|
|---|---|---|
|**695 SERIES**<br>**_Space-Saving Heat Sinks for Small Stud-Mounted Diodes_**||STUD-MOUNT|
|**Maximum**<br>**Thermal Performance at Typical Load**|||
|**Standard**<br>**Width**<br>**Height**<br>**Natural**|**Forced**|**Weight**|
|**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Convection**|**Convection**|**lbs.(grams)**|
|695-1B<br>1.330(33.8)<br>0.530(13.7)<br>72°C@4.0W<br>:|5.2°C/W@400 LFM|0.0030(1.36)|
|Mount and effectively heat sink small stud-mounted diodes with the 695 Series<br>provides good heat dissipation for use where height is limited above the print-|||
|space-saving heat sink type. Each unit is black anodized aluminum with an<br>ed circuit board or base plate.|||
|0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design|||
|**695 SERIES**|**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**||



## **MECHANICAL DIMENSIONS** 

**==> picture [68 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


All other products, please contact factory for price, delivery, and minimums. 

41 

Normally stocked 

**Board Level Heat Sinks** [_ 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

> **256 SERIES** _**Thermal Retainers**_ **256-DM** _TO-92_ **Height (Less Standard Mounting Tab) Weight P/N in. (mm) Material lbs. (grams)** 256-DM 0.190 (4.0) Beryllium Copper 0.0005 (0.23) 

|260 SERIES<br>**_Cup Clips for TO-5 Case Style Semiconductors_**|260 SERIES<br>**_Cup Clips for TO-5 Case Style Semiconductors_**|260 SERIES<br>**_Cup Clips for TO-5 Case Style Semiconductors_**|||
|---|---|---|---|---|
|**Characteristics**<br>**TO-5**<br>Thermal Resistance – Epoxy Insulated<br>14° C/W<br>Thermal Resistance – Beryllium Oxide Insulated<br>16° C/W<br>Breakdown Voltage – Epoxy Type (VAC), 60 Hz<br>500<br>Breakdown Voltage – Beryllium Type(VAC),60 Hz<br>1000<br>Recommended Operating Voltage, AC or DC<br>Clean Conditions: % Hipot Rating<br>50<br>Dusty Conditions: % Hipot Rating<br>30<br>DirtyConditions: % Hipot Rating<br>10 to 20<br>Temperature Range — Continuous (C°)<br>-73/+149<br>~~—~~||**T h r e a d**<br>**S i z e :**<br>4 = #4-40 UNC<br>6 = #6-32 UNC<br>10 = #10-32 UNF<br>**M o u n t i n g**<br>T = t a p p e d<br>**S t y l e :**<br>S = s t u d<br>P = p l a i n<br>**Depth of**<br>**Model**<br>**Tapped Base**<br>260-4T5E<br>0.093 (2.36)<br>260-4TH5E<br>0.125 (3.18)<br>260-4TH5B<br>0.125 (3.18)|**Base Style:** <br>**S e m i c o n d u c t o r**<br>**Case Style:** <br>**I n s u l a t i o n** <br>**Ty p e :**|H = h e x<br> 5 = T O - 5<br> E = e p o x y<br> B = b e ry l l i u m|
|**_TO-5 CASE STYLECUP CLIPS —ORDERING GUIDE_**|||||
|||**Outline Dimension**|||
|**Standard**<br>**Insulation**||**L x W x I.D.**|**Weight**|**Case**|
|**P/N**<br>**Type**||**in.(mm)**|**lbs.(grams)**|**Style**|
|260-4T5E<br>Epoxy Insulated|0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4)|0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4)|0.0024 (1.09)|TO-5|
|260-4TH5E<br>Epoxy Insulatad|0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4)|0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4)|0.0031 (1.41)|TO-5|
|260-6SH5E<br>Epoxy Insulated|0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)|0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)|0.0037 (1.68)|TO-5|
|260-1OSH5E<br>Epoxy Insulated|0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)|0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)|0.0042 (1.91)|TO-5|
|260-4TH5B<br>Beryllium Oxide Insulated|0.445 (11.3) x 0.370 (9.4) hex. x 0.290 (7.4)|0.445 (11.3) x 0.370 (9.4) hex. x 0.290 (7.4)|0.0042 (1.91)|TO-5|
|260-6SH5B<br>Beryllium Oxide Insulated|0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4)|0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4)|0.0039 (1.77)|TO-5|
|260-10SH5B<br>Beryllium Oxide Insulated|0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4)|0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4)|0.0043 (1.95)|TO-5|



_TO-5_ [| 

Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C”; Ceramic Spacers – beryllium oxide 

## **Base Mounting Configurations** — TO-5 

**Plain Ty p e** — Epoxy bonded, or used with #4 pan head screws. **Tapped Base** — #4-40 UNC screw (not supplied) fits tapped hole. Care should be taken not to use too long a screw, which could short against the semiconductor case. For correct screw lengths: 

Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness **Stud Mounting Base** . #6-32 UNC or #10-32 UNF studs. Nuts and washers not supplied. Stud hole must be slightly countersunk to ensure flat mounting. 

To determine the correct mounting screw lengths, add dimensions as follows: 

Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness 

## _**Epoxy Insulated For TO-5**_ 

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260-4TH5E<br>260-4T5E<br>**----- End of picture text -----**<br>


**==> picture [268 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
Beryllium Oxide Insulated For TO-5<br>86<br>=< pose<br>260-4TH5B 692 NOZA<br>260-6SH5E A 260-6SH5B<br>260-10SH5E 260-10SH5B<br>**----- End of picture text -----**<br>


All other products, please contact factory for price, delivery, and minimums. 

42 

Normally stocked 

**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

> **200 SERIES** _**High-Efficiency Heat Sinks for Small Metal Can Power Semiconductors**_ 

**==> picture [530 x 166] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|Single-Level Star|Dual-Level Star|Dual-Level Sunburst|
|201,202,204,205,211 Series|203,207,213 Series|“|209, 215 Series|can(4.8|
|Available|Semiconductor|Heat Sink|Heat Sink|Heat Sink|Natural|Applicable|
|Standard P/N|Case Diameter|Inside Dia.|Outside Dia.|Height|Convection|Forced|Power|Materials and|
|& Finish|Min/Max|“A”|“B”|“C”|Case Rise|Convection|Semiconductor|Finishes Available|
|Types|in. (mm)|in. (mm)|in. (mm)|in. (mm)|Above Ambient|(|Θ|CA@200 LFM)|Case Types|for 200 Series:|
|A|201CB, 201AB|0.161 (4.1)/0.240 (6.1)|0.150 (3.8)|0.640 (16.2)|0.187 (4.8)|65°C @ 1W|31°C/W|TO-18, TO-24, TO-28,|CB|Beryllium cop-|
|202CB|0.161 (4.1)/0.240 (6.1)|0.150 (3.8)|0.490 (12.5)|0.187 (4.8)|73°C @ 1W|43°C/W|TO-40, TO-44|per; black ebonol|
|203CB|0.161 (4.1)/0.240 (6.1)|0.150 (3.8)|0.640 (16.2)|0.375 (9.5)|53°C @ 1W|23°C/W|"C" Finish|
|204CB|A|, 204SB|0.275 (7.0)/0.370 (9.4)|0.255 (6.5)|0.550 (4.8)|0.187 (4.8)|68°C @ 1W|35°C/W|TO-5, TO-9, TO-11,|SB|Silver-bearing|
|205CB|A|, 205SB|0.275 (7.0)/0.370 (9.4)|0.255 (6.5)|0.720 (18.3)|0.187 (4.8)|59°C @ 1W|28°C/W|TO-12, TO-26, TO-29,|copper; black|
|205AB, 205AP|0,275 (7.0)/0.370 (9.4)|0.255 (6.5)|0.720 (18.3)|0.187 (4.8)|68°C @ 1W|28°C/W|TO-33, TO-43, TO-45|ebonol "C"|
|207CB|A|, 207SB|A|0.275 (7.0)/0.370 (9.4)|0.255 (6,5)|0.720 (18.3)|0.375 (9.5)|46°C @ 1W|20°C/W|AB|Aluminum, black|
|207AB|A|, 207AP|0.275 (7.0)/0.370 (9.4)|0.255 (6.5)|0.720 (18.3)|0.375 (9.5)|53°C @ 1W|20°C/W|anodized|
|209CB, 209SB|0.275 (7.0)/0.370 (9.4)|0.255 (6.5)|1.280 (32.5)|0.437 (11.1)|30°C @ 1W|13°C/W|AP|Aluminum, no|
|211CB|0.440 (11.2)/0.544 (13.8)|0.420 (10.7)|0.830 (21.1)|0.187 (4.8)|50°C @ 1W|24°C/W|TO-8, TO-38|finish applied|
|213CB, 213SB|0.440 (11.2)/0.544 (13.8)|0.420 (10.7)|0.830 (21.1)|0.375 (9.5)|44°C @ 1W|19°C/W|
|213AB, 213AP|0.440 (11.2)/0.544 (13.8)|0.420 (10.7)|0.830 (21.1)|0.375 (9.5)|51°C @ 1W|19°C/W|
|215CB, 215AB|0.440 (11.2)/0.544 (13.8)|0.420 (10.7)|1.400 (35.6)|0.437 (11.1)|28°C @ 1W|15°C/W|
|215AP|0.440 (11.2)/0.544 (13.8)|0.420 (10.7)|1.400 (35.6)|0.437 (11.1)|32°C @ 1W|15°C/W|

**----- End of picture text -----**<br>


**NATURAL AND FORCED CONVECTION CHARACTERISTICS** 

**258 SERIES** 

## _**Thermal Links for Fused Glass Diodes**_ 

_DIODES_ 

**Standard Dimensions Weight** ry ' 1 **P/N in. (mm) Material Finish lbs. (grams)** 258 : 0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6) Aluminum DeltaCoate™ 151 on all surfaces 0.0018 (0.82) except solder pads and base dey ~~a~~ **MECHANICAL DIMENSIONS** oss 0.340 The thermal resistance from diode leads to chassis (2.4) 4 COMETfF (2.3) ots(3.0) REFI 4| {ay REF or heat sink is 12°C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt **258 SERIES** fen REF chassis or sink to ambient impedance is available, 0,100(25) (Ba) OIA REF the thermal resistance from the diode leads to ambient is reduced from about 150°C/watt to **Dimensions: in. (mm)** | 0.331 | 22°C/watt. (64) al COPPER SHIMS 

> **292 SERIES** _**Heat Sink for Single TO-92**_ **Height Above Standard PC Board P/N in. (mm)** 292-AB 0.750 (19.1)(19.1)19.1)) **MECHANICAL** ~~;~~ 

_**Heat Sink for Single TO-92** TO-92_ **Height Above Overall PC Board Fin Width Thermal Performance Weight in. (mm) in. (mm) Natural Convection Finish lbs. (grams)** 0.750 (19.1)(19.1)19.1)) 0. 600 (15.3) 0.225°C/W @ 0.250 W Black Anodized 0.00049 (0.22) **MECHANICAL** 9.3 **0 292 SERIES NATURAL AND FORCED DIMENSIONS** ~~a~~ **CONVECTION CHARACTERISTICS** am att,aad ¥ UNOad zos so orocan rr] id PVR5)aSAe=ZN) amna aieteFifeelosog aesia A aee om ote0. a 1? OM om oF Om mf | Lt) | _ Ox a a a fe ak. am fa POWER DESSIPATION (WATTS) a 2 nr} + **Dimensions: in. (mm)** 

Power semiconductors packaged in a TO-92 style plastic case can be cooled effectively at little additional cost with the addition of the 292-AB heat sink. The 292-AB is effective over the typical power range of such devices. Material: Aluminum, Black Anodized. 

All other products, please contact factory for price, delivery, and minimums. 

43 

Normally stocked 

**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

> **634 SERIES** _**Slim Profile Unidirectional Fin Vertical Mount Heat Sink**_ **Standard Height Above Footprint P/N PC Board Dimensions Weight Plain Pin Without Pin in. (mm) in. (mm) lbs. (grams)** 634-10ABP 634-10AB 1.000 (25.4) 0.640 (16.26) x 0.640 (16.26) 0.016 (7.48) 634-15ABP 634-15AB 1.500 (38.1) 0.640 (16.26) x 0.640 (16.26) 0.025 (11.21) ~~CCee~~ 634-20ABP 634-20AB 2.000 (50.8) 0.640 (16.26) x 0.640 (16.26) 0.033 (14.95) Material: Aluminum, Black Anodized. 

_TO-220 and TO-218_ 

These slim profile unidirectional fin heat sinks offer users two assembly alternatives for vertically mounting TO-220 and TO-218 components. Models are available with or without wave- 

solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications where quick assembly is needed and space is at a premium. 

## **MECHANICAL DIMENSIONS** 

## _**Notes:**_ 

## **634 SERIES** 

**==> picture [102 x 15] intentionally omitted <==**

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TYPICAL THERMAL PERFORMANCE<br>FOR 634-15ABP<br>**----- End of picture text -----**<br>


_1. Thermal compound is assumed between device and heat sink._ 

_2. Tab temp with longer heat sink (634-20ABP) will typically be about 15% cooler. Tab temp with shorter heat sink (634- I0ABP) will typically be about 25% higher._ 

**==> picture [69 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


> **637 SERIES** _**High-Efficiency Heat Sinks For Vertical Board Mounting** TO-220_ **Height Above Thermal Performance at Typical Load Standard PC Board “A” Maximum Footprint Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams)** 637-10ABP 1.000 (25.4) 1.375 (34.9) x 0.500 (12.7) 76°C @ 6W 5.8°C/W @ 200 LFM 0.023 (10.43) ty ~~a~~ 637-15ABP A 1.500 (38.1) 1.375 (34.9) x 0.500 (12.7) 65°C @ 6w 5.5°C/W @ 200 LFM ~~a aR~~ 0.035 (15.88) 

> 637-20ABP A 2.000 (50.8) 1.375 (34.9) x 0.500 (12.7) 55°C @ 6W 4.7°C/W @ 200 LFM 0.050 (22.68) ~~a~~ 637-25ABP 2.500 (63.5) 1.375 (34.9) x 0.500 (12.7) 48°C @ 6W 4.2°C/W @ 200 LFM 0.062 (28.12) Material: Aluminum, Black Anodized Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. and board space occupied must be minimized. Refer to the Accessory products section for Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight thermal interface materials, thermal compounds, and other accessories products. 

## **MECHANICAL DIMENSIONS** 

**637 SERIES (EXTRUSION PROFILE  5183) NATURAL AND FORCED CONVECTION CHARACTERISTICS** 

**Dimensions: in. (mm)** 

All other products, please contact factory for price, delivery, and minimums. 

44 

Normally stocked 

**==> picture [524 x 706] intentionally omitted <==**

**----- Start of picture text -----**<br>
Wakefield Board Level<br>= Engineering Heat Sinks<br>ae 667 SERIES — Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting [70-220<br>—_Beet ‘ _ Height Above Maximum Thermal Performance at Typical Load<br>k rswer Standoff PinStandard P/NPlain Pin PCin. Board(mm) “A” Footprintin. (mm) ConvectionNatural ConvectionForced IbsWeight (grams)<br>a . SS 667-10ABSP & 667-10ABPP & 1.000 (25.4) 1.375 (34.9) x 0.500 (12.7) 76°C @6W = 5.8°C/W @ 200 LFM 0.0240 (11.0)<br>Bu. — 667-15ABSP 667-15ABPP & 1.500 (38.1) 1.375 (34.9) x 0.500 (12.7) 66°C @6W ss 5.5°C/W @ 200 LFM 0.0340 (15.6)<br>a a 667-20ABSP 667-20ABPP 2.000 (50.8) 1.375 (34.9) x 0.500 (12.7) 58°C @6W = 4.7°C/W @ 200 LFM 0.0460 (21.0)<br>667-25ABSP 667-25ABPP 2.500 (63.5) 1.375 (34.9) x 0.500 (12.7) 48°C @6W_ —4.2°C/W @ 200 LFM 0.0580 (26.2)<br>Wave-solderable pins. Material: Aluminum, Black Anodized<br>Excellent performance, choice of wave-solderable plain pins (PP-Type) or wave-solderable hex-shaped standoff pins (SP-Type), and reduced assembly cost.<br>Note: Order 330 SC or 285 SC SpeedClip™ separately.<br>7 ;<br>MECHANICALSaal DIMENSIONS a) DIA (EXTRUSION667 SERIES PROFILE 8073) CONVECTION CHARACTERISTICS<br>178tT (ia )REF [oo ,(NOMINAL)ty STANDOFFPansspr L, PLAINPils“PP 3308¢‘ti wgtop2 ——200__-400_600_AIR5 a VELOCITYana (FPM) g00_1000 =<br>(34.9) REF nd0.730 ntshs (4.6) OF f @ 0.093 ™) LJ Mominalom 2Be STfeSCNT eH 5<br>v (25.4) 4 Installed & Fs Chi 3 AES lor 3 PA<br>oh bb spent HE a } A Se rasa 2a<br>tees(1.6) REF |ro|| 044 1.1) (STANDOFF) i fe156 ask zs23 att[eft] tt+} ee Se2<br>A>] 0.130 (3.3) , vominal BE: WLS TTT, FE<br>RAISED BOSS0.125 x (3.2) 0.030 DIA(0.8) HIGH Dimensions: in. (mm) ee 0 POWER4 DISSIPATION8 2 (WATTS)#6 2<br>nO<br>285 AND 330 SERIES 285 SC and 330 SC SpeedClips™ for 667 Series Heat Sinks<br>Standard Nominal Installed For Use Weight<br>P/N Loading Force With Series Material Ibs. (grams)<br>285 SC 10 Ibs 232, 237, 240, 252, 667 Carbon Steel 0.00053 (0.24)<br>( 330 SC 4 Ibs 232, 237, 240, 252, 667 Stainless Steel 0.00074 (0.34)<br>- SpeedClips™ employ a locking safety tab for mounting. Must be ordered separately for these for the lowest production assembly time and cost. Order one SpeedClip™ for each 667 Series<br>heat sink series. Use these SpeedClips™ with our 237, 240, 252, and 667 Series heat sinks heat sink purchased.<br>MECHANICAL DIMENSIONS F 050 7 Speed ' Speed I<br>TY \ my Clip 0240 Clip<br>oars | 330 SC 4 7 285 SC<br>a i 4\b 0190 i | 10 Ib<br>Dimensions: P cH Nominal Force oe iy Nominal Force |<br>in. (mm) ome fb gg f° ae7h eeinstalled a or Installed |<br>, 647 SERIES = High-Performance Heat Sinks for Vertical Board Mounting 70-220 |<br>Standard Height Above Thermal Performance at Typical Load<br>P/N PC Boardin. (mm)“A” Maximumin. (mm)Footprint ConvectionNatural ConveFor c tioned Ibs.Weight(grams)<br>647-10ABP & 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 42°C @ 6W 3.8°C/W @ 200 LFM 0.055 (24.95)<br>647-15ABP a 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 37°C @ 6w 3.5°C/W @ 200 LFM 0.075 (34.02)<br>647-175ABP 1.750 (44.5) 1.650 (41.9) x 1.000 (25.4) 34°C @ BW 3.3°C/W @ 200 LFM 0.090 (40.82)<br>647-20ABP a 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 31°C @ BW 3.1°C/W @ 200 LFM 0.104 (47.17)<br>647-25ABP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 25°C @ 6W 2.8°C/W @ 200 LFM 0.125 (56.70)<br>Material: Aluminum, Black Anodized<br>Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed Products section for thermal interface materials, 126 Series silicone-free thermal compounds,<br>Circuit boards. Maximum semiconductor package width: 0.625 (15.9). Refer tothe Accessory —_and other accessoriesproducts, _ ;<br>MECHANICAL DIMENSIONS NATURAL AND FORCED<br>7 (25.4)1.000 |,r per ra >t 0.370 (9.4) 0.156 ryp.2) CONVECTIONAIR VELOCITY CHARACTERISTICS(LFM)<br>a | —| r (4.0) ~ 49 %—-200_ 4006008001000, =<br>Td xo TTT TT) uk<br>ee 2355—<br>im fea REF a rr ay.) 0.437 (14.1) (aga) REF Es 60 ae ee oe<br>—ao —_ , Ff=o DSSSK . yea rd<br>9333 nga 58z ZLd es |, 22<br>8.3) DIA THRU (TYP-3) 0.530 (13.5) (24) DIA bes 04s ODor<br>HOLE 0.720 (18.3) 647 SERIES Ye .eL TT TT) Pt td, -2<br>Dimensions: NOT PRESENT ON 1,000 (EXTRUSION PROFILE 5195) 0 4 8 12 16 20 |<br>in. (mm)MODEL 647-10ABP (2.4) POWER DISSIPATION (WATTS)<br>i<br>4 Normally stocked 45 All other products, please contact factory for price, delivery, and minimums.<br>**----- End of picture text -----**<br>


**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

**626 AND 627 SERIES** 

## _**High-Efficiency Heat Sinks for Vertical Board Mounting**_ 

|**626 AND 627 SERIES**|**626 AND 627 SERIES**<br>**_High-Efficiency Heat Sinks for Vertical Board Mounting_**|**_High-Efficiency Heat Sinks for Vertical Board Mounting_**|**_High-Efficiency Heat Sinks for Vertical Board Mounting_**||_TO-218, TO-220_|
|---|---|---|---|---|---|
|||**Height Above**|**Maximum**|**Thermal Performance at Typical Load**||
|**Standard**|**Standard**|**PC Board “A”**|**Footprint**|**Natural**|**Forced**|
|**P/N**|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|
|626-10ABP|627-10ABP|1.000 (25.4)|1.375 (34.9) x .500 (12.7)|76°C @ 6W|5.8°C/W @ 200 LFM|
|626-15ABP|627-15ABP|1.500 (38.1)|1.375 (34.9) x .500 (12.7)|65°C @ 6W|5.5°C/W @ 200 LFM|
|626-20ABP|627-20ABP|2.000 (50.8)|1.375 (34.9) x .500 (12.7)|55°C @ 6W|4.7°C/W @ 200 LFM|
|626-25ABP|627-25ABP|2.500(63-5)|1.375(34.9)x .500(12.7)|48°C@6W|4.2°C/M@200 LFM|
|**Wave-solderable pins.**Material: Aluminum, Black Anodized||Material: Aluminum, Black Anodized||||



**==> picture [456 x 224] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS 626 AND 627 SERIES NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>AIR VELOCITY (LFM)<br>500 A . D i,0 200 400 600,—§-§-—«s<br>rr«2m a sips2) E<eews 100»| ||TARPWN ><br>is 4 ns | —F és “COSC ST<br>G49) REFhi) e w000REF ai gt| YW MIN ew |<br>a @4 20 A SS<br>ae f _a eSsu ae "Ke 2yA| | |<br>bsp<br>oe 28m A<br>ea eeOa “VATPP<br>fr WITT0 4 8 rrri12 16<br>POWER DISSIPATION (WATTS)<br>[sores | type Device [Hole Diameters” | __Hole Height” | webbwteth"D” | Noten width” | Extrusion<br>2 SS, Yc) CL, ce,<br>a 2,<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


|**657 SERIES**<br>**_High-Performance Heat Sinks for Vertical Board Mounting_**|**657 SERIES**<br>**_High-Performance Heat Sinks for Vertical Board Mounting_**||_TO-220, TO-247, TO-218_|
|---|---|---|---|
||**Height Above**<br>**Maximum**<br>**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|**Standard**|**PC Board “A”**<br>**Footprint**<br>**Natural**|**Forced**|**Weight**|
|**P/N**|**in. (mm)**<br>**in. (mm)**<br>**Convection**|**Convection**|**lbs (grams)**|
|657-10ABP|657-10ABP<br>1.000 (25.4)<br>1.650 (41.9) x 1.000 (25.4)<br>41°C @ 6W<br>A|3.7°C/W @ 200 LFM|0.0515 (23.36)|
|657-15ABP|657-15ABP<br>1.500 (38.1)<br>1.650 (41.9) x 1.000 (25.4)<br>38°C @ 6W<br>3.3°C/W @ 200 LFM<br>0.0760 (34.60)<br>~~A~~|||
|657-20ABP|657-20ABP<br>2.000 (50.8)<br>1.650 (41.9) x 1.000 (25.4)<br>32°C @ 6W<br>2.9°C/W @ 200 LFM<br>0.1030 (47.00)<br>~~A~~|||
|657-25ABP<br>2.500(63.5)<br>1.650(41.9)x 1.000(25.4)<br>25°C@6W<br>2.7°C/W@200 LFM<br>0.1250(57.00)<br>~~a~~||||
|**Wave-solderable pins.**Material: Aluminum, Black Anodized||||



**==> picture [463 x 165] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS 657 SERIES NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>— (25.4)1.000 REF f— +—— A —| 0.156(4.0) TYP2 _ AIR VELOCITY (FPM)<br>t_, rd 0.093ey oa oSDS 1990TT200TTT400 600 800<br>a0 | ee 2S al<br>(41.9) REF | ge |_|| [| ertsace] TT<br>0062<br>0.870(17.0) o 1.000 OE col| Y/[esresV ,srzoane ash| |[eer<br> REF we 4) oe eS<br>tT Sea————S— j a2yu 40“CLot|  Nseecere™),Lapel=.“ es<br>A Tt<br>0.144 59 4 [Aer<br>(3.7) DIA THRU aso(216) | eefe “eeofl [| [tT] TT | | tT |<br>c 0 4 8 12 16<br>HEAT DISSIPATED (WATTS)<br>657 SERIES<br>(EXTRUSION PROFILE 6533)<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


All other products, please contact factory for price, delivery, and minimums. 

46 

Normally stocked 

**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

||**657 SERIES**<br>**Standard**<br>**P/N**<br>657-10ABPN<br>657-15ABPN<br>657-20ABPN<br>657-25ABPN<br>:|**_High-Performance Notched Heat Sinks for Vertical Board Mounting_**<br>**Height Above**<br>**Maximum**<br>**PC Board “A”**<br>**Footprint**<br>**in.(mm)**<br>**in.(mm)**<br>1.000 (25.4)<br>1.650 (41.9) x 1.000 (25.4)<br>1.500 (38.1)<br>1.650 (41.9) x 1.000 (25.4)<br>2.000 (50.8)<br>1.650 (41.9) x 1.000 (25.4)<br>2.500(63.5)<br>1.650(41.9)x 1.000(25.4)|**_High-Performance Notched Heat Sinks for Vertical Board Mounting_**<br>**Height Above**<br>**Maximum**<br>**PC Board “A”**<br>**Footprint**<br>**in.(mm)**<br>**in.(mm)**<br>1.000 (25.4)<br>1.650 (41.9) x 1.000 (25.4)<br>1.500 (38.1)<br>1.650 (41.9) x 1.000 (25.4)<br>2.000 (50.8)<br>1.650 (41.9) x 1.000 (25.4)<br>2.500(63.5)<br>1.650(41.9)x 1.000(25.4)|_TO-220, TO-247, TO-218_<br>**Thermal Performance at Typical Load**<br>**Natural**<br>**Forced**<br>**Convection**<br>**Convection**<br>41°C @ 6W<br>3.7°C/W @ 200 LFM<br>38°C @ 6W<br>3.3°C/W @ 200 LFM<br>32°C @ 6W<br>2.9°C/W @ 200 LFM<br>25°C@6W<br>2.7°C/W@200 LFM|
|---|---|---|---|---|
||**Wave-solderable pins.**Material: Aluminum, Black Anodized||||
|**MECHANICAL DIMENSIONS**<br>ao<br>i)|**MECHANICAL DIMENSIONS**<br>ao b-<br>062 REF<br>i)|**657 SERIES**<br>**657 SERIES**<br>**(EXTRUSION PROFILE 6533)**<br>A<br>093DIA<br>es 2<br>=<br>SEE A!<br>i<br>ae<br>_—__@—<br>!<br>(13.7)<br>(25.4)<br>7<br>|<br>PZ<br>+<br>MADATHRD<br>=<br>Aa<br>a7<br>—»|<br>850<br>fo<br>®<br>(21.6)|**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>AIRVELOCITY(LFM)<br>wSjq@__20_a00<br>eto<br>__ao0 sooo,<br>Se<br>FETTTTPTTrirrr?<br>yg<br>Ee gl) eran[TT<br>4 22<br>ae<br>ee<br>HE 4<br>ersuneels Be<br>ag<br>[TRE Tee<br>aa<br>Fz of |SScr reel<br>|, Sa<br>2 oo<br>Sa<br>2g oe<br>SS<br>ie<br>ao (tEtCrrrirtrttli, =<br>xz<br>0<br>4<br>8<br>12<br>6<br>0<br>®<br>POWERDISSIPATION (WATTS)||
||**657 SERIES**|**_High-Performance Heat Sinks with SpeedClips™ for Vertical Board Mounting_**||**_High-Performance Heat Sinks with SpeedClips™ for Vertical Board Mounting_**<br>_TO-220, TO-247, TO-218_|
|||**Height Above**<br>**Maximum**||**Thermal Performance at Typical Load**|
||**Standard**|**PC Board “A”**<br>**Footprint**||**Natural**<br>**Forced**|
||**P/N**|**in.(mm)**<br>**in.(mm)**||**Convection**<br>**Convection**|
||657-10ABPSC|1.000 (25.4)<br>1.650 (41.9) x 1.000 (25.4)||41°C @ 6W<br>3.7°C/W @ 200 LFM|
||657-15ABPSC|1.500 (38.1)<br>1.650 (41.9) x 1.000 (25.4)||38°C @ 6W<br>3.3°C/W @ 200 LFM|
||657-20ABPSC|2.000 (50.8)<br>1.650 (41.9) x 1.000 (25.4)||32°C @ 6W<br>2.9°C/W @ 200 LFM|
|657-25ABPSC<br>2.500(63.5)<br>1.650(41.9)x 1.000(25.4)<br>**Wave-solderable pins.**Material: Aluminum, Black Anodized<br>~~a~~<br>~~_~~||||25°C@6W<br>2.7°C/W@200 LFM|



## **MECHANICAL DIMENSIONS** 

**Dimensions: in. (mm)** 

## **MECHANICAL DIMENSIONS** 

## **657 SERIES** 

**NATURAL AND FORCED CONVECTION CHARACTERISTICS** INCLUDEDSPEEDCLIP™IN ORDER AIR VELOCITY (LFM) s— oh —] {gSwe G54) se ftp. i & ce& 00 Fesrnares|—| [iY EG gq[ | Y wreensc iwerl, (16.5)6 Weaooof Gi: 23suagr= 20°C| |“Se|[SSaaNCereSSpera?or] **657 SERIES** Se az 0eH,4 8. 2 6 **(EXTRUSION PROFILE 6533)** By .ALTTtritririrt,POWER DISSIPATION (WATTS) 

**Dimensions: in. (mm)** 

## **677 SERIES** 

## _**High-Performance, High-Power Heat Sinks for Vertical Board Mounting**_ 

|**677 SERIES**|**_High-Performance, High-Power Heat Sinks for Vertical Board Mounting_**|**_High-Performance, High-Power Heat Sinks for Vertical Board Mounting_**|**_High-Performance, High-Power Heat Sinks for Vertical Board Mounting_**|_TO-218, TO-220, TO-247_|
|---|---|---|---|---|
|||||_15-LEAD Multiwatt_|
||**Height Above**|**Maximum**|**Thermal Performance at Typical Load**||
|**Standard**|**PC Board “A”**|**Footprint**|**Natural**|**Forced**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|
|677-10ABP|1.000 (25.4)|1.650 (41.9) x 1.000 (25.4)|52°C @ 6W|3.1°C/W @ 200 LFM|
|677-15ABP|1.500 (38.1)|1.650 (41.9) x 1.000 (25.4)|46°C @ 6W|2.8°C/W @ 200 LFM|
|677-20ABP|2.000 (50.8)|1.650 (41.9) x 1.000 (25.4)|40°C @ 6W|2.5°C/W @ 200 LFM|
|677-25ABP|2.500(63.5)|1.650(41.9)x 1.000(25.4)|35°C@6W|2.2°C/W@200 LFM|
|**Wave-solderable pins.**|**Wave-solderable pins.**Material: Aluminum, Black Anodized||||



## **MECHANICAL DIMENSIONS** 

**==> picture [59 x 102] intentionally omitted <==**

**----- Start of picture text -----**<br>
677 SERIES<br>677 SERIES<br>(EXTRUSION PROFILE 8719)<br>**----- End of picture text -----**<br>


**NATURAL AND FORCED CONVECTION CHARACTERISTICS** 

**Dimensions: in. (mm)** 

All other products, please contact factory for price, delivery, and minimums. 

47 

Normally stocked 

**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

|**690 SERIES**<br>**_HIghest Efficiency/Lowest Unit Cost Heat Sinks_**<br>**Height Above**<br>**Standard**<br>**PC Board**<br>**Outline Dimensions**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>690-3B<br>1.310 (33.3)<br>1.860 (47.2)-sq<br>690-66B<br>1.310 (33.3)<br>1.860 (47.2)-sq<br>690-220B<br>1.310(33.3)<br>1.860(47.2)-sq<br>:|**_HIghest Efficiency/Lowest Unit Cost Heat Sinks_**<br>**Thermal Performance at Typical Load**<br>**Natural**<br>**Forced**<br>**Convection**<br>**Convection**<br>44°C @ 7.5W<br>2.0°C/W @ 400 LFM<br>44°C @ 7.5W<br>2.0°C/W @ 400 LFM<br>44°C@7.5W<br>2.0°C/W@400 LFM|**Semiconductor**<br>**Mounting**<br>**Hole Pattern**<br>(1) TO-3<br>(1) TO-66<br>(2)TO-220|**Semiconductor**<br>**Weight**<br>**lbs.(grams)**<br>0.0700 (31.75)<br>0.0700 (31.75)<br>0.0700(31.75)<br>_TO-3, TO-66, TO-220_|
|---|---|---|---|
|Material: Aluminum, Black Anodized||||



_TO-3, TO-66, TO-220_ 

semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting surface temperature rise above ambient air temperature of no more than 91°C. 

These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available in three standard types to mount and cool one TO-3 or TO-66 metal power semiconductor type or two plastic package TO-220 power semiconductor types. For higher power 

## **MECHANICAL DIMENSIONS** 

**==> picture [416 x 110] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>SEMICONDUCTOR MOUNTING HOLES<br>(7) DATIAY CONVECTION CHARACTERISTICS<br>8 HOLES) AIR VELOCITY (LFM)<br> 0 0.190 DIA THAU 0 0100 200 300 400 500 600_700 800 900 1000,<br>| (48) (TYP-2) 0.960 D515 1 ah crvP2) 5M<br>M {| (2)7|1.187 song ; (44) (19.1)a» " Tare Setgee ergeaerere<br>ne eas0.593 12} 23Bee k— | | 9257Be NQee| 20)oemael gopa ae<br>1.090 —|--za) ¢ O— 2-Hes) ¢ | | oan SoegtineaBH, || GEESee SERalSeb<br>690 SERIES fea gor es) ey oso BPX a a re<br>azoatry tt (1.8) (TYP-2) 0.156 OIA THRU NON 7<br>(66) (TYP “ones Nsay 0.190 POWER DISSIPATION (WATTS)<br>TO-3 TO-66 *TWO TO-220’S<br>**----- End of picture text -----**<br>


**==> picture [68 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


## **680 SERIES** 

## _**Maximum Efficiency Omnidirectional Heat Sinks**_ 

_TO-3,  TO-220_ 

||**Height Above**|**Horizontal Mounting**|**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**|**Semiconductor**||
|---|---|---|---|---|---|---|
|**Standard**<br>**PC Board “A”**||**Footprint Dimensions**|**Natural**|**Forced**|**Mounting**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**Hole Pattern**|**lbs.(grams)**|
|680-5A<br>~~A~~|0.500 (12.7)|1.810 (46.0)-sq|70°C @ 7.5W|3.0°C/W @ 400 LFM|(1) TO-3|0.0700 (31.75)|
|680-75A<br>A|0.750 (19.1)|1.810 (46.0)-sq|58°C @ 7.5W|2.4°C/W @ 400 LFM|(1) TO-3|0.0900 (40.82)|
|680-10A<br>A|1.000 (25.4)|1.810 (46.0)-sq|52°C @ 7.5W|2.0°C/W @ 400 LFM|(1) TO-3|0.0980 (44.45)|
|680-125A<br>1.250 (31.8)<br>A||1.810 (46.0)-sq|45°C @ 7.5W|1.5°C/W @ 400 LFM|(1) TO-3|0.1100 (49.90)|
|680-5220|0.500 (12.7)|1.810 (46.0)-sq|7O°C @ 7.5W|3.0°C/W @ 400 LFM|(2) TO-220|0.0700 (31.75)|
|680-75220|0.750 (19.1)|1.810 (46.0)-sq|58°C @ 7.5W|2.4°C/W @ 400 LFM|(2) TO-220|0.0900 (40.82)|
|680-10220<br>1.000 (25.4)<br>A||1.810 (46.0)-sq|52°C @ 7.5W|2.0°C/W @ 400 LFM|(2) TO-220|0.0980 (44.45)|
|680-125220<br>Material: Aluminum, Black Anodized<br>~~a~~|1.250(31.8)<br>Material: Aluminum, Black Anodized|1.810(46.0)-sq|45°C@7.5W|1.5°C/W@400 LFM|(2)TO-220|0.1100(49.90)|



Material: Aluminum, Black Anodized 

of air in natural convection applications. These 680 Series heat sinks can also be specified without any semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K). 

Achieve optimum natural convection cooling per unit volume occupied above the printed c i rcuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, when this low-cost heat sink is used. Any mounting attitude will provide free circ u l a t i o n 

**==> picture [461 x 200] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL (46.0) CONVECTION CHARACTERISTICSNATURAL AND FORCED<br>DIMENSIONS (38.1)1.500 0.156(4.0) 680 SERIES AIR VELOCITY (LFM)<br>0.100 200300 400 500 600 700 800 900<br>OO gyey<br>gee Lt gee ort<br>10 See Terra<br>“0 0Soe[eXa (38.1)1m i o3ags2 WRAereertht<br>Z = A baw 3) Seco (el tT Tl<br>| aig 7 258 «|Pee<br>1.560 AHH] \WO ((4 PLACE!S) SF< 49iA Gone a880-125 Pitt<br>(38.6) {8 PLACES) (33.3)1.310 (8 PLACES) (4). REF 0 POWER5 DISSIPATION10 15 (WATTS)20 2<br>SEMICONDUCTOR MOUNTING HOLES<br>A 220 K<br>0.190(4.8) DIA (2) A fig. 4 Gy0140 a oy<br>0200 "4 (10.9)ago (902)1.187 oor |. | | nn(20) R BLANK<br>a one NY” (3) 0086 NOWOLES<br>0070s 45° ase 08 0.190<br>Dimensions: in. (mm) (1) “A” gy (147) 42 7 (48)<br>TO-3 *TWO TO-220’S<br>**----- End of picture text -----**<br>


All other products, please contact factory for price, delivery, and minimums. 

48 

Normally stocked 

**Board Level Heat Sinks** 

## _**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**_ 

|**601 AND 603 SERIES**<br>**_Low-Height Heat Sinks_**|**601 AND 603 SERIES**<br>**_Low-Height Heat Sinks_**|**_Low-Height Heat Sinks_**||||_DO-4/DO-5 Diodes_|
|---|---|---|---|---|---|---|
||**Footprint**||**Mounting**|**Thermal Performance at Typical Load**|||
|**Standard**|**Dimensions**|**Height**|**Hole Dia.**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs.(grams)**|
|601E|2.000 (50.8) x 1.250 (31.8)|0.562 (14.3)|0.200 (5.1)|52°C @ 5.0W|4.5°C/W @ 175 LFM|0.0500 (22.68)|
|601F|2.000 (50.8) x 1.250 (31.8)|0.562 (14.3)|0.270 (6.9)|52°C @ 5.0W|4.5°C/W @ 175 LFM|0.0500 (22.68)|
|601K|2.000 (50.8) x 1.250 (31.8)|0.562 (14.3)|None|52°C @ 5.0W|4.5°C/W @ 175 LFM|0.0500 (22.68)|
|603K|2.000(50.8)x 2.000(50.8)|0.562(14.3)|None|41°C@5.0W|4.0°C/W@175 LFM|0.0810(36.74)|
|Material: Aluminum Alloy, Black Anodized|||||||



Use these low-height heat sinks on printed circuit board applications for TO-66 power semiconductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient 

heat dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or brackets using isolation hardware where necessary. 

## **MECHANICAL DIMENSIONS** 

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NATURAL AND FORCED<br>1.250 0.562 2,000 CONVECTION CHARACTERISTICS<br>(31.75) (14.3) (608) AIR VELOCITY (LFM)<br>E wx 1002 100200300400<br>— a Gh<br>pTPoae— Eeeeaf 380gtpWWe/- |TttT tTt T ttPPt t<br>2.000 —- az st ASX, | PTT Tt<br>E odie re aoNET<br>+ (50.8) -—}-|— (20.6) 29 » 7 | See tT tt<br>0.093 . OR AA<br>[-—+— (24) 4 fezw ifo Ltt| tT |ttitttT [ TT tT | tTy)<br>I 0 10 20 30 40<br>es POWER DISSIPATION (WATTS)<br>603 SERIES<br>601 SERIES (EXTRUSION PROFILE 1284)<br>(EXTRUSION PROFILE 1284)<br>SEMICONDUCTOR MOUNTING HOLES<br>K E F<br>0.200(6.1) DA THRU SkeeBOTH0.500 (12.7) (69) DIA THRU oo0.750ee (19.1<br>SIDES BOT Soce<br>NOBLANK HOLES . f tid<br>NI/ \S Ci<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


## **635 SERIES** _**Space-Saving Low-Cost Heat Sinks**_ 

_TO-3_ 

||**Height Above**||**Outline**|**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**|**Semiconductor**||
|---|---|---|---|---|---|---|---|
|**Standard**|**PC Board “A”**||**Dimensions**|**Natural**|**Forced**|**Mounting**|**Weight**|
|**P/N**|**in.(mm)**||**in.(mm)**|**Convection**|**Convection**|**Hole Pattern**|**lbs.(grams)**|
|635-5B2|0.500 (12.7)|1.900 (48.3) x 1.420 (36.0)|1.900 (48.3) x 1.420 (36.0)|90°C @ 8.0W|6.0°C/W @ 300 LFM|TO-3|0.0200 (9.07)|
|635-75B2|0.750 (19.1)|1.900 (48.3) x 1.420 (36.0)|1.900 (48.3) x 1.420 (36.0)|77°C @ 8.0W|4.8°C/W @ 300 LFM|TO-3|0.0220 (9.98)|
|635-10B2|1.000 (25.4)|1.900 (48.3) x 1.420 (36.0)|1.900 (48.3) x 1.420 (36.0)|61°C @ 8.0W|3.6°C/W @ 300 LFM|TO-3|0.024 (10.89)|
|635-125B2|1.250(31.8)|1.900|1.900(48.3)x 1.420(36.0)|53°C@8.0W|3.1°C/W@300 LFM|T0-3|0.028(12.70)|
|Material: Aluminum Alloy, Black Anodized|Material: Aluminum Alloy, Black Anodized|||||||



Use this low-cost TO-3 heat sink style for multiple TO-3 applications on a single printed circuit board, where two or more TO-3s must be placed in proximity and minimum space is 

available for heat sinking. Four different heights are available, all with TO-3 mounting hole pattern in the base. Consult factory for TO-66, TO-220, and multilead IC hole patterns. 

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MECHANICAL DIMENSIONS<br>635 SERIES<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


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NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>**----- End of picture text -----**<br>


All other products, please contact factory for price, delivery, and minimums. 

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