23071001

**Apalis Heatsink** HW Datasheet 

Apalis Heatsink Datasheet Revision History 

## **Revision History** 

## Document Revisions 

|**Date**|**Doc. **|**Revision**|**Product Version**|**Changes**|
|---|---|---|---|---|
|07-Nov-2014|Rev.|1.0|V1.0A|Initial release|
|13-Nov-2014|Rev.|1.1|V1.0A|Section 4: minor updates|
|25-Nov-2014|Rev.|1.2|V1.0A|Section 3: updated details<br>Section 5: updated fgure 1 (TIM pad thickness, Type 1)<br>Section 6.1: minor updates|
|||||Section 7: added compliance details|
|04-Apr-2016|Rev.|1.3|V1.0A|Section 4: updated compatible module list. Apalis Heatsink Type 3 can be used with Apalis<br>TK1 module|
|12-Jan-2017|Rev.|1.4|V1.0A|Section 4: updated compatible module list. Added Apalis iMX6D IT|
|07-Jul-2017|Rev.|1.5|V1.0A|Section 2: Added reference documents section<br>Section 3: Updated TIM Volume Resistivity value, added TIM supplier contact details|
|20-Dec-2017|Rev.|1.6|V1.0B|New product release V1.0B. New TIM details added to the document<br>Various small modifcations|
|26-Sep-2018|Rev.|1.7|V1.0B|Section 2: Added reference to compatible Fans and Screws|
|||||Section 3: Updated section headings|
|07-Nov-2018|Rev.|1.8|V1.0A (Type 4)|Section 4: Updated compatible module list. Added Apalis iMX8|
|||||Section 5: Added Apalis Heatsink Type 4 dimensional diagram|
|||||Updated section headings to include the Apalis Heatsink Type 4 V1.0B product version.|
|||||Various cosmetic improvements.|
|21-Jan-2021|Rev.|1.9|V1.0B|Section 2: Updated compatible Fan reference<br>Section 4: Updated compatible module list. Added Apalis iMX8X|
|||||Section 5: Updated Apalis Heatsink Type 4 mechanical drawing|
|||||Section 8: This section has been added to the document|
|||||Section 5: Added general tolerances|
|06-Oct-2022|Rev.|1.10|V1.0B|Section 6.1: Added details about screws maximum tightening torque|
|||||Section 7: Changed contact email address|
|||||Updated the document layout to follow the new standard template|
|||||Grammar and clarity improvements throughout the document|
|||||Section 2.1: Added link to Toradex Developer Website - Apalis Heatsink|
|||||Section 2.1: Added new Thermal Interface Material datasheet toSection 2.1.4|
|19-Sep-2025|Rev.|1.11|V1.0A (Type 0)<br>V1.0B (Type 1–4)|Section 2.1: Added supplier contact details toSection 2.1.6<br>Section 3: Reorganized content in Tables3and4<br>Section 3: Added technical specifcations for Apalis Heatsink Type 0 toTable 2|
|||||Section 4: Added Apalis Heatsink Type 0 toTable 5|
|||||Section 4: Highlighted EOL products onTable 5|
|||||Section 5: Added Apalis Heatsink Type 0 dimensions toSection 5.1|



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Apalis Heatsink Datasheet CONTENTS 

## **Contents** 

|**1**|**Abbreviations**|**Abbreviations**||**5**|
|---|---|---|---|---|
|**2**|**Introduction**|||**7**|
||2.1|Reference Documents<br>. . . . . . . . . . . . .|. . . . . . . . . . . . . . . . . . . . . . . . . . .|7|
|||2.1.1<br>Apalis Computer Modules . . . . . . .|. . . . . . . . . . . . . . . . . . . . . . . . . . .|7|
|||2.1.2<br>Toradex Developer Website - Apalis Heatsink . . . . . . . . . . . . . . . . . . . . . . .||7|
|||2.1.3<br>Toradex Developer Website - Apalis Carrier Boards . . . . . . . . . . . . . . . . . . .||7|
|||2.1.4<br>Thermal Interface Material (TSP600) Datasheets<br>. . . . . . . . . . . . . . . . . . . .||7|
|||2.1.5<br>Compatible Fan: Apalis Heatsink Fan|. . . . . . . . . . . . . . . . . . . . . . . . . . .|7|
|||2.1.6<br>TIM Supplier Contact Details<br>. . . . .|. . . . . . . . . . . . . . . . . . . . . . . . . . .|8|
|||2.1.6.1<br>CTX Thermal Solutions GmbH|. . . . . . . . . . . . . . . . . . . . . . . . . .|8|
|||2.1.6.2<br>Henkel AG & Co. KGaA . . . .|. . . . . . . . . . . . . . . . . . . . . . . . . . .|8|
|**3**|**Technical Specifications**|||**9**|
||3.1|Apalis Heatsink V1.0A (Type 0)<br>. . . . . . . .|. . . . . . . . . . . . . . . . . . . . . . . . . . .|9|
||3.2|Apalis Heatsink V1.0A (Type 1/2/3) . . . . . .|. . . . . . . . . . . . . . . . . . . . . . . . . . .|9|
||3.3|Apalis Heatsink V1.0B (Type 1/2/3) and V1.0A/V1.0B (Type 4) . . . . . . . . . . . . . . . . . .||10|
|**4**|**Compatibility**|||**11**|
|**5**|**Mechanical Dimensions**|||**12**|
||5.1|Heatsink Dimensions . . . . . . . . . . . . . .|. . . . . . . . . . . . . . . . . . . . . . . . . . .|12|
||5.2|General Tolerances . . . . . . . . . . . . . . .|. . . . . . . . . . . . . . . . . . . . . . . . . . .|14|
|**6**|**Assembly**|||**15**|
||6.1|Assembly procedure<br>. . . . . . . . . . . . . .|. . . . . . . . . . . . . . . . . . . . . . . . . . .|15|
|**7**|**Product Compliance**|||**17**|
|**8**|**Storage Requirements**|||**18**|



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Apalis Heatsink Datasheet LIST OF TABLES 

## **List of Tables** 

|1|Abbreviations<br>. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .|5|
|---|---|---|
|2|Technical Specifications - Apalis Heatsink V1.0A (Type 0)<br>. . . . . . . . . . . . . . . . . . .|9|
|3|Technical Specifications - Apalis Heatsink V1.0A (Type 1/2/3)<br>. . . . . . . . . . . . . . . . .|9|
|4|Technical Specifications - Apalis Heatsink V1.0B (Type 1/2/3) and V1.0A/V1.0B (Type 4) . .|10|
|5|Heatsink compatibility<br>. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .|11|
|6|Dimension tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .|14|
|7|Storage conditions for shelf life management . . . . . . . . . . . . . . . . . . . . . . . . . . .|18|



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Apalis Heatsink Datasheet LIST OF FIGURES 

## **List of Figures** 

|1|Apalis Heatsink dimensions (Type 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .|12|
|---|---|---|
|2|Apalis Heatsink dimensions (Type 1/2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .|13|
|3|Apalis Heatsink dimensions (Type 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .|14|
|4|Apalis Heatsink assembly<br>. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .|15|
|5|Removing the plastic film from the TIM<br>. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .|15|
|6|Align Apalis Heatsink screw holes with the fasteners<br>. . . . . . . . . . . . . . . . . . . . . .|16|
|7|Affix Apalis Heatsink with the system using M3 sized screws<br>. . . . . . . . . . . . . . . . .|16|



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Apalis Heatsink Datasheet Abbreviations 

## **1 Abbreviations** 

Table 1: Abbreviations 

|**Abbreviation**|**Explanation**|
|---|---|
|ADC|Analog to Digital Converter|
|CAN|Controller Area Network, a bus that is mainly used in the automotive and industrial environment|
|CAN FD|Controller Area Network Flexible Data-Rate, an extension to the original CAN bus protocol which allows higher data rates and<br>larger message sizes.|
|CEC|Consumer Electronic Control, HDMI feature that allows controlling CEC compatible devices|
|CPU|Central Processor Unit|
|CSI|Camera Serial Interface|
|DAC|Digital to Analog Converter|
|DDC|Display Data Channel, interface for reading out the capability of a monitor. In this document DDC2B (based on I2C) is always<br>meant.|
|DFP|Downstream Facing Port, USB Type-C port that acts as a host|
|DRP|Dual-Role Port, USB Type-C port that can operate as power sink and source|
|DSI|Display Serial Interface|
|DVI|Digital Visual Interface, digital signals are electrically compatible with HDMI|
|EDID|Extended Display Identifcation Data, timing setting information provided by the display in a PROM|
|EMI|Electromagnetic Interference, high-frequency disturbances|
|ESD|Electrostatic Discharge, high voltage spike or spark that can damage electrostatic-sensitive devices|
|FPD-Link|Flat Panel Display Link, high-speed serial interface for liquid crystal displays. In this document is also called the LVDS interface.|
|GBE|Gigabit Ethernet, Ethernet interface with a maximum data rate of 1000Mbit/s|
|GND|Ground|
|GND_CHASSIS|Chassis Ground|
|GPIO|General Purpose Input/Output, pin that can be confgured as an input or output|
|GSM|Global System for Mobile Communications|
|HDA|High-Defnition Audio (HD Audio), the digital audio interface between CPU and audio codec|
|I2C|Inter-Integrated Circuit, the two-wire interface for connecting low-speed peripherals|
|I2S|Integrated Interchip Sound, serial bus for connecting PCM audio data between two devices|
|I/O|Input-Output|
|JTAG|Joint Test Action Group, widely used debug interface|
|LCD|Liquid Crystal Display|
|LSB|Least Signifcant Bit|
|LVDS|Low-Voltage Diferential Signaling, electrical interface standard that can transport high-speed signals over twisted-pair cables.<br>Many interfaces like PCIe or SATA use this interface. Since the frst successful application was the Flat Panel Display Link, LVDS|
||became a synonymous for this interface. In this document, the term LVDS is used for the FPD-Link interface.|
|MAC|Medium Access Control is part of the second layer (data link layer) in the Ethernet stack|
|MIPI|Mobile Industry Processor Interface Alliance|
|MDI|Medium Dependent Interface, the physical interface between Ethernet PHY and cable connector|
|MDIO|Management Data Input/Output, an interface that is used for controlling the Ethernet PHY. The bus consists of the MDC clock<br>and the MDIO bidirectional data signal.|
|mini PCIe|PCI Express Mini Card, the card form factor for internal peripherals. The interface features PCIe and USB 2.0 connectivity|



_Continued on next page_ 

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Apalis Heatsink Datasheet Abbreviations 

Table 1: Abbreviations (Continued) 

|**Abbreviation**|**Explanation**|
|---|---|
|MMC|MultiMediaCard, fash memory card|
|MSB|Most Signifcant Bit|
|NC|Not Connected|
|OD|Open-Drain|
|OTG|USB On-The-Go, a USB host interface that can also act as USB client when connected to another host interface|
|PCB|Printed Circuit Board|
|PCI|Peripheral Component Interconnect, parallel computer expansion bus for connecting peripherals|
|PCIe|PCI Express, a high-speed serial computer expansion bus, replaces the PCI bus|
|PCM|Pulse-Code Modulation, digitally representation of analog signals, standard interface for digital audio|
|PD|Pull-Down Resistor|
|PHY|The physical layer of the OSI model|
|PU|Pull-up Resistor|
|PWM|Pulse-Width Modulation|
|PWR|Power|
|QSPI|Quad SPI, SPI interface with four bidirectional data signals|
|RGMII|Reduced Gigabit Media-Independent Interface, the interface between Ethernet MAC and PHY for up to 1Gb/s|
|RJ45|Registered Jack, common name for the 8P8C modular connector that is used for Ethernet wiring|
|RS232|The single-ended serial port interface|
|RS485|Diferential signaling serial port interface, half-duplex, multi-drop confguration possible|
|R-UIM|Removable User Identity Module, identifcations card for CDMA phones and networks, an extension of the GSM SIM card|
|SD|Secure Digital, fash memory card|
|SDIO|Secure Digital Input Output, an external bus for peripherals that uses the SD interface|
|SIM|Subscriber Identifcation Module, an identifcation card for GSM phones|
|SMBus|System Management Bus (SMB), a two-wire bus based on the I2C specifcations, is used in x86 designs for system management.|
|SoC|System on a Chip, IC which integrates the main component of a computer on a single chip|
|SoM|System on a Module, PCB which integrates the main component of a computer on a single board|
|SPI|Serial Peripheral Interface Bus, synchronous four-wire full-duplex bus for peripherals|
|TIM|Thermal Interface Material, thermally conductive material between CPU and heat spreader or heat sink|
|TMDS|Transition-Minimized Diferential Signaling, serial high-speed transmitting technology that is used by DVI and HDMI|
|TVS Diode|Transient-Voltage-Suppression Diode, a diode that is used to protect interfaces against voltage spikes|
|UFP|Upstream Facing Port, USB Type-C port that acts as a client|
|UART|Universal Asynchronous Receiver/Transmitter, serial interface, in combination with a transceiver an RS232, RS422, RS485, IrDA<br>or similar interface can be achieved|
|USB|Universal Serial Bus, serial interface for internal and external peripherals|



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Apalis Heatsink Datasheet Introduction 

## **2 Introduction** 

The Apalis Heatsink provides a complete thermal solution for Apalis modules. It is mounted directly onto Apalis carrier boards using four M3 screws, which can be fastened from the top side. 

For applications that require active cooling, there are additional threaded holes to attach a fan to the carrier board. 

## **2.1 Reference Documents** 

For detailed technical information about suitable computer modules, refer to the documents listed below. 

## **2.1.1 Apalis Computer Modules** 

An overview of the Apalis product family: 

https://www.toradex.com/computer-on-modules/apalis-arm-family 

## **2.1.2 Toradex Developer Website - Apalis Heatsink** 

https://developer.toradex.com/hardware/apalis-som-family/add-ons/apalis-heatsink/ 

## **2.1.3 Toradex Developer Website - Apalis Carrier Boards** 

https://developer.toradex.com/hardware/apalis-som-family/carrier-boards/ 

## **2.1.4 Thermal Interface Material (TSP600) Datasheets** 

The datasheets for the Thermal Interface Material (TIM) used on the Apalis Heatsink can be downloaded using the following links: 

## • **Apalis Heatsink V1.0A (Type 0)** : 

https://docs.toradex.com/117678-apalis-heatsink-tim-tgp5000-datasheet.pdf 

## • **Apalis Heatsink V1.0A (Type 1/2/3)** : 

https://docs.toradex.com/104905-apalis-heatsink-tim-tsp600-g35-datasheet.pdf 

## • **Apalis Heatsink V1.0B (Type 1/2/3) and V1.0A/V1.0B (Type 4)** : 

https://docs.toradex.com/104906-apalis-Heatsink-tim-tsp600-z45-datasheet.pdf 

## **2.1.5 Compatible Fan: Apalis Heatsink Fan** 

https://developer.toradex.com/hardware/apalis-som-family/add-ons/apalis-heatsink-fan/ 

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Apalis Heatsink Datasheet Reference Documents 

## **2.1.6 TIM Supplier Contact Details** 

## **2.1.6.1 CTX Thermal Solutions GmbH** 

Lötscher Weg 104 D-41334 Nettetal, Germany Phone: +49 2153 7374-0 Fax: +49 2153 7374-10 Email: info@ctx.eu Website: https://www.ctx.eu 

## **2.1.6.2 Henkel AG & Co. KGaA** 

Henkelstraße 67 D-40589 Düsseldorf, Germany Phone: +49-211-797-0 Email: info.klebstoffe.dech@henkel.com Website: https://next.henkel-adhesives.com 

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Apalis Heatsink Datasheet Technical Specifications 

## **3 Technical Specifications** 

## **3.1 Apalis Heatsink V1.0A (Type 0)** 

Table 2: Technical Specifications - Apalis Heatsink V1.0A (Type 0) 

|**Property**|**Value**|**Remarks**|
|---|---|---|
|Material|Aluminum alloy AL6063-T5||
|Coating|Black anodized||
|Thermal conductivity|190–221 W/(m·K)|Valid for temperature range 40–100 °C|
|Weight|39 g||
|||Refer to the TGP 5000 Datasheet for specifc|
|Thermal Interface Material|TGP 5000|information on Density, Temperature, and re-<br>lated specifcations.|
|Thermal resistance (Module-Alu)|TBD|Temperature of the module measured by on-<br>module thermal sensor|
|Thermal resistance (Alu-Ambient without fan)|< 5.9 °C/W||
|||Test fan details:|
|Thermal resistance (Alu-Ambient with fan)|< 2.9 °C/W|Dimensions: 40 × 40 × 10 mm (L × W × H)<br>Speed: 4000 RPM<br>Airfow: 4.81 CFM|



## **3.2 Apalis Heatsink V1.0A (Type 1/2/3)** 

Table 3: Technical Specifications - Apalis Heatsink V1.0A (Type 1/2/3) 

|**Property**|**Value**|**Remarks**|
|---|---|---|
|Material|Aluminum alloy AL6063-T5||
|Coating|Black anodized||
|Thermal conductivity|190–221 W/(m·K)|Valid for temperature range 40–100 °C|
|Weight|39 g||
|||Refer to theTSP600-G35 Datasheetfor specifc|
|Thermal Interface Material|TSP600-G35|information on Density, Temperature, and re-<br>lated specifcations.|
|Thermal resistance (Module-Alu)|TBD|Temperature of the module measured by on-<br>module thermal sensor|
|Thermal resistance (Alu-Ambient without fan)|< 5.9 °C/W||
|||Test fan details:|
|Thermal resistance (Alu-Ambient with fan)|< 2.9 °C/W|Dimensions: 40 × 40 × 10 mm (L × W × H)<br>Speed: 4000 RPM<br>Airfow: 4.81 CFM|



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Apalis Heatsink Datasheet Apalis Heatsink V1.0B (Type 1/2/3) and V1.0A/V1.0B (Type 4) 

## **3.3 Apalis Heatsink V1.0B (Type 1/2/3) and V1.0A/V1.0B (Type 4)** 

Table 4: Technical Specifications - Apalis Heatsink V1.0B (Type 1/2/3) and V1.0A/V1.0B (Type 4) 

|**Property**|**Value**|**Remarks**|
|---|---|---|
|Material|Aluminum alloy AL6063-T5||
|Coating|Black anodized||
|Thermal conductivity|190–221 W/(m·K)|Valid for temperature range 40–100 °C|
|Weight|39 g||
|||Refer to theTSP600-Z45 Datasheetfor specifc|
|Thermal Interface Material|TSP600-Z45|information on Density, Temperature, and re-<br>lated specifcations.|
|Thermal resistance (Module-Alu)|TBD|Temperature of the module measured by on-<br>module thermal sensor|
|Thermal resistance (Alu-Ambient without fan)|< 5.9 °C/W||
|||Test fan details:|
|Thermal resistance (Alu-Ambient with fan)|< 2.9 °C/W|Dimensions: 40 × 40 × 10 mm (L × W × H)<br>Speed: 4000 RPM<br>Airfow: 4.81 CFM|



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Apalis Heatsink Datasheet Compatibility 

## **4 Compatibility** 

There are multiple types of Apalis heatsinks. Each type is compatible with specific Apalis modules. 

The Apalis Heatsink Types 1, 3 and 4 have reached End-of-life (EOL) status. Moving forward, the Apalis Heatsink Type 0 is the supported replacement. For more information, see the PCN document available on the Apalis Heatsink product page. 

The following table shows the compatibility between Apalis heatsinks and Apalis modules: 

Table 5: Heatsink compatibility 

|**Apalis**|**Module**|**Compatible Apalis Heatsink**|
|---|---|---|
|Apalis<br>Apalis|iMX6Q IT<br>iMX6D IT|23051000 Apalis Heatsink Type 1 V1.0A (EOL)<br>23051001 Apalis Heatsink Type 1 V1.0B (EOL)<br>23151000 Apalis Heatsink Type 0 V1.0A|
|Apalis|T30|23061000 Apalis Heatsink Type 2 V1.0A (EOL)<br>23061001 Apalis Heatsink Type 2 V1.0B|
|Apalis|iMX6Q|23071000 Apalis Heatsink Type 3 V1.0A (EOL)|
|Apalis|iMX6D|23071001 Apalis Heatsink Type 3 V1.0B (EOL)|
|Apalis|TK1|23151000 Apalis Heatsink Type 0 V1.0A|
|Apalis|iMX8|23081000 Apalis Heatsink Type 4 V1.0A (EOL)<br>23151000 Apalis Heatsink Type 0 V1.0A|
|Apalis|iMX8|23081001 Apalis Heatsink Type 4 V1.0B (EOL)|
|Apalis|iMX8X|23151000 Apalis Heatsink Type 0 V1.0A|



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Apalis Heatsink Datasheet Mechanical Dimensions 

## **5 Mechanical Dimensions** 

The following drawings illustrate the mechanical dimensions of the Apalis Heatsink. All measurements are in millimeters (mm). 

## **5.1 Heatsink Dimensions** 

Figure 1: Apalis Heatsink dimensions (Type 0) 

**==> picture [388 x 236] intentionally omitted <==**

**----- Start of picture text -----**<br>
 25.0<br> 3.5   75.0<br> 4.0  Ir<br> 14.8<br>_— Od<br> 24.0±0.5<br> 51.0   59.0<br>32.0<br>28.0±0.5<br> 27.0±0.5<br>L<br>Gap Pad Bergquist TGP 5000 Protection foil is attached to Gap Pad<br>**----- End of picture text -----**<br>


**==> picture [225 x 75] intentionally omitted <==**

**----- Start of picture text -----**<br>
TF"  82.0<br> 9.8<br>Sie  3.175<br>**----- End of picture text -----**<br>


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Apalis Heatsink Datasheet ~~Heatsink Di~~ mensions 

Figure 2: Apalis Heatsink dimensions (Type 1/2/3) 

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Apalis Heatsink Datasheet General Tolerances 

Figure 3: Apalis Heatsink dimensions (Type 4) 

## **5.2 General Tolerances** 

Unless ~~explicitly specified, the following tolerances apply to the product:~~ 

~~Table 6: Dimension tolerances~~ 

|**Dimen**~~**sion Range (mm)**~~|~~**Tolera**~~**nce (mm)**|
|---|---|
|Over 1000|±1.20|
|400–1000|±0.80|
|120–400|±0.50|
|30–120|±0.30|
|6–30|±0.20|
|0.5–6|±0.10|



_Note_ : Radius or chamfer angle is less than 0.5° if not indicated. 

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Apalis Heatsink Datasheet Assembly 

## **6 Assembly** 

Assembly must be done carefully, as placing the Apalis heatsink in the wrong orientation can damage the Apalis module or prevent the system from working correctly. The illustration below shows how to attach the heatsink solution. 

Figure 4: Apalis Heatsink assembly 

## **6.1 Assembly procedure** 

The following procedure demonstrates how to attach the Apalis Heatsink to the Apalis module to complete the heatsink solution. Read the instructions and follow the procedure carefully to ensure the module is not damaged. Take the necessary precautions to avoid electrostatic charge build-up. 

1. Clean the top surface of the processor using an anti-static cloth. 

2. Insert the Apalis module into the MXM socket X1 on the Apalis carrier board. 

3. Carefully remove the plastic film from the TIM. 

Figure 5: Removing the plastic film from the TIM 

4. Carefully align mounting holes {1}, {2}, {3}, and {4} on the Apalis Heatsink with the fasteners on the Apalis carrier board. Place the Apalis Heatsink on the system. 

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Page 15 

Apalis Heatsink Datasheet Assembly procedure 

Figure 6: Align Apalis Heatsink screw holes with the fasteners 

5. Use four M3 screws to affix the Apalis heatsink to the system. The maximum tightening torque specified by the spacers on the Apalis carrier board is 0.2 Nm. 

   - Figure 7: Affix Apalis Heatsink with the system using M3 sized screws 

The system is now ready for use. For applications that may result in prolonged processor overheating— either due to environmental conditions (such as high ambient temperature) or high computational load— a DC fan can be mounted on top of the Apalis heatsink using four 2.5 mm screws. 

For most end applications, an additional heatsink fan is not required. 

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Apalis Heatsink Datasheet Product Compliance 

## **7 Product Compliance** 

Up-to-date information about product compliance (such as RoHS, CE, UL 94, conflict minerals, REACH and more) can be found on our website at https://www.toradex.com/support/product-compliance. 

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Apalis Heatsink Datasheet Storage Requirements 

## **8 Storage Requirements** 

Shelf life is the period during which a product is expected to remain within its approved specifications when stored under defined conditions. 

The most significant factor limiting the Apalis Heatsink’s shelf life is the Mylar film used to protect the TIM when the product is not assembled on the computer module. 

The following table shows the storage requirements and shelf life of the Apalis Heatsink. 

Table 7: Storage conditions for shelf life management 

|**Storage measures**|**Ambient atmosphere**|**Storage temperature**|**Storage relative humidity**|**Maximum storage time**|
|---|---|---|---|---|
|Original packing|Air|20°C to 30°C|40% to 60%|24 months|



Note that short periods of exposure to slightly off-specification environmental conditions will not significantly affect shelf life. 

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Apalis Heatsink Datasheet Disclaimer 

## **DISCLAIMER** 

Copyright © Toradex AG. All rights are reserved. The information and content in this document are provided “as-is” with no warranties of any kind and are for informational purposes only. Data and information have been carefully checked and are believed to be accurate; however, no liability or responsibility for any errors, omissions or inaccuracies is assumed. 

Brand and product names are trademarks or registered trademarks of their respective owners. Specifications are subject to change without notice. 

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