1812460000

**Data sheet** 

**OMNIMATE Signal - series BL/SL 5.08 SL-SMART 5.0XHC/03/180 1.5SN BK RL** 

**Weidmüller Interface GmbH & Co. KG** Klingenbergstraße 26 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com 

## **Product image** 

High-temperature resistant, modular pin header. Packed in tape with 1.5mm solder pin, optimised for automatic assembly and suitable for reflow soldering. The male connectors provide space for labelling and can be coded. HC = High Current. 

## **General ordering data** 

|Type|SL-SMART 5.0XHC/03/180 1.5SN BK RL|
|---|---|
|Order No.|1812460000|
|Version|PCB plug-in connector, male header, open side,|
||THT/THR solder connection, 5.00 mm, Number|
||of poles: 3, 180°, Solder pin length (l): 1.5 mm,|
||tinned, black, Tape|
|GTIN(EAN)|4032248294046|
|Qty.|270pc(s).|
|Product data|IEC: 400 V / 27.5 A|
||UL: 300 V/15 A|
|Packaging|Tape|



Creation date September 10, 2020 5:14:11 AM CEST 

Catalogue status 28.08.2020 / We reserve the right to make technical changes. 

1 

**Data sheet** — **OMNIMATE Signal - series BL/SL 5.08 SL-SMART 5.0XHC/03/180 1.5SN BK RL** 

## **Technical data** ~~Ld~~ 

**Weidmüller Interface GmbH & Co. KG** Klingenbergstraße 26 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com ~~a~~ 

## **Dimensions and weights** 

|Width(inches)|0.591 inch|
|---|---|
|Height(inches)|0.531 inch|
|Depth|8.3 mm|
|Net weight|2.363 g|



|Width|15 mm|
|---|---|
|Height|13.5 mm|
|Height of lowest version|12 mm|
|Depth (inches)|0.327 inch|
|**System specifications**||
|Product family|OMNIMATE Signal - series|
||BL/SL 5.08|
|Mounting onto the PCB|THT/THR solder|
||connection|
|Pitch in inches(P)|0.197 inch|
|Number ofpoles|3|
|Solderpin length(l)|1.5 mm|
|Tolerance of solderpinposition|± 0.1 mm|
|Solder eyelet hole diameter(D)|1.4 mm|
|L1 in mm|10 mm|
|Number of rows|1|
|Volume resistance|≤ 5mΩ|
|Pluggingcycles|25|
|Pluggingforce/pole,max.|8.5 N|
|Pulling force/pole, max.|8 N|



|Product family|OMNIMATE Signal - series|Type of connection||
|---|---|---|---|
||BL/SL 5.08||Board connection|
|Mounting onto the PCB|THT/THR solder|Pitch in mm (P)||
||connection||5 mm|
|Pitch in inches(P)|0.197 inch|Outgoingelbow|180°|
|Number ofpoles|3|Number of solderpinsperpole|1|
|Solderpin length(l)|1.5 mm|Solderpin length tolerance|0/-0.3 mm|
|Tolerance of solderpinposition|± 0.1 mm|Solderpin dimensions|d = 1.2 mm,Octagonal|
|Solder eyelet hole diameter(D)|1.4 mm|Solder eyelet hole diameter tolerance(D)<br>+ 0,1 mm||
|L1 in mm|10 mm|L1 in inches|0.394 inch|
|Number of rows|1|Pin seriesquantity|1|
|Volume resistance|≤ 5mΩ|Can be coded|Yes|
|Pluggingcycles|25|Pluggingforce/pole,min.|5.5 N|
|Pluggingforce/pole,max.|8.5 N|Pullingforce/ pole,min.|5 N|
|Pulling force/pole, max.|8 N|||
|**Material data**||||
|Insulatingmaterial|LCP GF|Colour|black|
|Colour chart(similar)|RAL 9011|Insulatingmaterialgroup|IIIa|
|Comparative Tracking Index (CTI)|≥ 175|Insulation strength|≥ 108Ω|
|Moisture Level(MSL)|1|UL 94 flammabilityrating|V-0|
|GWIT|930 °C|GWFI|960 °C|
|Contact material|CuMg|Contact surface|tinned|
|Layer structure of solder connection|1...3 µm Ni / 2...4 µm Sn|Layer structure of plug contact|1...3 µm Ni / 2...4 µm Sn|
||matt||matt|
|Storage temperature,min.|-40 °C|Storage temperature,max.|70 °C|
|Operatingtemperature,min.|-50 °C|Operatingtemperature,max.|100 °C|
|Temperature range, installation, min.|-30 °C|Temperature range, installation, max.|100 °C|
|**Rated data acc. to IEC**||||
|tested acc. to standard||Rated current, min. number of poles||
||IEC 60664-1,IEC 61984|(Tu=20°C)|27.5 A|
|Rated current, max. number of poles||Rated current, min. number of poles||
|(Tu=20°C)|19 A|(Tu=40°C)|24 A|
|Rated current, max. number of poles||Rated voltage for surge voltage class /||
|(Tu=40°C)|16.5 A|pollution degree II/2|400 V|
|Rated voltage for surge voltage class /||Rated voltage for surge voltage class /||
|pollution degree III/2|320 V|pollution degree III/3|250 V|
|Rated impulse voltage for surge voltage||Rated impulse voltage for surge voltage||
|class/ pollution degree II/2|4 kV|class/ pollution degree III/2|4 kV|
|Rated impulse voltage for surge voltage||||
|class/ contamination degree III/3|4 kV|||



Creation date September 10, 2020 5:14:11 AM CEST 

Catalogue status 28.08.2020 / We reserve the right to make technical changes. 

2 

**Data sheet** 

## **OMNIMATE Signal - series BL/SL 5.08 SL-SMART 5.0XHC/03/180 1.5SN BK RL** 

## **Technical data** ~~ass~~ 

**Weidmüller Interface GmbH & Co. KG** Klingenbergstraße 26 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com ~~so~~ 

## **Rated data acc. to CSA** 

|**Rated data acc. to CSA**||||
|---|---|---|---|
|Institute (CSA)|Co|Certificate No. (CSA)|200039-1176845|
|Rated voltage(UsegroupB/CSA)|300 V|Rated voltage(UsegroupD/CSA)|300 V|
|Rated current(UsegroupB/CSA)|15 A|Rated current(UsegroupD/CSA)|15 A|
|Reference to approval values|Specifications are|||
||maximum values, details -|||
||see approval certificate.|||
|**Rated data acc. to UL 1059**||||
|Institute (UR)<br>Rated voltage(UsegroupB/UL 1059)|300 V<br>~~i~~|Certificate No. (UR)<br>Rated voltage(UsegroupD/UL 1059)|E60693<br>300 V|
|Rated current(UsegroupB/UL 1059)|15 A|Rated current(UsegroupD/UL 1059)|10 A|
|Reference to approval values|Specifications are|||
||maximum values, details -|||
||see approval certificate.|||
|**Packing**||||
|Packaging|Tape|VPE length|35 mm|
|VPE width|330 mm|VPE height|330 mm|
|Tape depth(T2)|16.25 mm|Tape width(W)|32 mm|
|Tapepocket depth(K0)|15.75 mm|Tapepocket height(A0)|8 mm|
|Tapepocket width(B0)|0 mm|Tapepocket separation(P1)|16 mm|
|Tape hole separation(E)|1.75 mm|Tapepocket separation(F)|14.2 mm|
|Tape reel diameter ∅ (A)|330 mm|Surface resistance|Rs = 109- 1012Ω|
|**Classifications**||||
|ETIM 6.0|EC002637|ETIM 7.0|EC002637|
|eClass 9.0|27-44-04-02|eClass 9.1|27-44-04-02|
|eClass 10.0|27-44-04-02|UNSPSC|30-21-18-10|
|**Notes**||||
|Notes|• Gold-plated contact surfaces on request|||
||• Rated current related to rated cross-section & min. No. of poles.|||
||• P on drawing = pitch|||
||• Rated data refer only to the component itself. Clearance and creepage distances to other components are to|Rated data refer only to the component itself. Clearance and creepage distances to other components are to||
||be designed in accordance with the relevant application standards.|be designed in accordance with the relevant application standards.||
||• Longterm storage of theproduct with average temperature of 50 °C and average humidity70%, 36 months|||
|IPC conformity|Conformity: The products are developed, manufactured and delivered according international recognized||Conformity: The products are developed, manufactured and delivered according international recognized|
||standards and norms and comply with the assured properties in the data sheet resp. fulfill decorative properties|||
||in accordance with IPC-A-610 "Class 2". Further claims on the products can be evaluated on request.|||



Creation date September 10, 2020 5:14:11 AM CEST 

Catalogue status 28.08.2020 / We reserve the right to make technical changes. 

3 

**Data sheet** 

## **OMNIMATE Signal - series BL/SL 5.08 SL-SMART 5.0XHC/03/180 1.5SN BK RL** 

## **Technical data** ~~ass~~ 

**Weidmüller Interface GmbH & Co. KG** Klingenbergstraße 26 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com ~~So~~ 

## **Approvals** 

|**Approvals**||
|---|---|
|Approvals||
|ROHS|Conform|
|**Downloads**||
|Approval/Certificate/Document of||
|Conformity|Declaration of the Manufacturer|
|Brochure/Catalogue|FL DRIVES EN|
||MB DEVICE MANUF. EN|
||FL DRIVES DE|
||CAT 2 PORTFOLIOGUIDE EN|
||FL BUILDING SAFETY EN|
||FL APPL LED LIGHTING EN|
||FL INDUSTR.CONTROLS EN|
||FL MACHINE SAFETY EN|
||FL HEATING ELECTR EN|
||FL APPL_INVERTER EN|
||FL_BASE_STATION_EN|
||FL ELEVATOR EN|
||FL POWER SUPPLY EN|
||FL 72H SAMPLE SER EN|
||PO OMNIMATE EN|
|EngineeringData|STEP|
|White paper surface mount technology|Download Whitepaper|



Creation date September 10, 2020 5:14:11 AM CEST 

Catalogue status 28.08.2020 / We reserve the right to make technical changes. 

4 

**Data sheet** 

## **OMNIMATE Signal - series BL/SL 5.08 SL-SMART 5.0XHC/03/180 1.5SN BK RL** 

## **Drawings** 

**Weidmüller Interface GmbH & Co. KG** Klingenbergstraße 26 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com 

## **Dimensional drawing** 

## **Dimensional drawing** 

## **Dimensional drawing** 

## **Example of use** 

## **Product benefits** 

Safe power transmission Proven properties 

Creation date September 10, 2020 5:14:11 AM CEST 

Catalogue status 28.08.2020 / We reserve the right to make technical changes. 

5 

## 

**Weidmüller Interface GmbH & Co. KG** Klingenbergstraße 16 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com 

## **Single Wave:** 

**==> picture [432 x 446] intentionally omitted <==**

**----- Start of picture text -----**<br>
Contact time appr. 3 sec.<br>260 255 °C o s , 260 °C<br>240 250 °C I ~,.N\<br>\ [‘]<br>220 \\ [N] N [N] N<br>LON<br>200180 .\1\\ [.][N] SS\SsN.<br>160 \\\Str ‘\‘S‘S<br>wT “oy, “w<br>140 od° oNs\ "he,a> S.ss<br>12010080 Preheating :o.;7” .’Pua&&Pia4.-As-A.ue<ormeee7eeerrccCi7”Y11hae.~s- 7   appr. 150 °C \ny\\ny\\‘ wy£2.2>""y“ Cooling rate < 6 °K/s SS“>soy.‘s>“sDo~aTa“ss—m~. =~areTaaaooo-<br>;Fe ./4 -.- S.‘<br>6040 ¢Fa¢?me47soMosenooheSa--o “7“7“ ‘‘‘s.SS —=a-. Typical process        Prozess limits<br>20 Sa Heating rate < 3 °K/s “es Temperature on board<br>0<br>0  20  40  60  80  100  120  140  160  180  200  220  240<br>time [s]<br>Double Wave:<br>260 255 °C — 260 °C<br>Total contact time max. 10 sec. Q 250 °C<br>240<br>220<br>200<br>180<br>\<br>160 eee sue\\<br>140120100 Preheating a?’.a”oa a..ue °°&.SS£ 7*.“eS?ny“ocd;7 appr. 150°C [RO\‘\‘\‘‘ NS>NOS.°WSesyO~~>-°°~~ ~~~<br>8060 a?-o7747 *Aefre/&°oo&&4aea7”’ \‘‘‘‘\ Cooling rate < 6 °K/s ‘‘ >cS““Sse°“asD>,-_;-:<br>o* A. “ Typical process<br>40 Prie"7-- neeiteer<r — Process limits<br>20 Heating rate < 3 °K/s Temperature on board<br>0<br>0  20  40  60  80  100  120  140  160  180  200  220  240<br>time [s]<br>Temperature [°C]<br>Temperature  [°C]<br>**----- End of picture text -----**<br>


## 

Wired connection elements should be processed in accordance with the DIN EN 61760-1 standard. We have included two recommendations for practical wave soldering profiles, with which Weidmüller PCB terminals and connectors are qualified. 

- PCB thickness 

- Proportion of Cu in the layers 

- Single/double-sided assembly 

- Product range 

- Heating and cooling rates 

soldering temperature of 260°C. In practice, the maximum soldering temperature is quite often well below the above maximum profile. 

We reserve the right to make technical changes. 

## 

**Weidmüller Interface GmbH & Co. KG** Klingenbergstraße 16 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com 

**==> picture [510 x 255] intentionally omitted <==**

**----- Start of picture text -----**<br>
300<br>oe 254 °C<br>250 245 °C - aa<br>235 °C oo x<br>Melting point lead-free solder paste<br>217 o awe Ss<br>190 °C approx.  XN XN<br>200 vane yr 60 s > 217 °C XN<br>XN \<br>180 °C Pad , N \<br>----7 _-7 \ \ \ \<br>150 77 \ N\<br>preheating , o7 a Cooling rate: < 6 °K/s . ‘ \<br>100 o \<br>of \<br>o a \<br>aa Heating rate: < 3 °K/s \<br>a \<br>50 &<br>a<br>& — Continuous line: Typical process<br>a 7 -_ — Dotted line:   Process limits<br>0<br>0  50  100  150  200  250  300  350<br>Temperature [°C]<br>**----- End of picture text -----**<br>


**Time [sec]** 

## 

But there are more than one correct answer: The diagram of temperature-on-time is related to processing features of solder paste and to maximum load of components. 

We have to consider the following parameters: 

- Time for pre heating 

- Maximum temperature 

- Time above melting point 

- Time for cooling 

- Maximum heating rate 

- Maximum cooling rate 

prepared smoothly for the solder phase. Heating rate is typically  ≤ +3K/s. In parallel the solder paste is ‚activated’. The time above melting point of 217°C the paste gets liquid and components and boards begin to connect. The maximum temperature of 245°C to 254°C should stay between 10 and 40 seconds. In the cooling phase at ≥ -6K/s solder is cured. Board and components cool down while avoiding cold cracks. 

We reserve the right to make technical changes.