Cooling & Thermal Management

Thermal Insulator, Thermaflex Tube, TO-3P, Silicone Extrusion, 0.7 W/m.K, 8 kV, 0.5 mm

THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K

THERMAL JUMPER, ALUMI NITRIDE, 170 W/M.K

THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K

THERMAL JUMPER, ALUMI NITRIDE, 170 W/M.K

THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K

THERMAL JUMPER, ALUMI NITRIDE, 170 W/M.K

THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K

THERMAL JUMPER, ALUMI NITRIDE, 170 W/M.K

THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K

THERMAL JUMPER, ALUMI NITRIDE, 170 W/M.K

THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K

Thermal Jumper, THJP Series, Aluminium Nitride, 15°C/W, 2512

Thermal Insulator, Transistor Case Insulator Pad, TO-218, Pack25, Carbon, 0.178 mm

Phase Change Material, Thermally Conductive, 3.5W/m.K, 1kg

Heat Sink, TO-220, 9 °C/W, TO-220, 42 mm, 13 mm, 38 mm

Heat Sink, Square, PCB, Twisted Fin, 14.2 °C/W, TO-126, TO-220, 30 mm, 12.7 mm, 30.2 mm

Heat Sink, PCB, Board Level, 17 °C/W, TO-126, TO-220, 30 mm, 30.2 mm, 12.7 mm

Heat Sink, PCB, Board Level, 21 °C/W, TO-126, 22 mm, 19 mm, 19 mm

Heat Sink, PCB, Board Level, 9.9 °C/W, TO-218, TO-220, 28 mm, 22 mm, 38 mm

Heat Sink, 30 °C/W, TO-220, 22 mm, 11 mm, 19 mm

Heat Sink, PCB, Board Level, 21.6 °C/W, TO-126, 22 mm, 19 mm, 19 mm

Heat Sink, TO-220, TO-218, 20 °C/W, TO-220, 31.7 mm, 10.2 mm, 17.8 mm

Heat Sink, TO-220, TO-247, 60 mm, 25 mm, 38.6 mm

Heat Sink, TO-220, TO-247, 60 mm, 25 mm, 38.6 mm

Heat Sink, IXYS, TO-220, TO-247, 33.9 mm, 39.5 mm, 27 mm

Heat Sink, IXYS, TO-220, TO-247, 33.9 mm, 39.5 mm, 55 mm

Heat Sink, IXYS, TO-220, TO-247, 33.9 mm, 39.5 mm, 27 mm

Heat Sink, IXYS, TO-220, TO-247, 33.9 mm, 39.5 mm, 55 mm

Heat Sink, 209 W/m.K, TGHE, 48.7 mm, 30 mm, 35 mm