STM32WB5MMG

**STM32WB5MMG** 

Datasheet 

## Bluetooth[®] LE and 802.15.4 module 

## **Features** 

- Includes STMicroelectronics state-of-the-art patented technology 

- Integrated chip antenna 

- Bluetooth[®] LE, Zigbee[®] 3.0, OpenThread certified 

- Dynamic and static concurrent modes 

- IEEE 802.15.4-2011 MAC PHY 

These pictures are not contractual 

- Supports 2 Mbits/s 

- Frequency band 2402-2480 MHz 

- Advertising extension 

- Tx output power up to +6 dBm 

- Rx sensitivity: -96 dBm (Bluetooth[®] LE at 1 Mbps), -100 dBm (802.15.4) 

**Product status link** STM32WB5MMG 

|**Product summary**|**Product summary**|
|---|---|
|**Order code**|STM32WB5MMG|
|**Temperature**<br>**range**|-40 °C to 85 °C|
|**Package**|LGA86L 7.3 × 11|
|**Package**<br>**dimensions (mm)**|7.3 x 11 x 1.382 x<br>0.450 pitch|
|**Packaging**|Tape and reel|



- Range: up to 75 meters 

- Dedicated Arm[®] Cortex[®] -M0+ CPU for radio and security tasks 

- Dedicated Arm[®] Cortex[®] -M4 CPU with FPU and ART (adaptive real-time accelerator) up to 64 MHz speed 

- 1-Mbyte flash memory, 256-Kbyte SRAM 

- Fully integrated BOM, including 32 MHz radio and 32 kHz RTC crystals 

- Integrated SMPS 

- Ultra-low-power modes for battery longevity 

- 68 GPIOs 

- SWD, JTAG 

- Integrated IPD for best-in-class and reliable antenna matching 

- 1.71 V to 3.6 V VDD range 

- -40°C to 85°C temperature range 

- Built-in security features, such as: secure firmware installation (SFI) for radio stack, customer key storage/key management services, PKA, AES 256-bit, TRNG, PCROP, CRC, 96-bit UID, possibility to derive 802.15.4 and Bluetooth[® ] LE 48-bit UEI 

- Certifications: CE, FCC, IC, JRF, SRRC, RoHS, REACH, KC, NCC 

- Two-layer PCB compatibility (using external raw pins only) 

## **Application** 

- Lighting and home automation 

- Wireless audio devices 

- Wellness, healthcare, personal trackers 

- Gaming and toys 

- Smart locks 

- Beacons and accessories 

- Industrial 

**DS13252** - **Rev 8** - **June 2025** For further information, contact your local STMicroelectronics sales office. 

www.st.com 

**STM32WB5MMG Introduction** 

**1 Introduction** 

This datasheet provides the ordering information and mechanical device characteristics of the STM32WB5MMG module. 

This document must be read in conjunction with _Multiprotocol wireless 32_ ‑ _bit MCU Arm[®]_ ‑ _based Cortex[®]_ ‑ _M4 with FPU, Bluetooth[®] 5.4 and 802.15.4 radio solution_ (DS11929) and _Multiprotocol wireless 32_ ‑ _bit MCU Arm[®]_ ‑ _based Cortex[®]_ ‑ _M4 with FPU, Bluetooth[®] LE and 802.15.4 radio solution_ (RM0434). Both documents are available from the STMicroelectronics website at _www.st.com_ . 

For information on the device errata with respect to the datasheet and reference manual, refer to the _STM32WB5MMG errata sheet_ (ES0525), available on the STMicroelectronics website www.st.com. 

For information on the Arm[®] Cortex[®] cores, refer to the Cortex[®] Technical Reference Manual, available from the www.arm.com website. 

_Note: Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere._ 

**DS13252** - **Rev 8** 

**page 2/37** 

**STM32WB5MMG Description** 

## **2 Description** 

STM32WB5MMG is an ultra-low-power and small form factor certified 2.4 GHz wireless module. It supports Bluetooth[®] LE, Zigbee[®] 3.0, OpenThread, dynamic, and static concurrent modes, and 802.15.4 proprietary protocols. Based on the STMicroelectronics STM32WB55VGY wireless microcontroller, STM32WB5MMG provides best-in-class RF performance thanks to its high receiver sensitivity and output power signal. Its lowpower features enable extended battery life, small coin-cell batteries, and energy harvesting. 

STM32WB5MMG revision Y is based on cut 2.1 of the STM32WB55VGY microcontroller. Revision X is based on cut 2.2. 

STM32WB5MMG requires no RF expertise and is the best way to speed up any development and reduce associated costs. The module is completely protocol stack royalty-free. 

**DS13252** - **Rev 8** 

**page 3/37** 

**STM32WB5MMG Module overview** 

## **3 Module overview** 

The module is an SiP-LGA86 package (system in package land grid array) that integrates the proven STM32WB55VGY MCU with several external components. The package includes: 

- LSE crystal 

- HSE crystal 

- Passive components for SMPS 

- Antenna matching and antenna 

- IPD for RF matching and harmonics rejection 

## **Figure 1. STM32WB5MMG module block diagram** 

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Interfaces<br>STM32WB55VGY<br>SMPS                                                                 Antenna<br>RF IPD<br>passive                                                                1MB Flash matching<br>components<br>256KB RAM<br>= e c<br>Power supply<br>filtering<br>|) Gnd Uo<br>XTAL XTAL<br>32.774kHz 32 MHz<br>**----- End of picture text -----**<br>


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DT63524V1<br>**----- End of picture text -----**<br>


## **3.1** 

## **Versions** 

The STM32WB5MMG is shipped in two finished goods versions. In this datasheet they are referred to as versions X and Y. X is the more recent version. The product version is identified by the package marking with X or Y as shown in Section 9.3: Device marking for SiP-LGA86. 

## **3.2** 

## **Power supply** 

The power supply requirements are identical to regular STM32WB55xx and described in the datasheet. Filtering capacitors on power supply pins and components for the SMPS are already integrated into the module. 

_Note: An additional capacitor of 4.7 uF may be needed to eliminate ripple from the power supply. Refer to the application note Development of RF hardware using STM32WB microcontrollers (AN5165)._ 

## **3.2.1** 

## **SMPS** 

SMPS can be set to either ON or in BYPASS mode. The integrated passive components are for SMPS operation running at 4MHz. For additional information on the SMPS, check the reference manual or the application note _Usage of SMPS on STM32WB Series microcontroller_ (AN5246). 

**DS13252** - **Rev 8** 

**page 4/37** 

**STM32WB5MMG Module overview** 

## **3.3** 

## **Clocks** 

As the crystals are already integrated into the package, it is not possible to use any clock in bypass mode. The module integrates 32.774 kHz crystal for LSE and 32 MHz crystal for the HSE clock. 

- LSE must be used in medium high driving capability. (RCC_BDCR_LSEDRV[1:0] = 10, refer to _Multiprotocol wireless 32_ ‑ _bit MCU Arm[®]_ ‑ _based Cortex[®]_ ‑ _M4 with FPU, Bluetooth[®] LE and 802.15.4 radio solution_ (RM0434) for more details). 

- HSE is already tuned. RCC_HSECR_HSETUNE[5:0] value is loaded automatically by HW. The RCC_HSECR register configuration must not be changed by the user to keep the default parameters. 

- LSCO and MCO outputs are available. 

- HSEGMC[2:0] must be set to 0b011. 

## **3.4** 

## **Antenna** 

The rectangular module has one shorter side clearly different from the remaining finish surface. This side is unshielded and the mold cover contains the integrated antenna. 

There is no option to use an external antenna. 

## **3.5** 

## **One time programming (OTP)** 

The STM32WB5MMG features 1 Kbyte one time programmable (OTP) memory for use by the end product. This is described in _Multiprotocol wireless 32_ ‑ _bit MCU Arm[®]_ ‑ _based Cortex[®]_ ‑ _M4 with FPU, Bluetooth[®] 5.4 and 802.15.4 radio solution_ (DS11929) and _Multiprotocol wireless 32_ ‑ _bit MCU Arm[®]_ ‑ _based Cortex[®]_ ‑ _M4 with FPU, Bluetooth[® ] LE and 802.15.4 radio solution_ (RM0434). 

_Note:_ 

_STM32WB5MMG uses the first and last words of this area for trimming and identification purposes._ 

_As a consequence addresses 0x1FFF7000 - 0x1FFF7007 and 0x1FFF73F8 - 0x1FFF73FF cannot be changed._ 

**DS13252** - **Rev 8** 

**page 5/37** 

**STM32WB5MMG Available peripherals** 

## **4 Available peripherals** 

All peripherals available in STM32WB Series microcontrollers based on the WLCSP100 package are available and accessible on this module. 

The pins on the module offer access to the following system peripherals: 

- 2× DMA controllers (seven channels each) supporting ADC, SPI, I[2] C, USART, QSPI, SAI, AES, timers 

- 1× USART (ISO 7816, IrDA, SPI master, Modbus and Smartcard mode) 

- 1× LPUART (low power) – Two SPI running at 32 Mbit/s 

- 2× I[2] C (SMBus/PMBus) 

- 1× SAI (dual channel high quality audio) 

- 1× USB 2.0 FS device, crystal-less, BCD and LPM 

- 1× Touch sensing controller, up to 18 sensors 

- 1× LCD 8x40 with step-up converter 

- 1× 16-bit, four channels advanced timer 

- 2× 16-bit, two channels timers 

- 1× 32-bit, four channels timer 

- 2× 16-bit ultra-low-power timers 

- 1× independent Systick 

- 1× independent watchdog 

- 1× window watchdog. 

The full pin description is available in _Multiprotocol wireless 32_ ‑ _bit MCU Arm[®]_ ‑ _based Cortex[®]_ ‑ _M4 with FPU, Bluetooth[®] 5.4 and 802.15.4 radio solution_ (DS11929). 

**DS13252** - **Rev 8** 

**page 6/37** 

**STM32WB5MMG Pin description** 

## **5 Pin description** 

The following figure shows the module pinout package bottom view. 

## **Figure 2. STM32WB5MMG module pinout: bottom view** 

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VSS ANT_NC<br>86 85<br>47 60 1<br>PB10 PB2 PC4 PA8 PA9 PA7 PA6 PA5 PA4 PA3 VSS ANT_IN RF_OUT VSS PA2<br>PB11 PA1<br>74 75 76 61<br>PC5 PA0<br>PD9 PD8 PD15 PH0<br>PB0 VREF+<br>73 84 77 62<br>PB1 VSS<br>PD4 VSS PD10 PH1<br>PE4 VDDA<br>PB12 72 83 78 63 PC3<br>PC13 PE3 PC8 PE2 PD14 PC2<br>PB6 71 82 79 64 PC1<br>PB15 NRST<br>PC7 PD11 PE0 PE1<br>PB14 PB9<br>70 81 80 65<br>PC6 PC0<br>PD3 PD6 PD5 PD13<br>PB13 BOOT0PH3-<br>69 68 67 66<br>PD1 PB8<br>PC9 PD2 PD7 PD12<br>PD0 VBAT<br>VDD USB VSS<br>31 17<br>VSS PA11 PA12 PA10 PA15 PA14 PA13 PC12 PC11 PC10 PB3 PB4 PB5 PB7 VDD<br>**----- End of picture text -----**<br>


_Note: PB0 and PB1 are only available for revision X parts._ 

**DS13252** - **Rev 8** 

**page 7/37** 

**STM32WB5MMG Pin description** 

**Table 1. STM32WB5MMG pin/ball definition** 

|**Pin name**|**Pin name**|**Pin name (function after reset)**|**Pin te**|
|---|---|---|---|
|**STM32WB5MMG**|**STM32WB55VGY**||**yp**|
|1|F6|PA2|I/O|
|2|G6|PA1|I/O|
|3|G7|PA0|I/O|
|4|H8|VREF+|S|
|5|J9|VSS|S|
|6|H9|VDDA|S|
|7|G10|PC3|I/O|
|8|G9|PC2|I/O|
|9|G8|PC1|I/O|
|10|F9|NRST|RST|
|11|F10|PB9|I/O|
|12|F8|PC0|I/O|
|13|E8|PH3-BOOT0|I/O|
|14|F7|PB8|I/O|
|15|C10|VBAT|S|
|16|F1|VSS|S|
|17|D1|VDD|S|
|18|D7|PB7|I/O|
|19|D6|PB5|I/O|
|20|C7|PB4|I/O|
|21|A9|PB3|I/O|
|22|A6|PC10|I/O|
|23|B6|PC11|I/O|
|24|C5|PC12|I/O|
|25|A5|PA13|I/O|
|26|A3|PA14|I/O|
|27|A4|PA15|I/O|
|28|B5|PA10|I/O|
|29|A2|PA12|I/O|
|30|A1|PA11|I/O|
|31|-|VSS|S|
|32|B3|VDDUSB|S|
|33|C4|PD0|I/O|
|34|C3|PD1|I/O|
|35|C1|PB13|I/O|
|36|D2|PC6|I/O|
|37|E2|PB14|I/O|
|38|F3|PB15|I/O|
|39|F5|PB6|I/O|
|40|G5|PC13|I/O|
|41|G3|PB12|I/O|
|42|G1|PE4|I/O|
|43|H1(1)/NC(2)|PB1|I/O|
|44|H2(1)/NC(2)|PB0|I/O|
|45|H5|PC5|I/O|



**DS13252** - **Rev 8** 

**page 8/37** 

**STM32WB5MMG Pin description** 

|**Pin name**|**Pin name**|**Pin name (function after reset)**|**Pin te**|
|---|---|---|---|
|**STM32WB5MMG**|**STM32WB55VGY**||**yp**|
|46|J6|PB11|I/O|
|47|K6|PB10|I/O|
|48|K7|PB2|I/O|
|49|G4|PC4|I/O|
|50|J7|PA8|I/O|
|51|K8|PA9|I/O|
|52|H6|PA7|I/O|
|53|H7|PA6|I/O|
|54|K9|PA5|I/O|
|55|K10|PA4|I/O|
|56|J8|PA3|I/O|
|57|-|VSS|S|
|58|-|ANT_IN|I/O|
|59|-|RF_OUT|I/O|
|60|-|VSS|S|
|61|E10|PH0|I/O|
|62|E9|PH1|I/O|
|63|D8|PD14|I/O|
|64|B10|PE1|I/O|
|65|C9|PD13|I/O|
|66|B8|PD12|I/O|
|67|A8|PD7|I/O|
|68|A7|PD2|I/O|
|69|B4|PC9|I/O|
|70|C2|PD3|I/O|
|71|E3|PC7|I/O|
|72|G2|PE3|I/O|
|73|D3|PD4|I/O|
|74|D5|PD9|I/O|
|75|D4|PD8|I/O|
|76|E7|PD15|I/O|
|77|E4|PD10|I/O|
|78|E6|PE2|I/O|
|79|C8|PE0|I/O|
|80|B7|PD5|I/O|
|81|C6|PD6|I/O|
|82|E5|PD11|I/O|
|83|F4|PC8|I/O|
|84|-|VSS|S|
|85|-|ANT_NC|I/O|
|86|-|VSS|S|



_1. Version X_ 

_2. Version Y_ 

**DS13252** - **Rev 8** 

**page 9/37** 

**STM32WB5MMG Recommendations** 

## **6 Recommendations** 

## **6.1 Pin recommendations** 

- ANT_IN and RF_OUT pins must be connected to GND. This module already integrates an antenna, so no external antenna required. 

- The ANT_NC is only used for soldering planarity purposes. So this pin must be soldered to an unconnected pin on the customer board. 

- PH3_BOOT0 is tied low through an internal pull-down to enable start from flash memory. However, it can be tied high with a low resistive pull-up if required. 

- A reset pull-up is already implemented in the STM32WB Series microcontrollers. The reset circuitry only requires an external capacitor for filtering purpose (see Figure 3). 

## **Figure 3. Reset circuit** 

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STM32WB5MMG<br>8<br>PC2<br>9<br>PC1<br>10 To reset mechanism<br>NRST<br>100nF<br>11<br>PB9<br>12<br>PC0<br>**----- End of picture text -----**<br>


**DS13252** - **Rev 8** 

**page 10/37** 

**STM32WB5MMG Recommendations** 

## **6.2 Layout recommendations** 

## **6.2.1 STM32WB5MMG placement** 

The embedded antenna manufacturer of the STM32WB5MMG recommends to place the module on the application board as shown below. 

## **Figure 4. STM32WB5MMG board placement** 

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2.5<br>7.6<br>35<br>1.3 STM32WB5MMG<br>Application board<br>**----- End of picture text -----**<br>


## Distances in mm 

This position allows the antenna to work to its maximum performance. If it cannot be placed as recommended above, the application board performance could be reduced. This does not, however, prevent correct operation. 

## **6.2.2** 

## **Enclosure effects** 

Product casing properties must be also considered when designing an RF-enabled product as the following generic best practices list illustrated: 

- Conductive enclosure in the near field affects the impedance of the antenna, also the resonant frequency. A metal case must not be in the near field. The threshold between near and far-field is provided in Figure 5. 

- Plastic enclosures can be close to the antenna, but must not touch it. Contact between the casing and the antenna may influence the tuning of the resonant frequency and impedance matching. 

- The proximity of the human body attenuates the TX and RX signals due to a certain amount of water content. Any contact may untune frequency and impedance matching. 

**DS13252** - **Rev 8** 

**page 11/37** 

**STM32WB5MMG Recommendations** ~~ooo~~ **Figure 5. Conductive enclosure around the antenna** 

**Table 2. Minimum enclosure dimensions (mm)** 

|**Impact level**<br>~~SS~~|**a**<br>~~SS~~|**b**<br>~~SS~~<br>~~EE~~|**c**<br>~~SS~~|**d**<br>~~SS~~|**e**|
|---|---|---|---|---|---|
|Impact threshold|46|60<br>~~EE~~|27|23|17|
|High impact|13|24|3|8|5|



_Note:_ 

_Impact is determined by measuring the reflection losses in the appropriate direction. In case conductive material is present from other directions, the distances mentioned in Table 2 become larger. It means the same impact is observed further from module._ 

**DS13252** - **Rev 8** 

**page 12/37** 

**STM32WB5MMG Recommendations** 

## **6.2.3** 

## **Ground plane** 

Here are some recommendations with respect to the ground plane design: 

- Do not route any tracks to the right of the STM32WB5MMG and keep a large ground plane with the associated ground via. 

- Route the tracks down directly on the top layer or with via to the other layers. 

- The ground plane must include the presence of vias (distance between two vias = 2 mm). 

**Figure 6. STM32WB5MMG ground plane layout** 

**==> picture [231 x 103] intentionally omitted <==**

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Tracks<br>Ground via<br>°° ee<br>falalele} ee<br>gop | © 0 © © © © 8 Oo<br>Ground plane<br>**----- End of picture text -----**<br>


## **6.2.4 Sensitive GPIOs** 

This board contains three sensitive GPIOs as defined below: 

- PB10 

- PB11 

- PC5 

The GPIO locations are illustrated in Figure 7 

When PB10, PB11 and/or PC5 are used, a 3.3 pF capacitor in a small package such as the 0201 or smaller, must be placed as close as possible to the output pin. Also border the GPIO tracks with the ground plane. 

**Figure 7. Sensitive GPIO location** 

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Superposition of  Layer 1 Layer 4<br>four layers<br>Sensitive GPIO location on layer 1<br>Sensitive GPIO location on layer 4<br>**----- End of picture text -----**<br>


## **6.2.5 Four layer reference board design** 

The reference schematics are illustrated in Figure 8 and the associated PCB layout is illustrated in Figure 9 When all the pads on the device need to be used, the mother board must be designed with four layers. 

**DS13252** - **Rev 8** 

**page 13/37** 

## **Figure 8. Four layer reference board schematics for version X** 

**STM32WB5MMG Recommendations** 

**Figure 9. Four layer PCB layout for version X** 

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Layer 1<br>**----- End of picture text -----**<br>


## Layer 2 

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Layer 3<br>**----- End of picture text -----**<br>


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Layer 4<br>**----- End of picture text -----**<br>


**DS13252** - **Rev 8** 

**page 15/37** 

**STM32WB5MMG Recommendations** 

## **6.2.6 Two layer reference board design** 

The reference schematics are illustrated in Figure 10. Two layer reference board schematics for version X and the associated PCB layout is illustrated in Figure 11. Two layer PCB layout for version X 

By using the first external pad ring, the mother board on which the module is soldered may be designed with only two layers. 

**DS13252** - **Rev 8** 

**page 16/37** 

**Figure 10. Two layer reference board schematics for version X** 

**STM32WB5MMG Recommendations** 

**Figure 11. Two layer PCB layout for version X** 

**==> picture [261 x 11] intentionally omitted <==**

**----- Start of picture text -----**<br>
Layer 1 Layer 2<br>**----- End of picture text -----**<br>


**DS13252** - **Rev 8** 

**page 18/37** 

**STM32WB5MMG Electrical characteristics** 

## **7 Electrical characteristics** 

## **7.1 Operating conditions** 

**Table 3. STM32WB55VGY operating conditions** 

|**Parameter**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|
|VDD|1.71|3.3|3.6|V|
|Operating ambient temperature range|-40|-|85|°C|
|Storage temperature range|-40|-|125|°C|



## **7.2** 

## **Power consumption** 

The power consumption is identical to the regular STM32WB55. For full details refer to _Multiprotocol wireless 32_ ‑ _bit MCU Arm[®]_ ‑ _based Cortex[®]_ ‑ _M4 with FPU, Bluetooth[®] 5.4 and 802.15.4 radio solution_ (DS11929). 

## **7.3 RF characteristics** 

Refer to _Multiprotocol wireless 32_ ‑ _bit MCU Arm[®]_ ‑ _based Cortex[®]_ ‑ _M4 with FPU, Bluetooth[®] 5.4 and 802.15.4 radio solution_ (DS11929) for more details. 

## **7.4 Antenna radiation patterns and efficiency** 

Refer to TN1526 for antenna radiation patterns of module STM32WB5MMG 

**DS13252** - **Rev 8** 

**page 19/37** 

**STM32WB5MMG Thermal characteristics** 

## **8 Thermal characteristics** 

The thermal characteristics of the STM32WB5MMG are defined below and the constant values are given in Table 4 where: 

- ϴJA, is the junction-to-ambient thermal resistance (EIA/JESD51-2 and EIA/JESD51-6). ϴJA represents the resistance to the heat flows from the chip to ambient air. It is an indicator of package heat dissipation capability. Lower ϴJA, means better overall thermal performance and is calculated as follows: 

   - ϴJA, = (TJ - TA) / PH, 

where: 

   - TJ = junction temperature 

   - TA = ambient temperature 

   - PH = power dissipation. 

- ΨJT is the junction-to-top-center thermal characterization parameter (EIA/JESD51-2 and EIA/JESD51-6). ΨJT is used for estimating the junction temperature by measuring TT in an actual environment and is calculated as follows: 

   - ΨJT = (TJ - TT) / PH 

where TT = temperature at the top-center of the package. 

- ϴJC is the junction-to-case thermal resistance. ϴJC represents the resistance to the heat flows from the chip to package top case. ϴJC is important when external heat sink is attached on package top and is calculated as follows: ϴJC = (TJ – TC) / PH 

where TC = case temperature attached with a cold plate. 

- ϴJB is the junction-to-board thermal resistance (EIA/JESD51-8). ϴJB represents the resistance to the heat flows from the chip to PCB. ϴJB is used in compact thermal models for system-level thermal simulation and is calculated as follows: ϴJB = (TJ – TB) / PH 

   - where TB = board temperature with ring cold plate fixture applied. 

**Table 4. STM32WB5MMG thermal characteristics** 

|**Symbol**|**TJ(°C)**|**TT(°C)**|**ΨJT(°C/W)**|**ϴJA(°C/W)**|**ϴJB(°C/W)**|**ϴJC(°C/W)**|
|---|---|---|---|---|---|---|
|Value|97.36|96.98|0.38|37.36|24.58|16.21|



**DS13252** - **Rev 8** 

**page 20/37** 

**STM32WB5MMG Package information** 

## **9 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **9.1 SiP-LGA86 package information** 

This SiP-LGA is a 86 pin, 7.3 x 11mm, system in package land grid array package. 

## **Figure 12. SiP-LGA86 - Outline** 

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A<br>G1 F1 A1 CORNER PIN A1 CORNER bbb C A1<br>M S<br>(x2)b1xb1<br>E1 D2<br>G2 SPts DETAIL A<br>F4<br>F2 G3<br>D<br>(x56)b2xb3<br>D3<br>(x24)b4xb4<br>D1 eD<br>F3<br>G4<br>F3<br>(x4)b2xb2<br>B eE F2 E SPsw<br>A<br>E<br>aaa (4x)<br>BOTTOM VIEW TOP VIEW SIDE VIEW<br>H1<br>A2<br>DETAIL A<br>H2<br>SEATING PLANE<br>C<br>C<br>ddd<br>**----- End of picture text -----**<br>


_1. Drawing is not to scale._ 

**DS13252** - **Rev 8** 

**page 21/37** 

**STM32WB5MMG Package information** 

**Table 5. SiP-LGA86 - Mechanical data** 

|**Symbol**|**Description**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|
|A|Total thickness|1.382±0.046|||mm|
|A1|Pre-solder|40±20(1)|||μm|
|||30±20(2)||||
|A2|-|0.150|||mm|
|M|Mold thickness|1.100|||mm|
|S|Substrate thickness|0.242||||
|D|Body length|10925|11.000|11.075||
|D1|Lead pitch length|7.250||||
|D2|-|2.563||||
|D3|-|8.438||||
|eD|Lead pitch length|0.450||||
|E|Body width|7.225|7.300|7.375||
|eE|Lead pitch width|0.450||||
|b1|-|0.430||||
|b2|-|0.350||||
|b3|-|0.300||||
|b4|-|0.600||||
|F1|-|0.600||||
|F2|-|0.475||||
|F3|-|0.900||||
|F4|-|2.300||||
|G1|-|0.465||||
|G2|-|2.960||||
|G3|-|4.800||||
|G4|-|0.475||||
|H1|-|0.600|||mm|
|H2|-|0.400|||mm|
|SPts(3)|Top surface sputter|3|-|6|μm|
|SPsw(4)|Side wall sputter|1|-|3|μm|
|aaa|Package edge tolerance|0.075|||mm|
|bbb|Mold flatness|0.100||||
|ddd|Coplanarity|0.100||||



_1. Peripheral pads_ 

_2. Inner pads_ 

_3. Top surface sputter_ 

_4. Side wall sputter_ 

## **9.2 Board design** 

For information and recommendations related to board design, landing pads, stencils and the solder reflow profile for LGA packages, refer to _Guidelines for design and board assembly of land grid array packages_ (AN 5886). 

**DS13252** - **Rev 8** 

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**STM32WB5MMG Package information** 

## **9.3 Device marking for SiP-LGA86** 

The following figure gives an example of topside marking versus pin 1 position identifier location. The printed markings may differ depending on the supply chain. 

Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below. 

**Figure 13. SiP-LGA86 marking example** 

**==> picture [433 x 265] intentionally omitted <==**

**----- Start of picture text -----**<br>
Product<br>identification [(1)]<br>32WB5M<br>2D matrix  OT<br>code<br>MGH6<br>SS<br>Certification  OF Revision<br>marking<br>WW X<br>TIO [70] Oo<br>Date code<br>hy OO<br>Pin 1 identifier DT63781V1<br>**----- End of picture text -----**<br>


1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. 

**DS13252** - **Rev 8** 

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**STM32WB5MMG Ordering information** 

## **10 Ordering information** 

Example: STM32 WB 5 M M G H 6 TR **Device family** STM32 = Arm-based 32-bit microcontroller **Product type** 

WB = Wireless Bluetooth[®] 

## **Device subfamily** 

5 = STM32WB55, Die 5, full set of features 

## **Component type** 

M = module 

## **Pin count** 

M = 86 pins 

## **Flash memory size** 

G = 1 Mbyte 

## **Package** 

H = LGA 86 7.3 x 11 mm 

## **Temperature range** 

6 = Industrial temperature range, –40 to 85 °C 

## **Packing** 

TR = tape and reel 

_Note:_ 

_For a list of available options (such as speed and package) or for further information on any aspect of this device, contact your nearest ST sales office._ 

**DS13252** - **Rev 8** 

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**STM32WB5MMG Certification** 

## **11 Certification** 

The STM32WB5MMG module certifications status is detailed in the table below: 

## **Table 6. Certification status** 

|**Certification**|**Certification**|**Revision Y**|**Revision X**|
|---|---|---|---|
|Bluetooth LE|RF-PHY|X|X|
|802.15.4 (Zigbee)|RF-PHY|X|X|
|EU|RED|X|X|
|UK|UKCA|-|X|
|USA|FCC|X|X|
|Canada|ISED-PCB|X|X|
|China|SRRC|-|X|
|Japan|JRF|X|X|
|Korea|KC or MSIP|X|X|
|Taiwan|NCC|X|X|
|EU|ROHS|X|X|
|EU|REACH|X|X|
|India|ETA|-|X|
|Thailand|NBTC|-|X|



_Note: The current revision is X._ 

The following sections detail some of the module certifications from sample regions. All certifications reports are available on STM32WB5MMG page. 

## **11.1 Bluetooth[®] LE (RF_PHY) certification** 

The STM32WB5MMG module has obtained Bluetooth[®] LE RF_PHY certification. The module is published under Bluetooth[®] LE SIG website. 

## **11.2** 

## **CE certification** 

The STM32WB5MMG module has obtained CE certification. The module is provided with CE marking. 

## **Figure 14. CE certification logo** 

**DS13252** - **Rev 8** 

**page 25/37** 

**STM32WB5MMG Certification 11.3 UKCA certification** The STM32WB5MMG module has obtained UKCA certification. The module is provided with UKCA marking. **Figure 15. UKCA certification logo** UK **11.4 FCC certification** The STM32WB5MMG module complies with part 15 of the FCC Rules. The FCC ID is YCP-STM32WB5M001 for version Y, and YCP-32WB5MMGH02 for version X. The module label includes the corresponding FCC ID. The operation is subject to the following two conditions: • This device may not cause harmful interference • This device must accept any interference received, including interference that may cause undesired operation. _Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation._ 

## **Label requirements** 

If the identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This label must contain the FCC ID that matches the one on the module. 

## **Documentation requirements** 

The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. 

## **Integration requirements** 

Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the multi-transmitter procedures. 

The host integrator must follow the integration instructions provided in this document and ensure that the composite-system end product complies with the requirements by a technical assessment or evaluation to the rules and to KDB Publication 996369. 

The host integrator installing this module into their product must ensure that the final composite product complies with the requirements by a technical assessment or evaluation to the rules, including the transmitter operation and should refer to guidance in KDB 996369. 

**DS13252** - **Rev 8 page 26/37** 

**STM32WB5MMG Certification** 

## **11.5** 

## **ISED certification** 

The STM32WB5MMG module has been tested and found compliant with the ISED RSS-247 and RSS-Gen rules. The IC ID is 8976A-STM32WB5M01 for version Y and 8976A-32WB5MMGH02 for version X . 

This module contains license-exempt transmitter(s) that comply with Innovation, Science and Economic Development Canada’s license-exempt RSS(s). Operation is subject to the following two conditions: 

- This module may not cause interference 

- This module must accept any interference, including interference that may cause undesired operation of the module. 

L’émetteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 

- L’appareil ne doit pas produire de brouillage. 

- L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement. 

## **11.6 JRF certification** 

The STM32WB5MMG is certified in Japan with certification number: 

- 005-102490 for rev Y 

- 217-220682 for rev X. 

The JRF logo is the following: 

**Figure 16. JRF certification logo** 

## **11.7 NCC certification** 

The STM32WB5MMG rev X is certified in Taiwan with NCC certification number: CCAJ23LP3C40T2. The STM32WB5MMG rev Y is certified in Taiwan with NCC certification number: CCAN20LP0740T3. 

## **Figure 17. NCC certification logo** 

`取得審驗證明之低功率射頻器材，非經核准，公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計之 特性及功能。` 

`低功率射頻器材之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時，應立即停用，並改善至無干擾時 方得繼續使用。前述合法通信，指依電信管理法規定作業之無線電通信。低功率射頻器材須忍受合法通信或工業、 科學及醫療用電波輻射性電機設備之干擾。` 

`系統廠商應於平台上標示「` 本產品內 `頻模組：圖片` XXXyyyLPDzzzz-x `」字樣` 

For low-power radio frequency equipment that has obtained certification, companies, firms or users are not allowed to change the frequency, increase the power, or change the characteristics and functions of the original design without approval. The use of low-power radio-frequency equipment must not affect flight safety and interfere with legal communications; if any interference is found, it should be stopped immediately, and it can only be used after improvement to no interference. The aforementioned legal communication refers to radio communication operated in accordance with the provisions of the Telecommunications Management Act. Lowpower radio frequency equipment must endure the interference of legal communication or industrial, scientific and medical radio wave radiation electrical equipment. System manufacturers should mark the words "This product contains a radio frequency module: XXXyyyLPDzzzz-x" on the platform. 

**DS13252** - **Rev 8** 

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**STM32WB5MMG Certification** 

## **11.8 SRRC certification** 

The module STM32WB5MMG has received regulatory approval in China (SRRC) with CMIIT ID 2023DP14302. 

## **11.9 KC certification** 

Applicant : STMicroelectronics SAS Equipment Name: 특정소출력 무선기기 ( 무선데이터통신시스템용 무선기기 ) Basic Model Number: STM32WB5MMGH 

Certification No.: R-R-2AS-32WB5MMGH002 

Manufacturer / Country of Origin: STMicroelectronics SAS / France Date of manufacture: notation separately 

## **11.10 NBTC certification** 

The Supplier Declaration of Conformity for NBTC in Thailand is registered as SD04450-24. 

**DS13252** - **Rev 8** 

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**STM32WB5MMG Important security notice** 

## **12 Important security notice** 

The STMicroelectronics group of companies (ST) places a high value on product security, which is why the ST product(s) identified in this documentation may be certified by various security certification bodies and/or may implement our own security measures as set forth herein. However, no level of security certification and/or built-in security measures can guarantee that ST products are resistant to all forms of attacks. As such, it is the responsibility of each of ST's customers to determine if the level of security provided in an ST product meets the customer needs both in relation to the ST product alone, as well as when combined with other components and/or software for the customer end product or application. In particular, take note that: 

- ST products may have been certified by one or more security certification bodies, such as Platform Security Architecture (www.psacertified.org) and/or Security Evaluation standard for IoT Platforms (www.trustcb.com). For details concerning whether the ST product(s) referenced herein have received security certification along with the level and current status of such certification, either visit the relevant certification standards website or go to the relevant product page on www.st.com for the most up to date information. As the status and/or level of security certification for an ST product can change from time to time, customers should re-check security certification status/level as needed. If an ST product is not shown to be certified under a particular security standard, customers should not assume it is certified. 

- Certification bodies have the right to evaluate, grant and revoke security certification in relation to ST products. These certification bodies are therefore independently responsible for granting or revoking security certification for an ST product, and ST does not take any responsibility for mistakes, evaluations, assessments, testing, or other activity carried out by the certification body with respect to any ST product. 

- Industry-based cryptographic algorithms (such as AES, DES, or MD5) and other open standard technologies which may be used in conjunction with an ST product are based on standards which were not developed by ST. ST does not take responsibility for any flaws in such cryptographic algorithms or open technologies or for any methods which have been or may be developed to bypass, decrypt or crack such algorithms or technologies. 

- While robust security testing may be done, no level of certification can absolutely guarantee protections against all attacks, including, for example, against advanced attacks which have not been tested for, against new or unidentified forms of attack, or against any form of attack when using an ST product outside of its specification or intended use, or in conjunction with other components or software which are used by customer to create their end product or application. ST is not responsible for resistance against such attacks. As such, regardless of the incorporated security features and/or any information or support that may be provided by ST, each customer is solely responsible for determining if the level of attacks tested for meets their needs, both in relation to the ST product alone and when incorporated into a customer end product or application. 

- All security features of ST products (inclusive of any hardware, software, documentation, and the like), including but not limited to any enhanced security features added by ST, are provided on an "AS IS" BASIS. AS SUCH, TO THE EXTENT PERMITTED BY APPLICABLE LAW, ST DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, unless the applicable written and signed contract terms specifically provide otherwise. 

**DS13252** - **Rev 8** 

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**STM32WB5MMG** 

## **Revision history** 

**Table 7. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|12-Nov-2020|1|Initial release.|
|16-Jul-2021|2|Added:<br>•<br>Power supply<br>•<br>SMPS<br>•<br>Clocks<br>•<br>Antenna<br>•<br>Two layer reference board design<br>•<br>BLE(RF_PHY) certification<br>Updated:<br>•<br>Features<br>•<br>Figure 1. STM32WB5MMG module block diagram<br>•<br>Section 3.3: Clocks<br>•<br>Section 5: Pin description<br>•<br>STM32WB5MMG pin/ball definition<br>•<br>Section 6.2.2: Enclosure effects<br>•<br>Figure 8. Four layer reference board schematics<br>•<br>Section 7.4: Antenna radiation patterns and efficiency<br>•<br>Section 9.1: SiP-LGA86 package information<br>•<br>Section 11: Certification<br>•<br>Section 11.1: BLE(RF_PHY) certification|
|09-Nov-2022|3|Added:<br>•<br>Section 3.1: Versions<br>•<br>Section 3.5: One time programming (OTP)<br>•<br>Figure 8. Four layer reference board schematics for version X<br>•<br>Figure 9. Four layer PCB layout for version X<br>•<br>Figure 10. Two layer reference board schematics for version X<br>•<br>Figure 11. Two layer PCB layout for version X<br>•<br>Section 11.3: UKCA certification<br>•<br>Section 11.9: KC certification<br>•<br>Section 12: Important security notice<br>Updated:<br>•<br>Cerfication images<br>•<br>Bluetooth Bluetooth®LE protocol version support throughout the document<br>•<br>Document title<br>•<br>Section Features<br>•<br>Certification logo representation<br>•<br>Section 1: Introduction<br>•<br>Section 2: Description<br>•<br>Split Section 3: Module overview into a separate section<br>•<br>Section 3.1: Versions<br>•<br>Figure 1. STM32WB5MMG module block diagram<br>•<br>Section 3.2.1: SMPS<br>•<br>Section 3.3: Clocks<br>•<br>Section 5: Pin description<br>•<br>Table 1. STM32WB5MMG pin/ball definition<br>•<br>Section 6.1: Pin recommendations<br>•<br>Section 6.2.4: Sensitive GPIOs<br>•<br>Table 5. SiP-LGA86 - Mechanical data<br>•<br>Figure 8. Four layer reference board schematics for version Y<br>•<br>Figure 10. Four layer PCB layout for version Y<br>•<br>Figure 12. Two layer reference board schematics for version Y<br>•<br>Figure 14. Two layer PCB layout for version Y|



**DS13252** - **Rev 8** 

**page 30/37** 

**STM32WB5MMG** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|09-Nov-2022|3|•<br>Section 9.3: Device marking for SiP-LGA86<br>–<br>Section 9.1: SiP-LGA86 package information<br>–<br>Table 5. SiP-LGA86 - Mechanical data<br>•<br>Section 9.3: Device marking for SiP-LGA86<br>–<br>Figure 15. SiP-LGA86 marking example<br>•<br>Figure 15. SiP-LGA86 marking example<br>•<br>Section 8: Thermal characteristics<br>•<br>Section 11: Certification<br>•<br>Section 11.4: FCC certification<br>•<br>Section 11.5: ISED certification<br>•<br>Section 11.6: JRF certification<br>•<br>Section 11.7: NCC certification<br>Removed: Solder reflow recommendations section|
|01-Mar-2023|4|Updated:<br>•<br>Product status<br>•<br>Figure 1. STM32WB5MMG module block diagram<br>•<br>Section 5: Pin description<br>–<br>Figure 2. STM32WB5MMG module pinout: bottom view<br>•<br>Section 6.1: Pin recommendations<br>•<br>Section 6.2.5: Four layer reference board design<br>–<br>Figure 8. Four layer reference board schematics for version X<br>•<br>Section 6.2.6: Two layer reference board design<br>–<br>Figure 10. Two layer reference board schematics for version X<br>•<br>Section 7.4: Antenna radiation patterns and efficiency<br>–<br>Added Figure 13. Antenna radiation patterns<br>•<br>Section 9.2: Board design<br>Removed:<br>•<br>"Four layer reference board schematics for version Y" figure<br>•<br>"Four layer PCB layout for version Y" figure<br>•<br>"Two layer reference board schematics for version Y" figure<br>•<br>"Two layer PCB layout for version Y" figure|
|10-Mar-2023|5|Updated:<br>•<br>Figure 11. Two layer PCB layout for version X<br>•<br>Section 3.2: Power supply<br>•<br>Section 5: Pin description|
|21-Sep-2023|6|Updated:<br>•<br>Title<br>•<br>Figure 8. Four layer reference board schematics for version X<br>•<br>Figure 10. Two layer reference board schematics for version X<br>•<br>References to DS11929|
|26-Feb-2024|7|Updated:<br>•<br>Figure 13. Antenna radiation patterns<br>•<br>Table 6. Certification status<br>•<br>Section 11.4: FCC certification<br>•<br>Section 11.5: ISED certification<br>•<br>Section 11.7: NCC certification<br>•<br>Section 11.8: SRRC certification<br>Removed Tape and reel packing|



**DS13252** - **Rev 8** 

**page 31/37** 

**STM32WB5MMG** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|18-Jun-2025|8|Updated:<br>•<br>Referenced to Bluetooth standard<br>•<br>Cover image<br>•<br>Section Features<br>•<br>Figure 4. STM32WB5MMG board placement<br>•<br>Section 7.4: Antenna radiation patterns and efficiency<br>•<br>Section 10: Ordering information<br>•<br>Section 11: Certification<br>Added:<br>•<br>Section 11.10: NBTC certification|



**DS13252** - **Rev 8** 

**page 32/37** 

**STM32WB5MMG Contents** 

## **Contents** 

|**1**|**Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2**|**Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2**|
|---|---|---|
|**2**|**Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3**||
|**3**|**Module overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4**||
||**3.1**|Versions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4|
||**3.2**|Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4|
|||**3.2.1**<br>SMPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4|
||**3.3**|Clocks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
||**3.4**|Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
||**3.5**|One time programming (OTP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
|**4**|**Available peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6**||
|**5**|**Pin**|**description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7**|
|**6**|**Recommendations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10**||
||**6.1**|Pin recommendations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10|
||**6.2**|Layout recommendations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
|||**6.2.1**<br>STM32WB5MMG placement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
|||**6.2.2**<br>Enclosure effects. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
|||**6.2.3**<br>Ground plane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13|
|||**6.2.4**<br>Sensitive GPIOs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13|
|||**6.2.5**<br>Four layer reference board design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13|
|||**6.2.6**<br>Two layer reference board design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16|
|**7**|**Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19**||
||**7.1**|Operating conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19|
||**7.2**|Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19|
||**7.3**|RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19|
||**7.4**|Antenna radiation patterns and efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19|
|**8**|**Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20**||
|**9**|**Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21**||
||**9.1**|SiP-LGA86 package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21|
||**9.2**|Board design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22|
||**9.3**|Device marking for SiP-LGA86 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23|
|**10**|**Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24**||
|**11**|**Certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25**||
||**11.1**|Bluetooth®LE (RF_PHY) certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25|
||**11.2**|CE certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25|



**DS13252** - **Rev 8** 

**page 33/37** 

**STM32WB5MMG Contents** 

||**11.3**|UKCA certification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26|
|---|---|---|
||**11.4**|FCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26|
||**11.5**|ISED certification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27|
||**11.6**|JRF certification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27|
||**11.7**|NCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27|
||**11.8**|SRRC certification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28|
||**11.9**|KC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28|
||**11.10**|NBTC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28|
|**12**|**Important security notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29**||
|**Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30**|||



**DS13252** - **Rev 8** 

**page 34/37** 

**STM32WB5MMG List of tables** 

## **List of tables** 

|**Table**|**1.**|STM32WB5MMG pin/ball definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8|
|---|---|---|
|**Table**|**2.**|Minimum enclosure dimensions (mm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12|
|**Table**|**3.**|STM32WB55VGY operating conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19|
|**Table**|**4.**|STM32WB5MMG thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20|
|**Table**|**5.**|SiP-LGA86 - Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22|
|**Table**|**6.**|Certification status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25|
|**Table**|**7.**|Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30|



**DS13252** - **Rev 8** 

**page 35/37** 

**STM32WB5MMG List of figures** 

## **List of figures** 

|**Figure**|**1.**|STM32WB5MMG module block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4|
|---|---|---|
|**Figure**|**2.**|STM32WB5MMG module pinout: bottom view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
|**Figure**|**3.**|Reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10|
|**Figure**|**4.**|STM32WB5MMG board placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
|**Figure**|**5.**|Conductive enclosure around the antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12|
|**Figure**|**6.**|STM32WB5MMG ground plane layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13|
|**Figure**|**7.**|Sensitive GPIO location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13|
|**Figure**|**8.**|Four layer reference board schematics for version X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14|
|**Figure**|**9.**|Four layer PCB layout for version X. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15|
|**Figure**|**10.**|Two layer reference board schematics for version X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17|
|**Figure**|**11.**|Two layer PCB layout for version X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18|
|**Figure**|**12.**|SiP-LGA86 - Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21|
|**Figure**|**13.**|SiP-LGA86 marking example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23|
|**Figure**|**14.**|CE certification logo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25|
|**Figure**|**15.**|UKCA certification logo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26|
|**Figure**|**16.**|JRF certification logo. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27|
|**Figure**|**17.**|NCC certification logo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27|



**DS13252** - **Rev 8** 

**page 36/37** 

**STM32WB5MMG** 

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**DS13252** - **Rev 8** 

**page 37/37**