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SPWF01SC.21
Wireless LAN Module, 2.4 GHz, UART, Industrial Control and Data Acquisition, Home Automation
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: STMICROELECTRONICS
- Product type: WLAN Modules & USB Adaptors
- Frequency RF: 2.4GHz
- Module Interface: UART
- Module Applications: Industrial Control and Data Acquisition, Home Automation and Security Systems, Wireless Sensors
| Delivery and price | |
|---|---|
| Units per pack | 250 |
| Price | 9.5 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
## **SPWF01SA SPWF01SC** Serial-to-Wi-Fi b/g/n intelligent modules
**Datasheet** - **production data**
- RX sensitivity
- -96.0 dBm @ 1 Mbps DSSS
- -74.5 dBm @ 54 Mbps OFDM
- 16 configurable GPIOs available
- UART interface to host system
- Advanced low-power modes
- Standby with RTC: 43 µA
- Sleep connected (DTIM=1): 15 mA
- RX traffic: 105 mA typical
- TX traffic: 243 mA typical @ 10 dBm
## **Features**
- 2.4 GHz IEEE 802.11 b/g/n transceiver
- STM32 ARM Cortex-M3, with 64 KB RAM and 512 KB Flash memory
- 1 MB extended Flash available on SPWF01Sx.1y
- Integrated TCP/IP protocol stack
- 8 simultaneous TCP or UDP clients and 1 socket server
- 1 TLS/SSL socket client supporting up to TLS 1.2, including common encryption algorithms: AES (128, 256), hash (MD5, SHA-1, SHA-256) and public key algorithms (RSA, ECC)
- Web server supporting dynamic web pages
- RESTful API to get and post web content
-
- WEP/WPA/WPA2 personal security
- System modes: Station, IBSS, and miniAP (supporting up to 5 stations)
- miniAP easily provisioned (SSID, PWD)
- Fast Wi-Fi reassociation after reset
- Firmware update via UART and Over The Air (FOTA); extended Flash on board with SPWF01Sx.1y
- Simple AT command set host interface through UART
- Small form factor: 26.92 x 15.24 x 2.35 mm
- Single voltage supply (3.3 V typical)
- Multiple antenna options:
- Integrated antenna (SPWF01SA.xy versions)
- Integrated u.fl connector (SPWF01SC.xy versions)
- Industrial temperature range: -40 °C to 85 °C
- FCC/CE/IC/SRRC certified
- RoHS compliant
- Surface mount PCB module
## **Applications**
- Smart appliances
- Industrial control and data acquisition
- Home automation and security systems
- Wireless sensors
- Cable replacement
- Medical equipment
- Machine-to-machine communication
- TX power
- 18.3 dBm @ 1 Mbps DSSS
-
- 13.7 dBm @ 54 Mbps OFDM
1/21
January 2017
DocID025635 Rev 8
This is information on a product in full production.
_www.st.com_
**Contents**
**SPWF01SA, SPWF01SC**
## **Contents**
|**1**|**Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3**|
|---|---|
|**2**|**General electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5**|
|**3**|**Digital interface specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6**|
|**4**|**RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7**|
|**5**|**Pinout description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8**|
||Application guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10|
|**6**|**Module reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11**|
|**7**|**Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13**|
||7.1<br>RF compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13|
||7.2<br>FCC and IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13|
||7.2.1<br>Modular approval, FCC and IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13|
||7.2.2<br>Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14|
||7.3<br>CE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14|
||7.4<br>SRRC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14|
|**8**|**Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15**|
||8.1<br>Module shield package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15|
|**9**|**Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18**|
|**10**|**Traceability information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19**|
|**11**|**Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20**|
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**SPWF01SA, SPWF01SC**
**Description**
## **1 Description**
The SPWF01SA and the SPWF01SC intelligent Wi-Fi modules represent a plug-and-play and standalone 802.11 b/g/n solution for easy integration of wireless Internet connectivity features into existing or new products.
Configured around a single-chip 802.11 transceiver with integrated PA and comprehensive power management subsystem, and an STM32 microcontroller with an extensive GPIO suite, the modules also incorporate timing clocks and voltage regulators. Two different options exist based on the integrated Flash memory. The SPWF01Sx.1y orderable parts integrate 1.5 MB of Flash, while the SPWF01Sx.2y orderable parts integrate 512 KB of Flash.
The module is available either configured with an embedded micro 2.45 GHz highly-efficient ISM band antenna (SPWF01SA), or with an u.fl connector for external antenna connection (SPWF01SC).
With low power consumption and ultra-compact (2.7 x 1.5 cm) footprint, the modules are ideal for fixed and mobile wireless applications, as well as challenging battery-operated applications.
The SPWF01Sx parts are released with an integrated full featured TCP/IP protocol stack with added web server and additional application service capabilities, such as REST API for accessing files on servers in the cloud and support for dynamic web pages with CGI/SSI functions to easily interact with the module and the host processor over the air.
For secure end-to-end communication with the cloud, an SSL/TLS stack is embedded in every module with no licensing charge. See application note AN4683 for details.
The SW package also includes an AT command layer interface for user-friendly access to the stack functionalities via the UART serial port. For details, see user manual UM1695.
It is always possible to upgrade the module firmware via UART and Over The Air (FOTA).
Out of the 1 MB extended Flash available on the SPWF01Sx.1y module, 512 KB of the Flash is dedicated to FW upgrade and the other 512 KB is dedicated to host proprietary files, organized in a file system image, accessible through the integrated web server.
FOTA is also possible with the SPWF01Sx.2y module, temporarily storing the FW in the external host Flash memory, if it exists.
ST may update the FW provided with the modules at any time. ST recommends that users regularly check for documentation and the current FW version available at _www.st.com/wifimodules._
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**SPWF01SA, SPWF01SC**
**Description**
## **Figure 1. Block diagram**
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**SPWF01SA, SPWF01SC**
**General electrical specifications**
## **2 General electrical specifications**
**Table 1. Absolute maximum ratings**
|**Parameter**|**Test condition/comment**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|Voltage supply|-|-0.3|-|4.0|V|
|Vin for 5 V tolerant pins||-0.3||5.5|V|
|Vin for all other pins||-0.3||2.8|V|
|Storage temperature range||-55||105|°C|
**Table 2. Operating conditions and input power specifications[(1)]**
|**Parameter**|**Parameter**|**Test condition/comment**|**Test condition/comment**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|Operating temperature range||Industrial||-40||85|°C|
|3.3 V<br>supply|Input supply voltage|3.3 V supply input||3.1|3.3|3.6|V|
||Standby|Both the STM32 and the radio<br>are in standby power states|||43||A|
||Sleep|The STM32 is in stop power<br>state and the radio is in sleep<br>power state|||15||mA|
||Low power state|The STM32 is active and the<br>radio is in sleep power state|||26||mA|
||TX|802.11b|TX power = 0 dBm||236||mA|
||||TX power = 10 dBm||250||mA|
||||TX power = 18 dBm||344||mA|
|||802.11g|TX power = 0 dBm||210||mA|
||||TX power = 10 dBm||243||mA|
||||TX power = 18 dBm||338||mA|
||RX|802.11b|||105||mA|
|||802.11g|||105||mA|
1. Typical results are at room temperature only.
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**Digital interface specifications**
**SPWF01SA, SPWF01SC**
## **3 Digital interface specifications**
**Table 3. Digital interface specifications, I/O pins**
|**Parameter**|**Parameter**|**Test condition/comment**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Inputs|VIH||1.6|-|2.8|V|
||VIL||||0.9|V|
|Outputs|VOH|IOH = 4 mA|2.1||2.5|V|
||VOL|IOL = 4 mA|||0.4|V|
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**SPWF01SA, SPWF01SC**
**RF characteristics**
## **4 RF characteristics**
**Table 4. RF characteristics**
|**Parameter**|**Parameter**|**Test condition/comment**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
||11b, 1 Mbps|||-96||dBm|
|RX sensitivity(1)|11b, 2 Mbps|||-93||dBm|
||11b, 5.5 Mbps|||-91||dBm|
||11b, 11 Mbps|||-87||dBm|
||11g, 9 Mbps|||-89.5||dBm|
||11g, 18 Mbps|||-86||dBm|
||11g, 36 Mbps|||-80||dBm|
||11g, 54 Mbps|||-74.5||dBm|
||11n, MCS1, 13 Mbps|||-86.5||dBm|
||11n, MCS3, 26 Mbps|||-81.5||dBm|
||11n, MCS5, 52 Mbps|||-74||dBm|
||11n, MCS7, 65 Mbps|||-71||dBm|
|Channel-to-channel<br>de-sensitivity|CH1 to 14|11g, 54 Mbps, 10%PER||1||dB|
|Maximum input signal|CH7|11g, 54 Mbps||-20||dBm|
|Adjacent channel rejection|11Mbps|||38||dBc|
||9 Mbps|||20||dBc|
||54 Mbps|||4||dBc|
||MCS1|||24||dBc|
||MCS7|||3||dBc|
|TX output power(1)|11b, 1 Mbps|@ 11b spectral mask||18.3||dBm|
||11b, 11 Mbps|||18.3||dBm|
||11g, 9 Mbps|@ 11g spectral mask||18.3||dBm|
||11g, 54 Mbps|EVM = -27 dB, 4.5%||13.7||dBm|
||11n, MCS1|@ 11n spectral mask||18.3||dBm|
||11n, MCS7|EVM = -27 dB||13.5||dBm|
|On-board antenna gain||Average||-1.2||dBi|
|External antenna gain||SG901-1066 average<br>including cable loss||2.8||dBi|
1. Output power and sensitivities are measured with a 50 Ω connection at the antenna port.
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**SPWF01SA, SPWF01SC**
**Pinout description**
## **5 Pinout description**
**Table 5. Pinout description**
|**Signal name**|**Type**|**Pin number**|**Main function**|**Alternate**<br>**functions(1)**|**Notes**|
|---|---|---|---|---|---|
|**GPIO - general purpose input/output**||||||
|GPIO[0]|I/O|16|General purpose<br>input/output<br>Restore to factory<br>settings(2)||Input pull down and<br>5V tolerant|
|GPIO[1]|I/O|17|General purpose<br>input/output|PWM|Input pull down and<br>5V tolerant|
|GPIO[2]|I/O|19|General purpose<br>input/output||Floating and 5V<br>tolerant|
|GPIO[3]|I/O|1|General purpose<br>input/output||Input pull down and<br>5V tolerant|
|GPIO[6]|I/O|22|General purpose<br>input/output<br>Wake Up/Sleep<br>Inhibit(3)||Input pull down and<br>5V tolerant|
|GPIO[4]|I/O|18|General purpose<br>input/output|||
|GPIO[5]|I/O|20|General purpose<br>input/output|||
|GPIO[7]|I/O|13|General purpose<br>input/output<br>STA/Mini AP<br>switch(4)|||
|GPIO[8]|I/O|4|General purpose<br>input/output|ADC||
|GPIO[9]|I/O|7|General purpose<br>input/output|||
|GPIO[11]|I/O|11||||
|GPIO[12]|I/O|12|General purpose<br>input/output|||
|GPIO[15]|I/O|21|General purpose<br>input/output|DAC||
|**Monitoring purpose with no alternate function**||||||
|GPIO[10]|I/O|5|Drives LED, Blinks<br>while running|||
|GPIO[13]|I/O|15|Drives LED, Wi-Fi<br>link up|||
|GPIO[14]|I/O|14|LED drive, Power<br>up|||
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**SPWF01SA, SPWF01SC**
**Pinout description**
**Table 5. Pinout description (continued)**
|**Signal name**|**Type**|**Pin number**|**Main function**|**Alternate**<br>**functions(1)**|**Notes**|
|---|---|---|---|---|---|
|**UART pins**||||||
|RXD1|I|8|UART1 Receive<br>data input||5V tolerant|
|TXD1|O|6|UART1 Transmit<br>data output||5V Tolerant|
|CTS1_DN|I|9|UART1 Clear to<br>send input||Active low, 5V tolerant|
|RTS1_DP|O|10|UART1 Request to<br>send output||Active low, 5V tolerant|
|**Reset**||||||
|RESETn|I|3|Reset input||Active low for 5 ms<br>with pull up to<br>2.5VDC. Not 5V<br>tolerant|
|**Supply pins and paddle**||||||
|3.3 V||24|Voltage supply||Decouple with 10F<br>capacitor|
|Ground||23|Ground|||
|Ground Paddle||25|Ground||Add plenty of ground<br>vias for thermal<br>dissipation and ground<br>return|
|**Boot loader**||||||
|BOOT0|I|2|Boot loader(5)|||
1. The activation of ALT function depends upon the firmware version or upon the variable configuration.
2. To perform the factory reset of the variables, pin GPIO0 must be high during powerup.
3. GPIO function running when low power mode variable is enabled.
4. Introduced with the release 3.0 of AT Full stack. To enable the STAToMiniAP switch the GPIO[7] needs to be put low together with the HW reset.
5. To enable the firmware download, pin BOOT0 needs to be high during power up. RESETn need to be pulled low at least 5 ms to initiate the firmware download sequence.
_Note: Pin 26 to Pin 30 are reserved and they can be left floating in the final design._
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**SPWF01SA, SPWF01SC**
**Pinout description**
## **Application guidelines**
As a general rule, when signals between the I/O pins of the external host processor and the module are to be connected (e.g. from 2.5 V to 3.3 V), a level translator should be used to match the voltage of the I/O pins.
Please refer to the data brief for the STEVAL-IDW001V1 evaluation board on st.com, which includes a schematic diagram illustrating the use of the level translator.
The HOST processor should control the RESETn pin of the module in order to recover from unexpected behavior using the HW reset.
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**SPWF01SA, SPWF01SC**
**Module reflow**
## **6 Module reflow**
The SPWF01SA and SPWF01SC are surface mount modules with a 6-layer PCB. The recommended final assembly reflow profiles are indicated below.
The soldering phase must be executed with care: in order to prevent an undesired melting phenomenon, particular attention must be paid to the setup of the peak temperature.
The following are some suggestions for the temperature profile based on the IPC/JEDEC J- STD-020C, July 2004 recommendations.
**Table 6. Soldering values**
|**Profile feature**|**PB-free assembly**|
|---|---|
|Average ramp-up rate (TSMAXto TP)|3 °C/sec max|
|Preheat:<br>– Temperature min. (Tsmin.)<br>– Temperature max. (Tsmax.)<br>– Time (Tsmin. to Tsmax) (ts)|150 °C<br>200 °C<br>60-100 sec|
|Critical zone:<br>Temperature TL<br>Time TL|217 °C<br>60-70 sec|
|Peak temperature (TP)|240 + 0 °C|
|Time within 5 °C of actual peak temperature (TP)|10-20 sec|
|Ramp-down rate|6 °C/sec|
|Time from 25 °C to peak temperature|8 minutes max.|
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**Module reflow**
**SPWF01SA, SPWF01SC**
**==> picture [128 x 11] intentionally omitted <==**
**----- Start of picture text -----**<br>
Figure 2. Soldering profile<br>**----- End of picture text -----**<br>
**==> picture [405 x 217] intentionally omitted <==**
**----- Start of picture text -----**<br>
AM17477v1<br>**----- End of picture text -----**<br>
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**Regulatory compliance**
## **7 Regulatory compliance**
## **7.1 RF compliance**
The RF certifications obtained are described in _Table 7_ .
**Table 7. RF certification summary**
|||**Comment**|
|---|---|---|
|FCC ID|VRA-SG9011203|On board antenna and external SG901-1066 with connector version|
|IC ID|7420A-SG9011203|On board antenna and external SG901-1066 with connector version|
|ETSI|Compliant|Approved with on board antenna and connector version|
_Note: The SG901-1066 from Sagrad Inc. is the only approved antenna using the u.fl connector version._
## **7.2 FCC and IC**
This module has been tested and complies with the FCC part 15 and IC RSS-210 regulations. These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
1. The device must not cause harmful interference.
and
2. The device must accept any interference received, including interference that may cause undesired operation.
Modifications or changes to this equipment not expressly approved by the party responsible for compliance may render void the user's authority to operate this equipment.
## **7.2.1 Modular approval, FCC and IC**
FCC ID: VRA-SG9011203
IC: 7420A-SG9011203
In accordance with FCC part 15, the modules SPWF01SA and SPWF01SC are listed above as a modular transmitter device.
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**SPWF01SA, SPWF01SC**
**Regulatory compliance**
## **7.2.2 Labeling instructions**
When integrating the SPWF01SA and SPWF01SC into the final product, it must be ensured that the FCC labeling requirements specified below are satisfied. Based on the Public Notice from FCC, the product into which the ST transmitter module is installed must display a label referring to the enclosed module. The label should use wording like the following:
Contains Transmitter Module
FCC ID: VRA-SG9011203
IC: 7420A-SG9011203
Any similar wording that expresses the same meaning may also be used.
## **7.3 CE**
This module complies with the following European EMI/EMC and safety directives and standards:
- ETSI EN 300 238 v1.9.1:2015
- EN 301 489-1 V1.9.2:2011 + EN 301 489-17 V2.2.1:2009
- EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013
- EN 62479:2010
## **Figure 3. CE certified**
## **7.4 SRRC**
The SPWF01Sx.21 module complies with Chinese SRRC certification.
- SRRC CMIIT ID: 2015DJ6514
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**SPWF01SA, SPWF01SC**
**Package information**
## **8 Package information**
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _www.st.com_ . ECOPACK[®] is an ST trademark.
## **8.1 Module shield package information**
**Figure 4. Top view of the module shield**
**==> picture [221 x 129] intentionally omitted <==**
**----- Start of picture text -----**<br>
Shield<br>OO00O°0<br>OO0000<br>oe<br>CIE CE Logo<br>**----- End of picture text -----**<br>
**Figure 5. Bottom view of the module**
**==> picture [389 x 64] intentionally omitted <==**
**----- Start of picture text -----**<br>
Data Matrix<br>Board Design Reference<br>Model Series Name<br>FCC and IC IDs<br>**----- End of picture text -----**<br>
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**Package information**
**SPWF01SA, SPWF01SC**
## **Figure 6. Wi-Fi module dimensions**
**==> picture [343 x 361] intentionally omitted <==**
_Note: An antenna area of 217 x 520 mils must be free of any ground metalization or traces under the unit. The area extending away from the antenna should be free from metal on the PCB and housing to meet expected performance levels. Pin 25 is the required paddle ground and is not shown in this diagram._
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**Package information**
**Figure 7. Wi-Fi module footprint**
**==> picture [332 x 350] intentionally omitted <==**
PCB design requires a detailed review of the center exposed pad. This pad requires good thermal conductivity. Soldering coverage should be maximized and checked via x-ray for proper design. There is a trade-off between providing enough soldering for conductivity and applying too much, which allows the module to “float” on the paddle creating reliability issues. ST recommends two approaches, a large center via that allows excess solder to flow down into the host PCB with smaller vias around it, or many smaller vias with just enough space for the viscosity of the chosen solder/flux to allow some solder to flow into the smaller vias.
Either of these approaches must result in 60% or more full contact solder coverage on the paddle after reflow. ST strongly encourages PCB layout teams to work with their EMS providers to ensure vias and solder paste designs that will result in satisfactory performance.
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**Ordering information**
**SPWF01SA, SPWF01SC**
## **9 Ordering information**
## **Table 8. Ordering information**
||**Table 8. Ordering information**|
|---|---|
|**Order codes**|**Description**|
|SPWF01SA.11|Wi-Fi module with integrated antenna, 1.5 MB of Flash and Wi-Fi full stack|
|SPWF01SC.11|Wi-Fi module with integrated u.fl connector, 1.5 MB of Flash and Wi-Fi full stack|
|SPWF01SA.21|Wi-Fi module with integrated antenna, 512 KB of Flash and Wi-Fi full stack|
|SPWF01SC.21|Wi-Fi module with integrated u.fl connector 512 KB of Flash and Wi-Fi full stack|
_Note: Refer to the user manual for a complete list of features and commands available in the Wi-Fi full stack._
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**Traceability information**
## **10 Traceability information**
Each module is univocally identified by the serial number stored in a 2D data matrix laser marked on the bottom side of the module itself.
The serial number has the following format:
**Table 9. Traceability information letter meaning**
|**Letter (s)**|**Meaning**|
|---|---|
|WW|Week|
|YY|Year|
|D|Product ID family|
|FF|Production panel coordinate identification|
|NNN|Progressive serial number|
Each module bulk is identified by a bulk ID.
BULK ID and module 2D data matrix are linked by a reciprocal traceability link.
The module 2D data matrix traces the lot number of any raw material used.
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**Revision history**
## **11 Revision history**
**Table 10. Document revision history**
|**Date**|**Revision**|**Changes**|
|---|---|---|
|05-Dec-2013|1|Initial release.|
|22-Jan-2014|2|_Figure 3_has been modified.|
|16-Apr-2014|3|Updated with references to modules with reduced Flash<br>memory.|
|18-Sep-2014|4|Modified:_Figure 1_and_Table 3_|
|20-May-2015|5|Modified:_Features_and_Applications_|
|11-Nov-2015|6|Update picture in first page.|
|16-Mar-2016|7|– Added information regarding SRRC certification in<br>_Features_and_Section 7: Regulatory compliance_.<br>– Updated module photo on the coverpage and<br>_Figure 1: Block diagram_.<br>– Added information on upgrading the module firmware<br>in the_Features_and_Description_sections.<br>– Updated the text of_Application guidelines on page 9_.<br>– Changed title of_Section 8_to Package information.<br>– Updated image and caption of_Figure 6_and_Figure 7_.<br>– Minor text changes throughout the document.|
|18-Jan-2017|8|– Updated_Section : Features on page 1_[added<br>“(supporting up to 5 stations)”].<br>– Updated_Section 7.3: CE on page 14_(replaced “ETSI<br>EN 300 328 V1.8.1:2012” by “ETSI EN 300 238<br>v1.9.1:2015”).<br>– Added_Section 10: Traceability information on_<br>_page 19_.<br>– Minor modifications throughout document.<br>– **Important note regarding a prior release of this**<br>**datasheet:**The module photo on the coverpage was<br>replaced, and modifications to_Figure 6_and_Figure 7_<br>were implemented for revision 5, released on 20-May-<br>2015. These changes were erroneously omitted from<br>the change history for that revision. Please note that<br>these changes were effective from revision 5, and<br>have remained unchanged in all subsequent revisions<br>up to the date of this revision.|
20/21
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**SPWF01SA, SPWF01SC**
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DocID025635 Rev 8
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