# Power MOSFET, N Channel, 100 V, 1.8 A, 0.35 ohm, SOT-223, Surface Mount

![Product image](https://novapart.co/image/farnell:9525726RL/)

**URL**: https://novapart.co/products/ZXMN10A11G/power-mosfet-n-channel-100-v-18-a-035-ohm-sot-223
**SKU**: ZXMN10A11G
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2730
**Stock**: 500+
**Lead Time**: 78 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:1.8A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.6ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; Power Dissipation

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 3.9W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-223 |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 1.8A |
| Drain Source On State Resistance | 0.35ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:9525726RL/)

**ZXMN10A11G** ~~———~~ **100V N-CHANNEL ENHANCEMENT MODE MOSFET** 

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## **Product Summary** 

|**Product Summaryy**|**Product Summaryy**|**Product Summaryy**|
|---|---|---|
||||
|**BVDSS**|**RDS(on)**|**ID**<br>**TA = +25°C**|
|100V|350mΩ @ VGS= 10V|2.4A|
||450mΩ @ VGS= 6.0V|2.1A|



## **Features and Benefits** 

- Fast Switching Speed 

- Low Gate Drive 

- Low Input Capacitance 

- **Lead-Free Finish; RoHS Compliant (Notes 1 & 2)** 

- **Halogen and Antimony Free. “Green” Device (Note 3)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

## **Description and Applications** 

This MOSFET is designed to minimize the on-state resistance and yet maintain superior switching performance, making it ideal for high efficiency power management applications. 

## **Mechanical Data** 

   - Case: SOT223 

   - Case Material: Molded Plastic; UL Flammability Classification Rating 94V-0 

   - Moisture Sensitivity:  Level 1 per J-STD-020 

- Motor Control 

- DC-DC Converters 

- Power Management Functions 

   - Terminals: Finish - Matte Tin Annealed over Copper Leadframe; Solderable per MIL-STD-202, Method 208 

   - Weight: 0.112 grams (Approximate) 

- Uninterrupted Power Supply 

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SOT223<br>D<br>G<br>i: & S<br>Equivalent Circuit<br>**----- End of picture text -----**<br>


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## **Ordering Information** (Note 4) 

|**Ordering Informationg Information Information**(Note 4)|**Ordering Informationg Information Information**(Note 4)|**Ordering Informationg Information Information**(Note 4)|**Ordering Informationg Information Information**(Note 4)|**Ordering Informationg Information Information**(Note 4)|
|---|---|---|---|---|
||||||
|**Product**|**Marking**|**Reel size(inches)**|**Tape width(mm)**|**Quantity per reel**|
|ZXMN10A11GTA|SeeBelow|7|12|1,000|



Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. 

## **Marking Information** 

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SOT223<br>ZXMN<br>10A11<br>co<br>YWW<br>**----- End of picture text -----**<br>


ZXMN10A11 = Product Type Marking Code YWW = Date Code Marking Y or Y = Last Digit of Year (ex: 5= 2015) WW or WW = Week Code (01~53) 

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ZXMN10A11G Document Number DS32056 Rev. 8 - 2 

March 2015 © Diodes Incorporated 

**ZXMN10A11G** 

**Maximum Ratings** (@TA = +25°C unless otherwise specified.) 

|**Maximum Ratingsgss** (@TA = +25°C unless otherwise specified.)A = +25°C unless otherwise specified.)= +25°C unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C unless otherwise specified.)A = +25°C unless otherwise specified.)= +25°C unless otherwise specified.)|**Maximum Ratingsgss** (@TA = +25°C unless otherwise specified.)A = +25°C unless otherwise specified.)= +25°C unless otherwise specified.)|(@TA = +25°C unless otherwise specified.)A = +25°C unless otherwise specified.)= +25°C unless otherwise specified.)|||
|---|---|---|---|---|---|
|**Characteristic**|||**Symbol**|**Value**|**Unit**|
|Drain-Source Voltage|||VDSS|100|V|
|Gate-Source Voltage|||VGS|20|V|
|Continuous Drain Current|VGS= 10V|(Note 6)|ID|2.4|A|
|||TA= +70°C(Note 6)||1.9||
|||(Note 5)||1.7||
|Pulsed Drain Current|VGS= 10V|(Note 7)|IDM|7.9|A|
|Continuous Source Current(BodyDiode)||(Note 6)|IS|4.6|A|
|Pulsed Source Current(BodyDiode)||(Note 7)|ISM|7.9|A|



**Thermal Characteristics** (@TA = +25°C unless otherwise specified.) 

|**Thermal Characteristics **(@TA = +25°C unless otherwise specified.)A = +25°C unless otherwise specified.)= +25°C unless otherwise specified.)|**Thermal Characteristics **(@TA = +25°C unless otherwise specified.)A = +25°C unless otherwise specified.)= +25°C unless otherwise specified.)|(@TA = +25°C unless otherwise specified.)A = +25°C unless otherwise specified.)= +25°C unless otherwise specified.)|||
|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Value**|**Unit**|
|Power Dissipation<br>Linear Derating Factor|(Note 5)|PD|2.0<br>16|W<br>mW/°C|
||(Note 6)||3.9<br>31||
|Thermal Resistance, Junction to Ambient|(Note 5)|RJA|62.5|°C/W|
||(Note 6)||32.0||
|Thermal Resistance,Junction to Lead|(Note 8)|RJL|9.8|°C/W|
|Operatingand Storage Temperature Range||TJ,TSTG|-55 to 150|°C|



Notes: 5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured when operating in a steady-state condition. 

6. Same as Note 5, except the device is measured at t  10 seconds. 

7. Same as Note 5, except the device is pulsed with D = 0.02 and pulse width 300µs. The pulse current is limited by the maximum junction temperature. 

8. Thermal resistance from junction to solder-point (at the end of the drain lead). 

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ZXMN10A11G Document Number DS32056 Rev. 8 - 2 

March 2015 © Diodes Incorporated 

**ZXMN10A11G** 

## **Thermal Characteristics** 

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10<br>R 2.0<br>DS(on)<br>ARR SS N<br>Limited<br>1 TS 1.6 LK<br>Het TUNA’ XN<br>ne ee ee Se) aS hz 1.2 »<br>DC<br>EER fff a é XN<br>100m<br>1s<br>TTS 100ms NINOS 0.8 NN<br>SEE eee 10ms a i <aellz NX<br>10m Single Pulse 1ms . | 0.4 I~ ~<br>T =25°C 100µs<br>amb<br>eeee ee eee 0.0 IN<br>1 10 100 0 20 40 60 80 100 120 140 160<br>VDS  Drain-Source Voltage (V)  Temperature (°C)<br>Safe Operating Area Derating Curve<br>70<br>7 A na<br>T =25°C<br>60 amb Single Pulse<br>: CHT TTT CITT eat UEC OTT il<br>T =25°C<br>amb<br>50 / LA a 100 CPT TTT TT TT il<br>Fay A ER<br>40 Ae” See en ett eet tt ee ea<br>30 Timi D=0.5 0 |lM Va ; PTCon TINEASSTP<br>ST iS 10 IIE ATI TUTTI<br>20 pn D=0.2 {tii ntaeUN Single Pulse AlltH Lleee cai amet mein eelTTI ETTeeeHI<br>10 ee D=0.05 1/1 Se REEL Ree<br>0 eeeSchneeerm CCL D=0.1 JN TviiTT 1 BST 0000 8 ll<br>100µ 1m 10m 100m 1 10 100 1k 100µ 1m 10m 100m 1 10 100 1k<br>Pulse Width (s) Pulse Width (s)<br>Transient Thermal Impedance Pulse Power Dissipation<br>  Drain Current (A)<br>ID<br> Max Power Dissipation (W)<br> Maximum Power (W)<br>Thermal Resistance (°C/W)<br>**----- End of picture text -----**<br>


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ZXMN10A11G Document Number DS32056 Rev. 8 - 2 

March 2015 © Diodes Incorporated 

**ZXMN10A11G** 

**Electrical Characteristics** (@TA = +25°C unless otherwise specified.) 

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|||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|Characteristic|Symbol|Min|Typ|Max|Unit|Test Condition|
|CN|OFF CHARACTERISTICS|
|a|Drain-Source Breakdown Voltage|SCO|BVDSS|100|||V|ID|= 250µA, VGS|= 0V|
|a|Zero Gate Voltage Drain Current|IDSS|||1|OO|µA|(|VDS|= 100V, VGS|= 0V|
|Gate-Source Leakage|Ge|IGSS||CO||100|(OG|nA|VGS|= 20V, VDS|= 0V|
|CO|COG|
|ON CHARACTERISTICS|
|Gate Threshold Voltage|VGS(th)|2.0||4.0|V|ID|= 250µA, VDS|= VGS|
|0.35|VGS|= 10V, ID|= 2.6A|
|Static Drain-Source On-Resistance (Note 9)|RDS (ON)|||||Ω|pO|
|0.45|VGS|= 6V, ID|= 1.3A|
|ceeGe|Forward Transconductance (Notes 9 & 10) Diode Forward Voltage (Note 9)|VgSDfs||CO|0.85 4|0.95 |(OG|S V|eee|VISDS= 1.85A, V= 15V, IDGS= 2.6A = 0V|
|a|Reverse Recovery Time (Note 10)|trr|26||ns|
|Reverse Recovery Charge (Note 10)|Qrr||30||nC|IF|= 1.0A, di/dt = 100A/µs|
|en|
|DYNAMIC CHARACTERISTICS (Note 6)|
|a|Input Capacitance|Ciss||274||pF|
|Output Capacitance|Coss||21||pF|VDS|= 50V, VGS|= 0V|
|f = 1MHz|
|——|Reverse Transfer Capacitance|oe|Crss|ee||ee|11|oe||oe|pF|
|a|Total Gate Charge (Note 11)|Qg||GO|3.5||nC|VGS|= 6.0V|
|a|Total Gate Charge (Note 11)|Qg||5.4||nC|VDS|= 50V|
|Gate-Source Charge (Note 11)|Qgs||1.4||nC|VGS|= 10V|ID|= 2.5A|
|a|Gate-Drain Charge (Note 11)|Qgd||1.5||nC|
|a——_|Turn-On Delay Time (Note 11)|tD(on)||2.7||e|ns|e|
|Turn-On Rise Time (Note 11)|tr||1.7||ns|VDD|= 50V, VGS|= 10V|
|a|Turn-Off Delay Time (Note 11)|tD(off)||7.4||ns|ID|= 1A, RG  6.0Ω|
|e|Turn-Off Fall Time (Note 11)|ee|tf||3.5||ns|
|ss|
|Notes:|9.   Measured under pulsed conditions. Pulse width  300µs; duty cycle  2%.|

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10.   For design aid only, not subject to production testing. 

11.   Switching characteristics are independent of operating junction temperatures. 

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ZXMN10A11G Document Number DS32056 Rev. 8 - 2 

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**ZXMN10A11G** 

## **Typical Characteristics** 

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10 10<br>T = 25°C 10V T = 150°C 10V<br>5V 5V<br>r Soe POC oe =<br>Pc ee amore q iit oroc 4.5V<br>1 UN | ee 4.5V 1 UII | | |rd 4V<br>4V 3.5V<br>Fo V 4 | Goan 4<br>0.1 GS 0.1<br>3V<br>3.5V<br>V<br>GS<br>eS aati en TT ee |<br>0.01 CT1ai 0.01 per 2.5V<br>0.1 1 10 0.1 1 10<br>VDS  Drain-Source Voltage (V) VDS  Drain-Source Voltage (V)<br>Output Characteristics Output Characteristics<br>2.2<br>a<br>2.0 V GS  = 10V<br>ne 7 | 1.8 I D  = 2.6A<br>1.6 R DS(on)<br>1 T = 150°C 1.4<br>/4ee ee 1.2 ee ee<br>SP T = 25°C<br>1.0<br>V<br>0.8 GS(th)<br>ff 0.6 y — V  = V —=_<br>VDS = 10V 0.4 I DGS  = 250uA DS<br>0.1 ff 0.2 JPr |<br>3 4 5 -50 0 50 100 150<br>VGS  Gate-Source Voltage (V) Tj  Junction Temperature (°C)<br>Typical Transfer Characteristics Normalised Curves v Temperature<br>100 1 0<br>3.5V 4V<br>V<br>GS<br>4.5V T = 150 ° C<br>10 eee Ul qth, 5V TE | 1 aa<br>Sn<br>T = 25°C<br>1 NY A 0. 1 pf<br>10V<br>CMe EZ<br>SSS ey A A<br>T = 25°C<br>0.1 ee 0.0 1 AnyGe<br>0.01 0.1 1 10 0.4 0.6 0.8 1.0<br>ID  Drain Current (A) VSD  Source-Drain Voltage (V)<br>On-Resistance v Drain Current Source-Drain Diode Forward Voltage<br>  Drain Current (A)   Drain Current (A)<br>ID ID<br>GS(th)<br> and V<br>DS(on)<br>  Drain Current (A)<br>ID<br>Normalised R<br><br>  Reverse Drain Current (A)<br> Drain-Source On-Resistance  ISD<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


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ZXMN10A11G Document Number DS32056 Rev. 8 - 2 

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**ZXMN10A11G** 

## **Typical Characteristics** (cont.) 

## **Test Circuits** 

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ZXMN10A11G Document Number DS32056 Rev. 8 - 2 

March 2015 © Diodes Incorporated 

**ZXMN10A11G** 

## **Package Outline Dimensions** 

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. 

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D<br>b1 Q<br>C<br>SOT223<br>Dim  Min  Max  Typ<br>A 1.55  1.65  1.60<br>A1 0.010 0.15 0.05<br>b 0.60 0.80 0.70<br>E E1 b1 2.90 3.10 3.00<br>C 0.20 0.30 0.25<br>Gauge D 6.45  6.55  6.50<br>Plane I E 3.45  3.55  3.50<br>0.25 E1 6.90  7.10  7.00<br>SeatingPlane L e -  -  4.60<br>e1 -  -  2.30<br>e1 ; b L 0.85  1.05  0.95<br>- e Q 0.84  0.94  0.89<br>a All Dimensions in mm<br>A A1 7°<br>0°-10°<br>7°<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. 

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X1 |<br>Y1<br>C1 Y2<br>Y<br>.<br>40 X  | C<br>**----- End of picture text -----**<br>


|**Dimensions Value**|**Dimensions Value(in mm)**|
|---|---|
|**C**|2.30|
|**C1**|6.40|
|**X**|1.20|
|**X1**|3.30|
|**Y**|1.60|
|**Y1**|1.60|
|**Y2**|8.00|



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ZXMN10A11G Document Number DS32056 Rev. 8 - 2 

March 2015 © Diodes Incorporated 

**ZXMN10A11G** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending.  Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

This document is written in English but may be translated into multiple languages for reference.  Only the English version of this document is the final and determinative format released by Diodes Incorporated. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2015, Diodes Incorporated 

**www.diodes.com** 

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ZXMN10A11G Document Number DS32056 Rev. 8 - 2 

March 2015 © Diodes Incorporated 



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- [Supplier page](https://es.farnell.com/diodes-inc/zxmn10a11g/mosfet-n-sot-223/dp/9525726RL)
---

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