# Dual MOSFET, Complementary Dual N and Dual P Channel, 100 V, 100 V, 800 mA, 800 mA, 0.7 ohm

![Product image](https://novapart.co/image/farnell:3944181/)

**URL**: https://novapart.co/products/ZXMHC10A07N8TC/dual-mosfet-complementary-n-and-p-channel-100-v
**SKU**: ZXMHC10A07N8TC
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Dual MOSFETs
**Price**: €0.4740
**Stock**: 500+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | Complementary Dual N and Dual P Channel |
| Product Range | - |
| Qualification | - |
| Transistor Case Style | SOIC |
| Operating Temperature Max | 150°C |
| Power Dissipation N Channel | 870mW |
| Power Dissipation P Channel | 870mW |
| Drain Source Voltage Vds N Channel | 100V |
| Drain Source Voltage Vds P Channel | 100V |
| Continuous Drain Current Id N Channel | 800mA |
| Continuous Drain Current Id P Channel | 800mA |
| Drain Source On State Resistance N Channel | 0.7ohm |
| Drain Source On State Resistance P Channel | 1ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3944181/)

**A Product Line of Diodes Incorporated** 

## **ZXMHC10A07N8 100V SO8 Complementary enhancement mode MOSFET H-Bridge** 

## **Summary** 

|**Device**|**V(BR)DSS**|**QG**|**RDS(on)**|
|---|---|---|---|
|N-CH|100V|2.9nC|0.70Ω @ VGS= 10V|
||||0.90Ω @ VGS= 6.0V|
|P-CH|-100V|3.5nC|1.00Ω @ VGS= -10V|
||||1.45Ω @ VGS= -6.0V|



## **Description** 

This new generation complementary MOSFET H-Bridge features low on-resistance achievable with low gate drive. 

## **Features** 

- 2 x N + 2 x P channels in a SOIC package 

## **Applications** 

- DC Motor control 

- DC-AC Inverters 

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P1S/P2S<br>P1G  P2G<br>P1D/N1D  P2D/N2D<br>N1G  N2G<br>N1S/N2S<br>**----- End of picture text -----**<br>


## **Ordering information** 

|**Device**|**Reel size**<br>**(inches)**|**Tape width**<br>**(mm)**|**Quantity**<br>**per reel**|
|---|---|---|---|
|ZXMHC10A07N8TC|13|12|2,500|



## **Device marking** 

ZXMHC 10A07 

**www.diodes.com** 

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## **Absolute maximum ratings** 

|**Absolute maximum ratings**|||||
|---|---|---|---|---|
|**Parameter**|**Symbol**|**N-**<br>**channel **|**P-**<br>**channel **|**Unit**|
|Drain-Source voltage|VDSS|100|-100|V|
|Gate-Source voltage|VGS|±20|±20|V|
|Continuous Drain current @ VGS= 10V; TA=25°C(b)<br>@ VGS= 10V; TA=70°C(b)<br>@ VGS= 10V; TA=25°C(a)<br>@ VGS= 10V; TL=25°C(f)|ID|1.00<br>0.80<br>0.80<br>0.81|-0.85<br>-0.68<br>-0.68<br>-0.69|A|
|Pulsed Drain current @ VGS= 10V; TA=25°C(c)|IDM|4.30|-3.64|A|
|Continuous Source current (Body diode) at TA=25°C(b)|IS|0.70|-0.60|A|
|Pulsed Source current (Body diode) at TA=25°C(c)|ISM|4.30|-3.64|A|
|Power dissipation at TA=25°C(a)<br>Linear derating factor|PD|0.87<br>6.94||W<br>mW/°C|
|Power dissipation at TA=25°C(b)<br>Linear derating factor|PD|1.36<br>10.9||W<br>mW/°C|
|Power dissipation at TL=25°C(f)<br>Linear derating factor|PD|0.90<br>7.19||W<br>mW/°C|
|Operating and storage temperature range|Tj, Tstg|-55 to 150||°C|



## **Thermal resistance** 

|**Thermal resistance**||||
|---|---|---|---|
|**Parameter**|**Symbol**|**Value**|**Unit**|
|Junction to ambient(a)|RθJA|144|°C/W|
|Junction to ambient(b)|RθJA|92|°C/W|
|Junction to ambient(d)|RθJA|106|°C/W|
|Junction to ambient(e)|RθJA|254|°C/W|
|Junction to lead(f)|RθJL|139|°C/W|



## **NOTES:** 

(a) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions with the heat-sink split into two equal areas (one for each drain connection); the device is measured when operating in a steady-state condition with one active die. 

(b) Same as note (a), except the device is measured at t ≤ 10 sec. 

(c) Same as note (a), except the device is pulsed with D= 0.02 and pulse width 300 µs.  The pulse current is limited by the maximum junction temperature. 

(d) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions with the heat-sink split into two equal areas (one for each drain connection); the device is measured when operating in a steady-state condition with one active die. 

(e) For a device surface mounted on minimum copper 1.6mm FR4 PCB, in still air conditions; the device is measured when operating in a steady-state condition with one active die. 

(f) Thermal resistance from junction to solder-point (at the end of the drain lead); the device is operating in a steady-state condition with one active die. 

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## **Thermal characteristics** 

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10 10<br>RDS(ON) RDS(ON)<br>Limited Limited<br>1 1<br>DC DC<br>100m 1s 100m 1s<br>100ms 100ms<br>Note (a) 10ms 1ms Note (a) 10ms<br>1ms<br>10m Single Pulse, Tamb=25°C 100us 10m Single Pulse, Tamb=25°C 100us<br>1 10 100 1 10 100<br>VDS  Drain-Source Voltage (V) -VDS  Drain-Source Voltage (V)<br>N-channel Safe Operating Area P-channel Safe Operating Area<br>  Drain Current (A)ID   Drain Current (A)-ID<br>**----- End of picture text -----**<br>


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1.0<br>140 One Active Die<br>120 25 x 25mm 1oz<br>100<br>Any one<br>80 D=0.5 active die<br>0.5<br>60<br>40 D=0.2 Single Pulse<br>D=0.05<br>20<br>D=0.1<br>0 0.0<br>100µ 1m 10m 100m 1 10 100 1k 0 25 50 75 100 125 150<br>Pulse Width (s)  Temperature (°C)<br>Transient Thermal Impedance Derating Curve<br>Thermal Resistance (°C/W)  Max Power Dissipation (W)<br>**----- End of picture text -----**<br>


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100 One Active Die<br>Single Pulse<br>T amb =25°C<br>10<br>1<br>100µ 1m 10m 100m 1 10 100 1k<br>Pulse Width (s)<br>Pulse Power Dissipation<br>Maximum Power (W)<br>**----- End of picture text -----**<br>


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## **N-channel electrical characteristics (at Tamb = 25°C unless otherwise stated)** 

|**Parameter**|**Symbol**|**Min.**|**Typ. **|**Max.**|**Unit**|**Conditions**|
|---|---|---|---|---|---|---|
|**Static**|||||||
|Drain-Source breakdown<br>voltage|V(BR)DSS|100|||V|ID = 250μA, VGS= 0V|
|Zero Gate voltage Drain<br>current|IDSS|||0.5|µA|VDS= 100V, VGS= 0V|
|Gate-Bodyleakage|IGSS|||±100|nA|VGS=±20V,VDS= 0V|
|Gate-Source threshold<br>voltage|VGS(th)|2.0||4.0|V|ID= 250μA, VDS= VGS|
|Static Drain-Source<br>on-state resistance(a)|RDS(on)|||0.7<br>0.9|Ω|VGS= 10V, ID= 1.5A<br>VGS= 6.0V, ID= 1.0A|
|Forward<br>Transconductance(a) (c)|gfs||1.6||S|VDS= 15V, ID= 1.0A|
|**Dynamic**|||||||
|**Capacitance **(c)|||||||
|Input capacitance|Ciss||138||pF|VDS= 60V, VGS= 0V<br>f= 1MHz|
|Output capacitance|Coss||12||pF||
|Reverse transfer<br>capacitance|Crss||6||pF||
|**Switching **(b) (c)|||||||
|Turn-on-delaytime|td(on)||1.8||ns|VDD= 50V, VGS= 10V<br>ID= 1.0A<br>RG ≅6.0Ω,|
|Rise time|tr||1.5||ns||
|Turn-off delaytime|td(off)||4.1||ns||
|Fall time|tf||2.1||ns||
|**Gate charge **(c)|||||||
|Total Gate charge|Qg||2.9||nC|VDS=50V, VGS= 10V<br>ID= 1.0A|
|Gate-Source charge|Qgs||0.7||nC||
|Gate-Drain charge|Qgd||1.0||nC||
|**Source–Drain diode**|||||||
|Diode forward voltage(a)|VSD|||0.95|V|IS= 1.5A, VGS= 0V|
|Reverse recoverytime(c)|trr||27||ns|IS= 1.8A, di/dt= 100A/μs|
|Reverse recoverycharge(c)|Qrr||12||nC||



## **NOTES:** 

(a) Measured under pulsed conditions. Pulse width ≤ 300μs; duty cycle ≤ 2%. 

(b) Switching characteristics are independent of operating junction temperature. 

(c) For design aid only, not subject to production testing 

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## **N-channel typical characteristics** 

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T = 25°C 10V 7V T = 150°C 10V 7V<br>6V 6V<br>1 1<br>5V<br>5V<br>4.5V<br>0.1<br>4.5V 0.1 4V<br>0.01 VGS VGS<br>3.5V<br>4V<br>0.01<br>0.1 1 10 0.1 1 10<br>VDS  Drain-Source Voltage (V) VDS  Drain-Source Voltage (V)<br>Output Characteristics Output Characteristics<br>2.0<br>1 1.8 VGS = 10V<br>1.6 ID = 1.5A R DS(on)<br>T = 150°C 1.4<br>1.2<br>1.0<br>0.1 T = 25°C 0.8 VGS(th)<br>0.6 VGS = VDS<br>0.4 I D = 250uA<br>VDS = 10V 0.2<br>0.01 0.0<br>3 4 5 6 -50 0 50 100 150<br>VGS  Gate-Source Voltage (V) Tj  Junction Temperature (°C)<br>Typical Transfer Characteristics Normalised Curves v Temperature<br>10 10<br>4.5V 5V 6V V GS<br>T = 150°C<br>1<br>1 7V<br>T = 25°C<br>10V<br>T = 25°C 0.1<br>0.01 0.1 1 0.4 0.6 0.8 1.0 1.2<br>ID  Drain Current (A) VSD  Source-Drain Voltage (V)<br>On-Resistance v Drain Current Source-Drain Diode Forward Voltage<br>  Drain Current (A)   Drain Current (A)<br>ID ID<br>GS(th)<br> and V<br>DS(on)<br>  Drain Current (A)<br>ID Normalised R<br>(Ω)<br>  Reverse Drain Current (A)<br>ISD<br> Drain-Source On-Resistance<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


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## **N-channel typical characteristics –continued** 

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200<br>180 VGS = 0V<br>f = 1MHz<br>160<br>140<br>120<br>100 C ISS<br>80 C OSS C RSS<br>60<br>40<br>20<br>0<br>1 10 100<br>VDS - Drain - Source Voltage (V)<br>Capacitance v Drain-Source Voltage<br>C  Capacitance (pF)<br>**----- End of picture text -----**<br>


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10<br>I D  = 1.0A<br>8<br>6<br>VDS = 50V<br>4<br>2<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0<br>Q - Charge (nC)<br>Gate-Source Voltage v Gate Charge<br>  Gate-Source Voltage (V)<br>GS<br>V<br>**----- End of picture text -----**<br>


## **Test circuits** 

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QG<br>VG QGS QGD<br>Charge<br>**----- End of picture text -----**<br>


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Current<br>regulator<br>12V 50k Same as<br>D.U.T<br>VDS<br>IG<br>D.U.T<br>ID<br>VGS<br>**----- End of picture text -----**<br>


**Basic gate charge waveform** 

**Gate charge test circuit** 

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VDS<br>90%<br>10%<br>VGS<br>td(on) tr td(off) tr<br>t(on) t(on)<br>**----- End of picture text -----**<br>


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RD<br>VGS VDS<br>RG VDD<br>**----- End of picture text -----**<br>


**Switching time waveforms** 

**Switching time test circuit** 

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## **P-channel electrical characteristics (at Tamb = 25°C unless otherwise stated)** 

|**Parameter**|**Symbol**|**Min.**|**Typ. **|**Max.**|**Unit**|**Conditions**|
|---|---|---|---|---|---|---|
|**Static**|||||||
|Drain-Source breakdown<br>voltage|V(BR)DSS|-100|||V|ID = -250μA, VGS= 0V|
|Zero Gate voltage Drain<br>current|IDSS|||-0.5|µA|VDS= -100V, VGS= 0V|
|Gate-Bodyleakage|IGSS|||±100|nA|VGS=±20V,VDS= 0V|
|Gate-Source threshold<br>voltage|VGS(th)|-2.0||-4.0|V|ID= -250μA, VDS= VGS|
|Static Drain-Source<br>on-state resistance(a)|RDS(on)|||1.0<br>1.45|Ω|VGS= -10V, ID= -0.6A<br>VGS= -6.0V, ID= -0.5A|
|Forward<br>Transconductance(a) (c)|gfs||1.2||S|VDS= -15V, ID= -0.6A|
|**Dynamic**|||||||
|**Capacitance **(c)|||||||
|Input capacitance|Ciss||141||pF|VDS= -50V, VGS= 0V<br>f= 1MHz|
|Output capacitance|Coss||13.1||pF||
|Reverse transfer<br>capacitance|Crss||10.8||pF||
|**Switching **(b) (c)|||||||
|Turn-on-delaytime|td(on)||1.6||ns|VDD= -50V, VGS= -10V<br>ID= -1.0A<br>RG ≅6.0Ω|
|Rise time|tr||2.1||ns||
|Turn-off delaytime|td(off)||5.9||ns||
|Fall time|tf||3.3||ns||
|**Gate charge **(c)|||||||
|Total Gate charge|Qg||3.5||nC|VDS= -50V, VGS= -10V<br>ID= -0.6A|
|Gate-Source charge|Qgs||0.6||nC||
|Gate-Drain charge|Qgd||1.6||nC||
|**Source–Drain diode**|||||||
|Diode forward voltage(a)|VSD||-0.85|-0.95|V|IS= -0.7A, VGS= 0V|
|Reverse recoverytime(c)|trr||29||ns|IS= -0.9A, di/dt= 100A/μs|
|Reverse recoverycharge(c)|Qrr||31||nC||



## **NOTES:** 

(a) Measured under pulsed conditions. Pulse width ≤ 300μs; duty cycle ≤ 2%. 

(b) Switching characteristics are independent of operating junction temperature. 

(c) For design aid only, not subject to production testing 

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## **P-channel typical characteristics** 

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10 10<br>T = 25°C 10V 7V T = 150°C 10V 7V<br>5V 5V<br>1 4.5V 1 4.5V<br>4V<br>4V<br>0.1 0.1 3.5V<br>3.5V<br>3V<br>0.01 0.01<br>-VGS -VGS<br>1E-3 1E-3<br>0.1 1 10 0.1 1 10<br>-VDS  Drain-Source Voltage (V) -VDS  Drain-Source Voltage (V)<br>Output Characteristics Output Characteristics<br>2.2<br>1 2.0 VGS = -10V<br>1.8 ID = - 0.6A<br>T = 150°C 1.6<br>RDS(on)<br>T = 25°C 1.4<br>0.1 1.2<br>1.0 V GS(th)<br>0.8 V GS  = V DS<br>-V DS  = 10V 0.6 ID = -250uA<br>0.01 0.4<br>3 4 5 -50 0 50 100 150<br>-VGS  Gate-Source Voltage (V) Tj  Junction Temperature (°C)<br>Typical Transfer Characteristics Normalised Curves v Temperature<br>1 0<br>3.5V -V GS T = 25 ° C<br>100 4V T = 150°C<br>1<br>4.5V<br>5V<br>10 T = 25°C<br>0. 1<br>7V<br>10V<br>1<br>0.0 1<br>0.01 0.1 1 10 0.2 0.4 0.6 0.8 1.0 1.2<br>-ID  Drain Current (A) -VSD  Source-Drain Voltage (V)<br>On-Resistance v Drain Current Source-Drain Diode Forward Voltage<br>  Drain Current (A)   Drain Current (A)<br>D D<br>-I -I<br>GS(th)<br> and V<br>DS(on)<br>  Drain Current (A)<br>D<br>-I<br>Normalised R<br>(Ω)<br>  Reverse Drain Current (A)<br> Drain-Source On-Resistance DS(on) -ISD<br>R<br>**----- End of picture text -----**<br>


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## **P-channel typical characteristics –continued** 

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200 V GS = 0V<br>f = 1MHz<br>150<br>CISS<br>100 C OSS<br>C RSS<br>50<br>0<br>0.1 1 10 100<br>-VDS - Drain - Source Voltage (V)<br>C  Capacitance (pF)<br>**----- End of picture text -----**<br>


**Capacitance v Drain-Source Voltage** 

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10<br>ID = -0.6A<br>8<br>6<br>4<br>2<br>VDS = -50V<br>0<br>0 1 2 3 4<br>Q - Charge (nC)<br>Gate-Source Voltage v Gate Charge<br>  Gate-Source Voltage (V)<br>GS<br>-V<br>**----- End of picture text -----**<br>


## **Test circuits** 

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QG<br>VG  QGS  QGD<br>Charge<br>**----- End of picture text -----**<br>


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Current<br>regulator<br>12V  0.2�F  50k  Same as<br>D.U.T<br>VDS<br>IG<br>D.U.T<br>ID<br>VGS<br>**----- End of picture text -----**<br>


**Basic gate charge waveform** 

**Gate charge test circuit** 

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VDS<br>90%<br>10%<br>VGS<br>tr  td(off)  tr  td(on)<br>t(on)  t(on)<br>**----- End of picture text -----**<br>


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RD<br>VGS  VDS<br>RG  VDD<br>Pulse width � 1�S<br>Duty factor 0.1%<br>**----- End of picture text -----**<br>


**Switching time waveforms** 

**Switching time test circuit** 

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**ZXMHC10A07N8** 

## **Packaging details - SO8** 

|**DIM**<br>~~ee~~<br>~~ee~~|**Inches**<br>~~ee~~|**Inches**<br>~~ee~~|**Millimeters**<br>~~ee~~|**Millimeters**<br>~~ee~~|**DIM**<br>~~ee~~<br>|**Inches**<br>~~ee~~|**Inches**<br>~~ee~~|**Millimeters**<br>~~ee~~|**Millimeters**<br>~~ee~~|
|---|---|---|---|---|---|---|---|---|---|
||**Min.**<br>~~ee~~<br>~~ee~~<br>~~ee~~|**Max.**<br>~~ee~~<br>~~ee~~<br>~~ee~~|**Min.**<br>~~ee~~<br>~~ee~~|**Max.**<br>~~ee~~<br>~~ee ~~||**Min.**<br>~~ee~~<br> ~~ee~~|**Max.**<br>~~ee~~<br>~~ee~~|**Min.**<br>~~ee~~<br>~~ee~~|**Max.**<br>~~ee~~<br>~~ee~~|
|A<br>~~ee~~<br>~~es~~|0.053<br>~~ee~~<br>~~es~~|0.069<br>~~ee~~|1.35|1.75|e|0.050 BSC||1.27 BSC||
|A1<br>~~ee~~<br>~~es~~<br>~~ee~~|0.004<br>~~ee ~~<br>~~es~~<br>~~ee~~|0.010<br> ~~ee~~<br>|0.10<br>~~es~~<br>|0.25<br>|b<br>|0.013|0.020|0.33|0.51|
|D<br>~~es~~<br>~~es~~<br>~~ee~~<br>~~ee~~|0.189<br>~~es~~<br>~~es~~<br>~~ee es es~~<br>~~ee~~|0.197<br>~~es~~<br>~~es es~~<br>|4.80<br>~~es~~<br>~~es~~<br>~~es es~~<br>|5.00<br>~~es~~<br>~~ee~~|c<br>~~es~~<br>~~ee~~|0.008<br>~~es~~<br>~~ee~~|0.010<br>~~es~~<br>~~ee~~|0.19<br>~~es~~|0.25<br>~~es~~|
|H<br>~~ee~~<br>~~ee~~|0.228<br>~~ee es es~~<br>~~ee~~|0.244<br>~~es es~~<br>|5.80<br>~~es~~<br>~~es es~~<br>|6.20<br>~~ee~~|θ<br>~~ee~~|0°<br>~~ee~~|8°<br>~~ee~~|0°|8°|
|E<br><br>~~ee~~|0.150<br>~~es es~~<br>~~ee ~~|0.157<br>~~es es~~<br> ~~es~~|3.80<br>~~es es~~<br>~~es~~|4.00<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|-|-|
|L<br>~~ee~~|0.016<br>~~ee ~~|0.050<br> ~~es~~|0.40<br>~~es~~|1.27|-|-|-|-|-|



**Note:** Controlling dimensions are in inches. Approximate dimensions are provided in millimeters 

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## **IMPORTANT NOTICE** 

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Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. 

Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

Products described herein may be covered by one or more United States, international or foreign patents pending.  Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. 

## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

A.   Life support devices or systems are devices or systems which: 

1. are intended to implant into the body, or 

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the        failure of the life support device or to affect its safety or effectiveness. 

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated.  Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. 

Copyright © 2009, Diodes Incorporated 

**www.diodes.com** 

**Issue 1.0 - March 2009                                          11** 

**www.diodes.com** 

**© Diodes Incorporated** 



## Links

- [View this product on Novapart](https://novapart.co/products/ZXMHC10A07N8TC/dual-mosfet-complementary-n-and-p-channel-100-v)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/diodes-inc/zxmhc10a07n8tc/mosfet-dual-n-p-ch-100v-0-8a/dp/3944181)
---

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