# Power MOSFET, P Channel, 20 V, 3.5 A, 0.09 ohm, MSOP, Surface Mount

![Product image](https://novapart.co/image/farnell:3943968/)

**URL**: https://novapart.co/products/ZXM64P02XTA/power-mosfet-p-channel-20-v-35-a-009-ohm-msop
**SKU**: ZXM64P02XTA
**Manufacturer**: DIODES INC.
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4830
**Stock**: 1000+
**Lead Time**: 78 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 1.1W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | MSOP |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 3.5A |
| Drain Source On State Resistance | 0.09ohm |
| Gate Source Threshold Voltage Max | 700mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3943968/)

**ZXM64P02X** 

## **20V P-CHANNEL ENHANCEMENT MODE MOSFET** 

**SUMMARY V(BR)DSS=-20V; RDS(ON)=0.090** ; **ID= -3.5A** 

## **DESCRIPTION** 

This new generation of high density MOSFETs from Zetex utilises a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications. 

## **MSOP8** 

## **FEATURES** 

- Low on-resistance 

- Fast switching speed 

- Low threshold 

- Low gate drive 

- Low profile SOIC package 

## **APPLICATIONS** 

- DC - DC Converters 

- Power Management Functions 

- Disconnect switches 

- Motor control 

## **ORDERING INFORMATION** 

|DEVICE|REEL SIZE<br>(inches)|TAPE WIDTH (mm)|QUANTITY<br>PER REEL|
|---|---|---|---|
|ZXM64P02XTA|7|12mm embossed|1000  units|
|ZXM64P02XTC|13|12mm embossed|4000 units|



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S D<br>S D<br>S D<br>G D<br>Top View<br>1 8<br>2 7<br>3 6<br>4 5<br>**----- End of picture text -----**<br>


## **DEVICE MARKING** 

- ZXM64P02 

Issue 2 - February 2008 

**1** 

**ZXM64P02X** 

## **ABSOLUTE MAXIMUM RATINGS.** 

|**ABSOLUTE MAXIMUM RATINGS.**||||
|---|---|---|---|
|PARAMETER|SYMBOL|LIMIT|UNIT|
|Drain-Source Voltage|VDSS|-20|V|
|Gate- Source Voltage|VGS|±12|V|
|Continuous Drain Current (VGS=4.5V; TA=25°C)(b)<br>(VGS=4.5V; TA=70°C)(b)|ID|-3.5<br>-2.8|A|
|Pulsed Drain Current (c)|IDM|-19|A|
|Continuous Source Current (Body Diode)(b)|IS|-2.0|A|
|Pulsed Source Current (Body Diode)(c)|ISM|-19|A|
|Power Dissipation at TA=25°C (a)<br>Linear Derating Factor|PD|1.1<br>8.8|W<br>mW/°C|
|Power Dissipation at TA=25°C (b)<br>Linear Derating Factor|PD|1.8<br>14.4|W<br>mW/°C|
|Operating and Storage Temperature Range|Tj:Tstg|-55 to +150|°C|



## **THERMAL RESISTANCE** 

|**THERMAL RESISTANCE**||||
|---|---|---|---|
|PARAMETER|SYMBOL|VALUE|UNIT|
|Junction to Ambient (a)|RθJA|113|°C/W|
|Junction to Ambient (b)|RθJA|70|°C/W|



## NOTES 

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions 

(b) For a device surface mounted on FR4 PCB measured at t�10 secs. 

(c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph. 

Issue 2 - February 2008 

**2** 

**ZXM64P02X** 

## **CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
100 2.0<br>Refer Note (a)<br>1.5<br>10 Refer Note (b)<br>Refer Note (a)<br>1.0<br>DC<br>1 100ms1s<br>10ms 0.5<br>1ms<br>100us<br>100m 0<br>0.1 1 10 100 0 20 40 60 80 100 120 140 160<br>-VDS - Drain-Source Voltage (V) T - Temperature (°C)<br>Safe Operating Area Derating Curve<br>80 120<br>Refer Note (b) Refer Note (a)<br>60 90<br>40 D=0.5 60 D=0.5<br>20 D=0.2 30 D=0.2<br>D=0.1 D=0.1<br>Single Pulse Single Pulse<br>0 0<br>0.0001 0.001 0.01 0.1 1 10 100 0.0001 0.001 0.01 0.1 1 10 100 1000<br>Pulse Width (s) Pulse Width (s)<br>Transient Thermal Impedance Transient Thermal Impedance<br> - Drain Current (A)<br>D<br>-I<br>Max Power Dissipation (Watts)<br>Thermal Resistance (°C/W) Themal Resistance (°C/W)<br>**----- End of picture text -----**<br>


Issue 2 - February 2008 

**3** 

## **ZXM64P02X** 

## **ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated).** 

|PARAMETER|SYMBOL|MIN.|TYP.|MAX.|UNIT|CONDITIONS.|
|---|---|---|---|---|---|---|
|**STATIC**|||||||
|Drain-Source  Breakdown Voltage|V(BR)DSS|-20|||V|ID=-250µA, VGS=0V|
|Zero Gate Voltage Drain Current|IDSS|||-1|µA|VDS=-20V, VGS=0V|
|Gate-Body Leakage|IGSS|||±100|nA|VGS=±12V, VDS=0V|
|Gate-Source Threshold Voltage|VGS(th)|-0.7|||V|ID=-250µA, VDS= VGS|
|Static Drain-Source On-State Resistance<br>(1)|RDS(on)|||0.090<br>0.13|Ω<br>Ω|VGS=-4.5V, ID=-2.4A<br>VGS=-2.7V, ID=-1.2A|
|Forward Transconductance (3)|gfs|2.6|||S|VDS=-10V,ID=-1.2A|
|**DYNAMIC**(3)|||||||
|Input Capacitance|Ciss||900||pF|VDS=-15 V, VGS=0V,<br>f=1MHz|
|Output Capacitance|Coss||350||pF||
|Reverse Transfer Capacitance|Crss||150||pF||
|**SWITCHING**(2) (3)|||||||
|Turn-On Delay Time|td(on)||5.6||ns|VDD=-10V, ID=-2.4A<br>RG=6.0Ω, RD=4.0Ω<br>(Refer to test circuit)|
|Rise Time|tr||12.3||ns||
|Turn-Off Delay Time|td(off)||45.5||ns||
|Fall Time|tf||40.0||ns||
|Total Gate Charge|Qg|||6.9|nC|VDS=-16V,VGS=-4.5V,<br>ID=-2.4A<br>(Refer to test circuit)|
|Gate-Source Charge|Qgs|||1.3|nC||
|Gate Drain Charge|Qgd|||2.5|nC||
|**SOURCE-DRAIN DIODE**|||||||
|Diode Forward Voltage (1)|VSD|||-0.95|V|Tj=25°C, IS=-2.4A,<br>VGS=0V|
|Reverse Recovery Time (3)|trr||46.0||ns|Tj=25°C, IF=-2.4A,<br>di/dt= 100A/µs|
|Reverse Recovery Charge(3)|Qrr||35.0||nC||



(1) Measured under pulsed conditions. Width=300 µ s. Duty cycle ≤ 2% . 

(2) Switching characteristics are independent of operating junction temperature. 

(3) For design aid only, not subject to production testing. 

Issue 2- February 2008 

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**ZXM64P02X** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
100 100<br>+25 C +150°C<br>5V 4.5V 4V 3.5V 3V -VGS 5V 4.5V 4V 3.5V -VGS<br>3V<br>10 2.5V 10 2.5V<br>2V 2V<br>1.5V<br>1 1.5V 1<br>0.1 0.1<br>0.1 1 10 100 0.1 1 10 100<br>-VDS - Drain-Source Voltage (V) -VDS - Drain-Source Voltage (V)<br>Output Characteristics Output Characteristics<br>100 1.6<br>VDS=-10V<br>1.4<br>RDS(on)<br>VGS=-4.5V<br>10 1.2 ID=-2.4A<br>T=150°C 1.0<br>VGS=VDS<br>T=25°C<br>ID=-250uA<br>1 0.8<br>VGS(th)<br>0.6<br>0.1 0.4<br>0.5 1 1.5 2 2.5 3 3.5 -100 -50 0 50 100 150 200<br>-VGS - Gate-Source Voltage (V) Tj - Junction Temperature (°C)<br>Typical Transfer Characteristics Normalised RDS(on) and VGS(th)<br> v Temperature<br>10 100<br>1 10<br>VGS=-2V<br>VGS=-5V<br>0.1 1<br>T=150°C<br>T=25°C<br>0.01 0.1<br>0.1 1 10 100 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>-ID - Drain Current (A) -VSD - Source-Drain Voltage (V)<br>On-Resistance v Drain Current Source-Drain Diode Forward Voltage<br> - Drain Current (A)  - Drain Current (A)<br>D D<br>-I -I<br>GS(th)<br>and V<br>DS(on)<br> - Drain Current (A)<br>D<br>-I<br>Normalised R<br>) Ω  - Reverse Drain Current (A)<br>SD<br>-I<br> - Drain-Source On-Resistance (<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


Issue 2 - February 2008 

**5** 

## **ZXM64P02X** 

## **TYPICAL CHARACTERISTICS** 

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2000 5<br>Vgs=0V ID=-2.4A<br>1800 f=1Mhz 4.5<br>1600 4<br>Ciss VDS=-15V<br>1400 Coss 3.5<br>1200 Crss 3<br>1000 2.5<br>800 2<br>600 1.5<br>400 1<br>200 0.5<br>0 0<br>0.1 1 10 100 0 1 2 3 4 5 6<br>-VDS - Drain Source Voltage (V) Q -Charge (nC)<br>Capacitance v Drain-Source Voltage  Gate-Source Voltage v Gate Charge<br>Basic Gate Charge Waveform Gate Charge Test Circuit<br>Switching Time Waveforms Switching Time Test Circuit<br>C - Capacitance (pF)  - Gate-Source Voltage (V)<br>GS<br>-V<br>**----- End of picture text -----**<br>


Issue 2 - February 2008 

**6** 

## **ZXM64P02X** 

## **PACKAGE DIMENSIONS** 

**==> picture [415 x 204] intentionally omitted <==**

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|||||||
|---|---|---|---|---|---|
|D|DIM|Millimetres|Inches|
|MIN|MAX|MIN|MAX|
|A|1.10|0.043|
|8|7|6|5|
|A1|0.05|0.15|0.002|0.006|
|B|0.25|0.40|0.010|0.016|
|1|2|3|4|
|C|0.13|0.23|0.005|0.009|
|e X 6|
|θ°|D|2.90|3.10|0.114|0.122|
|e|0.65|BSC|0.0256|BSC|
|E|2.90|3.10|0.114|0.122|
|L|
|B|C|
|H|4.90|BSC|0.193|BSC|
|Conforms to JEDEC MO-187 Iss A|L|0.40|0.70|0.016|0.028|
|q°|0°|6°|0°|6°|

**----- End of picture text -----**<br>


## **PAD LAYOUT DETAILS** 

## Zetex plc. 

Chadderton Technology Park, Chadderton, Oldham, OL9-9LL, United Kingdom. Telephone: (44)161 622 4422 (Sales), (44)161 622 4444 (General Enquiries) Fax: (44)161 622 4420 

Zetex GmbH Zetex Inc. Zetex (Asia) Ltd. These are supported by tKustermann-park                      700 Veteran Mem. Highway      Metroplaza, Tower 1 agents and distributors in D-81541 München                     Hauppauge, NY, 11788           Hing Fong Road,                            major countries world-wide Germany USA Kwai Fong, Hong Kong Zetex plc 1999 Telefon: (49) 89 45 49 49 0 Telephone: (516) 543-7100 Telephone:(852) 26100 611 Fax: (49) 89 45 49 49 49 Fax: (516) 864-7630 Fax: (852) 24250 494 **Internet:http://www.zetex.com** 

This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. 

Issue 2 - February 2008 

**7** 



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- [Supplier page](https://es.farnell.com/diodes-inc/zxm64p02xta/mosfet-p-ch-20v-3-5a-msop/dp/3943968)
---

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