# VARISTOR, 18V, 50V, 0603

![Product image](https://novapart.co/image/farnell:4059656/)

**URL**: https://novapart.co/products/V18MLE0603NH/varistor-18v-50v-0603
**SKU**: V18MLE0603NH
**Manufacturer**: LITTELFUSE
**Category**: Circuit Protection || TVS - Transient Voltage Suppressors || TVS Varistors
**Price**: €0.2010
**Stock**: 1000+
**Lead Time**: 135 days (indicative)

## Description

Voltage Rating VAC:-; Voltage Rating VDC:18V; Product Range:MLE Series; Clamping Voltage Vc Max:50V; Varistor Case Style:0603 ^1608 Metric]; Peak Surge Current @ 8/20µS:-; Op 06R2043

## Specifications

| Parameter | Value |
|---|---|
| Product Range | MLE Series |
| Varistor Type | Multilayer Varistor (MLV) |
| Voltage Rating Vac | - |
| Voltage Rating Vdc | 18V |
| Varistor Case Style | 0603 [1608 Metric] |
| Clamping Voltage Vc Max | 50V |
| Peak Energy (10/1000Us) | - |
| Operating Temperature Max | 125°C |
| Operating Temperature Min | -40°C |
| Peak Surge Current @ 8/20Μs | - |
| Automotive Qualification Standard | - |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4059656/)

**Metal-Oxide Varistors (MOVs)** Surface Mount Multilayer Varistors (MLVs) > MLE Series 

~~L_|HF~~ ~~**RoHS**~~ 

## MLE Varistor Series 

## ~~**Description**~~ 

The MLE Series family of transient voltage suppression devices are based on the Littelfuse multilayer fabrication technology. These components are designed to suppress ESD events, including those specified in IEC 61000-4-2 or other standards used for Electromagnetic Compliance testing. The MLE Series is typically applied to protect integrated circuits and other components at the circuit board level operating at 18VDC, or less. 

The fabrication method and materials of these devices result in capacitance characteristics suitable for high frequency attenuation/low-pass filter circuit functions, thereby providing suppression and filtering in a single device. 

The MLE Series is manufactured from semiconducting ceramics and is supplied in a leadless, surface mount package. The MLE Series is compatible with modern reflow and wave soldering procedures. 

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Size Table<br>Metric EIA<br>1005 0402<br>EE 1608 | 0603<br>2012 | 0805<br>a 3216 1206<br>**----- End of picture text -----**<br>


Littelfuse Inc. manufactures other Multilayer Series products. See the ML Series data sheet for higher energy/ peak current transient applications. See the AUML Series for automotive applications and the MLN Quad Array. For 

high–speed applications see the MHS Series. 

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Applications Features<br>ee<br>**----- End of picture text -----**<br>


- Protection of • Used in mobile components and communications, circuits sensitive computer/EDP to ESD Transients products, medical occurring on power products, hand held/ supplies, control portable devices, and signal lines industrial equipment, including diagnostic 

- • Suppression of ESD events such as port protection and specified in IEC-61000I/O interfaces 4-2 or MIL-STD-883 Method-3015.7, for electromagnetic compliance (EMC) 

- Halogen-Free and • Leadless 0402, 0603, RoHS Compliant 0805, and 1206 sizes 

- Rated for ESD • Operating voltages (IEC-61000-4-2) up to 18VM(DC) 

- Characterized for • Multilayer ceramic impedance and construction technology capacitance 

- -40ºC to +125ºC operating temp. range 

**Additional Information** ~~**Absolute Maximum Ratings** ee~~ •  For ratings of individual members of a series, see device ratings and specifications table. ~~ee~~ **Continuous MLE Series** ~~ee~~ **Units** ~~ee~~ **Steady State Applied Voltage:** DC Voltage Range (VM(DC)) ≤18 V **Datasheet Resources Samples** Operating Ambient Temperature Range (TA) -40 to +125 ºC ~~——~~ Storage Temperature Range (TSTG) -40 to +150 C 

© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BO.11/18/20 

**Metal-Oxide Varistors (MOVs)** Surface Mount Multilayer Varistors (MLVs) > MLE Series 

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## ~~**Device Ratings and Specifcations**~~ 

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Performance Specifications (25ºC)<br>Max Continuous<br>Part Number Working Voltage  -55ºC to 125ºC Nominal Voltage Maximum Clamping Voltage at Specified Current (8/20µs) Maximum ESD Clamp Voltage (Note 2) Capacitance Typical<br> (Note 1)VM(DC) 1mA DCVNOM at VC 8kV Contact(Note 3) 15kV Air(Note 4) at 1MHz<br>(V) MIN (V) MAX (V) (V)   (V) Clamp (V) (pF)<br>V18MLE0402N 18 22 28 50 at 1A <125 <110 <55<br>V18MLE0402F  [(Note 8)] 18 22  28 50 at 1A <125 <110 <55<br>V18MLE0603N 18 22  28 50 at 1A <75 <110 <125<br>V18MLE0603F  [(Note 8)] 18 22  28 50 at 1A <75 <110 <125<br>V18MLE0603LN 18 22 28 50 at 1A <100 <140 <100<br>V18MLE0805N 18 22 28 50 at 1A <70 <75 <500<br>V18MLE0805LN 18 22 28 50 at 1A <75 <135 <290<br>V18MLE1206N 18 22 28 50 at 1A <65 <65 <1700<br>**----- End of picture text -----**<br>


## **NOTES:** 

**1.** For applications of 18VDC or less. Higher voltages available, contact your Littelfuse Sales Representative. 

**2.** Tested with IEC-61000-4-2 Human Body Model (HBM) discharge test circuit. 

**3.** Direct discharge to device terminals (IEC preferred test method). 

**4.** Corona discharge through air (represents actual ESD event). 

**5.** Capacitance may be customized, contact your Littelfuse Sales Representative. 

**6.** Leakage current ratings are at 18 VDC and 25µA maximum. 

**7.** The typical capacitance rating is the discrete component test result. 

**8.** Items are lead free, and available as "R" packing option only. 

## ~~**Peak Current and Energy Derating Curve**~~ 

**Nominal Voltage Stability to Multiple ESD Impulses (8kV Contact Discharges per IEC 61000-4-2)** 

For applications exceeding 125ºC ambient temperature, the peak surge current and energy ratings must be reduced as shown below. 

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100<br>80<br>60<br>40<br>20<br>0<br>-55 50 60 70 80 90 100 110 120 130 140 150<br>AMBIENT TEMPERATURE ( [o] C)<br>Figure 1<br>PERCENT OF RATED VALUE<br>**----- End of picture text -----**<br>


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Standby Current at Normalized Varistor Voltage and<br>Temperature<br>1.2<br>1.0<br>0.8<br>25O<br>0.6<br>85O<br>0.4<br>125O<br>0.2<br>0.0<br>0.0001 0.001 0.01 0.1 1<br>Figure 3<br>CURRENT (mA)<br>NORMALIZED VARISTOR VOLTAGE (V)<br>**----- End of picture text -----**<br>


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30<br>25<br>20<br>15<br>10<br>5<br>0<br>1 10 100 1000 10000<br>Figure 2 CURRENT (A)<br>NOMINAL VOLTAGE AT 1mADC<br>**----- End of picture text -----**<br>


## ~~**Impedance (Z) vs Frequency Typical Characteristic**~~ 

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100<br>-0402<br>10 -0603<br>-0805<br>1 -1206<br>0.1<br>0.01<br>Figure 4 10 100 1000 10000<br>FREQUENCY (MHz)<br>IMPEDANCE (Z)<br>**----- End of picture text -----**<br>


© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BO.11/18/20 

**Metal-Oxide Varistors (MOVs)** Surface Mount Multilayer Varistors (MLVs) > MLE Series 

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## ~~**Device Characteristics**~~ 

At low current levels, the V-I curve of the multilayer transient voltage suppressor approaches a linear (ohmic) relationship and shows a temperature dependent effect. At or below the maximum working voltage, the suppressor is in a high resistance model (approaching 10[6] Ω at its maximum rated working voltage). Leakage currents at maximum rated voltage are below 100 _µ_ A, typically 25 _µ_ A; for 0402 size below 20 _µ_ A, typically 5 _µ_ A. 

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Typical Temperature Dependance of the Characteristic<br>Curve in the Leakage Region<br>100%<br>25o 50o 75o 100o 125 [o] C<br>10%<br>1E [-9] 1E [-8] 1E [-7] 1E [-6] 1E [-5] 1E [-4] 1E [-3] 1E [-2]<br>Figure 5 SUPPRESSOR CURRENT (ADC)<br>C (%)<br> o<br> VALUE AT 25<br>NOM<br>V<br>SUPPRESSOR VOLTAGE IN PERCENT OF<br>**----- End of picture text -----**<br>


## ~~**Speed of Response**~~ 

The Multilayer Suppressor is a leadless device. Its response time is not limited by the parasitic lead inductances found in other surface mount packages. The response time of the ZNO dielectric material is less than 1ns and the MLE can clamp very fast dV/dT events such as ESD. Additionally, in "real world" applications, the associated circuit wiring is often the greatest factor effecting speed of response. Therefore, transient suppressor placement within a circuit can be considered important in certain instances. 

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Multilayer Internal Construction<br>FIRED CERAMIC<br>DIELECTRIC<br>METAL<br>ELECTR ODES<br>METAL END<br>TERMINATION<br>DEPLETION<br>REGION<br>DEPLETION<br>REGION<br>Figure 7 GRAINS<br>**----- End of picture text -----**<br>


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Clamping Voltage Over Temperature (V C  at 10A)<br>100<br>V26MLA1206<br>V5.5MLA1206<br>10<br>-60 -40 -20 0 20 40 60 80 100 120 140<br>Figure 6 TEMPERATURE ( [o] C)<br>CLAMPING VOLTAGE (V)<br>**----- End of picture text -----**<br>


## ~~**Energy Absorption/Peak Current Capability**~~ 

Energy dissipated within the MLE is calculated by multiplying the clamping voltage, transient current and transient duration. An important advantage of the multilayer is its interdigitated electrode construction within the mass of dielectric material. This results in excellent current distribution and the peak temperature per energy absorbed is very low. The matrix of semiconducting grains combine to absorb and distribute transient energy (heat) (see Speed of Response). This dramatically reduces peak temperature; thermal stresses and enhances device reliability. 

As a measure of the device capability in energy and peak current handling, the V26MLA1206A part was tested with multiple pulses at its peak current rating (3A, 8/20 _µ_ s). At the end of the test, 10,000 pulses later, the device voltage characteristics are still well within specification. 

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Repetitive Pulse Capability<br>100<br>PEAK CURRENT = 3A<br>8/20 s DURATION, 30s BETWEEN PULSES<br>V26MLA1206<br>10<br>0 2000 4000 6000 8000 10000 12000<br>NUMBER OF PULSES<br>Figure 8<br>VOLTAGE<br>**----- End of picture text -----**<br>


© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BO.11/18/20 

**Metal-Oxide Varistors (MOVs)** Surface Mount Multilayer Varistors (MLVs) > MLE Series 

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## ~~**Lead (Pb) Soldering Recommendations**~~ 

The principal techniques used for the soldering of components in surface mount technology are IR Re-flow and Wave soldering. Typical profiles are shown on the right. 

The recommended solder for the MLE suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. 

Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. 

When using a reflow process, care should be taken to ensure that the MLE chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. 

Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50ºC before cleaning. 

## ~~**Lead–free (Pb-free) Soldering Recommendations**~~ 

Littelfuse offers the Nickel Barrier Termination finish for the optimum Lead–free solder performance. 

The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA flux, but there is a wide selection of pastes and fluxes available with which the Nickel Barrier parts should be compatible. 

The reflow profile must be constrained by the maximums in the Lead–free Reflow Profile. For Lead–free Wave soldering, the Wave Solder Profile still applies. 

Note: the Lead–free paste, flux and profile were used for evaluation purposes by Littelfuse, based upon industry standards and  practices. There are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. 

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Refow Solder Profle<br>230<br>Figure 9<br>**----- End of picture text -----**<br>


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Wave Solder Profle<br>Figure 10<br>Lead–free Re-fow Profle<br>MAXIMUM TEMPERATURE 260˚C<br>20 - 40 SECONDS WITHIN 5˚C<br>RAMP RATE<br><3˚C/s 60 - 150 SEC<br> > 217˚C<br>PREHEAT ZONE<br>5.0          6.0         7.0<br>Figure 11<br>**----- End of picture text -----**<br>


© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BO.11/18/20 

**Metal-Oxide Varistors (MOVs)** Surface Mount Multilayer Varistors (MLVs) > MLE Series 

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## ~~**Product Dimensions (mm)**~~ 

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PAD LAYOUT DEMENSIONS CHIP LAYOUT DIMENSIONS<br>C<br>E<br>B NO TE<br>D<br>L<br>A W<br>**----- End of picture text -----**<br>


**Note:** Avoid metal runs in this area, parts are not recommended for use in applications using Silver (Ag) epoxy paste. 

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1206 Size 0805 Size 0603 Size 0402 Size<br>Dimension<br>IN MM IN MM IN MM IN MM<br>A 0.160 4.06 0.120 3.05 0.100 2.54 0.067 1.70<br>B 0.065 1.65 0.050 1.27 0.030 0.76 0.020 0.51<br>C 0.040  1.02 0.040 1.02 0.035 0.89 0.024 0.61<br>D (max.) 0.071 1.80 0.043 1.10 0.040 1.00 0.024 0.60<br>E 0.02 -/+ 0.01 0.50 -/+ 0.25 0.02 -/+ 0.01 0.50 -/+ 0.25 0.015 -/+ 0.008 0.4 -/+ 0.2 0.010 -/+ 0.006 0.25 -/+ 0.15<br>L 0.125 -/+ 0.012 3.20 -/+ 0.03 0.079 -/+ 0.008 2.01 -/+ 0.2 0.063 -/+ 0.006 1.6 -/+ 0.15 0.039 -/+ 0.004 1.0 -/+ 0.1<br>W 0.06 -/+ 0.011 1.60 -/+ 0.28 0.049 -/+ 0.008 1.25 -/+ 0.2 0.032 -/+ 0.006 0.8 -/+ 0.15 0.020 -/+ 0.004 0.5 -/+ 0.1<br>**----- End of picture text -----**<br>


## ~~**Part Numbering System**~~ 

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V 18 MLE 1206 X X X<br>Device Family Packing Options  (see Packaging table for quantities)<br>Littelfuse TVSS Device  T: 13in (330mm) Diameter Reel, Plastic Carrier Tape<br>Maximum DC H: 7in (178mm) Diameter Reel, Plastic Carrier Tape<br>R: 7in (178mm) Diameter Reel, Paper Carrier Tape<br>Working Voltage<br>End Temination Option<br>Multiplier Series N:Nickel Barrier<br>Designator Device Size (Matte Tin outer surface, plated on Nickel underlayer plated on silver base metal)<br>i.e ., 120 mil x 60 mil Capacitance Option<br>(3mm x 1.5mm) No Letter : Standard<br>L: Lo w Capacitance  Version<br>**----- End of picture text -----**<br>


## ~~**Packaging***~~ 

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Quantity<br>Device Size 13” Inch  Reel 7” Inch Reel  7” Inch Reel Bulk Pack<br>('T' Option) ('H' Option) ('R' Option) ('A'  Option)<br>1206 10,000 2,500 N/A 2500<br>0805 10,000 2,500 N/A 2500<br>0603 10,000 2,500 4,000 2500<br>0402 N/A N/A 10,000 N/A<br>**----- End of picture text -----**<br>


- *(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags. 

© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BO.11/18/20 

**Metal-Oxide Varistors (MOVs)** Surface Mount Multilayer Varistors (MLVs) > MLE Series 

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## ~~**Tape and Reel Specifcations**~~ 

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PRODUCT<br>D 0 P 0 IDENTIFYING<br>P 2 For R PacFor T and H Pack Options: EMBOSSED Pk Options: PLASTIC CARRIER APER CARRIER TAP ETAP E LABEL<br>E<br>F<br>W<br>K 0 B 0<br>EMBOSSMENT<br>t1 D 1 P 1 A 0 TOP TAPE NOMINAL8mm OR 330mm178mm<br>DIA. REEL<br>Dimensions in Millimeters<br> Symbol Description<br>0402 Size 0603, 0805 & 1206 Sizes<br>A0 Width of Cavity Dependent on Chip Size to Minimize Rotation.<br>B0 Length of Cavity Dependent on Chip Size to Minimize Rotation.<br>K0 Depth of Cavity Dependent on Chip Size to Minimize Rotation.<br>W Width of Tape 8 -/+ 0.2  8 -/+ 0.3<br>F Distance Between Drive Hole Centers and Cavity Centers 3.5 -/+ 0.05   3.5 -/+ 0.05<br>E Distance Between Drive Hole Centers and Tape Edge 1.75 -/+ 0.1   1.75 -/+ 0.1<br>P1 Distance Between Cavity Centers 2 -/+ 0.05 4 -/+ 0.1<br>P2 Axial Drive Distance Between Drive Hole Centers & Cavity Centers 2 -/+ 0.1   2 -/+ 0.1<br>P0 Axial Drive Distance Between Drive Hole Centers 4 -/+ 0.1  4 -/+ 0.1<br>D0 Drive Hole Diameter 1.55 -/+ 0.05 1.55 -/+ 0.05<br>D1 Diameter of Cavity Piercing N/A 1.05 -/+ 0.05<br>T1 Top Tape Thickness 0.1 Max  0.1 Max<br>**----- End of picture text -----**<br>


**Notes :** 

- Conforms to EIA-481-1, Revision A 

- Can be supplied to IEC publication 286-3 

**Disclaimer Notice -** Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications.  Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. 

© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BO.11/18/20 



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