# VARISTOR, 18V, 55V, 0603

![Product image](https://novapart.co/image/farnell:1685225/)

**URL**: https://novapart.co/products/V0603MHS12NH./varistor-18v-55v-0603
**SKU**: V0603MHS12NH.
**Manufacturer**: LITTELFUSE
**Category**: Circuit Protection || TVS - Transient Voltage Suppressors || TVS Varistors
**Price**: €0.2030
**Stock**: 10+
**Lead Time**: 117 days (indicative)

## Description

Voltage Rating VAC:14V; Voltage Rating VDC:18V; Product Range:MHS Series; Clamping Voltage Vc Max:55V; Varistor Case Style:0603 ^1608 Metric]; Peak Surge Current @ 8/20µS:-; 92H4448

## Specifications

| Parameter | Value |
|---|---|
| Voltage Rating Vac | 14V |
| Peak Energy (10/1000Us) | - |
| Operating Temperature Min | -40°C |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1685225/)

**Metal-Oxide Varistors (MOVs)** Surface Mount Multilayer Varistors (MLVs) > MHS Series 

~~**RoHS** |__]HF@~~ 

## MHS Varistor Series 

## ~~**Description**~~ 

The Multilayer High–Speed MHS Series is a very-low capacitance extension to the Littelfuse ML family of transient voltage surge suppression devices available in an 0402 and 0603–size surface mount chip. 

The MHS Series provides protection from ESD and EFT in high–speed data line and other high frequency applications. The low capacitance of the MHS Series permits usage in analog or digital circuits where it will not attenuate or distort the desired signal or data. 

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Size Table<br>Metric EIA<br>1005 0402<br>1608 0603<br>Additional Information<br>Datasheet Resources<br>**----- End of picture text -----**<br>


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Samples<br>**----- End of picture text -----**<br>


Their small size is ideal for high–density printed circuit boards, being typically applied to protect intergrated circuits and other sensitive components. They are particularly well suited to suppress ESD events including those specified in IEC 61000-4-2 or other standards used for Electromagnetic Compliance (EMC) testing. 

The MHS Series is manufactured from semiconducting ceramics and is supplied in a leadless, surface mount package. The MHS Series is also compatible with modern 

reflow and wave soldering prcesses. 

Littelfuse Inc. manufactures other multilayer varistor series products, see the ML, MLE, MLN and AUML Series data sheets. 

## ~~**Applications**~~ 

   - Mobile Communications 

- Data, Diagnostic I/O Ports 

- Universal Serial • Computer/DSP Bus (USB) Products 

- Video & Audio Ports 

   - Industrial Instruments Including Medical 

- Portable/HandHeld Products 

## ~~**Features**~~ 

   - EFT/B rated to IEC 

- Halogen-Free and EFT/B rated to IEC RoHS compliant 61000-4-4 (Level 4) 

   - Low leakage currents 

- 3pF, 12pF, and 22pF Low leakage currents capacitance versions • -40ºC to 125ºC suitable for high–speed operating temp. range 

- data rate lines 

   - Inherently bi-directional 

- ESD rated to IEC 61000-4-2 (Level 4) 

## ~~**Absolute Maximum Ratings**~~ 

•  For ratings of individual members of a series, see device ratings and specifications table. 

~~a~~ **Continuous MHS Series Units Steady State Applied Voltage:** DC Voltage Range (VM(DC)) : V0402/0603MHS03 ≤ 42 V ~~a~~ - V0402/0603MHS12 ≤ 18 V - V0402/0603MHS22 ≤ 09 V ~~a~~ Operating Ambient Temperature Range (TA) -40 to +125 ~~(~~ OC ~~eae~~ Storage Temperature Range (TSTG) -40 to +150 OC 

© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BO.11/18/20 

**Metal-Oxide Varistors (MOVs)** Surface Mount Multilayer Varistors (MLVs) > MHS Series 

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## ~~**Device Ratings and Specifcations**~~ 

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Performance Specifications (25 ºC)<br>Typical  Typical Inductance<br>Maximum  Maximum ESD Clamp  Typical Leakage Current  Capacitance at  (from Impedance<br>Part  Clamping  Voltage  (Note 1) at Specified DC Voltage 1MHz (1V p-p) Analysis)<br>Number Voltage At 1A  8kV Contact (Note 2) 15kV AIR (Note 3) 3.5V 5.5V C (Note 4)<br>(8X20µs) L<br>Clamp Clamp P IL MIN MAX<br>(Vc) (V) (V) (µA) (µA) (pF) (pF) (nH)<br>V0402MHS03N [ (Note 5)] 135 <300 <400 0.5  1.00  2  5  <1.0<br>V0402MHS03F  [(Note 7)] 135 <300 <400 0.5  1.00  2  5  <1.0<br>V0603MHS03N  [(Note 5)] 135 <300 <400 0.5  1.00  1  6  <1.0<br>V0603MHS03F  [(Note 7)] 135 <300 <400 0.5  1.00  1  6  <1.0<br>V0402MHS12N  [(Note 5)] 55 <125 <160 0.5  1.00  8  16  <1.0<br>V0402MHS12F  [(Note 7)] 55 <125 <160 0.5  1.00  8  16  <1.0<br>V0603MHS12N  [(Note 5)] 55 <125 <160 0.5  1.00  8  16  <1.0<br>V0603MHS12F  [(Note 7)] 55 <125 <160 0.5  1.00  8  16  <1.0<br>V0402MHS22N  [(Note 5)] 30 <125 <160 0.5  1.00  15  29  <1.0<br>V0402MHS22F  [(Note 7)] 30 <125 <160 0.5  1.00  15  29  <1.0<br>V0603MHS22N  [(Note 5)] 30 <65 <100 0.5  1.00  15  29  <1.0<br>V0603MHS22F  [(Note 7)] 30 <65 <100 0.5  1.00  15  29  <1.0<br>**----- End of picture text -----**<br>


## **NOTES:** 

**1.** Tested to IEC-61000-4-2 Human Body Model (HBM) discharge test circuit. 

**2.** Direct discharge to device terminals (IEC preferred test method). 

**3.** Corona discharge through air (represents actual ESD event). 

**4.** Capacitance may be customized, contact your Littelfuse Sales Representative. 

**5.** V0402MHSxxx (0402 size devices) available as "R" packaging option only. Example: V0402MHS03NR. See Packaging and Tape and Reel sections (last page) for additional information. 

**6.** The typical capacitance rating is discrete component test result. 

**7.** Items are lead free and antimony free, available as "R" packing option only. 

## ~~**Peak Current and Energy Derating Curve**~~ 

For applications exceeding 125ºC ambient temperature, the peak surge current and energy ratings must be reduced as shown below. 

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100<br>80<br>60<br>40<br>20<br>0<br>-55 50 60 70 80 90 100 110 120 130 140 150<br>Figure 1 AMBIENT TEMPERATURE ( [o] C)<br>PERCENT OF RATED VALUE<br>**----- End of picture text -----**<br>


## **Standby Current at Normalized Varistor Voltage and Temperature** 

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1.2<br>1.0<br>0.8<br>25O<br>0.6<br>85O<br>0.4<br>125O<br>0.2<br>0.0<br>0.0001 0.001 0.01 0.1 1<br>CURRENT (mA)<br>Figure 2<br>NORMALIZED VARISTOR VOLTAGE (V)<br>**----- End of picture text -----**<br>


© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BO.11/18/20 

**Metal-Oxide Varistors (MOVs)** Surface Mount Multilayer Varistors (MLVs) > MHS Series 

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Nominal Voltage Stability to Multiple ESD Impulses   Insertion Loss (S21) Characteristics<br>(8kV Contact Discharges per IEC 61000-4-2)<br>60<br>0<br>V0402MHS03<br>50 V0603MHS03<br>40 -10 V0402MHS12V0603MHS12<br>V0402MHS03<br>30 V0603MHS03<br>V0402MHS12<br>V0603MHS12<br>20 -20<br>V0402MHS22<br>V0402MHS22 V0603MHS22<br>V0603MHS22<br>10<br>-30<br>0 1 10 100 1000 10000 10 100 1000 10000<br>Figure 3 Number of Pulses Figure 4 FREQUENCY (MHz)<br>Device Characteristics Speed of Response<br>At low current levels, the V-I curve of the multilayer  The Multilayer Suppressor is a leadless device. Its response<br>transient voltage suppressor approaches a linear (ohmic)  time is not limited by the parasitic lead inductances found<br>relationship and shows a temperature dependent effect.  in other surface mount packages. The response time of the<br>At or below the maximum working voltage, the suppressor  ZNO dielectric material is less than 1ns and the MLE can<br>is in a high resistance model (approaching 10 [6] Ω at its  clamp very fast dV/dT events such as ESD. Additionally,<br>maximum rated working voltage). Leakage currents at  in “real world” applications, the associated circuit wiring<br>maximum rated voltage are below 100 µ A, typically 25 µ A;  is often the greatest factor effecting speed of response.<br>for 0402 size below 20 µ A, typically 5 µ A. Therefore, transient suppressor placement within a circuit<br>can be considered important in certain instances.<br>Typical Temperature Dependance of the Characteristic<br>Curve in the Leakage Region Multilayer Internal Construction<br>100%<br>FIRED CERAMIC<br>DIELECTRIC<br>METAL<br>ELECTR ODES<br>METAL END<br>TERMINATION<br>DEPLETION<br>REGION<br>25o 50o 75o 100o 125 [o] C<br>10% DEPLETION<br>1E [-9] 1E [-8] 1E [-7] 1E [-6] 1E [-5] 1E [-4] 1E [-3] 1E [-2] REGION<br>Figure 5 SUPPRESSOR CURRENT (ADC) Figure 6 GRAINS<br>Lead (Pb) Soldering Recommendations<br>NOMINAL VOLTAGE AT 1mADC  INSERTION LOSS (dB)<br>C (%)<br> o<br> VALUE AT 25<br>NOM<br>V<br>SUPPRESSOR VOLTAGE IN PERCENT OF<br>**----- End of picture text -----**<br>


The principal techniques used for the soldering of components in surface mount technology are IR Re-flow and Wave soldering. Typical profiles are shown on the right. 

The recommended solder for the MHS suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. 

Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. 

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Refow Solder Profle<br>230<br>Figure 7<br>**----- End of picture text -----**<br>


© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BO.11/18/20 

**Metal-Oxide Varistors (MOVs)** Surface Mount Multilayer Varistors (MLVs) > MHS Series 

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## ~~**Lead–free (Pb-free) Soldering Recommendations**~~ 

When using a reflow process, care should be taken to ensure that the MHS chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. 

Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50ºC before cleaning. 

Littelfuse offers the Nickel Barrier Termination finish for the optimum Lead–free solder performance. 

The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA flux, but there is a wide selection of pastes and fluxes available with which the Nickel Barrier parts should be compatible. 

The reflow profile must be constrained by the maximums in the Lead–free Reflow Profile. For Lead–free wave soldering, the Wave Solder Profile still applies. 

Note: the Lead–free paste, flux and profile were used for evaluation purposes by Littelfuse, based upon industry standards and practices. There are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. 

## ~~**Product Dimensions (mm)**~~ 

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PAD LAYOUT DEMENSIONS<br>Note:  Avoid metal runs in this area, parts are not<br>recommended for use in applications using Silver (Ag)<br>epoxy paste.<br>**----- End of picture text -----**<br>


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Wave Solder Profle<br>Figure 8<br>**----- End of picture text -----**<br>


## ~~**Lead–free Re-fow Profle**~~ 

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MAXIMUM TEMPERATURE 260˚C<br>20 - 40 SECONDS WITHIN 5˚C<br>RAMP RATE<br><3˚C/s 60 - 150 SEC<br> > 217˚C<br>PREHEAT ZONE<br>5.0          6.0         7.0<br>Figure 10<br>CHIP LAYOUT DIMENSIONS<br>E<br>D<br>L<br>W<br>0402 Size 0603 Size<br>Dimension<br>IN MM IN MM<br>A 0.067 1.700 0.100 2.540<br>B 0.020 0.510   0.030 0.760<br>C 0.024 0.610 0.035 0.890<br>D (max.) 0.024 0.600 0.040 1.000<br>E 0.01 +/- 0.006 0.25 +/- 0.15 0.015 +/- 0.008 0.4 +/- 0.2<br>L 0.039 +/- 0.004 1.00 +/- 0.10 0.063 +/- 0.006 1.6 +/- 0.15<br>W 0.020 +/- 0.004 0.50 +/- 0.10 0.032 +/- 0.006 0.8 +/-  0.15<br>**----- End of picture text -----**<br>


© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BO.11/18/20 

**Metal-Oxide Varistors (MOVs)** Surface Mount Multilayer Varistors (MLVs) > MHS Series 

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## ~~**Part Numbering System**~~ 

## **V 0402 MHS 03 N R** 

**Device Family Packing Options (See quantities in Packaging section)** Littelfuse TVSS Device T = (0603 device only)13in (330mm) Diameter Reel, Plastic Carrier Tape H = (0603 device only) 7in (178mm) Diameter Reel, Plastic Carrier Tape **Device Size** R = (available for 0402 and 0603 devices) 7in (178mm) Diameter Reel, Paper Carrier Tape 0402 = .04 inch x .02 inch (1.0 mm x 0.5 mm) **End Termination Option** 0603 = .063 inch x .031 inch N:Nickel Barrier (1.6 mm x 0.8 mm) (Matte Tin outer surface, plated on Nickel underlayer plated on silver base metal) **Series Designator** MHS = Multilayer Hi-Speed **Capacitance Designation** 03 = 3pF 12 = 12pF 22 = 22pF 

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Packaging* Tape and Reel Specifcations<br>D 0 P 0<br>Quantity T<br>Device Size 13 Inch Reel  7 Inch Reel  7 Inch Reel  P 2<br>("T" Option) ("H" Option) ("R" Option) E<br>0603 10,000 2,500 4,000<br>0402 not available not available 10,000 F<br>W<br>*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.  K 0 B 0<br>P 1 A 0<br>T1 D 1<br>Dimensions in Millimeters<br> Symbol Description<br>0402 Size 0603 Size<br>A0 Width of Cavity Dependent on Chip Size to Minimize Rotation.<br>B0 Length of Cavity Dependent on Chip Size to Minimize Rotation.<br>K0 Depth of Cavity Dependent on Chip Size to Minimize Rotation.<br>W Width of Tape 8 -/+ 0.2  8 -/+ 0.3<br>F Distance Between Drive Hole Centers and Cavity Centers 3.5 -/+.05  3.5 -/+.05<br>E Distance Between Drive Hole Centers and Tape Edge 1.75 -/+ 0.1  1.75 -/+ 0.1<br>P1 Distance Between Cavity Centers 2 -/+ 0.05 4 -/+ 0.1<br>P2 Axial Drive Distance Between Drive Hole Centers & Cavity Centers 2 -/+ 0.1  2 -/+ 0.1<br>P0 Axial Drive Distance Between Drive Hole Centers 4 -/+ 0.1   4 -/+ 0.1<br>D0 Drive Hole Diameter 1.55 -/+ 0.05  1.55 -/+ 0.05<br>D1 Diameter of Cavity Piercing N/A 1.05 -/+ 0.05<br>T1 Top Tape Thickness 0.1 Max   0.1 Max<br>T Nominal Carrier Tape Thickness 1.1 1.1<br>**----- End of picture text -----**<br>


## **Notes:** 

- Conforms to EIA-481-1, Revision A 

- Can be supplied to IEC publication 286-3 

**Disclaimer Notice -** Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications.  Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. 

© 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BO.11/18/20 



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