# VARISTOR, 42V, 135V, 0402

![Product image](https://novapart.co/image/farnell:1680683/)

**URL**: https://novapart.co/products/V0402MHS03NR./varistor-42v-135v-0402
**SKU**: V0402MHS03NR.
**Manufacturer**: LITTELFUSE
**Category**: Circuit Protection || TVS - Transient Voltage Suppressors || TVS Varistors
**Price**: €0.1230
**Stock**: 500+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Product Range | MHS Series |
| Varistor Type | Multilayer Varistor (MLV) |
| Voltage Rating Vac | 30V |
| Voltage Rating Vdc | 42V |
| Varistor Case Style | 0402 [1005 Metric] |
| Clamping Voltage Vc Max | 135V |
| Operating Temperature Max | 125°C |
| Operating Temperature Min | -40°C |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1680683/)

**Varistor Products** Surface Mount Multilayer Varistors (MLVs)  >  MHS Series 

## **RoHS MHS Varistor Series** ~~a~~ 

## ~~**Description**~~ 

The Multilayer High–Speed MHS Series is a very-low capacitance extension to the Littelfuse ML family of transient voltage surge suppression devices available in an 0402 and 0603–size surface mount chip. 

The MHS Series provides protection from ESD and EFT in high–speed data line and other high frequency applications. The low capacitance of the MHS Series permits usage in analog or digital circuits where it will not attenuate or distort the desired signal or data. 

## ~~**Size Table**~~ 

|Metric<br>1005|EIA<br>0402|
|---|---|
|1608|0603|



Their small size is ideal for high–density printed circuit boards, being typically applied to protect intergrated circuits and other sensitive components. They are particularly well suited to suppress ESD events including those specified in IEC 61000-4-2 or other standards used for Electromagnetic Compliance (EMC) testing. 

The MHS Series is manufactured from semiconducting ceramics and is supplied in a leadless, surface mount package. The MHS Series is also compatible with modern reflow and wave soldering prcesses. 

Littelfuse Inc. manufactures other multilayer varistor series products, see the ML, MLE, MLN and AUML Series data sheets. 

## ~~**Applications**~~ 

- Data, Diagnostic I/O Ports 

- Universal Serial Bus (USB) 

- Video & Audio Ports 

- Portable/HandHeld Products 

- Mobile Communications 

- Computer/DSP Products 

- Industrial Instruments Including Medical 

## ~~**Features**~~ 

- AEC - Q200 compliant • EFT/B rated to IEC 61000-4-4 (Level 4) 

- RoHS compliant 

   - Low leakage currents 

- 3pF, 12pF, and 22pF capacitance versions • -55ºC to +125ºC suitable for high–speed operating temp. range data rate lines 

   - Inherently bi-directional 

- ESD rated to IEC 61000-4-2 (Level 4) 

## ~~**Absolute Maximum Ratings**~~ 

|**Continuous**<br>~~rr~~|MHS Series<br>~~r~~<br>ee|Units<br>~~r~~|
|---|---|---|
|Steady State Applied Voltage:|ee||
|DC Voltage Range (VM(DC)) :<br>V0402/0603MHS03<br>||≤ 42<br>Po<br>||V|
|V0402/0603MHS12<br>|<br>~~|~~|≤ 18<br>|<br>~~|~~|V|
|V0402/0603MHS22<br>|<br>~~|~~||≤ 09<br>|<br>~~|~~||V|
|Operating Ambient Temperature Range (TA)<br>~~|~~|||-55 to +125<br>~~|~~|||OC|
|Storage Temperature Range (TSTG)<br>|||-55 to +150<br>|||OC|



©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MHS.html for current information. 

**MHS Varistor Series** 

Revision: June 28, 2010 

**Varistor Products** Surface Mount Multilayer Varistors (MLVs)  >  MHS Series 

## ~~**Device Ratings and Specifcations**~~ 

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**----- Start of picture text -----**<br>
Performance Specifications (25 ºC)<br>Typical<br>Typical Leakage  Typical<br>Maximum  Maximum ESD Clamp  Current at Specified  Capacitance at  Inductance<br>Part  Clamping  Voltage  (Note 1) DC Voltage 1MHz (1V p-p) (from Impedance<br>Number Voltage At  Analysis)<br>1A (8X20 μ s) 8kV Contact (Note 2) 15kV AIR (Note 3) 3.5V 5.5V C (Note 4)<br>L<br>Clamp Clamp P IL MIN MAX<br>(Vc) (V) (V) ( μ A) ( μ A) (pF) (pF) (nH)<br> V0402MHS03N  [(Note 5)] 135 <300 <400 0.5 1.00 2 5 <1.0<br> V0603MHS03N 135 <300 <400 0.5 1.00 1 6 <1.0<br> V0402MHS12N  [(Note 5)] 55 <125 <160 0.5 1.00 8 16 <1.0<br> V0603MHS12N 55 <125 <160 0.5 1.00 8 16 <1.0<br> V0402MHS22N  [(Note 5)] 30 <125 <160 0.5 1.00 15 29 <1.0<br> V0603MHS22N 30 <65 <100 0.5 1.00 15 29 <1.0<br>**----- End of picture text -----**<br>


NOTES: 

1. Tested to IEC-61000-4-2 Human Body Model (HBM) discharge test circuit. 

2. Direct discharge to device terminals (IEC preferred test method). 

3. Corona discharge through air (represents actual ESD event). 

4. Capacitance may be customized, contact your Littelfuse Sales Representative. 

5. V0402MHSxxx (0402 size devices) available as "R" packaging option only. Example: V0402MHS03NR. See Packaging and Tape and Reel sections (last page) for additional information. 

## ~~**Peak Current and Energy Derating Curve**~~ 

For applications exceeding 125ºC ambient temperature, the peak surge current and energy ratings must be reduced as shown below. 

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**----- Start of picture text -----**<br>
100<br>80<br>60<br>40<br>20<br>0<br>-55 50 60 70 80 90 100 110 120 130 140 150<br>AMBIENT TEMPERATURE ( [o] C)<br>Figure 1<br>PERCENT OF RATED VALUE<br>**----- End of picture text -----**<br>


## **Nominal Voltage Stability to Multiple ESD Impulses (8kV Contact Discharges per IEC 61000-4-2)** 

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**----- Start of picture text -----**<br>
60<br>V0402MHS03<br>50 V0603MHS03<br>40<br>30<br>V0402MHS12<br>V0603MHS12<br>20<br>V0402MHS22<br>V0603MHS22<br>10<br>0<br>1 10 100 1000 10000<br>Figure 3 Number of Pulses<br>NOMINAL VOLTAGE AT 1mADC<br>**----- End of picture text -----**<br>


## **Standby Current at Normalized Varistor Voltage and Temperature** 

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**----- Start of picture text -----**<br>
1.2<br>1.0<br>0.8<br>25O<br>0.6<br>85O<br>0.4<br>125O<br>0.2<br>0.0<br>0.0001 0.001 0.01 0.1 1<br>Figure 2 CURRENT (mA)<br>Insertion Loss (S21) Characteristics<br>0<br>-10 V0402MHS12<br>V0603MHS12<br>V0402MHS03<br>V0603MHS03<br>-20<br>V0402MHS22<br>V0603MHS22<br>-30<br>10 100 1000 10000<br>FREQUENCY (MHz)<br>Figure 4<br>NORMALIZED VARISTOR VOLTAGE (V)<br>INSERTION LOSS (dB)<br>**----- End of picture text -----**<br>


©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MHS.html for current information. 

**MHS Varistor Series** 

Revision: June 28, 2010 

**Varistor Products** Surface Mount Multilayer Varistors (MLVs)  >  MHS Series 

## ~~**Device Characteristics**~~ 

## ~~**Speed of Response**~~ 

The Multilayer Suppressor is a leadless device. Its response time is not limited by the parasitic lead inductances found in other surface mount packages. The response time of the ZNO dielectric material is less than 1ns and the MLE can clamp very fast dV/dT events such as ESD. Additionally, in “real world” applications, the associated circuit wiring is often the greatest factor effecting speed of response. Therefore, transient suppressor placement within a circuit can be considered important in certain instances. 

At low current levels, the V-I curve of the multilayer transient voltage suppressor approaches a linear (ohmic) relationship and shows a temperature dependent effect. At or below the maximum working voltage, the suppressor is in a high resistance model (approaching 10[6] Ω at its maximum rated working voltage). Leakage currents at maximum rated voltage are below 100 _μ_ A, typically 25 _μ_ A; for 0402 size below 20 _μ_ A, typically 5 _μ_ A. 

**==> picture [504 x 160] intentionally omitted <==**

**----- Start of picture text -----**<br>
important in certain instances.<br>Typical Temperature Dependance of the Characteristic<br>Curve in the Leakage Region Multilayer Internal Construction<br>100%<br>FIRED CERAMIC<br>DIELECTRIC<br>METAL<br>ELECTRODES<br>METAL END<br>TERMINATION<br>DEPLETION<br>REGION<br>25o 50o 75o 100o 125 [o] C<br>10% DEPLETION<br>1E [-9] 1E [-8] 1E [-7] 1E [-6] 1E [-5] 1E [-4] 1E [-3] 1E [-2] REGION<br>Figure 5 SUPPRESSOR CURRENT (ADC) Figure 6 GRAINS<br>C (%)<br> o<br> VALUE AT 25<br>NOM<br>V<br>SUPPRESSOR VOLTAGE IN PERCENT OF<br>**----- End of picture text -----**<br>


## ~~**Lead (Pb) Soldering Recommendations**~~ 

The principal techniques used for the soldering of components in surface mount technology are IR Re-flow and Wave soldering. Typical profiles are shown on the right. 

The recommended solder for the MHS suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). 

Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. 

When using a reflow process, care should be taken to ensure that the MHS chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. 

Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50ºC before cleaning. 

## ~~**Refow Solder Profle**~~ 

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**----- Start of picture text -----**<br>
230<br>Figure 7<br>**----- End of picture text -----**<br>


## ~~**Wave Solder Profle**~~ 

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**----- Start of picture text -----**<br>
Figure 8<br>**----- End of picture text -----**<br>


©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MHS.html for current information. 

**MHS Varistor Series** 

Revision: June 28, 2010 

**Varistor Products** 

Surface Mount Multilayer Varistors (MLVs)  >  MHS Series 

## ~~**Lead–free (Pb-free) Soldering Recommendations**~~ 

Littelfuse offers the Nickel Barrier Termination finish for the optimum Lead–free solder performance. 

The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA flux, but there is a wide selection of pastes and fluxes available with which the Nickel Barrier parts should be compatible. 

The reflow profile must be constrained by the maximums in the Lead–free Reflow Profile. For Lead–free wave soldering, the Wave Solder Profile still applies. 

Note: the Lead–free paste, flux and profile were used for evaluation purposes by Littelfuse, based upon industry standards and practices. There are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. 

## ~~**Lead–free Re-fow Profle**~~ 

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**----- Start of picture text -----**<br>
MAXIMUM TEMPERATURE 260˚C<br>20 - 40 SECONDS WITHIN 5˚C<br>RAMP RATE<br><3 ˚ C/s 60 - 150 SEC<br> > 217˚C<br>PREHEAT ZONE<br>5.0          6.0         7.0<br>Figure 10<br>**----- End of picture text -----**<br>


## ~~**Product Dimensions (mm)**~~ 

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PAD LAYOUT DEMENSIONS<br>**----- End of picture text -----**<br>


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CHIP LAYOUT DIMENSIONS<br>E<br>D<br>L<br>W<br>**----- End of picture text -----**<br>


Note: Avoid metal runs in this area, parts are not recommended for use in applications using Silver (Ag) epoxy paste. 

**==> picture [325 x 130] intentionally omitted <==**

**----- Start of picture text -----**<br>
0402 Size 0603 Size<br>Dimension<br>IN MM IN MM<br>A 0.067 1.700 0.100 2.540<br>B 0.020 0.510   0.030 0.760<br>C 0.024 0.610 0.035 0.890<br>D  (max.) 0.024 0.600 0.040 1.000<br>E 0.10 +/- 0.006 0.25 +/- 0.15 0.015 +/- 0.008 0.4 +/- 0.2<br>L 0.039 +/- 0.004 1.00 +/- 0.10 0.063 +/- 0.006 1.6 +/- 0.15<br>W 0.020 +/- 0.004 0.50 +/- 0.10 0.032 +/- 0.006 0.8 +/-  0.15<br>**----- End of picture text -----**<br>


©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MHS.html for current information. 

**MHS Varistor Series** 

Revision: June 28, 2010 

**Varistor Products** Surface Mount Multilayer Varistors (MLVs)  >  MHS Series 

## ~~**Part Numbering System**~~ 

**V 0402 MHS 03 N R DEVICE FAMILY PACKING OPTIONS** (See quantities in Packaging section) Littelfuse TVSS Device T = (0603 device only)13in (330mm) Diameter Reel, Plastic Carrier Tape H = (0603 device only) 7in (178mm) Diameter Reel, Plastic Carrier Tape **DEVICE SIZE** R = (available for 0402 and 0603 devices) 7in (178mm) Diameter Reel, Paper Carrier Tape 0402 = .04 inch x .02 inch (1.0 mm x 0.5 mm) **END TERMINATION OPTION** 0603 = .063 inch x .031 inch N = Nickel Barrier (Ni/Sn) (1.6 mm x 0.8 mm) **CAPACITANCE DESIGNATION SERIES DESIGNATOR** 03 = 3pF MHS = Multilayer Hi-Speed 12 = 12pF 22 = 22pF 

## ~~**Packaging***~~ 

|||Quantity|Quantity|
|---|---|---|---|
|Device Size|<br>13 Inch Reel<br>("T" Option)|7 Inch Reel<br>("H" Option)|7 Inch Reel<br>("R" Option)|
|0603|10,000|2,500|4,000|
|0402|not available|not available|10,000|



*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags. 

## ~~**Tape and Reel Specifcations**~~ 

**==> picture [506 x 342] intentionally omitted <==**

**----- Start of picture text -----**<br>
D0 P0<br>T<br>P2<br>E<br>F<br>W<br>K0 B0<br>P1 A0<br>T1 D1<br>Dimensions in Millimeters<br> Symbol Description<br>0402 Size 0603 Size<br>A0 Width of Cavity Dependent on Chip Size to Minimize Rotation.<br>B0 Length of Cavity Dependent on Chip Size to Minimize Rotation.<br>K0 Depth of Cavity Dependent on Chip Size to Minimize Rotation.<br>W Width of Tape 8 -/+ 0.2  8 -/+ 0.3<br>F Distance Between Drive Hole Centers and Cavity Centers 3.5 -/+.05  3.5 -/+.05<br>E Distance Between Drive Hole Centers and Tape Edge 1.75 -/+ 0.1  1.75 -/+ 0.1<br>P1 Distance Between Cavity Centers 2 -/+ 0.05 4 -/+ 0.1<br>P2 Axial Drive Distance Between Drive Hole Centers & Cavity Centers 2 -/+ 0.1  2 -/+ 0.1<br>P0 Axial Drive Distance Between Drive Hole Centers 4 -/+ 0.1   4 -/+ 0.1<br>D0 Drive Hole Diameter 1.55 -/+ 0.05  1.55 -/+ 0.05<br>D1 Diameter of Cavity Piercing N/A 1.05 -/+ 0.05<br>T1 Top Tape Thickness 0.1 Max   0.1 Max<br>T Nominal Carrier Tape Thickness 1.1 1.1<br>**----- End of picture text -----**<br>


Notes: 

- Conforms to EIA-481-1, Revision A 

- Can be supplied to IEC publication 286-3 

©2010 Littelfuse, Inc. 

**MHS Varistor Series** 

Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MHS.html for current information. 

Revision: June 28, 2010 



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