# Bipolar Transistor Array, Complementary NPN and PNP, 50 V, 50 V, 200 mA, 200 mA, 250 mW

![Product image](https://novapart.co/image/farnell:2845431/)

**URL**: https://novapart.co/products/UMZ1NT1G/bipolar-transistor-array-complementary-npn-and-pnp
**SKU**: UMZ1NT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Bipolar Junction Transistor Arrays - BJT
**Price**: €0.0430
**Stock**: 1000+
**Lead Time**: 127 days (indicative)

## Description

Transistor Polarity:N and P Complement; Collector Emitter Voltage V(br)ceo:50V; Power Dissipation Pd:250mW; DC Collector Current:200mA; DC Current Gain hFE:200hFE; Transistor Case

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | - |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | Complementary NPN and PNP |
| Power Dissipation Npn | 250mW |
| Power Dissipation Pnp | 250mW |
| Transistor Case Style | SC-70 |
| Transition Frequency Npn | 114MHz |
| Transition Frequency Pnp | 114MHz |
| Operating Temperature Max | 150°C |
| Dc Current Gain Hfe Min Npn | 200hFE |
| Dc Current Gain Hfe Min Pnp | 200hFE |
| Continuous Collector Current Npn | 200mA |
| Continuous Collector Current Pnp | 200mA |
| Collector Emitter Voltage Max Npn | 50V |
| Collector Emitter Voltage Max Pnp | 50V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2845431/)

## UMZ1NT1G 

## Complementary Dual General Purpose Amplifier Transistor **PNP and NPN Surface Mount** 

**==> picture [122 x 196] intentionally omitted <==**

**----- Start of picture text -----**<br>
www.onsemi.com<br>(6) (5) (4)<br>Q1 Q2<br>aes<br>(1) (2) (3)<br>1<br>SC−88<br>CASE 419B<br>**----- End of picture text -----**<br>


## **Features** 

- High Voltage and High Current: VCEO = 50 V, IC = 200 mA 

- High hFE: hFE = 200 | 400 

- Moisture Sensitivity Level: 1 

- ESD Rating − Human Body Model: 3A ESD Rating − Machine Model: C 

- NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

**MAXIMUM RATINGS** (TA = 25 ° C) 

|**Rating**<br>~~ures~~|**Symbol**<br>~~ures~~|**Value**<br>~~ures~~|**Unit**<br>~~ures~~|
|---|---|---|---|
|Collector−Base Voltage<br>~~ures~~|V(BR)CBO<br>~~ures~~|60<br>~~ures~~|Vdc<br>~~ures~~|
|Collector−Emitter Voltage<br>~~ures~~|V(BR)CEO<br>~~ures~~|50<br>~~ures~~|Vdc<br>~~ures~~|
|Emitter−Base Voltage<br>~~ures~~|V(BR)EBO<br>~~ures~~|7.0<br>~~ures~~|Vdc<br>~~ures~~|
|Collector Current − Continuous<br>~~ures~~|IC<br>~~ures~~|200<br>~~ures~~|mAdc<br>~~ures~~|



## **MARKING DIAGRAM** 

**THERMAL CHARACTERISTICS** 3Z M **Characteristic (One Junction Heated) Symbol Max Unit** 1 Total Device Dissipation PD 187 (Note 1) mW TA = 25 ° C 256 (Note 2) 3Z = Device Code Derate above 25 ° C 1.5 (Note 1) mW/ ° C M = Date Code 2.0 (Note 2) = Pb−Free Package Thermal Resistance, Junction-to-Ambient R JA 670 (Note 1) ° C/W (Note: Microdot may be in either location) 490 (Note 2) ~~ar.”~~ **Characteristic (Both Junctions Heated) Symbol Max Unit ORDERING INFORMATION** Total Device DissipationTA = 25 ° C PD 250 (Note 1)385 (Note 2) mW **Device Package Shipping** Derate above 25 ° C 2.0 (Note 1) mW/ ° C UMZ1NT1G SC−88 3000 / 3.0 (Note 2) (Pb−Free) Thermal Resistance, Junction-to-Ambient R JA 493 (Note 1) ° C/W NSVUMZ1NT1G SC−88 3000 / 325 (Note 2) ~~TE~~ (Pb−Free) Thermal Resistance, Junction-to-Lead R JL 188 (Note 1) ° C/W 208 (Note 2) †For information on tape and reel specifications, including part orientation and tape sizes, please Junction and Storage Temperature TJ, Tstg −55 to +150 ° C refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 @ Minimum Pad 2. FR−4 @ 1.0 x 1.0 inch Pad 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|UMZ1NT1G|SC−88<br>(Pb−Free)|3000 /<br>Tape & Reel|
|NSVUMZ1NT1G|SC−88<br>(Pb−Free)|3000 /<br>Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: 

© Semiconductor Components Industries, LLC, 2010 **September, 2016 − Rev. 9** 

**UMZ1NT1/D** 

## **UMZ1NT1G** 

## **Q1: NPN** 

**ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS **(TA= 25°C unless otherwise noted)||||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|Collector−Emitter Breakdown Voltage<br>(IC= 2.0 mAdc, IB= 0)|V(BR)CEO|50|−|−|Vdc|
|Collector−Base Breakdown Voltage<br>(IC= 10�Adc, IE= 0)|V(BR)CBO|60|−|−|Vdc|
|Emitter−Base Breakdown Voltage<br>(IE= 10�Adc, IC= 0)|V(BR)EBO|7.0|−|−|Vdc|
|Collector−Base Cutoff Current<br>(VCB= 45 Vdc, IE= 0)|ICBO|−|−|0.1|�Adc|
|Collector−Emitter Cutoff Current<br>(VCE= 10 Vdc, IB= 0)<br>(VCE= 30 Vdc, IB= 0)<br>(VCE= 30 Vdc, IB= 0, TA= 80°C)|ICEO|−<br>−<br>−|−<br>−<br>−|0.1<br>2.0<br>1.0|�Adc<br>�Adc<br>mAdc|
|DC Current Gain (Note 3)<br>(VCE= 6.0 Vdc, IC= 2.0 mAdc)|hFE|200|−|400|−|
|Collector−Emitter Saturation Voltage<br>(IC= 100 mAdc, IB= 10 mAdc)|VCE(sat)|−|−|0.25|Vdc|
|Transistor Frequency|fT|−|114|−|MHz|



3. Pulse Test: Pulse Width ≤ 300 � s, D.C. ≤ 2%. 

## **Q2: PNP** 

**ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS **(TA= 25°C unless otherwise noted)||||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|Collector−Emitter Breakdown Voltage<br>(IC= 2.0 mAdc, IB= 0)|V(BR)CEO|−50|−|−|Vdc|
|Collector−Base Breakdown Voltage<br>(IC= 10�Adc, IE= 0)|V(BR)CBO|−60|−|−|Vdc|
|Emitter−Base Breakdown Voltage<br>(IE= 10�Adc, IC= 0)|V(BR)EBO|−7.0|−|−|Vdc|
|Collector−Base Cutoff Current<br>(VCB= 45 Vdc, IE= 0)|ICBO|−|−|−0.1|�Adc|
|Collector−Emitter Cutoff Current<br>(VCE= 10 Vdc, IB= 0)<br>(VCE= 30 Vdc, IB= 0)<br>(VCE= 30 Vdc, IB= 0, TA= 80°C)|ICEO|−<br>−<br>−|−<br>−<br>−|−0.1<br>−2.0<br>−1.0|�Adc<br>�Adc<br>mAdc|
|DC Current Gain (Note 3)<br>(VCE= 6.0 Vdc, IC= 2.0 mAdc)|hFE|200|−|400|−|
|Collector−Emitter Saturation Voltage<br>(IC= 100 mAdc, IB= 10 mAdc)|VCE(sat)|−|−|−0.3|Vdc|
|Transistor Frequency|fT|−|142|−|MHz|



**www.onsemi.com** 

**2** 

**UMZ1NT1G** 

## **TYPICAL ELECTRICAL CHARACTERISTICS: PNP TRANSISTOR** 

**==> picture [490 x 624] intentionally omitted <==**

**----- Start of picture text -----**<br>
−200 1000<br>−2.0 mA −1.5 mA<br>−160 −1.0 mA TA = 100 ° C<br>−120 25 ° C −25 ° C<br>−0.5 mA<br>100<br>−80<br>IB = −0.2 mA<br>−40<br>TA = 25 ° C VCE = −1.0 V<br>0 10<br>0 −1 −2 −3 −4 −5 −6 −1 −10 −100 −1000<br>VCE, COLLECTOR−EMITTER VOLTAGE (V) IC, COLLECTOR CURRENT (mA)<br>Figure 1. Collector Saturation Region Figure 2. DC Current Gain<br>1000 −1<br>IC/IB = 10<br>TA = 100 ° C<br>TA = 100 ° C<br>25 ° C −25 ° C 25 ° C −25 ° C<br>100 −0.1<br>VCE = −6.0 V<br>10 −0.01<br>−1 −10 −100 −1000 −1 −10 −100 −1000<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>Figure 3. DC Current Gain Figure 4. VCE(sat) versus IC<br>−10 −10,000<br>COMMON EMITTER 25 ° C<br>VCE = 6 V TA = 100 ° C<br>−1000<br>−25 ° C<br>−100<br>−1<br>−10<br>TA = 25 ° C −1<br>IC/IB = 10<br>−0.1 −0.1<br>−1 −10 −100 −1000 0 −0.1 −0.2 −0.3 −0.4 −0.5 −0.6 −0.7 −0.8 −0.9 −1<br>IC, COLLECTOR CURRENT (mA) VBE, BASE−EMITTER VOLTAGE (V)<br>, DC CURRENT GAIN<br>FE<br>h<br>, COLLECTOR CURRENT (mA)<br>IC<br>, DC CURRENT GAIN<br>FE<br>h<br>, MAXIMUM COLLECTOR VOLTAGE (V)<br>CE(sat)<br>V<br>A)<br>�<br>VOLTAGE (V)<br>, BASE CURRENT (<br>IB<br>BASE−EMITTER SATURATION<br>**----- End of picture text -----**<br>


**Figure 5. VBE(sat) versus IC** 

**Figure 6. Base−Emitter Voltage** 

**www.onsemi.com** 

**3** 

**UMZ1NT1G** 

## **TYPICAL ELECTRICAL CHARACTERISTICS: NPN TRANSISTOR** 

**==> picture [240 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
280<br>6.0 mA 3.0 mA 2.0 mA<br>240 5.0 mA<br>200<br>1.0 mA<br>160<br>120 0.5 mA<br>80<br>IB = 0.2 mA<br>40<br>0 TA = 25 ° C<br>0 1 2 3 4 5 6<br>VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>, COLLECTOR CURRENT (mA)<br>IC<br>**----- End of picture text -----**<br>


**Figure 7. Collector Saturation Voltage** 

**==> picture [237 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>TA = 100 ° C<br>25 ° C<br>−25 ° C<br>100<br>VCE = 1.0 V<br>10<br>1 10 100 1000<br>IC, COLLECTOR CURRENT (mA)<br>, DC CURRENT GAIN<br>FE<br>h<br>**----- End of picture text -----**<br>


**Figure 8. DC Current Gain** 

**==> picture [488 x 407] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000 1<br>IC/IB = 10<br>TA = 100 ° C<br>25 ° C<br>−25 ° C TA = 100 ° C<br>25 ° C<br>100 0.1 −25 ° C<br>VCE = 6.0 V<br>10 0.01<br>1 10 100 1000 1 10 100 1000<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>Figure 9. DC Current Gain Figure 10. VCE(sat) versus IC<br>10 10,000<br>COMMON EMITTER 25 ° C<br>VCE = 6 V TA = 100 ° C<br>1000<br>−25 ° C<br>100<br>1<br>10<br>TA = 25 ° C 1<br>IC/IB = 10<br>0.1 0.1<br>1 10 100 1000 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1<br>IC, COLLECTOR CURRENT (mA) VBE, BASE−EMITTER VOLTAGE (V)<br>(V)<br>, DC CURRENT GAIN<br>FE<br>h<br>, MAXIMUM COLLECTOR VOLTAGE<br>CE(sat)<br>V<br>A)<br>�<br>VOLTAGE (V)<br>, BASE CURRENT (<br>IB<br>BASE−EMITTER SATURATION<br>**----- End of picture text -----**<br>


**Figure 11. VBE(sat) versus IC** 

**Figure 12. Base−Emitter Voltage** 

**www.onsemi.com** 

**4** 

**UMZ1NT1G** 

## **PACKAGE DIMENSIONS** 

## **SC−88/SC70−6/SOT−363** 

CASE 419B−02 ISSUE Y 

**==> picture [503 x 399] intentionally omitted <==**

**----- Start of picture text -----**<br>
2X<br>aaa H D<br>- D H NOTES:1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>A 3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,<br>D GAGE PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-<br>PLANE SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.<br>4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF<br>6 5 4 THE PLASTIC BODY AND DATUM H.<br>L2 L 5. DATUMS A AND B ARE DETERMINED AT DATUM H.<br>E E1 DETAIL A 6. LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE<br>7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.<br>1 2 3<br>ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN<br>EXCESS OF DIMENSION b AT MAXIMUM  MATERIAL CONDI-<br>2X aaa C TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER<br>bbb H D 2X 3 TIPS RADIUS OF THE FOOT.<br>e MILLIMETERS INCHES<br>: DIM MIN NOM MAX MIN NOM MAX<br>B = 6X b A −−− −−− 1.10 −−− −−− 0.043<br>ddd M C A-B D A1 0.00 −−− 0.10 0.000 −−− 0.004<br>TOP VIEW A2 0.70 0.90 1.00 0.027 0.035 0.039<br>b 0.15 0.20 0.25 0.006 0.008 0.010<br>C 0.08 0.15 0.22 0.003 0.006 0.009<br>A2 DETAIL A D 1.80 2.00 2.20 0.070 0.078 0.086<br>A E 2.00 2.10 2.20 0.078 0.082 0.086<br>E1 1.15 1.25 1.35 0.045 0.049 0.053<br>e 0.65 BSC 0.026 BSC<br>a == L 0.26 0.36 0.46 0.010 0.014 0.018<br>L2 0.15 BSC 0.006 BSC<br>aaa 0.15 0.006<br>bbb 0.30 0.012<br>6X ccc C ccc 0.10 0.004<br>A1 C SEATINGPLANE c ddd 0.10 0.004<br>SIDE VIEW END VIEW<br>RECOMMENDED<br>SOLDERING FOOTPRINT*<br>6X 6X<br>0.30 0.66<br>Too yt 2.50<br>0.65 goo<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

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