# Bipolar Pre-Biased / Digital Transistor, NPN+PNP, NPN and PNP Complement, 50 V, 50 V, 100 mA
**URL**: https://novapart.co/products/UMD3NFHATR/bipolar-pre-biased-digital-transistor-npnpnp-npn
**SKU**: UMD3NFHATR
**Manufacturer**: ROHM
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Pre-Biased / Digital Bipolar Transistors
**Price**: €0.1040
**Stock**: 1000+
**Lead Time**: 113 days (indicative)
## Description
Digital Transistor Polarity:NPN and PNP Complement; Collector Emitter Voltage V(br)ceo:50V; Continuous Collector Current Ic:100mA; Base Input Resistor R1:10kohm; Base-Emitter Resist
## Specifications
| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 6 Pin |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 150mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | NPN and PNP Complement |
| Transistor Case Style | SOT-363 |
| Base Input Resistor R1 | 10kohm |
| Dc Current Gain Hfe Min | 30hFE |
| Base Emitter Resistor R2 | 10kohm |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 100mA |
| Collector Emitter Voltage Max Npn | 50V |
| Collector Emitter Voltage Max Pnp | 50V |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:2576208RL/)
EMD3FHA / UMD3NFHA / IMD3AFRAEMD3 / UMD3N / IMD3A
Datasheet
**==> picture [510 x 316] intentionally omitted <==**
**----- Start of picture text -----**
NPN + PNP Complex Digital Transistors (Bias Resistor Built-in Transistors)
AEC-Q101 Qualified
l Outline
(6)
Parameter Value EMT6 UMT6
(6) (5)
(5) (4)
VCC 50V (4)
(1) (1)
IC(MAX.) 100mA (2) (3) (2) (3)
R1 10kW
EMD3FHAEMD3 UMD3NFHAUMD3N
R2 10kW (SC-107C) SOT-363 (SC-88)
SMT6 (4)
(5)
(6)
Parameter Value (3)
(2)
(1)
VCC -50V
IMD3AFRAIMD3A
= IC(MAX.) -100mA u SOT-457 (SC-74)
R1 10kW
R2 10kW
== l Features l Inner circuit
**----- End of picture text -----**
## l **Features**
**==> picture [73 x 9] intentionally omitted <==**
**----- Start of picture text -----**
l Inner circuit
**----- End of picture text -----**
**==> picture [106 x 126] intentionally omitted <==**
**----- Start of picture text -----**
OUT IN GND
(6) (5) (4)
DTr1 R1 R2
DTr2
R2 R1
H
(1) (2) (3)
GND IN OUT
EMD3FHA / UMD3NFHAEMD3 / UMD3N
**----- End of picture text -----**
- 1) Both the DTC114E chip and DTA114E chip in one package.
- 2) Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistors (see inner circuit).
- 3) The bias resistors consist of thin-film resistors with complete isolation to allow negative biasing of the input. They also have the advantage of completely eliminating parasitic effects.
- 4) Only the on/off conditions need to be set for operation, making the circuit design easy.
OUT IN GND (4) (5) (6) operation, making the circuit design easy. 5) Lead Free/RoHS Compliant. R1 R2 DTr2 DTr1 l **Application** R2 R1 Inverter circuit, Interface circuit, Driver circuit ~~Hd~~ (3) (2) (1) GND IN OUT IMD3AFRAIMD3A l **Packaging specifications** Package Basic Taping Reel size Tape width Part No. Package size ordering Marking code (mm) (mm) (mm) unit (pcs) **EMD3** FHA EMT6 1616 T2R 180 8 8,000 D3 **UMD3N** FHA UMT6 2021 TR 180 8 3,000 D3 **IMD3A** FRA SMT6 2928 T108 180 8 3,000 D3 ~~EEE~~ www.rohm.com ~~=~~ © 2013 ROHM Co., Ltd. All rights reserved. ~~=E~~ 1/8 **2013.07 - Rev.E**
**EMD3 / UMD3N / IMD3AEMD3FHA / UMD3NFHA / IMD3AFRA**
Data Sheet
## l **Absolute maximum ratings** (Ta = 25C)
|l
**Absolute maximum ratings **(Ta = 25C)|l
**Absolute maximum ratings **(Ta = 25C)|||||
|---|---|---|---|---|---|
|Parameter||Symbol|DTr1(NPN)|DTr2(PNP)|Unit|
|Supply voltage||VCC|50|-50|V|
|Input voltage||VIN|-10 to+40|-40 to+10|V|
|Output current||IO|50|-50|mA|
|Collector current||IC(MAX.)
*1|100|-100|mA|
|Power dissipation|**E**MD3 / UMD3N
MD3FHA / UMD3NFHA|PD
*2|150(Total)*3||mW|
||**I**MD3A
MD3AFRA||300(Total)*4||mW|
|Junction temperature||Tj|150||°C|
|Range of storage temperature||Tstg|-55 to+150||°C|
## l **Electrical characteristics** (Ta = 25°C)
|l
**Electrical characteristics**(Ta|= 25°C)|||||
|---|---|---|---|---|---|---|
|Parameter|Symbol|Conditions|Min.
T|yp.|Max.|Unit|
|Input voltage|VI(off)|VCC= 5V, IO= 100mA|-|-|0.5|V|
||VI(on)|VO= 0.3V, IO= 10mA|3.0|-|-||
|Output voltage|VO(on)|IO/ II= 10mA / 0.5mA|-
0|.1|0.3|V|
|Input current|II|VI= 5V|-|-|0.88|mA|
|Output current|IO(off)|VCC= 50V, VI= 0V|-|-|0.5|mA|
|DC current gain|GI|VO= 5V, IO= 5mA|30|-|-|-|
|Input resistance|R1|-|7
|10|13|kW|
|Resistance ratio|R2/R1|-|0.8|1|1.2|-|
|Transition frequency|fT
*1|VCE= 10V, IE=-5mA
f = 100MHz|-
2|50|-|MHz|
## l **Electrical characteristics** (Ta = 25°C)
|l
**Electrical characteristics**(Ta|= 25°C)|||||
|---|---|---|---|---|---|---|
|Parameter|Symbol|Conditions|Min.
T|yp.|Max.|Unit|
|Input voltage|VI(off)|VCC=-5V, IO=-100mA|-|-|-0.5|V|
||VI(on)|VO=-0.3V, IO=-10mA|-3.0|-|-||
|Output voltage|VO(on)|IO/ II=-10mA /-0.5mA|-
-|0.1|-0.3|V|
|Input current|II|VI=-5V|-|-|-0.88|mA|
|Output current|IO(off)|VCC=-50V, VI= 0V|-|-|-0.5|mA|
|DC current gain|GI|VO=-5V, IO=-5mA|30|-|-|-|
|Input resistance|R1|-|7
|10|13|kW|
|Resistance ratio|R2/R1|-|0.8|1|1.2|-|
|Transition frequency|fT
*1|VCE=-10V, IE= 5mA
f = 100MHz|-
2|50|-|MHz|
- *1 Characteristics of built-in transistor
- *2 Each terminal mounted on a reference footprint
- *3 120mW per element must not be exceeded.
- *4 200mW per element must not be exceeded.
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.
**2013.07 - Rev.E**
2/8
**EMD3 / UMD3N / IMD3AEMD3FHA / UMD3NFHA / IMD3AFRA**
Data Sheet
l O **Electrical characteristic curves** (Ta = 25°C)
**==> picture [213 x 252] intentionally omitted <==**
**----- Start of picture text -----**
Fig.1 Input voltage vs. output current
(ON characteristics)
10 AS
so eeFoEHS]Vor0.3v
a
ee
|0
5 fooa ee Ta 40°Conl CetiitT
4ST eeoc eANEEDS
1 Eee eeta
200m FIT
100m a a
100p 2002 S500u1m 2m 5m 10m 20m
OUTPUT CURRENT : IO [A]
[V]
I(on)
INPUT VOLTAGE : V
**----- End of picture text -----**
**==> picture [11 x 125] intentionally omitted <==**
**----- Start of picture text -----**
[A]
O
OUTPUT CURRENT : I
**----- End of picture text -----**
**==> picture [182 x 24] intentionally omitted <==**
**----- Start of picture text -----**
Fig.2 Output current vs. input voltage
(OFF characteristics)
**----- End of picture text -----**
INPUT VOLTAGE : VI(off)[V]
Fig.3 Output current vs. output voltage
**==> picture [248 x 233] intentionally omitted <==**
**----- Start of picture text -----**
II= 260mA
50 —
240mA
foFa aa 220mA
40 Tannese
PRO] 200mA
pTTTT
30 180mA
| __ Ee
160mA
/
20
ASESSSSSes 140mA
|_—__—____——_/
|] | | ff] 120mA
10 [{_
Ta=25ºC
PT | 100mA
_-—__—_—— —_
0 VUE T TET TTT | 0A
0 5 10
OUTPUT VOLTAGE : VO [V]
[mA]
O
OUTPUT CURRENT : I
**----- End of picture text -----**
Fig.4 DC current gain vs. output current
OUTPUT CURRENT : IO [A]
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.
**2013.07 - Rev.E**
3/8
**EMD3 / UMD3N / IMD3AEMD3FHA / UMD3NFHA / IMD3AFRA**
Data Sheet
l O **Electrical characteristic curves** (Ta = 25°C)
Fig.5 Output voltage vs. output current
**==> picture [463 x 516] intentionally omitted <==**
**----- Start of picture text -----**
Pt
soom FINI tae t00ro TT
"TIME 2@sNN UI
100m fF 40°C SH
som feeeane
ee ee a ll
com LE E T ETT
rm a
sm eeFE Eth
PT TTTT
om LT TPT
a
100n 200n 5002 1m 2m 5m 10m 20m 50m 100m
OUTPUT CURRENT : IO [A]
Electrical characteristic curves (Ta = 25°C)
Fig.6 Input voltage vs. output current Fig.7 Output current vs. input voltage
(ON characteristics) (OFF characteristics)
-s0 afHee eelvo =-osv fF om FAPe A A [vescov
-20| =m-1im TEEPE LE A
° 250 NO SSGS0000) G00 inn S08
wore SANIN Oyfe ven—100y CELLET(eeeT T= 20025 ° C6
NNN aa SaaSaSasSea a= -==ae
,)§ —STS zo, FECj
i SSS eet mo ee
OHMl Fesoncee iene inaicaeees e esessesee
-200m fF oy EREREEDPEESRF SES See
-soom-100n LL-200n [LMI-500n -1mTEI-2m -5m -10m -20mLTT-50m -100m Bye 0 ABAD05NNW-10 (A0FADRREROERBEROEAD-15 -20 -25
OUTPUT CURRENT : IO [A] INPUT VOLTAGE : VI(off)[V]
[V]
O(on)
OUTPUT VOLTAGE : V
[V] [A]
I(on) O
INPUT VOLTAGE : V OUTPUT CURRENT : I
**----- End of picture text -----**
## l O **Electrical characteristic curves** (Ta = 25°C)
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.
**2013.07 - Rev.E**
4/8
**EMD3 / UMD3N / IMD3AEMD3FHA / UMD3NFHA / IMD3AFRA**
Data Sheet
l O **Electrical characteristic curves** (Ta = 25°C)
Fig.8 Output current vs. output voltage
Fig.9 DC current gain vs. output current
**==> picture [253 x 226] intentionally omitted <==**
**----- Start of picture text -----**
-50
Ta=25ºC II=
— = -300mA
-40 IT.) [p+ -280mA
= ee -260mA
-240mA
-30 | jp[—_— -220mA
yo -200mA
[_-——— r_| -180mA
-20
-160mA
oS’
/ -140mA
-10 [sesmr tft i -120mA
motos -100mA
0 |LEeGGnnnnn 0A
0 -5 -10
OUTPUT VOLTAGE : VO [V]
[mA]
O
OUTPUT CURRENT : I
**----- End of picture text -----**
**==> picture [11 x 112] intentionally omitted <==**
**----- Start of picture text -----**
DC CURRENT GAIN : GI
**----- End of picture text -----**
OUTPUT CURRENT : IO [A]
Fig.10 Output voltage vs. output current
**==> picture [199 x 199] intentionally omitted <==**
**----- Start of picture text -----**
°C
-20om |__TTIT , =40°G
som (llHt al US
50m [ee] aeeeer
|
oom FLT
som Fa
$m eyHH
rr
om LE
am ELI EE
-100u-200n -500n -1m -2m -5m -10m-20m
OUTPUT CURRENT : IO [A]
[V]
O(on)
OUTPUT VOLTAGE : V
**----- End of picture text -----**
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.
**2013.07 - Rev.E**
5/8
**EMD3 / UMD3N / IMD3AEMD3FHA / UMD3NFHA / IMD3AFRA**
Data Sheet
## l O **Dimensions** (Unit : mm)
## **EMT6**
Pattern of terminal position areas [Not a recommended pattern of soldering pads]
Dimension in mm / inches
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.
**2013.07 - Rev.E**
6/8
**EMD3 / UMD3N / IMD3AEMD3FHA / UMD3NFHA / IMD3AFRA**
Data Sheet
## l O **Dimensions** (Unit : mm)
## **UMT6**
Pattern of terminal position areas [Not a recommended pattern of soldering pads]
Dimension in mm / inches
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.
**2013.07 - Rev.E**
7/8
**EMD3 / UMD3N / IMD3AEMD3FHA / UMD3NFHA / IMD3AFRA**
Data Sheet
## l O **Dimensions** (Unit : mm)
## **SMT6**
Pattern of terminal position areas [Not a recommended pattern of soldering pads]
Dimension in mm / inches
www.rohm.com
**2013.07 - Rev.E**
© 2013 ROHM Co., Ltd. All rights reserved.
8/8
Datasheet
## **Notice**
## **Precaution on using ROHM Products**
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment[(Note 1)] , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications.
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|---|---|---|---|
|CLASSⅢ|CLASSⅢ|CLASSⅡb|CLASSⅢ|
|CLASSⅣ||CLASSⅢ||
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- [a] Installation of protection circuits or other protective devices to improve system safety
- [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
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- [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering
- [h] Use of the Products in places subject to dew condensation
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5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document.
## **Precaution for Mounting / Circuit board design**
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
> **[Notice-PAA-E ]** © 2015 ROHM Co., Ltd. All rights reserved.
**Rev.001**
Datasheet
## **Precautions Regarding Application Examples and External Circuits**
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information.
## **Precaution for Electrostatic**
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
## **Precaution for Storage / Transportation**
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period.
## **Precaution for Product Label**
QR code printed on ROHM Products label is for ROHM’s internal use only.
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When disposing Products please dispose them properly using an authorized industry waste company.
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## **Precaution Regarding Intellectual Property Rights**
1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data.
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## **Other Precaution**
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
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3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.
> **[Notice-PAA-E ]** © 2015 ROHM Co., Ltd. All rights reserved.
**Rev.001**
Datasheet
## **General Precaution**
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.
> **[Notice – WE ]** © 2015 ROHM Co., Ltd. All rights reserved.
**Rev.001**
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---
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