UG2DAFL-TP

**UG2DAFL** 

## **Features** 

- Lead Free Finish/RoHS Compliant (Note1) ("P"Suffix Designates Compliant. See Ordering Information) 

- Halogen Free. “Green” Device (Note 2) 

- Epoxy Meets UL 94 V-0 Flammability Rating 

- Moisture Sensitivity Level 1 

- Low Switching Losses and High Efficiency 

- Low Reverse Leakage 

- Ultrafast Soft Recovery Time 

## **2 Amp Surface-Mount Ultrafast Rectifier 200 Volts** 

## **Maximum Ratings** 

- Operating Junction Temperature Range: -55⁰C To +175⁰C 

- ~~Storage Temperature Range: -55⁰C To +175⁰C~~ 

- Thermal Resistance(Note 3): 10°C/W Junction to Case 

- ~~Thermal Resistance(Note 4): 25°C/W Junction to Lead~~ 

- Thermal Resistance(Note 4): 75°C/W Junction to Ambient 

|•<br>Thermal R|esistance(Not|e4): 75°C/W Ju|nction to Ambi|ent|
|---|---|---|---|---|
|MCC<br>Part Number|Device<br>Marking|Maximum<br>Recurrent<br>Peak Reverse<br>Voltage|Maximum<br>RMS<br>Voltage|Maximum DC<br>Blocking<br>Voltage|
|UG2DAFL|UG2D|200V|140V|200V|



## 

|Average Forward<br>Current|IF(AV)|2.0A|TC=155⁰C|
|---|---|---|---|
|Peak Forward Surge<br>Current|IFSM|65A|8.3ms,Half Sine|
|Maximum DC Reverse<br>Current At Rated DC<br>Blocking Voltage<br>Maximum Instantaneous<br>Forward Voltage|IR<br>VF|2μA<br>0.93V<br>0.77V<br>10μA|TJ=25⁰C<br>IF=2.0A; TJ=25⁰C<br>IF=2.0A; TJ=125⁰C<br>TJ=125⁰C|
|Typical Junction<br>Capacitance|CJ|30pF|Measured at<br>1.0MHz, VR=4.0V|



## **Dynamic Recovery Characteristics @ 25°C Unless Otherwise Specified** 

|||15ns(Typ.)|IF=0.5A; IR=1.0A;|
|---|---|---|---|
|Reverse Recovery<br>Time|trr|25ns(Max.)|IRR=0.25A|
|Peak recovery<br>current|IRRM|25ns(Typ.)<br>3.0A(Typ.)|IF=3A diF/dt = 200 A/μs<br>VR= 200 V,TJ=25⁰C|
|Reverse recovery<br>charge|Qrr|40nC(Typ.)||



Note: 

1. High Temperature Solder Exemptions Applied, See EU Directive Annex Notes 7a. 

2. Halogen free "Green” products are defined as those which contain <900ppm bromine, 

## DO-221AC(SMA-FL) 

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D Cathode Mark B<br>E1<br>E<br>A C<br>L L<br>**----- End of picture text -----**<br>


||DIMENSIONS|DIMENSIONS|DIMENSIONS|DIMENSIONS|DIMENSIONS|
|---|---|---|---|---|---|
|DIM|INCHES||MM||NOTE|
||MIN|MAX|MIN|MAX||
|A|0.035|0.049|0.90|1.25||
|B|0.049|0.065|1.25|1.65||
|C|0.004|0.016|0.10|0.40||
|D|0.089|0.116|2.25|2.95||
|E|0.173|0.220|4.40|5.60||
|E1|0.126|0.181|3.20|4.60||
|L|0.020|0.059|0.50|1.50||



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SUGGESTED SOLDER PAD LAYOUT<br>**----- End of picture text -----**<br>


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inch<br>0.232 mm<br>(5.9)<br>0.075<br>(1.9)<br>0.106 0.063<br>(2.7) (1.6)<br>**----- End of picture text -----**<br>


<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 

3. Mounted on P.C.B With 8 mm x 16 mm Copper Pad Areas. 

4. Mounted on P.C.B. With 0.2" x 0.2" (5.0 mm x 5.0 mm) Copper Pad Areas. 

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**UG2DAFL** 

## **Curve Characteristics** 

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Fig. 1 - Forward Current Derating Curve<br>**----- End of picture text -----**<br>


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2.5<br>2.0<br>1.5<br>1.0<br>0.5<br>Resistive or Inductive Load<br>0.0<br>0 25 50 75  100 125 150 175<br>Lead Temperature (°C)<br>Average Forward Current (A)<br>**----- End of picture text -----**<br>


Fig. 3 - Typical Instantaneous Forward Characteristics 

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5<br>1<br>25°C<br>75 ° C<br>125°C<br>150°C<br>0.1<br>0.2 0.4 0.6 0.8 1.0 1.2<br>Instantaneous Forward Voltage (V)<br>Instantaneous Forward Current (A)<br>**----- End of picture text -----**<br>


Fig. 5 - Typical Capacitance Characteristics 

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120<br>25°C<br>f=1MHz<br>80<br>40<br>0<br>0 5 10 15 20<br>Reverse Voltage (V)<br>Capacitance Between Terminals (pF)<br>**----- End of picture text -----**<br>


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Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current<br>**----- End of picture text -----**<br>


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75<br>60<br>45<br>30<br>15<br>8.3 ms Single Half Sine-Wave<br>0<br>1 10 100<br>Number of Cycles at 60 Hz<br>Peak Forward Surge Current (A)<br>**----- End of picture text -----**<br>


## Fig. 4 - Typical Reverse Leakage Characteristics 

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10<br>150°C<br>1<br>125°C<br>0.1<br>75°C<br>0.01<br>25°C<br>0.001<br>20 40  60  80  100<br>Percent of Rated Peak Reverse Voltage (%)<br>Instantaneous Reverse Leakage Current (μA)<br>**----- End of picture text -----**<br>


Fig. 6 - Reverse Recovery Waveform and Definitions 

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(3)<br>IF trr<br>ta tb<br>0<br>(4)<br>Qrr<br>(2) IRRM 0.5 IRRM<br>(1) diF/dt di(rec)M/dt (5)<br>0.75 IRRM<br>(1) diF/dt - rate of change of current  (4) Qrr - area under curve defined by trr<br>through zero crossing and IRRM<br>(2) IRRM - peak reverse recovery current Qrr [ =] t      2rr x IRRM<br>(3) tfrom zero crossing point of negative rr - reverse recovery time measured  (5) di(rec)M/dt - peak rate of change of<br>going IF to point where a line passing  current during tb portion of trr<br>through 0.75 IRRM and 0.50 IRRM<br>extrapolated to zero current.<br>**----- End of picture text -----**<br>


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**UG2DAFL** 

## **Ordering Information** 

|**Ordering Information**|||
|---|---|---|
|**Device**|**Packing**||
|UG2DAFL-TP|Tape&Reel: 10Kpcs/Reel||



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## *****LIFE SUPPORT***** 

MCC's products are not authorized for use as critical components in life support devices or systems without the express written approval of Micro Commercial Components Corporation. 

## *****CUSTOMER AWARENESS***** 

Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on our web page cited below. Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine parts, have full traceability, meet MCC's quality standards for handling and storage. **MCC will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources** . MCC is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. 

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