# Power MOSFET, Power, P Channel, 30 V, 16 A, 0.0039 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:1901964/)

**URL**: https://novapart.co/products/TPC8128/power-mosfet-p-channel-30-v-16-a-00039-ohm-soic
**SKU**: TPC8128
**Manufacturer**: TOSHIBA
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2730
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Power Dissipation | 1.9W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | P Channel |
| Power Dissipation Pd | 1.9W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.0039ohm |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 16A |
| Drain Source On State Resistance | 0.0039ohm |
| Gate Source Threshold Voltage Max | 800mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1901964/)

TPC8128 ~~TOSHIBA~~ 

TPC8128 

TOSHIBA Field Effect Transistor  Silicon P Channel MOS Type (U-MOSⅥ) 

## **TPC8128** 

## Lithium Ion Battery Applications 

## Power Management Switch Applications 

Unit: mm 

- Small footprint due to small and thin package 

- Low drain-source ON-resistance: RDS (ON) = 3.9 m Ω (typ.) 

- Low leakage current: IDSS = −10 μ A (max) (VDS = −30 V) 

- Enhancement mode: Vth = −0.8 to −2.0 V (VDS = −10 V, ID = −0.5mA) 

## **Absolute Maximum Ratings (Ta = 25°C)** 

|Characteristics|Characteristics|Symbol|Rating|Unit|
|---|---|---|---|---|
|Drain-source voltage||VDSS|−30|V|
|Drain-gate voltage (RGS =20 kΩ)||VDGR|−30|V|
|Gate-source voltage<br>~~ee~~<br>~~ee~~||VGSS<br>~~ee~~<br>~~eee~~|−25/+20<br>~~ee~~<br>~~eee~~|V|
|Drain current<br>~~a~~|DC<br>(Note 1)<br>~~ee~~<br>~~ee~~|ID<br>~~ee~~<br>~~eee~~|−16<br>~~ee~~<br>~~eee~~|A|
||Pulse (Note 1)<br>~~ee~~<br>~~ee~~|IDP<br>~~ee~~<br>~~eee~~|−64<br>~~ee~~<br>~~eee~~||
|Drain power dissipation (t=10 s)<br>(Note 2a)<br>~~ee ~~||PD<br> ~~eee ~~|1.9<br> ~~eee~~|W|
|Drain power dissipation (t=10 s)<br>(Note 2b)||PD|1.0|W|
|Single pulse avalanche energy<br>(Note 3)||EAS|166|mJ|
|Avalanche current          (Note 1)<br>~~ee~~||IAR<br>~~ee~~<br>~~ee~~|−16<br>~~ee~~|A<br>~~ee~~|
|Channel temperature<br>~~ee~~||Tch<br>~~ee~~<br>~~ee~~|150<br>~~ee~~|°C<br>~~ee~~|
|Storage temperature range<br>~~es~~||Tstg<br>~~ee~~<br>~~es~~|−55 to 150<br>~~es~~|°C<br>~~es~~|



Note 1, Note 2, Note 3 : See the next page. 

Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating 

temperature/current/voltage, etc.) are within the absolute maximum ratings. 

|ye<br>4<br>5.6,7,8|Sek<br>GATE<br>7,8 DRAIN|
|---|---|
|JEDEC|⎯|
|JEITA|⎯|
|TOSHIBA|2-6J1B|



Weight: 0.080 g (typ.) 

## **Circuit Configuration** 

**==> picture [78 x 95] intentionally omitted <==**

**----- Start of picture text -----**<br>
8  7  6  5<br>1  2  3  4<br>**----- End of picture text -----**<br>


Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 

This transistor is an electrostatic-sensitive device. Handle with care. 

2009-11-20 

1 

TPC8128 

## **Thermal Characteristics** 

|**hermal Characteristics**||||
|---|---|---|---|
|Characteristics|Symbol|Max|Unit|
|Thermal resistance, channel to ambient<br>(t=10 s)<br>(Note 2a)|Rth (ch-a)|65.8|°C/W|
|Thermal resistance, channel to ambient<br>(t=10 s)<br>(Note 2b)|Rth (ch-a)|125|°C/W|



## **Marking (Note 4)** 

**==> picture [179 x 93] intentionally omitted <==**

**----- Start of picture text -----**<br>
Part No.<br>T P C 8 1 2 8 (or abbreviation code)<br>Lot No.<br>Note 5<br>**----- End of picture text -----**<br>


Note 1: Ensure that the channel temperature does not exceed 150°C. 

Note 2: (a)Device mounted on a glass-epoxy board (a) (b)Device mounted on a glass-epoxy board (b) 

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FR-4  FR-4<br>25.4 × 25.4 × 0.8 25.4 × 25.4 × 0.8<br>(Unit: mm) (Unit: mm)<br>(a)  (b)<br>**----- End of picture text -----**<br>


Note 3: VDD = −24 V, Tch = 25 °C (initial), L = 500 μH, RG = 25 Ω, IAR = −16 A 

Note 4: • on lower left of the marking indicates Pin 1. 

- ※ Weekly code: (Three digits) 

Week of manufacture (01 for the first week of a year: sequential number up to 52 or 53) Year of manufacture (The last digit of a year) 

Note 5: A line under a Lot No. identifies the indication of product Labels. 

Not underlined: [[Pb]]/INCLUDES > MCV 

Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]] 

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 

2009-11-20 

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TPC8128 

## **Electrical Characteristics (Ta = 25°C)** 

|Characteristics|Characteristics|Symbol|Test Condition|Test Condition|Test Condition|Test Condition|Min|Typ.|Max|Unit|
|---|---|---|---|---|---|---|---|---|---|---|
|Gate leakage current||IGSS|VGS = ±20 V, VDS =0 V||||⎯|⎯|±100|nA|
|Drain cut-OFF current||IDSS|VDS = −30 V, VGS =0 V||||⎯|⎯|−10|μA|
|Drain-source breakdown voltage||V(BR) DSS|ID = −10 mA, VGS =0 V||||−30|⎯|⎯|V|
|||V(BR) DSX|ID = −10 mA, VGS =10 V  (Note 6)||||−21|⎯|⎯||
|Gate threshold voltage||Vth|VDS = −10 V, ID = −0.5 mA||||−0.8|⎯|−2.0|V|
|Drain-source ON-resistance||RDS (ON)|VGS = −4.5 V, ID = −8 A||||⎯|5.3|6.9|mΩ|
||||VGS = −10 V, ID = −8 A||||⎯|3.9|5||
|Input capacitance||Ciss|VDS = −10 V, VGS =|||0 V, f=1 MHz|⎯|4800|⎯|pF|
|Reverse transfer capacitance||Crss|||||⎯|800|⎯||
|Output capacitance||Coss|||||⎯|900|⎯||
|Switching time|Rise time|tr|Duty≤1%, tw =10μs<br>RL =1.88Ω<br>VDD≈ −15 V<br>0 V<br>VGS<br>−10 V<br>4.7Ω<br>ID = −8 A<br>VOUT|I|||⎯|10|⎯|ns|
||Turn-ON time|ton|||||⎯|19|⎯||
||||||||||||
||Fall time|tf|||||⎯|140|⎯||
||Turn-OFF time|toff|||||⎯|420|⎯||
|Total gate charge<br>(gate-source plus gate-drain)||Qg|VDD≈ −24 V, VGS = −10 V,<br>ID = −16 A||||⎯|115|⎯|nC|
|Gate-source charge 1||Qgs1|||||⎯|11|⎯||
|Gate-drain (“miller”) charge||Qgd|||||⎯|30|⎯||



## = **Source-Drain Ratings and Characteristics (Ta 25°C)** 

|Characteristics|Characteristics|Symbol|Test Condition|Min|Typ.|Max|Unit|
|---|---|---|---|---|---|---|---|
|Drain reverse<br>current|Pulse<br>(Note 1)|IDRP|⎯|⎯|⎯|−64|A|
|Forward voltage (diode)||VDSF|IDR = −16 A, VGS =0 V|⎯|⎯|1.2|V|



Note 6:  VDSX mode (the application of a plus voltage between gate and source) may cause decrease in maximum rating of drain-source voltage. 

2009-11-20 

3 

TPC8128 

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ID – VDS ID – VDS<br>−−20 16  TWNTALIAF −10  −3  −2.4−2.6 − Yo 2.5 −2.3  Common sourceTa  Pulse test −2.2  = 25°C   −−5040 TZHitt −−4.5 10 −3.6  £7 − − 3 2.8 −2.6  −2.5  −2.4  Common sourceTa  Pulse test  = 25°C<br>−3.6<br>WLS −4.5 oz AE AZ −2.3<br>−12  WML ZC −2.1 −30 Nita —aan<br>Vigan an Wiigacauunn −2.2<br>−8  Vigaecdaun −20 WIMACLEERRTT<br>WAZ ZC −2 Wi CEE −2.1<br>−4  WAAL aT −10 WALES TE<br>−2<br>V7 LS V GS = −1.9 V | ue aa<br>VGS = −1.9 V<br>0  jz8= eee 0 nSee<br>0  −0.2  −0.4 −0.6  −0.8  −1 0 −0.4 −0.8 −1.2  −1.6  −2<br>Drain−source voltage  VDS  (V)  Drain-source voltage  VDS  (V)<br>ID – VGS VDS – VGS<br>−50 −0.4<br>Common source  Common source<br>VDS = −10 V  Ta = 25 ° C<br>−40 Pulse test  Pulse test<br>aiPee −0.3 SHHPRT Td<br>ee<br>−30 ee) se PL<br>−0.2<br>−20 PEPER, EE Ey<br>a | AREEEEELE<br>Ta = 100°C −0.1 AIEEE EE<br>−10 −55  ID = −16A<br>25  −8<br>−4<br>0 ayFe Door 0 SS(Pet<br>0  −1  −2  −3  −4 0 −4 −8 −12  −16  −20<br>Gate−source voltage  VGS  (V)  Gate−source voltage  VGS  (V)<br>RDS (ON) – ID<br>100<br>Common source<br>Ta = 25 ° C<br>Pulse test<br>TI oe<br>10<br>SU<br>VGS = −4.5 V<br>Seeae −10<br>To2 co<br>1 ETATEIN LTH<br>−0.1  −1  −10  −100<br>Drain current  ID  (A)<br>  (A)    (A)<br>D D<br>Drain current  I Drain current  I<br>  (V)<br>  (A)  DS<br>D<br>source voltage  V<br>Drain current  I −<br>Drain<br>)<br>Ω<br>  (m<br>DS (ON)<br>source ON-resistance − R<br>Drain<br>**----- End of picture text -----**<br>


2009-11-20 

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TPC8128 

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RDS (ON) – Ta  IDR – VDS<br>10  −100<br>Common source<br>Pulse test  −10 −4.5<br>8  PFTFLT ID  EP = − TTT 4, −8,  EET −16 A   tt aar −3<br>A ee −10 ) Afnen/en08<br>6<br>ft} ett | re ae<br>VGS = −4.5 V  pe | ee |ee<br>4  ID = −4, −8, −16 A −1  VGS = 0 V<br>−1 faueay<br>aoe ny i<br>VGS = −10 V<br>2<br>Pt tiaali tT ETT YE === =..=————0 aeate Common source<br>Ta = 25 ° C<br>Pulse test<br>0 −80  PTTPLT −40  TETitty 0  40  TTTey 80   yyty 120 | 160 −0.1 0 SeenrFETT 0.2 0.4 TAee 0.6  YY 0.8  1  1.2<br>Ambient temperature  Ta  (°C)  Drain−source voltage  VDS  (V)<br>Capacitance – VDS Vth – Ta<br>10000  −2<br>SSSsees meas COLE<br>SS ne a<br>C iss −1.6<br>See<br>a −1.2 SPREE<br>1000<br>UAT ll Coss −0.8 POCA ERE<br>FEEPt TTrH EAH SSH Crss HHT PEPE<br>Common source<br>ee Common source  VGS = 0 V  | −0.4 I V DDS= − = 0.5mA  −10 V  Y | | | tt ft]<br>f = 1 MHz<br>Pulse test<br>Ta = 25°C<br>100  AAR 0 | Eee<br>−0.1  −1  LIME −10  | EHIM −100 −80 −40 0 PCCP 40  80  120  160<br>Drain−source voltage  VDS  (V)  Ambient temperature  Ta  (°C)<br>Dynamic input/output<br>PD – Ta  characteristics<br>2 −30 −30<br>(1)Device mounted on a glass-epoxy   Common source<br>rT (1)  (2)Device mounted on a glass-epoxy  boardboard(b) (Note 2b) (a) (Note 2a) −25 i VDD = −24 V Ta  ID = = 25 −16 A  °C  −25<br>1.6  t = 10 s  Pulse test<br>mine Ee<br>| \ : TE<br>−20 −20<br>1.2  Pi Se Oe V DS Oa<br>VGS<br>tT At | |] tT −15 YP tt tr −15<br>(2)  −12<br>0.8  SN BEaa<br>−6<br>−10 −10<br>VDD = −24 V<br>−6<br>0.4  −12<br>pt NN −5 | −5<br>pt ft | | tTINEI N At ohOA<br>0  0 0<br>0  40  80  120  160 0 40 80  120  160<br>Ambient temperature  Ta  (°C)  Total gate charge  Qg  (nC)<br>  (A)<br>)  DR<br>Ω<br>  (m<br>DS (ON)<br>R<br>Drain-source ON-resistance<br>Drain reverse current  I<br>  (V)<br>Capacitance  C  (pF)  th<br>Gate threshold voltage  V<br>  (W)    (V)    (V)<br>D DS GS<br>Drain power dissipation  P source voltage  VDrain− Gatesource voltage  V−<br>**----- End of picture text -----**<br>


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TPC8128 

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**----- Start of picture text -----**<br>
rth − tw<br>1000<br>(1) Device mounted on a glass-epoxy board (a) (Note 2a)<br>(2) Device mounted on a glass-epoxy board (b) (Note 2b) (2)<br>PE<br>(1)<br>100  RN eT<br>ere a reer eel reas nec EO error ee cereal<br>ee<br>10  Ier<br>a eee<br>SE 1? cece ce | En nA ed | ||<br>1  ee|<br>~~ | iti Tt TyTT<br>0.1  rETIE LEMTILTITa llTTL, Single pulse  I Hill<br>0.001  0.01  0.1  1  10  100  1000<br>Pulse width  tw  (s)<br>  (°C/W)<br>th<br> r<br>Transient thermal impedance<br>**----- End of picture text -----**<br>


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Safe operating area<br>−100<br>ID max (Pulse)  *<br>PsN<br>−10  ptPfITPT TTTTTeeTTT t = 10 ms  AENPNGNNT * TT TTA AG 1 ms  TTTTEHH * TTTETTeeTTT]<br>Ve<br>FE<br>ee eee eeeeeNS<br>a ee eee ll<br>−1<br>*  Single pulse  2eeeee ee<br>Ta = 25°C  en eeee<br>Curves must be derated<br>linearly with increase in<br>temperature.  VDSS max<br>−0.1<br>−0.1  −1  −10  −100<br>  (A)<br>D<br>Drain current  I<br>**----- End of picture text -----**<br>


Drain−source voltage  VDS  (V) 

2009-11-20 

6 

TPC8128 

## **RESTRICTIONS ON PRODUCT USE** 

- Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. 

- This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. 

- Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. **TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.** 

- Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. 

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- Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. 

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- **ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.** 

- Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. 

- Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 

2009-11-20 

7 



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---

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