# THERMAL JUMPER, ALUMI NITRIDE, 170 W/M.K

![Product image](https://novapart.co/image/farnell:3787961/)

**URL**: https://novapart.co/products/THJP0603AST1/thermal-jumper-alumi-nitride-170-w-mk
**SKU**: THJP0603AST1
**Manufacturer**: VISHAY
**Category**: Cooling & Thermal Management || Thermal Interface Materials || Thermally Conductive Materials
**Price**: €0.3810
**Stock**: 25+
**Lead Time**: 2 days (indicative)

## Description

Thermal Conductivity:170W/m.K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:14°C/W; Dielectric Strength:-; External Length:0.061" 59AJ2387

## Specifications

| Parameter | Value |
|---|---|
| Thermal Impedance | 14°C/W |
| Thermal Conductivity | 170W/m.K |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3787961/)

**THJP** ~~a~~ Vishay Dale Thin Film 

www.vishay.com 

## **ThermaWick[TM] Thermal Jumper Surface Mount Chip** 

## **FEATURES** 

- Electrically isolated thermal conductor 

- High thermal conductivity AlN substrate Available (170 W/m°K) RoHS* 

- • Electrically isolated terminations (> 999 M  ) Available HALOGEN 

- • Low capacitance • Available with SnPb or lead (Pb)-free wrap terminations ~~'5-2008,~~ Available 

- Electrically isolated terminations (> 999 M  ) 

- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 

## **LINKS TO ADDITIONAL RESOURCES** 

3D Models 

## **APPLICATIONS** 

- Power supplies and converters 

- RF amplifiers 

THJP surface mount chips are designed to provide an electrically isolated thermal conductive pathway to a ground plane or heat sink while maintaining the electrical isolation of the device. The devices are constructed with aluminum nitride substrates in both SnPb and Pb-free wraparound termination styles. The low capacitance of the device makes them an excellent choice for high frequency and thermal ladder applications. Custom sizes available. 

- Synthesizers 

- Switch mode power supplies 

- Pin and laser diodes 

- Filters 

## **CONSTRUCTION** 

**==> picture [77 x 85] intentionally omitted <==**

**----- Start of picture text -----**<br>
Solder coating<br>Nickel termination<br>Aluminum nitride<br>substrate<br>**----- End of picture text -----**<br>


## **HEAT TRANSFER DEMONSTRATION** 

Chip surface temperature was measured using a FLIR SC645 thermal imaging system under ambient conditions. The devices were mounted to an FR4 test card designed with a 25 mm x 19 mm copper heat sink. Power was supplied to device to cause the surface temperature to stabilize at 150 °C. The device was then retested at the same power level with the thermal jumper connecting the device to the heat sink. 

## **Example THJP 1206 Thermal Jumper Showing 36 % Surface Temperature Reduction** 

Ceramic Resistor Chip Without Thermal Jumper (149.8 °C) 

Ceramic Chip Resistor With Thermal Jumper (95.5 °C) 

Revision: 08-Apr-2020 

Document Number: 60157 

**1** For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**THJP** 

Vishay Dale Thin Film 

www.vishay.com 

## **DIMENSIONS** in inches 

|**DIMENSIONS**in inches|**DIMENSIONS**in inches|**DIMENSIONS**in inches|**DIMENSIONS**in inches|**DIMENSIONS**in inches|
|---|---|---|---|---|
|W<br>T<br>D<br>D<br>L|||||
|**CASE SIZE**|**L**|**W**|**T**|**D**|
|0603|0.061 ± 0.005|0.033 ± 0.005|0.030 ± 0.005|0.015 ± 0.005|
|0612|0.063 ± 0.005|0.126 ± 0.005|0.030 ± 0.005|0.015 ± 0.005|
|0805|0.079 ± 0.005|0.047 ± 0.005|0.030 ± 0.005|0.020 ± 0.005|
|1206|0.126 ± 0.005|0.063 ± 0.005|0.030 ± 0.005|0.020 ± 0.005|
|1225|0.126 ± 0.005|0.252 ± 0.005|0.030 ± 0.005|0.020 ± 0.005|
|2512|0.252 ± 0.005|0.126 ± 0.005|0.030 ± 0.005|0.020 ± 0.005|



## **TYPICAL CHARACTERISTICS** 

|**TYPICAL CHARACTERISTICS**|**TYPICAL CHARACTERISTICS**|**TYPICAL CHARACTERISTICS**|**TYPICAL CHARACTERISTICS**|**TYPICAL CHARACTERISTICS**|**TYPICAL CHARACTERISTICS**|**TYPICAL CHARACTERISTICS**|
|---|---|---|---|---|---|---|
|**CASE SIZE**|**0603**|**0612**|**0805**|**1206**|**1225**|**2512**|
|Thermal resistance (°C/W)|14|4|13|15|4|15|
|Thermal conductance (mW/°C)|70|259|77|65|259|65|
|Capacitance (pF)|0.07|0.26|0.15|0.07|0.26|0.07|
|Dielectric withstanding voltage kVAC,<br>RMS (60 Hz)|> 1.5|> 1.5|> 1.5|> 1.5|> 1.5|> 1.5|



**STANDARD MATERIAL SPECIFICATIONS** Substrate material Aluminum nitride (170 W/m°K) Termination (tin / lead) Electroplate tin / lead over electroplate nickel Termination (lead (Pb)-free) Electroplate tin (e3) over electroplate nickel ~~———~~ **GLOBAL PART NUMBER INFORMATION New Global Part Numbering: THJP1206AST1 T H J P 1 2 0 6 A S T 1** GLOBAL MODEL CASE SIZE THICKNESS TERMINATION PACKAGING **THJP 0603 A** = 0.030" **B** = wraparound Sn/Pb solder **BS** = BULK 100 min., 1 mult. **0805** with nickel termination **0612 S** = wraparound Sn (e3) solder TAPE AND REEL **1206** with nickel termination **T0** = 100 min., 100 mult. **1225** RoHS compliant **T1** = 1000 min., 1000 mult. **2512 T3** = 300 min., 300 mult. **T5** = 500 min., 500 mult. **TF** = full reel **TS** = 100 min., 1 mult. **TI** = 100 min., 1 mult. (item single lot date code) **TP** = 100 min., 1 mult. (package unit single lot date code) ~~ao~~ Revision: 08-Apr-2020 **2** Document Number: 60157 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Legal Disclaimer Notice** Vishay 

www.vishay.com 

**==> picture [59 x 48] intentionally omitted <==**

## **Disclaimer** 

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product.  To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. 

Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications.  Such statements are not binding statements about the suitability of products for a particular application.  It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time.  All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts.  Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. 

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. 

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.  Product names and markings noted herein may be trademarks of their respective owners. 

_**© 2019 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED**_ 

Revision: 01-Jan-2019 

Document Number: 91000 

**1** 



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- [Supplier page](https://es.farnell.com/vishay/thjp0603ast1/thermal-jumper-alumi-nitride-170/dp/3787961)
---

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