# Triac, 600 V, 30 A, TO-220AB, 1 V, 270 A, 60 mA

![Product image](https://novapart.co/image/farnell:1889346/)

**URL**: https://novapart.co/products/T3035H-6T/triac-600-v-30-a-to-220ab-1-270-60-ma
**SKU**: T3035H-6T
**Manufacturer**: STMICROELECTRONICS
**Price**: €1.0100
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Description

Peak Repetitive Off-State Voltage, Vdrm:600V; On State RMS Current IT(rms):30A; Triac Case Style:TO-220AB; Gate Trigger Current Max (QI), Igt:35mA; Gate Trigger Voltage Max Vgt:1V; Pea

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Triac Case Style | TO-220AB |
| Thyristor Mounting | Through Hole |
| Holding Current Max | 60mA |
| On State Rms Current | 30A |
| Peak On State Voltage | 1.55V |
| Gate Trigger Voltage Max | 1V |
| Operating Temperature Max | 150°C |
| Peak Non Repetitive Surge Current | 270A |
| Peak Repetitive Off State Voltage | 600V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1889346/)

**T3035H, T3050H** 

Datasheet 

## 30 A - 600 V H-series Snubberless Triac 

**==> picture [132 x 182] intentionally omitted <==**

**----- Start of picture text -----**<br>
A2<br>G<br>A1<br>A2<br>G G<br>A2 A2<br>A1 A1<br>TO-220AB TO-220AB Ins.<br>A2<br>A2 G<br>A1<br>D²PAK<br>**----- End of picture text -----**<br>


## **Features** 

- High current Triac 

- High immunity level 

- Low thermal resistance with clip bonding 

- Very high 3 quadrant commutations at 150 °C capabilities 

- Packages are RoHS (2002/95/EC) compliant 

- UL certified (ref. file E81734) 

## **Application** 

Thanks to its high electrical noise immunity level and its strong current robustness, the T3035H, T3050H series is designed for the control of AC actuators in appliances and industrial systems. 

## **Description** 

**Product status link** T3035H, T3050H 

|**Product summary**|**Product summary**|
|---|---|
|**IT(RMS)**|30 A|
|**VDRM/VRRM**|600 V|
|**IGT**|35 or 50 mA|



Specifically designed to operate at 150 °C, the 30 A triacs T3050H provide very high dynamic and enhanced performance in terms of power loss and thermal dissipation. This allows the heatsink size optimization, leading to space and cost effectiveness when compared to electro-mechanical solutions. 

Based on ST Snubberless technology, they offer a specified minimal commutation and high noise immunity levels valid up to the Tj max. 

These devices safely optimize the control of universal motors and inductive loads found in power tools and major appliances. 

By using an internal ceramic pad, they provide voltage insulation (rated at 2500 VRMS). 

**DS6689** - **Rev 8** - **April 2022** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**T3035H, T3050H Characteristics** 

**1 Characteristics** 

## **Table 1. Absolute maximum ratings (limiting values)** 

|**Symbol**|**Parameter**|||**Value**|**Unit**|
|---|---|---|---|---|---|
|IT(RMS)|RMS on-state current (full sine wave)|D2PAK,<br>TO-220AB|Tc= 121 °C|30|A|
|||TO-220AB Ins.|Tc= 92 °C|||
|ITSM|Non repetitive surge peak on-state current<br>(full cycle, Tjinitial = 25 °C)|f = 50 Hz|t = 20 ms|270|A|
|||f = 60 Hz|t = 16.7 ms|284||
|I2t|I2t value for fusing||tp= 10 ms|487|A2s|
|dl/dt|Critical rate of rise of on-state current,<br>IG= 2 x IGT, tr ≤ 100 ns, f = 100 Hz|f = 120 Hz|Tj=150 °C|50|A/µs|
|VDSM/<br>VRSM|Non Repetitive peak off-state voltage|tp= 10 ms|Tj= 25 °C|VDRM/VRRM<br>+100|V|
|IGM|Peak gate current|tp= 20 µs|Tj= 150 °C|4|A|
|PG(AV)|Average gate power dissipation||Tj= 150 °C|1|W|
|Tstg|Storage temperature range|||-40 to +150|°C|
|Tj|Operating junction temperature range|||-40 to +150|°C|



**Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified)** 

|**Sbl**|**Tt diti**|**Qdt**||**Value**|**Value**|**Uit**|
|---|---|---|---|---|---|---|
|**ymo**|**es conons**|**uarans**||**T3035H**|**T3050H**|**n**|
|IGT(1)|VD= 12 V, RL= 33 Ω|I - II - III|Max.|35|50|mA|
|VGT|||Max.|1.0||V|
|VGD|VD= VDRM, RL= 3.3 kΩ|I - II - III|Max.|0.15||V|
|IL|IG= 1.2 x IGT|I - III|Max.|75|90|mA|
|||II|Max.|90|110||
|IH (2)|IT= 500 mA, gate open||Max.|60|75|mA|
|dV/dt(2)|VD= 2/3 x VDRM, gate open|Tj= 150 °C|Min.|1000|1500|V/µs|
|(dl/dt)c(2)|Without snubber|Tj= 150 °C|Min.|33|44|A/ms|



_1. Minimum IGT is guaranteed at 20% of IGT max._ 

_2. For both polarities of A2 referenced to A1._ 

**DS6689** - **Rev 8** 

**page 2/13** 

**T3035H, T3050H Characteristics** 

**Table 3. Static characteristics** 

|**Symbol**|**Test conditions**|||**Value**|**Unit**|
|---|---|---|---|---|---|
|VT (1)|IT= 42 A, tp= 380 µs|Tj= 25 °C|Max.|1.55|V|
|VTO (1)|Threshold voltage|Tj= 150 °C|Max.|0.80|V|
|RD(1)|Dynamic resistance|Tj= 150 °C|Max.|15|mΩ|
|IDRM/<br>IRRM(2)|VDRM= VRRM|Tj= 25 °C|Max.|10|µA|
|||Tj= 150°C||8.5|mA|
||VD= VR= 400 V, peak voltage|Tj= 150 °C|Max.|7|mA|
||VD= VR= 200 V, peak voltage|Tj= 150 °C|Max.|5.5||



_1. For both polarities of A2 referenced to A1._ 

_2. tp = 380 μs_ 

**Table 4. Thermal resistance** 

|**Symbol**|**Parameter**||**Value**|**Unit**|
|---|---|---|---|---|
|Rth(j-c)|Junction to case (AC)|D2PAK,<br>TO-220AB|0.8|°C/W|
|||TO-220AB Ins.|1.6||
|Rth(j-a)|Junction to ambient (Scu= 2 cm2)|D2PAK,<br>TO-220AB|45|°C/W|
||Junction to ambient|TO-220AB Ins.|60||



**DS6689** - **Rev 8** 

**page 3/13** 

**T3035H, T3050H Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**==> picture [513 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1. Maximum power dissipation versus on-state<br>Figure 2. On-state RMS current versus case temperature<br>RMS current<br>P(W) IT(RMS)(A)<br>35<br>40<br>35 30 TO-220AB, D²PAK<br>30 25<br>TO-220AB- ins<br>25 20<br>20<br>15<br>15<br>10<br>10<br>5<br>5<br>0 IT(RMS)(A) 0 0 25 50 Tc(°C)75 100 125 150<br>0 5 10 15 20 25 30<br>**----- End of picture text -----**<br>


**==> picture [513 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 3. On-state RMS current versus ambient Figure 4. Variation of thermal impedance versus pulse<br>temperature (free air convection) duration<br>IT(RMS)(A) K=[Zth /Rth]<br>1.0E+00<br>3.5<br>3.0 Zth(j-c) Z th(j-a)<br>2.5 1.0E-01<br>2.0<br>1.5<br>1.0E-02<br>1.0<br>0.5<br>Ta (°C) tP(s)<br>0.0 1.0E-03<br>0 25 50 75 100 125 150 1.0E-03 1.0E-02 1.0E-01 1.0E+00  1.0E+01  1.0E+02  1.0E+03<br>**----- End of picture text -----**<br>


**Figure 5. Relative variation of gate trigger current and gate trigger voltage versus junction temperature** 

**==> picture [224 x 138] intentionally omitted <==**

**Figure 6. Relative variation of holding current and latching current versus junction temperature (typical value)** 

**==> picture [222 x 135] intentionally omitted <==**

**----- Start of picture text -----**<br>
IH, IL [Tj] / IH, IL [Tj = 25 °C]<br>2.0<br>1.5<br>1.0<br>IL<br>IH<br>0.5<br>Tj(°C)<br>0.0<br>-50 -25 0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**DS6689** - **Rev 8** 

**page 4/13** 

**T3035H, T3050H Characteristics (curves)** 

**==> picture [513 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Surge peak on-state current versus number of Figure 8. Non-repetitive surge peak on-state current for a<br>cycles sinusoidal pulse with width tP < 10 ms<br>ITSM(A) ITSM (A)<br>10000<br>250 Tj initial = 25  °C<br>t = 20 ms<br>200<br>Non repetitive One cy cle 1000<br>Tj initial = 25 °C<br>150<br>100<br>100<br>50 Repetitive<br>TC = 121 °C<br>Number of cycles tP(ms)<br>0 10<br>1 01 100 1000<br>0.01 0.10 1.00 10.00<br>**----- End of picture text -----**<br>


**Figure 9. On-state characteristics (maximum values)** 

**==> picture [223 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
ITM(A)<br>1000<br>100<br>V<br>10<br>1<br>0 1 2 3 4 5<br>**----- End of picture text -----**<br>


**Figure 10. Relative variation of critical rate of decrease of main current versus junction temperature** 

**==> picture [217 x 138] intentionally omitted <==**

**----- Start of picture text -----**<br>
(dI/dt)c[T ]/(dI/dt)c [T = 150 °C]j  j<br>11<br>10<br>9<br>8<br>7<br>6<br>5<br>4<br>3<br>2<br>1<br>0 T (°C)j<br>25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**==> picture [513 x 202] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 12. Relative variation of leakage current versus<br>Figure 11. Relative variation of static dV/dt immunity<br>junction temperature for different values of blocking<br>versus junction temperature<br>voltage<br>11 dV/dt[Tj ]/dV/dt[Tj = 150 °C] 1.0E+00 IDRM RRM [T ;Vj DRM /VRRM DRM RRM<br>10 V = V = 400 VD R [Tj = 150 °C; 600 V]<br>9<br>8 1.0E-01 VDRM = VRRM = 600 V<br>7<br>6 VDRM = VRRM = 400 V<br>5 1.0E-02<br>4 VDRM = VRRM = 200 V<br>3<br>2 1.0E-03<br>1<br>Tj(°C)<br>0<br>25 50 75 100 125 150 1.0E-04 T (°C)j<br>25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**DS6689** - **Rev 8** 

**page 5/13** 

**T3035H, T3050H Characteristics (curves)** 

**Figure 13. Thermal resistance junction to ambient versus copper surface under tab** 

**==> picture [225 x 145] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a) (°C/W)<br>80<br>D²PAK<br>70<br>Epoxy printed board FR4, copper thickness = 35 µm<br>60<br>50<br>40<br>30<br>20<br>10 SCu(cm²)<br>0<br>0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br>


**Figure 14. Acceptable junction to ambient thermal resistance versus repetitive peak off-state voltage and ambient temperature** 

**==> picture [205 x 151] intentionally omitted <==**

**DS6689** - **Rev 8** 

**page 6/13** 

**T3035H, T3050H Package information** 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1 D²PAK package information** 

## **Figure 15. D²PAK package outline** 

**==> picture [320 x 292] intentionally omitted <==**

**----- Start of picture text -----**<br>
E A E1<br>c2 E2<br>1 2 3<br>b2<br>e<br>b Max resin gate protrusion: 0.5 mm (1)<br>G<br>A1<br>A2<br>A3<br>R<br>Gauge Plane<br>c<br>V2<br>L2<br>D1<br>D<br>H<br>D2<br>L3<br>L<br>**----- End of picture text -----**<br>


(1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical. 

**DS6689** - **Rev 8** 

**page 7/13** 

**T3035H, T3050H D²PAK package information** 

**Table 5. D²PAK package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches(1)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|4.30||4.60|0.1693||0.1811|
|A1|2.49||2.69|0.0980||0.1059|
|A2|0.03||0.23|0.0012||0.0091|
|A3||0.25|||0.0098||
|b|0.70||0.93|0.0276||0.0366|
|b2|1.25||1.7|0.0492||0.0669|
|c|0.45||0.60|0.0177||0.0236|
|c2|1.21||1.36|0.0476||0.0535|
|D|8.95||9.35|0.3524||0.3681|
|D1|7.50||8.00|0.2953||0.3150|
|D2|1.30||1.70|0.0512||0.0669|
|e|2.54|||0.1|||
|E|10.00||10.28|0.3937||0.4047|
|E1|8.30||8.70|0.3268||0.3425|
|E2|6.85||7.25|0.2697||0.2854|
|G|4.88||5.28|0.1921||0.2079|
|H|15||15.85|0.5906||0.6240|
|L|1.78||2.28|0.0701||0.0898|
|L2|1.27||1.40|0.0500||0.0551|
|L3|1.40||1.75|0.0551||0.0689|
|R||0.40|||0.0157||
|V2|0°||8°|0°||8°|



_1. Dimensions in inches are given for reference only_ 

**Figure 16. D²PAK recommended footprint (dimensions are in mm)** 

**==> picture [207 x 125] intentionally omitted <==**

**----- Start of picture text -----**<br>
16.90<br>10.30 5.08<br>1.30<br>3.70<br>8.90<br>**----- End of picture text -----**<br>


**DS6689** - **Rev 8** 

**page 8/13** 

**T3035H, T3050H TO-220AB package information** 

## **2.2 TO-220AB package information** 

- Molding compound resin is halogen-free and meets flammability standard UL94 level 0 

- Lead-free package leads finishing 

- ECOPACK2 compliant 

- Recommended torque: 0.4 to 0.6 N.m 

**Figure 17. TO-220AB package outline** 

**==> picture [314 x 322] intentionally omitted <==**

**----- Start of picture text -----**<br>
B C<br>b2<br>Resin gate 0.5 mm I<br>max. protusion [(1)]<br>L<br>F<br>A<br>I4<br>l3<br>c2<br>a1<br>l2<br>a2<br>M<br>b1 Resin gate 0.5 mm c1<br>max. protusion [(1)]<br>e<br>**----- End of picture text -----**<br>


(1)Resin gate position accepted in one of the two positions or in the symmetrical opposites. 

**DS6689** - **Rev 8** 

**page 9/13** 

**T3035H, T3050H TO-220AB package information** 

**Table 6. TO-220AB package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches(1)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|15.20||15.90|0.5984||0.6260|
|a1||3.75|||0.1476||
|a2|13.00||14.00|0.5118||0.5512|
|B|10.00||10.40|0.3937||0.4094|
|b1|0.61||0.88|0.0240||0.0346|
|b2|1.23||1.32|0.0484||0.0520|
|C|4.40||4.60|0.1732||0.1811|
|c1|0.49||0.70|0.0193||0.0276|
|c2|2.40||2.72|0.0945||0.1071|
|e|2.40||2.70|0.0945||0.1063|
|F|6.20||6.60|0.2441||0.2598|
|I|3.73||3.88|0.1469||0.1528|
|L|2.65||2.95|0.1043||0.1161|
|I2|1.14||1.70|0.0449||0.0669|
|I3|1.14||1.70|0.0449||0.0669|
|I4|15.80|16.40|16.80|0.6220|0.6457|0.6614|
|M||2.6|||0.1024||



_1. Inch dimensions are for reference only._ 

**DS6689** - **Rev 8** 

**page 10/13** 

**T3035H, T3050H Ordering information** 

**3** 

## **Ordering information** 

## **Figure 18. Ordering information scheme** 

**==> picture [370 x 274] intentionally omitted <==**

**----- Start of picture text -----**<br>
Table 7.<br>T   30   xx   H  -  6 y  -TR<br>Triac series<br>Current<br>30 = 30 A<br>Sensitivity<br>35 = 35 mA<br>50 = 50 mA<br>High temperature<br>Voltage<br>6 = 600 V<br>Package<br>T =TO-220AB<br>I =TO-220AB insulated<br>G = D²PAK<br>Delivery mode<br>Blank = Tube (T0-220AB, TO-220AB ins.)<br>-TR = Tape and reel (D²PAK)<br>**----- End of picture text -----**<br>


## **Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|T3035H-6G|T3035H-6G|D²PAK|1.5 g|50|Tube|
|T3035H-6G-TR|T3035H-6G|||1000|Tape and reel 13"|
|T3035H-6I|T3035H-6I|TO-220AB Ins.|2.3 g|50|Tube|
|T3035H-6T|T3035H-6T|TO-220AB|2.3 g|50|Tube|
|T3050H-6G|T3050H-6G|D²PAK|1.5 g|50|Tube|
|T3050H-6G-TR|T3050H-6G|||1000|Tape and reel 13"|
|T3050H-6T|T3050H-6T|TO-220AB|2.3 g|50|Tube|



**DS6689** - **Rev 8** 

**page 11/13** 

**T3035H, T3050H** 

## **Revision history** 

**Table 8. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|28-Jan-2010|1|Initial release.|
|17-May-2010|2|Updated maximum Tj in Table 2.|
|14-Dec-2010|3|Updated IGT in Table 1.|
|20-Sep-2011|4|Updated: Features.|
|21-Jul-2015|5|Update Table 2 and reformatted to current standard.|
|20-Jan-2017|6|D²PAK package added.|
|17-Nov-2021|7|Updated Description andTable 2.<br>Minor text changes.|
|29-Apr-2022|8|UpdatedTable 2andTable 7.|



**DS6689** - **Rev 8** 

**page 12/13** 

**T3035H, T3050H** 

## **IMPORTANT NOTICE – READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2022 STMicroelectronics – All rights reserved 

**DS6689** - **Rev 8** 

**page 13/13** 



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