# Fast / Ultrafast Diode, 600 V, 2 A, Single, 1.45 V, 75 ns, 35 A

![Product image](https://novapart.co/image/farnell:3606250/)

**URL**: https://novapart.co/products/SURS8260T3G/fast-ultrafast-diode-600-v-2-a-single-145-75-ns-35
**SKU**: SURS8260T3G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.1910
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (15-Jan-2018) |
| No. Of Pins | 2 Pin |
| Product Range | - |
| Qualification | AEC-Q101 |
| Diode Case Style | DO-214AA (SMB) |
| Diode Configuration | Single |
| Forward Voltage Max | 1.45V |
| Forward Surge Current | 35A |
| Reverse Recovery Time | 75ns |
| Average Forward Current | 2A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 600V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3606250/)

**DATA SHEET www.onsemi.com** 

## Power Rectifiers, Ultra-Fast Recovery 

## MURS260, SURS8260 

## **ULTRAFAST RECTIFIERS 2 AMPERES 600 VOLTS** 

Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. 

## **Features** 

- Small Compact Surface Mountable Package with J−Bend Leads 

**SMB CASE 403A** 

- Rectangular Package for Automated Handling 

- High Temperature Glass Passivated Junction 

## **MARKING DIAGRAM** 

- Low Forward Voltage Drop (1.20 Volts Max @ 2.0 A, TJ = 150°C) 

- AEC−Q101 Qualified and PPAP Capable 

- SURS8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements 

AYWW U2J � � 

- These Devices are Pb−Free and are RoHS Compliant 

## **Mechanical Characteristics** 

- Case: Epoxy, Molded 

- Weight: 95 mg (approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 

- Polarity: Polarity Band Indicates Cathode Lead 

- ESD Ratings: 

   - ♦ Human Body Model = 3B (> 8 kV) 

   - ♦ Charged Device Model > 1000 V 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|600|V|
|Average Rectified Forward Current|IF(AV)|2.0 @ TL= 125°C|A|
|Non−Repetitive Peak Surge Current<br>(Surge applied at rated load conditions<br>halfwave,  single phase, 60 Hz)|IFSM|35|A|
|Operating Junction Temperature|TJ|�65 to +175|°C|



U2J = Specific Device Code A = Assembly Location Y = Year WW = Work Week � = Pb-Free Package 

(Note: Microdot may be in either location) 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MURS260T3G|SMB<br>(Pb−Free)|2,500 /<br>Tape & Reel|
|SURS8260T3G|SMB<br>(Pb−Free)|2,500 /<br>Tape & Reel|
|SURS8260T3G−VF01|SMB<br>(Pb−Free)|2,500 /<br>Tape & Reel|
|SURS8260T3G−GA01|SMB<br>(Pb−Free)|2,500 /<br>Tape & Reel|



- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

*For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2012 **April, 2023 − Rev. 7** 

**MURS260T3/D** 

**MURS260, SURS8260** 

## **THERMAL CHARACTERISTICS** 

|**Characteristic**|**Symbol**|**Value**|**Unit**|
|---|---|---|---|
|Thermal Resistance, Junction−to−Lead<br>(TL= 25°C)|R�JL|13|°C/W|
|**ELECTRICAL CHARACTERISTICS**||||
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 1)<br>(iF= 2.0 A, TJ= 25°C)<br>(iF= 2.0 A, TJ= 150°C)|vF|1.45<br>1.20|V|
|Maximum Instantaneous Reverse Current (Note 1)<br>(Rated DC Voltage, TJ= 25°C)<br>(Rated DC Voltage, TJ= 150°C)|iR|5.0<br>150|�A|
|Maximum Reverse Recovery Time<br>(iF= 1.0 A, di/dt = 50 A/�s)<br>(iF= 0.5 A, iR= 1.0 A, IRto 0.25 A)|trr|75<br>50|ns|
|Maximum Forward Recovery Time<br>(iF= 1.0 A, di/dt = 100 A/�s, Rec. to 1.0 V)|tfr|50|ns|
|1. Pulse Test: Pulse Width = 300�s, Duty Cycle≤2.0%.||||



**==> picture [488 x 402] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 10<br>7.0 7.0<br>5.0 175°C 5.0 TC = 175°C<br>100°C TC = 100°C<br>3.0 3.0<br>TC = 25°C TC = 25°C<br>2.0 2.0<br>1.0 1.0<br>0.7 0.7<br>0.5 0.5<br>0.3 0.3<br>0.2 0.2<br>0.1 0.1<br>0.07 0.07<br>0.05 0.05<br>0.03 0.03<br>0.02 0.02<br>0.01 0.01<br>0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3<br>VF, INSTANTANEOUS VOLTAGE (VOLTS) VF, INSTANTANEOUS VOLTAGE (VOLTS)<br>, INSTANTANEOUS FORWARD CURRENT (AMPS) , INSTANTANEOUS FORWARD CURRENT (AMPS)<br>IF IF<br>**----- End of picture text -----**<br>


**Figure 1. Typical Forward Voltage** 

**Figure 2. Maximum Forward Voltage** 

**www.onsemi.com** 

**2** 

**MURS260, SURS8260** 

**==> picture [237 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>TJ = 175°C<br>10<br>1.0 TJ = 100°C<br>TJ = 25°C<br>0.1<br>0.01<br>0 100 200 300 400 500 600 700<br>VR, REVERSE VOLTAGE (VOLTS)<br>�<br>, REVERSE CURRENT (   A)<br>IR<br>**----- End of picture text -----**<br>


**Figure 3. Typical Reverse Current*** 

**==> picture [238 x 174] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>TJ = 175°C<br>10<br>TJ = 100°C<br>1.0<br>TJ = 25°C<br>0.1<br>0.01<br>0 100 200 300 400 500 600 700<br>VR, REVERSE VOLTAGE (VOLTS)<br>�<br>IR, REVERSE CURRENT (   A)<br>**----- End of picture text -----**<br>


**Figure 4. Maximum Reverse Current** 

* The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if applied VR is sufficiently below rated VR. 

**==> picture [475 x 175] intentionally omitted <==**

**----- Start of picture text -----**<br>
25 10<br>RATED VOLTAGE APPLIED<br>9.0<br>20 CAPACITANCE ATNOTE: TYPICAL 8.0 R�TJLJ = 175 = 13° ° C/WC<br>0 V = 24 pF 7.0<br>15 6.0<br>5.0<br>10 4.0<br>DC<br>3.0<br>5.0 2.0<br>1.0 SQUARE WAVE<br>0 0<br>0 4.0 8.0 12 16 20 24 28 32 36 40 0 20 40 60 80 100 120 140 160 180 200<br>VR, REVERSE VOLTAGE (VOLTS) TC, CASE TEMPERATURE (°C)<br>C, CAPACITANCE (pF)<br>, AVERAGE FORWARD CURRENT (AMPS)<br>IF(AV)<br>**----- End of picture text -----**<br>


**Figure 5. Typical Capacitance** 

**Figure 6. Current Derating, Case** 

**==> picture [238 x 175] intentionally omitted <==**

**----- Start of picture text -----**<br>
5.0<br>4.0 SQUARE WAVE<br>3.0<br>DC<br>T J  = 175°C<br>2.0<br>1.0<br>0<br>0 0.5 1.0 1.5 2.0 2.5<br>IF(AV), AVERAGE FORWARD CURRENT (AMPS)<br>, AVERAGE POWER DISSIPATION (WATTS)<br>PF(AV)<br>**----- End of picture text -----**<br>


**Figure 7. Power Dissipation** 

**www.onsemi.com** 

**3** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SMB** CASE 403A−03 ISSUE J 

**SCALE 1:1 SCALE 1:1 Polarity Band Non−Polarity Band** 

DATE 19 JUL 2012 

**==> picture [266 x 184] intentionally omitted <==**

**----- Start of picture text -----**<br>
HE<br>E<br>b D<br>POLARITY INDICATOR<br>OPTIONAL AS NEEDED<br>A<br>A1<br>L L1 c<br>**----- End of picture text -----**<br>


## **SOLDERING FOOTPRINT*** 

**==> picture [234 x 133] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.261<br>0.089<br>2.743<br>0.108<br>2.159<br>0.085<br>SCALE 8:1<br>� inches [mm] �<br>**----- End of picture text -----**<br>


NOTES: 

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 

2. CONTROLLING DIMENSION: INCH. 

3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1. 

|**DIM**|**MILLIMETERS**|**MILLIMETERS**|**MILLIMETERS**|**INCHES**|**INCHES**|**INCHES**|
|---|---|---|---|---|---|---|
||**MIN**|**NOM**|**MAX**|**MIN**|**NOM**|**MAX**|
|**A**|1.95|2.30|2.47|0.077|0.091|0.097|
|**A1**|0.05|0.10|0.20|0.002|0.004|0.008|
|**b**|1.96|2.03|2.20|0.077|0.080|0.087|
|**c**|015|023|031|0006|0009|0012|
|**D**|.<br>3.30|.<br>3.56|.<br>3.95|.<br>0.130|.<br>0.140|.<br>0.156|
|**E**|4.06|4.32|4.60|0.160|0.170|0.181|
|**HE**|5.21|5.44|5.60|0.205|0.214|0.220|
|**L**|0.76|1.02|1.60|0.030|0.040|0.063|
|**L1**|0.51 REF|||0.020 REF|||



## **GENERIC MARKING DIAGRAM*** 

**==> picture [159 x 135] intentionally omitted <==**

**----- Start of picture text -----**<br>
AYWW AYWW<br>XXXXX � XXXXX �<br>� �<br>Polarity Band Non−Polarity Band<br>XXXXX = Specific Device Code<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>� = Pb−Free Package<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


   - *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. 

- *For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

|**DOCUMENT NUMBER:**|**98ASB42669B**|
|---|---|
|**DESCRIPTION:**|**SMB**|



Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **PAGE 1 OF 1** 

**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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 



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