# Power MOSFET, N Channel, 200 V, 35.1 A, 0.0375 ohm, TO-263 (D2PAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2785450/)

**URL**: https://novapart.co/products/SUM90330E-GE3/power-mosfet-n-channel-200-v-351-a-00375-ohm-to
**SKU**: SUM90330E-GE3
**Manufacturer**: VISHAY
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5390
**Stock**: 10+

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:35.1A; Drain Source Voltage Vds:200V; On Resistance Rds(on):0.0312ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V;

## Specifications

| Parameter | Value |
|---|---|
| Svhc | Lead (07-Nov-2024) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | TrenchFET |
| Qualification | - |
| Power Dissipation | 125W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-263 (D2PAK) |
| Drain Source Voltage Vds | 200V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 35.1A |
| Drain Source On State Resistance | 0.0375ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2785450/)

_**Work-In-Progress**_ 

**SUM90330E** 

Vishay Siliconix 

www.vishay.com 

## **N-Channel 200 V (D-S) 175 °C MOSFET** 

## **FEATURES** 

**==> picture [81 x 117] intentionally omitted <==**

**----- Start of picture text -----**<br>
TO-263<br>S<br>D<br>G<br>Top View<br>**----- End of picture text -----**<br>


- ThunderFET[®] power MOSFET 

- Low RDS - Qg figure-of-merit (FOM) 

- Maximum 175 °C junction temperature 

- 100 % Rg and UIS tested 

- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 

## **APPLICATIONS** 

Top View D • Synchronous rectification • Power supplies **PRODUCT SUMMARY** • DC/AC inverter VDS (V) 200 • DC/DC converter G RDS(on) max. (  ) at VGS = 10 V 0.0375 • Solar micro inverter RDS(on) max. (  ) at VGS = 7.5 V 0.0422 • Motor drive switch Qg typ. (nC) 21 S ID (A) 35.1 N-Channel MOSFET Configuration Single ~~———— 4~~ **ORDERING INFORMATION** Package TO-263 Lead (Pb)-free and halogen-free SUM90330E-GE3 

~~OOOO~~ **ABSOLUTE MAXIMUM RATINGS** (TA = 25 °C, unless otherwise noted) ~~a~~ **PARAMETER SYMBOL LIMIT UNIT** Drain-source voltage VDS 200 V Gate-source voltage VGS ± 20 ~~_ a~~ TC = 25 °C 35.1 Continuous drain current ID TC = 125 °C 20.3 ~~**a** eeeee~~ Pulsed drain current (t = 100 μs) IDM 70 A Continuous source-drain diode current IS 12.5 Single pulse avalanche current[a] IAS 33 ~~—— ee~~ L = 0.1 mH ~~e~~ Single pulse avalanche energy ~~e~~[a] EAS 54.45 mJ TC = 25 °C 125[b] Maximum power dissipation PD W ~~ee~~ TC = 125 °C 41.7[b] ~~a~~ Operating junction and storage temperature ran ~~ces~~ ge ~~Oe~~ TJ, Tstg -55 to +175 ~~een ee~~ °C ~~a~~ Soldering recommendations (peak temperature)[c] 260 

|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|
|---|---|---|---|---|
|**PARAMETER**||**SYMBOL**|**MAXIMUM**|**UNIT**|
|Maximum junction-to-ambient (PCB mount)c||RthJA|40|°C/W|
|Maximum junction-to-case (drain)|Steady state|RthJC|1.2||



## **Notes** 

a. Duty cycle  1 % b. See SOA curve for voltage derating 

c. When mounted on 1" square PCB (FR4 material) 

SPending-Rev. B, 06-Sep-17 

Document Number: 74505 

**1** 

For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

_**Work-In-Progress**_ 

**SUM90330E** 

Vishay Siliconix 

**==> picture [59 x 48] intentionally omitted <==**

www.vishay.com 

|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C,unless otherwise noted)|||||
|---|---|---|---|---|---|---|
|**PARAMETER**|**SYMBOL**|**TEST CONDITIONS**|**MIN.**|**TYP.**|**MAX.**|**UNIT**|
|**Static**|||||||
|Drain-source breakdown voltage|VDS|VGS= 0 V, ID= 250 μA|200|-|-|V|
|Gate-source threshold voltage|VGS(th)|VDS= VGS, ID= 250 μA|2|-|4|V|
|Gate-source leakage|IGSS|VDS= 0 V, VGS= ± 20 V|-|-|250|nA|
|Zero gate voltage drain current|IDSS|VDS= 200 V, VGS= 0 V|-|-|1|μA|
|||VDS= 200 V, VGS= 0 V, TJ= 125 °C|-|-|150||
|||VDS= 200 V, VGS= 0 V, TJ= 175 °C|-|-|5|mA|
|On-state drain currenta|ID(on)|VDS 10 V, VGS= 10 V|20|-|-|A|
|Drain-source on-state resistancea|RDS(on)|VGS= 10 V, ID= 12.2 A|-|0.0312|0.0375||
|||VGS= 7.5 V, ID= 11.5 A|-|0.0337|0.0422||
|Forward transconductancea|gfs|VDS= 15 V, ID= 10 A|-|28|-|S|
|**Dynamicb**|||||||
|Input capacitance|Ciss|VDS= 100 V, VGS= 0 V, f = 1 MHz|-|1172|-|pF|
|Output capacitance|Coss||-|150|-||
|Reverse transfer capacitance|Crss||-|11|-||
|Totalgate charge|Qg|VDS= 100 V, VGS=10 V, ID= 12.2 A|-|21|32|nC|
|Gate-source charge|Qgs||-|6|-||
|Gate-drain charge|Qgd||-|5.3|-||
|Gate resistance|Rg|f = 1 MHz|0.76|3.8|7.6||
|Turn-on delay time|td(on)|VDD= 100 V, RL= 14.2, ID 7 A,<br>VGEN= 10 V, Rg= 1|-|12|24|ns|
|Rise time|tr||-|25|50||
|Turn-off delay time|td(off)||-|30|50||
|Fall time|tf||-|22|44||
|**Drain-Source Body Diode Characteristics**|||||||
|Pulse diode forward current (t = 100 μs)|ISM||-|-|70|A|
|Body diode voltage|VSD|IF= 7 A, VGS= 0 V|-|0.8|1.5|V|
|Body diode reverse recovery time|trr|IF= 7 A, di/dt = 100 A/μs|-|111|170|ns|
|Body diode reverse recovery charge|Qrr||-|0.51|1|μC|
|Reverse recovery fall time|ta||-|94|-|ns|
|Reverse recovery rise time|tb||-|17|-||
|Body diode peak reverse recovery charge|IRM(REC)||-|8.5|17|A|



## **Notes** 

a. Pulse test; pulse width  300 μs, duty cycle  2 % 

b. Guaranteed by design, not subject to production testing 

c. Independent of operating temperature 

_Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability._ 

SPending-Rev. B, 06-Sep-17 

Document Number: 74505 

**2** 

For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

_**Work-In-Progress**_ 

**SUM90330E** 

**==> picture [59 x 48] intentionally omitted <==**

www.vishay.com 

## Vishay Siliconix 

## **TYPICAL CHARACTERISTICS** (25 °C, unless otherwise noted) 

**==> picture [504 x 591] intentionally omitted <==**

**----- Start of picture text -----**<br>
Axis Title<br>Axis Title<br>70 10000 70 10000<br>VGS = 10 V thru 7 V<br>56 56<br>VGS = 6 V<br>1000 1000<br>42 42<br>28 28<br>100 TC = 25 °C 100<br>VGS = 5 V<br>14 14<br>TC = 125 °C TC = -55 °C<br>0 10 0 10<br>0 1 2 3 4 0 2 4 6 8<br>VDS - Drain-to-Source Voltage (V) VGS - Gate-to-Source Voltage (V)2nd line<br>2nd line<br>Output Characteristics Transfer Characteristics<br>Axis Title Axis Title<br>0.06 10000 2500 10000<br>0.05 2000<br>1000 1000<br>0.04 VGS = 7.5 V 1500<br>Ciss<br>0.03 VGS = 10 V 1000<br>100 Coss 100<br>0.02 500<br>Crss<br>0.01 10 0 10<br>0 14 28 42 56 70 0 20 40 60 80 100<br>ID - Drain Current (A) VDS - Drain-to-Source Voltage (V)<br>2nd line 2nd line<br>On-Resistance vs. Drain Current and Gate Voltage Capacitance<br>Axis Title Axis Title<br>10 10000 2.8 10000<br>ID = 12.2 A VDS = 100 V VGS = 10 V, ID = 12.2 A<br>8<br>2.2<br>VDS = 50 V 1000 1000<br>6 VGS = 7.5 V,<br> ID = 11.5 A<br>VDS = 160 V 1.6<br>4<br>100 100<br>1.0<br>2<br>0 10 0.4<br>0 5.5 11 16.5 22 -50 -25 0 25 50 75 100 125 150 175<br>Qg - Total Gate Charge (nC)2nd line TJ - Junction Temperature (°C)2nd line<br>2nd line<br>2nd line 1st line 2nd line Drain Current (A)- 1st line 2nd line<br>ID<br> - Drain Current (A)<br>ID<br>2nd line<br>2nd line 1st line 2nd line 1st line 2nd line<br> - On-Resistance (Ω) C - Capacitance (pF)<br>DS(on)<br>R<br>2nd line 1st line 2nd line 2nd line 1st line 2nd line<br> - On-Resistance (Normalized)<br> - Gate-to-Source Voltage (V)<br>GS<br>V DS(on)<br>R<br>**----- End of picture text -----**<br>


**Gate Charge** 

## **On-Resistance vs. Junction Temperature** 

Document Number: 74505 

SPending-Rev. B, 06-Sep-17 

**3** 

For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

_**Work-In-Progress**_ 

**SUM90330E** 

**==> picture [59 x 48] intentionally omitted <==**

www.vishay.com 

## Vishay Siliconix 

## **TYPICAL CHARACTERISTICS** (25 °C, unless otherwise noted) 

**==> picture [504 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
Axis Title Axis Title<br>100 10000 0.15 10000<br>ID = 12.2 A<br>10 0.12<br>T J = 150 °C 1000 1000<br>1 0.09<br>TJ = 25  ° C TJ = 150 °C<br>0.1 0.06<br>100 100<br>TJ = 25 °C<br>0.01 0.03<br>0.001 10 0 10<br>0 0.2 0.4 0.6 0.8 1.0 1.2 4 5 6 7 8 9 10<br>VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)<br>2nd line 2nd line<br>2nd line 1st line 2nd line 2nd line 1st line 2nd line<br> - On-Resistance (Ω)<br> - Source Current (A)<br>IS DS(on)<br>R<br>**----- End of picture text -----**<br>


## **Source-Drain Diode Forward Voltage** 

## **On-Resistance vs. Gate-to-Source Voltage** 

**==> picture [238 x 382] intentionally omitted <==**

**----- Start of picture text -----**<br>
Axis Title<br>3.7 10000<br>ID = 250 μA<br>3.1<br>1000<br>2.5<br>100<br>1.9<br>1.3 10<br>-50 -25 0 25 50 75 100 125 150 175<br>TJ - Temperature (°C)<br>2nd line<br>Threshold Voltage<br>Axis Title<br>100 10000<br>I DM limited<br>10<br>Limited by RDS(on) (1) 1000<br>100 μs<br>1 1ms<br>DC, 10 s ,<br>1 s, 100  ms<br>100<br>0.1<br>T C  = 25 °C BVDSS limited<br>Single pulse<br>0.01 10<br>0.1 1 10 100 1000<br>VDS - Drain-to-Source Voltage (V)<br>(1) VGS > minimum VGS at which RDS(on) is specified<br> (V)<br>2nd line VGS(th)<br>1st line 2nd line<br>2nd line 1st line 2nd line<br> - Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


**Safe Operating Area, Junction-to-Ambient** 

**==> picture [238 x 377] intentionally omitted <==**

**----- Start of picture text -----**<br>
Axis Title<br>60 10000<br>TC = -55 °C<br>45<br>TC = 25 °C<br>1000<br>30 TC = 125 °C<br>100<br>15<br>0 10<br>0 5 10 15 20 25<br>ID - Drain Current (A)<br>2nd line<br>Transconductance<br>100<br>25 °C<br>150 °C<br>10<br>1<br>0.00001 0.0001 0.001 0.01<br>Time (s)<br>2nd line<br>2nd line 1st line 2nd line<br> - Transconductance (S)<br>fs<br>g<br> (A)<br>2nd line IDAV<br>**----- End of picture text -----**<br>


## **Avalanche vs. Time** 

Document Number: 74505 

SPending-Rev. B, 06-Sep-17 

**4** 

For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

_**Work-In-Progress**_ 

**SUM90330E** 

**==> picture [59 x 48] intentionally omitted <==**

www.vishay.com 

Vishay Siliconix 

## **TYPICAL CHARACTERISTICS** (25 °C, unless otherwise noted) 

**==> picture [238 x 186] intentionally omitted <==**

**----- Start of picture text -----**<br>
Axis Title<br>40 10000<br>30<br>1000<br>20<br>100<br>10<br>0 10<br>0 25 50 75 100 125 150 175<br>TC - Case Temperature (°C)<br>2nd line<br>Current Derating  [a]<br>2nd line 1st line 2nd line<br> - Drain Current (A)<br>ID<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Axis Title<br>250 10000<br>ID = 10 mA<br>240<br>1000<br>230<br>100<br>220<br>210 10<br>-50 -25 0 25 50 75 100 125 150 175<br>TJ - Temperature (°C)<br>2nd line<br>2nd line 1st line 2nd line<br> - Drain-to-Source Voltage (V)<br>DS<br>V<br>**----- End of picture text -----**<br>


**==> picture [196 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
Drain Source Breakdown vs. Junction Temperature<br>**----- End of picture text -----**<br>


## **Note** 

a. The power dissipation PD is based on TJ max. = 25 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit 

**==> picture [434 x 188] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>Duty Cycle = 0.5<br>0.2<br>0.1 Notes:<br>0.05 PDM<br>0.02 t1<br>Single Pulse 1. Duty Cycle, D =t 2 t t12<br>2. Per Unit Base = RthJC = 1.2 °C/W<br>3. TJM - TA = PDMZthJA [(t)]<br>4. Surface Mounted<br>0.1<br>0.0001 0.001 0.01 0.1 1<br>Square Wave Pulse Duration (s)<br>Normalized Thermal Transient Impedance, Junction-to-Case<br>Thermal Impedance<br>Normalized Effective Transient<br>**----- End of picture text -----**<br>


_Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and reliability data, see www.vishay.com/ppg?74505._ 

SPending-Rev. B, 06-Sep-17 

Document Number: 74505 

**5** 

For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Package Information** 

Vishay Siliconix 

www.vishay.com 

## **TO-263 (D[2] PAK): 3-LEAD** 

## **VERSION 1: FACILITY CODE = T** 

**==> picture [332 x 153] intentionally omitted <==**

**----- Start of picture text -----**<br>
-B-<br>A<br>E c2<br>E1 6<br>-A- K<br>E3<br>A A<br>e bb2 Detail “A” c E2<br>0.010 M   A M<br>2   PL<br>L2 D3<br>D2<br>D4<br>1<br>D<br>D<br>L<br>L3<br>**----- End of picture text -----**<br>


**==> picture [95 x 152] intentionally omitted <==**

**----- Start of picture text -----**<br>
L1<br>DETAIL A (ROTATED 90°)<br>b<br>b1<br>SECTION A-A<br>0° - 5° L4<br>M<br>c1 c<br>**----- End of picture text -----**<br>


## **Notes** 

1. Plane B includes maximum features of heat sink tab and plastic. 

2. No more than 25 % of L1 can fall above seating plane by max.  8 mils. 

3. Pin-to-pin coplanarity max. 4 mils. 

4. *: Thin lead is for SUB, SYB. Thick lead is for SUM, SYM, SQM. 

5. Use inches as the primary measurement. 

6. This feature is for thick lead. 

|**DIM.**|**DIM.**|**INCHES**|**INCHES**|**MILLIMETERS**|**MILLIMETERS**|
|---|---|---|---|---|---|
|||**MIN.**|**MAX.**|**MIN.**|**MAX.**|
|A||0.160|0.190|4.064|4.826|
|b||0.020|0.039|0.508|0.990|
|b1||0.020|0.035|0.508|0.889|
|b2||0.045|0.055|1.143|1.397|
|Thin lead||0.013|0.018|0.330|0.457|
|Thick lead||0.023|0.028|0.584|0.711|
|Thin lead||0.013|0.017|0.330|0.431|
|Thick lead||0.023|0.027|0.584|0.685|
|c2||0.045|0.055|1.143|1.397|
|D||0.340|0.380|8.636|9.652|
|D1||0.220|0.240|5.588|6.096|
|D2||0.038|0.042|0.965|1.067|
|D3||0.045|0.055|1.143|1.397|
|D4||0.044|0.052|1.118|1.321|
|E||0.380|0.410|9.652|10.414|
|E1||0.245|-|6.223|-|
|E2||0.355|0.375|9.017|9.525|
|E3||0.072|0.078|1.829|1.981|
|e||0.100 BSC||2.54 BSC||
|K||0.045|0.055|1.143|1.397|
|L||0.575|0.625|14.605|15.875|
|L1||0.090|0.110|2.286|2.794|
|L2||0.040|0.055|1.016|1.397|
|L3||0.050|0.070|1.270|1.778|
|L4||0.010 BSC||0.254 BSC||
|M||-|0.002|-|0.050|



Revison: 28-Oct-2024 

Document Number: 71198 

**1** 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Package Information** 

Vishay Siliconix 

www.vishay.com 

## **VERSION 2: FACILITY CODE = N** 

**==> picture [492 x 232] intentionally omitted <==**

**----- Start of picture text -----**<br>
E A E<br>c2 E1<br>Gauge<br>plane<br>L<br>L4<br>Plating b1, b3 Base metal<br>2x b2 J1 (b, b2)<br>e 2x b SECTION G - G and T - T<br>0.25 A B<br>OPTION 1 OPTION 2<br>2 leads 3 leads<br>c<br>L1 0°~ 8°<br>D1<br>D L3 A1<br>H<br>L2 (c)<br>c1<br>**----- End of picture text -----**<br>


|**DIM.**|**MIN.**|**MAX.**|
|---|---|---|
|A|4.36|4.56|
|A1|0|0.25|
|b|0.70|0.90|
|b1|0.51|0.89|
|b2|1.20|1.46|
|b3|1.17|1.37|
|c|0.38|0.694|
|c1|0.38|0.534|
|c2|1.19|1.34|
|D|8.60|9.00|
|D1|6.9|7.5|
|E|10.15|10.55|
|E1|8.1|8.7|
|e|2.54 BSC||
|H|15.0|15.6|
|L|1.9|2.5|
|L1|-|1.65|
|L2|-|1.78|
|L3|0.25 typ.||
|L4|4.78|5.28|
|J1|2.56|2.96|
|ECN: S24-1080-Rev. L, 28-Oct-2024<br>DWG: 5843|||



Document Number: 71198 

Revison: 28-Oct-2024 

**2** 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**AN826** 

## **Vishay Siliconix** 

## RECOMMENDED MINIMUM PADS FOR D[2] PAK:  3-Lead 

**==> picture [238 x 323] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.420<br>(10.668)<br>mil<br>0.145<br>(3.683)<br>0.135<br>(3.429)<br>0.200 0.050<br>| rt<br>— (5.080) (1.257)<br>Recommended Minimum Pads<br>Dimensions in Inches/(mm)<br>0.355 (9.017)<br>0.635<br>(16.129)<br>**----- End of picture text -----**<br>


Return to Index 

Document Number:   73397 11-Apr-05 

www.vishay.com 

**1** 

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## **Disclaimer** 

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 

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Document Number: 91000 

_**© 2024 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED**_ 

Revision: 01-Jul-2024 

**1** 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 



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- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/vishay/sum90330e-ge3/mosfet-n-ch-200v-35-1a-to-263/dp/2785450)
---

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> [Request a quote](https://novapart.co/quote/) — it's free and there's no
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