# Power MOSFET, N Channel, 300 V, 60 A, 0.033 ohm, MAX-247, Through Hole

![Product image](https://novapart.co/image/farnell:2629754/)

**URL**: https://novapart.co/products/STY60NK30Z/power-mosfet-n-channel-300-v-60-a-0033-ohm-max-247
**SKU**: STY60NK30Z
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €6.3200
**Stock**: 50+
**Lead Time**: 127 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:60A; Drain Source Voltage Vds:300V; On Resistance Rds(on):0.033ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3.75V

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | SuperMESH |
| Qualification | - |
| Power Dissipation | 450W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | MAX-247 |
| Drain Source Voltage Vds | 300V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 60A |
| Drain Source On State Resistance | 0.033ohm |
| Gate Source Threshold Voltage Max | 3.75V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2629754/)

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# **STY60NK30Z** 

# N-CHANNEL 300V - 0.033Ω - 60A Max247 Zener-Protected Su erMESH™Power MOSFET p 

|**TYPE**|**VDSS**|**RDS(on)**|**ID**|**Pw**|
|---|---|---|---|---|
|STY60NK30Z|300 V|< 0.045Ω|60 A|450 W|



- I TYPICAL RDS(on) = 0.033 Ω 

- I EXTREMELY HIGH dv/dt CAPABILITY 

- I 100% AVALANCHE TESTED 

- I GATE CHARGE MINIMIZED 

- I VERY LOW INTRINSIC CAPACITANCES 

- I VERY GOOD MANUFACTURING REPEATIBILITY 

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Max247<br>**----- End of picture text -----**<br>


## **DESCRIPTION** 

The SuperMESH™series is obtained through an extreme optimization of ST’s well established stripbased PowerMESH™layout. In addition to pushing on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the most demanding applications. Such series complements ST full range of high voltage MOSFETs including revolutionary MDmesh™products. 

## **APPLICATIONS** 

- I HIGH CURRENT, HIGH EFFICIENCY 

   - SWITCHING DC/DC CONVETERS FOR PLASMA TV’s 

## **INTERNAL SCHEMATIC DIAGRAM** 

**==> picture [69 x 82] intentionally omitted <==**

- I IDEAL FOR OFF-LINE POWER SUPPLIES, ADAPTORS AND PFC 

## **ORDERING INFORMATION** 

|**SALES TYPE**|**MARKING**|**PACKAGE**|**PACKAGING**|
|---|---|---|---|
|STY60NK30Z|Y60NK30Z|Max247|TUBE|



February 2004 

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**STY60NK30Z** 

## **ABSOLUTE MAXIMUM RATINGS** 

|**ABSOLUTE**|**MAXIMUM RATINGS**|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|VDS|Drain-source Voltage (VGS= 0)|300|V|
|VDGR|Drain-gate Voltage (RGS= 20 kΩ)|300|V|
|VGS|Gate- source Voltage|± 30|V|
|ID|Drain Current (continuous) at TC= 25°C|60|A|
|ID|Drain Current (continuous) at TC= 100°C|37.5|A|
|IDM(�)|Drain Current (pulsed)|240|A|
|PTOT|Total Dissipation at TC= 25°C|450|W|
||Derating Factor|3.57|W/°C|
|VESD(G-S)|Gate source ESD(HBM-C=100 pF, R=1.5 KΩ)|6000|V|
|dv/dt (1)|Peak Diode Recovery voltage slope|4.5|V/ns|
|Tj<br>Tstg|Operating Junction Temperature<br>Storage Temperature|-55 to 150|°C|



(�) Pulse width limited by safe operating area 

(1) ISD ≤60A, di/dt ≤200A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX. 

## **THERMAL DATA** 

|Rthj-case|Thermal Resistance Junction-case Max|Thermal Resistance Junction-case Max||0.28|0.28|0.28|°C/W|
|---|---|---|---|---|---|---|---|
|Rthj-amb<br>Tl|Thermal Resistance Junction-ambient Max<br>Maximum Lead Temperature For Soldering Purpose|||30<br>300|||°C/W<br>°C|
|**AVALANCHE CHARACTERISTICS**||||||||
|**Symbol**|**Parameter**|||**Max Value**|||**Unit**|
|IAR|Avalanche Current, Repetitive or Not-Repetitive<br>(pulse width limited by Tjmax)|||60|||A|
|EAS|Single Pulse Avalanche Energy<br>(starting Tj= 25 °C, ID= IAR, VDD= 50 V)|||0.7|||J|
|**GATE-SOURCE ZENER DIODE**||||||||
|**Symbol**|**Parameter**|**Test Conditions**||**Min.**|**Typ.**|**Max.**|**Unit**|
|BVGSO|Gate-Source Breakdown<br>Voltage|Igs=± 1mA (Open Drain)||30|||V|



## **PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES** 

The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components. 

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**STY60NK30Z** 

**ELECTRICAL CHARACTERISTICS** (TCASE =25°C UNLESS OTHERWISE SPECIFIED) ON/OFF 

|<br>ON/OFF|||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|V(BR)DSS|Drain-source<br>Breakdown Voltage|ID = 1 mA, VGS= 0|300|||V|
|IDSS|Zero Gate Voltage<br>Drain Current (VGS= 0)|VDS= Max Rating<br>VDS= Max Rating, TC= 125 °C|||1<br>50|µA<br>µA|
|IGSS|Gate-body Leakage<br>Current (VDS= 0)|VGS= ± 20 V|||±10|µA|
|VGS(th)|Gate Threshold Voltage|VDS= VGS, ID= 100 µA|3|3.75|4.5|V|
|RDS(on)|Static Drain-source On<br>Resistance|VGS= 10V, ID= 30 A||0.033|0.045|Ω|
|DYNAMIC|||||||
|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|gfs(1)|Forward Transconductance|VDS= 15 V,ID= 30 A||29||S|
|Ciss<br>Coss<br>Crss|Input Capacitance<br>Output Capacitance<br>Reverse Transfer<br>Capacitance|VDS= 25V, f = 1 MHz, VGS= 0||7200<br>1070<br>250||pF<br>pF<br>pF|
|Coss eq.(3)|Equivalent Output<br>Capacitance|VGS= 0V, VDS= 0V to 240V||880||pF|
|SWITCHING ON|||||||
|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|td(on)<br>tr|Turn-on Delay Time<br>Rise Time|VDD= 150 V, ID= 30 A<br>RG= 4.7Ω ,VGS= 10 V<br>(Resistive Load see, Figure 3)||50<br>90||ns<br>ns|
|Qg<br>Qgs<br>Qgd|Total Gate Charge<br>Gate-Source Charge<br>Gate-Drain Charge|VDD= 240 V, ID= 60 A,<br>VGS= 10 V||220<br>46<br>123||nC<br>nC<br>nC|
|SWITCHING OFF|||||||
|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|td(off)<br>tf|Turn-off Delay Time<br>Fall Time|VDD= 150 V, ID= 30 A<br>RG= 4.7Ω, VGS= 10 V<br>(Resistive Load see, Figure 3)||150<br>60||ns<br>ns|
|tr(Voff)<br>tf<br>tc|Off-voltage Rise Time<br>Fall Time<br>Cross-over Time|VDD= 240 V, ID= 60 A,<br>RG= 4.7Ω,VGS= 10V<br>(Inductive Load see, Figure 5)||40<br>65<br>110||ns<br>ns<br>ns|



## SOURCE DRAIN DIODE 

|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|ISD<br>ISDM(2)|Source-drain Current<br>Source-drain Current (pulsed)||||60<br>240|A<br>A|
|VSD(1)|Forward On Voltage|ISD= 60 A, VGS= 0|||1.6|V|
|trr<br>Qrr<br>IRRM|Reverse Recovery Time<br>Reverse Recovery Charge<br>Reverse Recovery Current|ISD= 60 A, di/dt = 100 A/µs<br>VR= 100 V, Tj= 150°C<br>(see test circuit, Figure 5)||475<br>6.4<br>27||ns<br>µC<br>A|



- Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. 

   2. Pulse width limited by safe operating area. 

3. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS. 

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**STY60NK30Z** 

## **Safe Operating Area** 

## **Output Characteristics** 

**Transconductance** 

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## **Thermal Impedance** 

## **Transfer Characteristics** 

## **Static Drain-source On Resistance** 

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**STY60NK30Z** 

## **Gate Charge vs Gate-source Voltage** 

**Normalized Gate Thereshold Voltage vs Temp.** 

## **Capacitance Variations** 

**Normalized On Resistance vs Temperature** 

**Source-drain Diode Forward Characteristics** 

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**STY60NK30Z** 

**Fig. 1:** Unclamped Inductive Load Test Circuit 

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**Fig. 3:** Switching Times Test Circuit For Resistive Load 

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**Fig. 2:** Unclamped Inductive Waveform 

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**Fig. 4:** Gate Charge test Circuit 

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**Fig. 5:** Test Circuit For Inductive Load Switching And Diode Recovery Times 

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**STY60NK30Z** 

## **Max247 MECHANICAL DATA** 

|**DIM.**||||||**mm**|**mm**|**mm**|||||||||**inch**|**inch**|**inch**|**inch**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||**MIN.**||||**TYP.**|||||**MAX.**|||**MIN.**||||**TYP.**||**MAX.**|
|A||4.70|||||||||5.30||||||||||
|A1||2.20|||||||||2.60||||||||||
|b||1.00|||||||||1.40||||||||||
|b1||2.00|||||||||2.40||||||||||
|b2||3.00|||||||||3.40||||||||||
|c||0.40|||||||||0.80||||||||||
|D||19.70|||||||||20.30||||||||||
|e||5.35|||||||||5.55||||||||||
|E||15.30|||||||||15.90||||||||||
|L||14.20|||||||||15.20||||||||||
|L1||3.70|||||||||4.30||||||||||
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**Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.** 

**The ST logo is a registered trademark of STMicroelectronics All other names are the property of their respective owners** 

**© 2004 STMicroelectronics - All Rights Reserved** 

**STMicroelectronics GROUP OF COMPANIES** 

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