# Power MOSFET, N Channel, 650 V, 96 A, 0.019 ohm, MAX-247, Through Hole

![Product image](https://novapart.co/image/farnell:2098403/)

**URL**: https://novapart.co/products/STY112N65M5/power-mosfet-n-channel-650-v-96-a-0019-ohm-max-247
**SKU**: STY112N65M5
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €19.6100
**Stock**: 10+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:96A; Drain Source Voltage Vds:650V; On Resistance Rds(on):0.019ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; Power

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 625W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | MAX-247 |
| Drain Source Voltage Vds | 650V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 96A |
| Drain Source On State Resistance | 0.019ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2098403/)

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## **STY112N65M5** 

## N-channel 650 V, 0.019 Ω, 96 A, MDmesh™ V Power MOSFET in Max247 package 

## **Datasheet — production data** 

## **Features** 

|**Order code**|**VDSS**<br>**@TjMAX**|**RDS(on) max**|**ID**|
|---|---|---|---|
|STY112N65M5|710 V|< 0.022Ω|96 A|



- Higher VDSS rating 

- Higher dv/dt capability 

- Excellent switching performance 

- Easy to drive 

- 100% avalanche tested 

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2 [3]<br>1<br>Max247<br>**----- End of picture text -----**<br>


## **Applications** 

- Switching applications 

## **Figure 1. Internal schematic diagram** 

## **Description** 

This device is an N-channel MDmesh™ V Power MOSFET based on an innovative proprietary vertical process technology, which  is combined with STMicroelectronics’ well-known PowerMESH™ horizontal layout structure. The resulting product has extremely low onresistance, which is unmatched among siliconbased Power MOSFETs, making it especially suitable for applications which require superior power density and outstanding efficiency. 

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## **Table 1. Device summary** 

|**Order code**|**Marking**|**Package**|**Packaging**|
|---|---|---|---|
|STY112N65M5|112N65M5|Max247|Tube|



1/ 

May 2012 

Doc ID 15321 Rev 3 

This is information on a product in full production. 

_www.st.com_ 

**Contents** 

**STY112N65M5** 

|**Contents**|**Contents**|
|---|---|
|**1**|**Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3**|
|**2**|**Electrical characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4**|
||2.1<br>Electrical characteristics (curves)         . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6|
|**3**|**Test circuits     . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8**|
|**4**|**Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9**|
|**5**|**Revision history  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11**|



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**STY112N65M5** 

**Electrical ratings** 

## **1 Electrical ratings** 

## **Table 2. Absolute maximum ratings** 

|**Table 2.**|**Absolute maximum ratings**|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|VGS|Gate- source voltage|± 25|V|
|ID|Drain current (continuous) at TC= 25 °C|96|A|
|ID|Drain current (continuous) at TC= 100 °C|61|A|
|IDM<br>(1)|Drain current (pulsed)|384|A|
|PTOT|Total dissipation at TC= 25 °C|625|W|
|IAR|Max current during repetitive or single pulse avalanche<br>(pulse width limited by TJMAX)|17|A|
|EAS|Single pulse avalanche energy<br>(starting Tj= 25°C, ID= IAR, VDD= 50V)|2400|mJ|
|dv/dt(2)|Peak diode recovery voltage slope|15|V/ns|
|Tstg|Storage temperature|- 55 to 150|°C|
|Tj|Max. operating junction temperature|150|°C|



1. Pulse width limited by safe operating area. 

2. ISD ≤   96 A, di/dt = 400 A/µs, VDD = 400 V, peak VDS < V(BR)DSS. 

## **Table 3. Thermal data** 

|**Table 3.**|**Thermal data**|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|Rthj-case|Thermal resistance junction-case max|0.2|°C/W|
|Rthj-amb|Thermal resistance junction-ambient max|30|°C/W|
|Tl|Maximum lead temperature for soldering purpose|300|°C|



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**STY112N65M5** 

**Electrical characteristics** 

## **2 Electrical characteristics** 

(TC = 25 °C unless otherwise specified) 

## **Table 4. On /off states** 

|**Table 4.**|**On /off states**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|V(BR)DSS|Drain-source<br>breakdown voltage|ID= 1 mA, VGS= 0|650|||V|
|IDSS|Zero gate voltage<br>drain current (VGS= 0)|VDS= 650 V<br>VDS= 650 V, TC=125 °C|||10<br>100|µA<br>µA|
|IGSS|Gate-body leakage<br>current (VDS= 0)|VGS= ± 25 V|||±100|nA|
|VGS(th)|Gate threshold voltage|VDS= VGS, ID= 250 µA|3|4|5|V|
|RDS(on)|Static drain-source on<br>resistance|VGS= 10 V, ID= 48 A||0.019|0.022|Ω|



## **Table 5. Dynamic** 

|**Table 5.**|**Dynamic**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|Ciss<br>Coss<br>Crss|Input capacitance<br>Output capacitance<br>Reverse transfer<br>capacitance|VDS= 100 V, f = 1 MHz,<br>VGS= 0|-|16870<br>365<br>7|-|pF<br>pF<br>pF|
|Co(tr)<br>(1)|Equivalent<br>capacitance time<br>related|VGS= 0, VDS= 0 to 520 V|-|1333|-|pF|
|Co(er)<br>(2)|Equivalent<br>capacitance energy<br>related|VGS= 0, VDS= 0 to 520 V|-|350|-|pF|
|RG|Intrinsic gate<br>resistance|f = 1 MHz open drain|-|1.26|-|Ω|
|Qg<br>Qgs<br>Qgd|Total gate charge<br>Gate-source charge<br>Gate-drain charge|VDD= 520 V, ID= 48 A,<br>VGS= 10 V<br>(see_Figure 15_)|-|350<br>97<br>118|-|nC<br>nC<br>nC|



1. Co(tr) is a constant capacitance value that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS. 

2. Co(er) is a constant capacitance value that gives the same stored energy as Coss while VDS is rising from 0 to 80% VDSS. 

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**STY112N65M5** 

**Electrical characteristics** 

## **Table 6. Switching times** 

|**Table 6.**|**Switching times**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|td(v)<br>tr(v)<br>tf(i)<br>tc(off)|Voltage delay time<br>Voltage rise time<br>Current fall time<br>Crossing time|VDD= 400 V, ID= 64 A,<br>RG= 4.7Ω,VGS= 10 V<br>(see_Figure 16_)<br>(see_Figure 19_)|-|267<br>79<br>53<br>140|-|ns<br>ns<br>ns<br>ns|



## **Table 7. Source drain diode** 

|**Table 7.**|**Source drain diode**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|ISD<br>ISDM (1)|Source-drain current<br>Source-drain current (pulsed)||-||96<br>384|A<br>A|
|VSD (2)|Forward on voltage|ISD= 96 A, VGS= 0|-||1.5|V|
|trr<br>Qrr<br>IRRM|Reverse recovery time<br>Reverse recovery charge<br>Reverse recovery current|ISD= 96 A, di/dt = 100 A/µs<br>VDD= 100 V (see_Figure 16_)|-|570<br>17<br>60||ns<br>µC<br>A|
|trr<br>Qrr<br>IRRM|Reverse recovery time<br>Reverse recovery charge<br>Reverse recovery current|ISD= 96 A, di/dt = 100 A/µs<br>VDD= 100 V, Tj= 150 °C<br>(see_Figure 16_)|-|695<br>26<br>73||ns<br>µC<br>A|



1. Pulse width limited by safe operating area 

2. Pulsed: pulse duration = 300 µs, duty cycle 1.5% 

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**STY112N65M5** 

**Electrical characteristics** 

## **2.1 Electrical characteristics (curves)** 

## **Figure 2. Safe operating area** 

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ID AM08892v1<br>(A) Tj=150°C<br>Tc=25°C<br>Single pulse<br>100<br>100µs<br>10 1ms<br>10ms<br>1<br>0.1<br>0.1 1 10 100 VDS(V)<br>Operation in this area is<br>Limited by max RDS(on)<br>**----- End of picture text -----**<br>


## **Figure 4. Output characteristics** 

## **Figure 3. Thermal impedance** 

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AM09125v1<br>K<br>δ=0.5<br>0.2<br>0.1<br>0.05<br>10-1<br>0.02<br>0.01 Zth=k Rthj-c<br>δ=tp/τ<br>Single pulse<br>tp<br>τ<br>10-2<br>10-4 10-3 10-2 10-1 tp [(s)]<br>**----- End of picture text -----**<br>


## **Figure 5. Transfer characteristics** 

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AM08893v1 AM08894v1<br>ID (A) ID<br>VGS=10V (A) VDS=30V<br>300 300<br>7V<br>250 250<br>200 200<br>6V<br>150 150<br>100 100<br>50 50<br>5V<br>0 0<br>0 5 10 15 VDS(V) 0 2 4 6 8 10 VGS(V)<br>**----- End of picture text -----**<br>


## **Figure 6. Normalized VDS vs temperature** 

## **Figure 7. Static drain-source on resistance** 

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VDS AM10399v1 RDS(on) AM08896v1<br>(norm) (Ω)<br>1.08<br>ID = 1mA 0.022 VGS=10V<br>1.06<br>1.04<br>0.020<br>1.02<br>1.00<br>0.018<br>0.98<br>0.96 0.016<br>0.94<br>0.92 0.014<br>-50 -25 0 25 50 75 100 TJ(°C) 0 20 40 60 80 ID(A)<br>**----- End of picture text -----**<br>


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**STY112N65M5** 

**Electrical characteristics** 

## **Figure 8. Gate charge vs gate-source voltage Figure 9. Capacitance variations** 

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VGS AM08897v1 � ���������<br>VDS (V)<br>(V) VDS ����<br>VDD=520V<br>12<br>ID=48A 500 ������<br>10 ����<br>400 �����<br>8<br>300 ����<br>6 ����<br>200 ���<br>4<br>100 ��<br>2 ����<br>0 0 �<br>0 100 200 300 400 Qg(nC) ��� � �� ��� ������<br>Figure 10. Normalized gate threshold voltage  Figure 11. Normalized on resistance vs<br>vs temperature temperature<br>VGS(th) AM08899v1 RDS(on) AM08900v1<br>(norm) ID=250µA (norm) VGS=10V<br>1.10 2.1<br>1.00 1.7<br>0.90 1.3<br>0.9<br>0.80<br>0.70 0.5<br>-50 -25 0 25 50 75 100 TJ(°C) -50 -25 0 25 50 75 100 TJ(°C)<br>**----- End of picture text -----**<br>


**Figure 12. Output capacitance stored energy** 

**Figure 13. Switching losses vs gate resistance (1)** 

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**----- Start of picture text -----**<br>
Eoss AM08901v1 E (μJ) AM08902v1<br>(µJ) Eoff<br>ID=64A<br>70<br>6000 VDD=400V<br>TJ=25°C<br>60<br>5000<br>50<br>4000 Eon<br>40<br>3000<br>30<br>2000<br>20<br>10 1000<br>0 0<br>0 100 200 300 400 500 600 VDS(V) 0 10 20 30 40 RG(Ω)<br>**----- End of picture text -----**<br>


1. Eon including reverse recovery of a SiC diode 

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**STY112N65M5** 

**Test circuits** 

## **3 Test circuits** 

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Figure 14. Switching times test circuit for  Figure 15. Gate charge test circuit<br>resistive load<br>VDD<br>12V 47kΩ<br>1kΩ<br>100nF<br>RL 2200 3.3<br>μF μF<br>VDD IG=CONST<br>VD Vi=20V=VGMAX 100Ω D.U.T.<br>VGS<br>2200<br>RG D.U.T. μF 2.7kΩ VG<br>PW<br>47kΩ<br>1kΩ<br>PW<br>AM01468v1 AM01469v1<br>eA et<br>Figure 16. Test circuit for inductive load  Figure 17. Unclamped inductive load test<br>switching and diode recovery times circuit<br>L<br>A A A<br>D<br>G D.U.T. FASTDIODE L=100μH VD 2200 3.3<br>S B 3.3 1000 μF μF VDD<br>25 Ω B B D μF μF VDD ID<br>G<br>RG S<br>Vi D.U.T.<br>Pw<br>AM01470v1 AM01471v1<br>Seinen<br>Figure 18. Unclamped inductive waveform Figure 19. Switching time waveform<br>**----- End of picture text -----**<br>


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V(BR)DSS<br>VD<br>IDM<br>—<br>ID<br>VDD VDD<br>AM01472v1<br>**----- End of picture text -----**<br>


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**STY112N65M5** 

**Package mechanical data** 

## **4 Package mechanical data** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 

**Table 8. Max247 mechanical data** 

|**Dim.**|**mm**|**mm**|**mm**|
|---|---|---|---|
||**Min.**|**Typ.**|**Max.**|
|A|4.70||5.30|
|A1|2.20||2.60|
|b|1.00||1.40|
|b1|2.00||2.40|
|b2|3.00||3.40|
|c|0.40||0.80|
|D|19.70||20.30|
|e|5.35||5.55|
|E|15.30||15.90|
|L|14.20||15.20|
|L1|3.70||4.30|



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**STY112N65M5** 

**Package mechanical data** 

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**----- Start of picture text -----**<br>
Figure 20. Max247 drawing<br>**----- End of picture text -----**<br>


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0094330_Rev_D<br>**----- End of picture text -----**<br>


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**Revision history** 

## **5 Revision history** 

**Table 9. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|20-Jan-2009|1|First release.|
|20-May-2011|2|Document status pomoted from preliminary data to datasheet.|
|03-May-2012|3|_Section 4: Package mechanical data_has been updated.|



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