# Power MOSFET, N Channel, 800 V, 6.2 A, 1.5 ohm, TO-247, Through Hole

![Product image](https://novapart.co/image/farnell:9936041/)

**URL**: https://novapart.co/products/STW8NK80Z/power-mosfet-n-channel-800-v-62-a-15-ohm-to-247
**SKU**: STW8NK80Z
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.6890
**Stock**: 10+

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:6.2A; Drain Source Voltage Vds:800V; On Resistance Rds(on):1.5ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3.75V; Power Dissipatio

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 140W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-247 |
| Drain Source Voltage Vds | 800V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 6.2A |
| Drain Source On State Resistance | 1.5ohm |
| Gate Source Threshold Voltage Max | 3.75V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:9936041/)

**STP8NK80Z - STP8NK80ZFP STW8NK80Z** N-channel 800V - 1.3Ω - 6.2A - TO-220 /TO-220FP/TO-247 Zener-protected SuperMESH™ Power MOSFET **Features Type VDSS RDS(on) ID** STP8NK80Z 800 V < 1.5 Ω 6.2 A 3 2 STP8NK80ZFP 800 V < 1.5 Ω 6.2 A 1 **TO-220 TO-220FP** STW8NK80Z 800 V < 1.5 Ω 6.2 A ■ Extremely high dv/dt capability ■ 100% avalanche tested ■ Gate charge minimized ■ Very low intrinsic capacitances » **TO-247** ~~a~~ ■ Very good manufacturing repeatability ~~N~~ **Description Figure 1. Internal schematic diagram** The SuperMESH™ series is obtained through an extreme optimization of ST’s well established strip-based PowerMESH™ layout. In addition to pushing on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the most demanding applications. Such series complements ST full range of high voltage MOSFETs including revolutionary MDmesh™ products. 

## **Application** 

■ Switching applications **Table 1. Device summary Order codes Marking Package Packaging** STP8NK80Z P8NK80Z TO-220 Tube STP8NK80ZFP P8NK80ZFP TO-220FP Tube STW8NK80Z W8NK80Z TO-247 Tube ~~——~~ 

1/15 

July 2007 

Rev 5 

_www.st.com_ 

|**Contents**|**STP8NK80Z - STP8NK80ZFP - STW8NK80Z**|
|---|---|
|**Contents**||
|**1**|**Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3**|
|**2**|**Electrical characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4**|
||2.1<br>Electrical characteristics (curves)         . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6|
|**3**|**Test circuit   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9**|
|**4**|**Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10**|
|**5**|**Revision history  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14**|



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**Electrical ratings** 

## **1 Electrical ratings** 

## **Table 2. Absolute maximum ratings** 

|**Table 2.**|**Absolute maximum ratings**||||
|---|---|---|---|---|
|**Symbol**|**Parameter**|**Value**||**Unit**|
|||**TO-220 - TO-247**|**TO-220FP**||
|VDS|Drain-source voltage (VGS= 0)|800||V|
|VGS|Gate- source voltage|± 30||V|
|ID|Drain current (continuous) at TC= 25°C|6.2|6.2(1)|A|
|ID|Drain current (continuous) at TC= 100°C|3.9|3.9(1)|A|
|IDM<br>(2)|Drain current (pulsed)|24.8|24.8(1)|A|
|PTOT|Total dissipation at TC= 25°C|140|30|W|
||Derating factor|1.12|0.24|W/°C|
|VESD(G-S)|Gate source ESD(HBM-C=100pF, R=1.5KΩ)|4000||V|
|dv/dt<br>(3)|Peak diode recovery voltage slope|4.5||V/ns|
|VISO|Insulation withstand voltage (RMS) from all<br>three leads to external heat sink<br>(t=1s; Tc= 25°C)|-|2500|V|
|Tj<br>Tstg|Max operating Junction temperature<br>Storage temperature|-55 to 150||°C|



1. Limited only by maximum temperature allowed 

2. Pulse width limited by safe operating area 

3. ISD ≤ 6.2 A, di/dt ≤ 200A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX. 

## **Table 3. Thermal data** 

|**Table 3.**|**Thermal data**|||||
|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|||**Unit**|
|||**TO-220**|**TO-220FP**|**TO-247**||
|Rthj-case|Thermal resistance junction-case max|0.89|4.2|0.89|°C/W|
|Rthj-amb|Thermal resistance junction-ambient max|62.5||50|°C/W|
|Tl|Maximum lead temperature for soldering<br>purpose|300|||°C|



## **Table 4. Avalanche characteristics** 

|**Table 4.**|**Avalanche characteristics**|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|IAR|Avalanche current, repetitive or not-<br>repetitive (pulse width limited by Tj Max)|6.2|A|
|EAS|Single pulse avalanche energy<br>(starting Tj=25°C, Id=Iar, Vdd=50V)|300|mJ|



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**Electrical characteristics** 

## **2 Electrical characteristics** 

(TCASE=25°C unless otherwise specified) 

## **Table 5. On/off states** 

|**Table 5.**|**On/off states**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|V(BR)DSS|Drain-source<br>Breakdown voltage|ID=1mA, VGS= 0|800|||V|
|IDSS|Zero gate voltage<br>Drain current (VGS= 0)|VDS= Max rating<br>VDS= Max rating, @125°C|||1<br>50|µA<br>µA|
|IGSS|Gate-body leakage<br>Current (VDS= 0)|VGS= ± 20 V|||± 10|µA|
|VGS(th)|Gate threshold voltage|VDS= VGS, ID= 100 µA|3|3.75|4.5|V|
|RDS(on)|Static drain-source on<br>resistance|VGS= 10 V, ID= 3.1 A||1.3|1.5|Ω|



## **Table 6. Dynamic** 

|**Table 6.**|**Dynamic**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|gfs<br>(1)|Forward transconductance|VDS= 15v, ID= 3.1 A||5.2||S|
|Ciss<br>Coss<br>Crss|Input capacitance<br>Output capacitance<br>Reverse transfer capacitance|VDS= 25 V, f = 1 MHz,<br>VGS= 0||1320<br>143<br>27||pF<br>pF<br>pF|
|Coss eq.<br>(2)|Equivalent output<br>capacitance|VDS=0V, VDS= 0V to 640V||58||pF|
|td(on)<br>tr<br>tr(off)<br>tr|Turn-on delay time<br>Rise time<br>Turn-off delay time<br>Fall time|VDD= 400 V, ID= 3.1 A,<br>RG= 4.7Ω,VGS= 10 V<br>(see_Figure 21_)||17<br>30<br>48<br>28||ns<br>ns<br>ns<br>ns|
|Qg<br>Qgs<br>Qgd|Total gate charge<br>Gate-source charge<br>Gate-drain charge|VDD= 640 V, ID= 6.2 A,<br>VGS= 10 V||46<br>8.5<br>25||nC<br>nC<br>nC|
|tr(Voff)<br>tr<br>tc|Off-voltage rise time<br>Fall time<br>Cross-over time|VDD= 640 V, ID= 6.2 A,<br>RG= 4.7Ω,VGS= 10 V<br>(see_Figure 23_)||9<br>9<br>18||ns<br>ns<br>ns|



1. Pulsed: pulse duration=300µs, duty cycle 1.5% 

2. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS. 

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**STP8NK80Z - STP8NK80ZFP - STW8NK80Z** 

**Electrical characteristics** 

## **Table 7. Source drain diode** 

|**Table 7.**|**Source drain diode**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|ISD<br>ISDM<br>(1)|Source-drain current<br>Source-drain current (pulsed)||||6.2<br>24.8|A<br>A|
|VSD<br>(2)|Forward on voltage|ISD= 6.2 A, VGS= 0|||1.6|V|
|trr<br>Qrr<br>IRRM|Reverse recovery time<br>Reverse recovery charge<br>Reverse recovery current|ISD= 6.2 A, di/dt = 100 A/µs<br>VDD= 50 V, Tj = 150°C<br>(see_Figure 23_)||460<br>2990<br>13||ns<br>nC<br>A|



1. Pulsed: pulse duration=300µs, duty cycle 1.5% 

2. Pulse width limited by safe operating area 

|**Table 8.**<br>**Gate-source zener diode**|**Table 8.**<br>**Gate-source zener diode**|**Table 8.**<br>**Gate-source zener diode**|**Table 8.**<br>**Gate-source zener diode**|**Table 8.**<br>**Gate-source zener diode**|**Table 8.**<br>**Gate-source zener diode**|**Table 8.**<br>**Gate-source zener diode**|
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|BVGSO<br>(1)|Gate-source breakdown voltage|Igs=± 1mA (Open Drain)|30|||V|



1. The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components. 

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**Electrical characteristics** 

## **2.1 Electrical characteristics (curves)** 

**Figure 2. Safe operating area for TO-220** 

**Figure 3. Thermal impedance for TO-220** 

**==> picture [155 x 153] intentionally omitted <==**

**==> picture [149 x 149] intentionally omitted <==**

**Figure 4. Safe operating area for TO-220FP** 

**Figure 5. Thermal impedance for TO-220FP** 

**==> picture [155 x 153] intentionally omitted <==**

**==> picture [149 x 149] intentionally omitted <==**

**Figure 6. Safe operating area for TO-247** 

**Figure 7. Thermal impedance for TO-247** 

**==> picture [155 x 152] intentionally omitted <==**

**==> picture [149 x 149] intentionally omitted <==**

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**Electrical characteristics** 

## **Figure 8. Output characteristics** 

**==> picture [148 x 149] intentionally omitted <==**

**Figure 10. Transconductance** 

**==> picture [150 x 149] intentionally omitted <==**

**Figure 12. Gate charge vs gate-source voltage** 

**==> picture [150 x 151] intentionally omitted <==**

## **Figure 9. Transfer characteristics** 

**==> picture [151 x 151] intentionally omitted <==**

**Figure 11. Static drain-source on resistance** 

**==> picture [149 x 149] intentionally omitted <==**

**Figure 13. Capacitance variations** 

**==> picture [149 x 149] intentionally omitted <==**

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**STP8NK80Z - STP8NK80ZFP - STW8NK80Z** 

**Electrical characteristics** 

**Figure 14. Normalized gate threshold voltage vs temperature** 

**==> picture [149 x 149] intentionally omitted <==**

**Figure 16. Source-drain diode forward characteristic** 

**==> picture [147 x 147] intentionally omitted <==**

**Figure 15. Normalized on resistance vs temperature** 

**==> picture [147 x 147] intentionally omitted <==**

**Figure 17. Normalized BVDSS vs temperature** 

**==> picture [149 x 149] intentionally omitted <==**

**Figure 18. Maximum avalanche energy vs temperature** 

**==> picture [147 x 147] intentionally omitted <==**

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**Test circuit** 

## **3 Test circuit** 

**Figure 19. Unclamped inductive load test circuit** 

**Figure 20. Unclamped inductive waveform** 

**==> picture [192 x 127] intentionally omitted <==**

**==> picture [179 x 147] intentionally omitted <==**

**Figure 21. Switching times test circuit for resistive load** 

**Figure 22. Gate charge test circuit** 

**==> picture [443 x 143] intentionally omitted <==**

**Figure 23. Test circuit for inductive load switching and diode recovery times** 

**==> picture [208 x 122] intentionally omitted <==**

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**Package mechanical data** 

## **4 Package mechanical data** 

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: _www.st.com_ 

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**Package mechanical data** 

## **TO-220 mechanical data** 

|**Dim**|**mm**|**mm**|**mm**|**inch**|**inch**|**inch**|
|---|---|---|---|---|---|---|
||**Min**|**Typ**|**Max**|**Min**|**Typ**|**Max**|
|A|4.40||4.60|0.173||0.181|
|b|0.61||0.88|0.024||0.034|
|b1|1.14||1.70|0.044||0.066|
|c|0.49||0.70|0.019||0.027|
|D|15.25||15.75|0.6||0.62|
|D1||1.27|||0.050||
|E|10||10.40|0.393||0.409|
|e|2.40||2.70|0.094||0.106|
|e1|4.95||5.15|0.194||0.202|
|F|1.23||1.32|0.048||0.051|
|H1|6.20||6.60|0.244||0.256|
|J1|2.40||2.72|0.094||0.107|
|L|13||14|0.511||0.551|
|L1|3.50||3.93|0.137||0.154|
|L20||16.40|||0.645||
|L30||28.90|||1.137||
|∅P|3.75||3.85|0.147||0.151|
|Q|2.65||2.95|0.104||0.116|



**==> picture [286 x 241] intentionally omitted <==**

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**Package mechanical data** 

**==> picture [405 x 566] intentionally omitted <==**

**----- Start of picture text -----**<br>
TO-220FP MECHANICAL DATA<br>mm. inch<br>DIM.<br>MIN. TYP MAX. MIN. TYP. MAX.<br>A 4.4 4.6 0.173 0.181<br>B 2.5 2.7 0.098 0.106<br>D 2.5 2.75 0.098 0.108<br>E 0.45 0.7 0.017 0.027<br>F 0.75 1 0.030 0.039<br>F1 1.15 1.7 0.045 0.067<br>F2 1.15 1.7 0.045 0.067<br>G 4.95 5.2 0.195 0.204<br>G1 2.4 2.7 0.094 0.106<br>H 10 10.4 0.393 0.409<br>L2 16 0.630<br>L3 28.6 30.6 1.126 1.204<br>L4 9.8 10.6 .0385 0.417<br>L5 2.9 3.6 0.114 0.141<br>L6 15.9 16.4 0.626 0.645<br>L7 9 9.3 0.354 0.366<br>Ø 3 3.2 0.118 0.126<br>L3<br>L6<br>L7<br>1 2 3<br>L5<br>L2 L4<br>F1 F<br>G<br>F2<br>E<br>A<br>D<br>B<br>G1<br>H<br>**----- End of picture text -----**<br>


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**Package mechanical data** 

|||||||||||**inch**<br>**TYP.**<br>**MAX.**<br>0.20<br>0.102<br>0.055<br>0.094<br>0.134<br>0.03<br>0.793<br>0.620<br>0.214<br>0.582<br>0.17<br>0.728<br>0.143<br>0.216<br>0.216|**inch**<br>**TYP.**<br>**MAX.**<br>0.20<br>0.102<br>0.055<br>0.094<br>0.134<br>0.03<br>0.793<br>0.620<br>0.214<br>0.582<br>0.17<br>0.728<br>0.143<br>0.216<br>0.216|
|---|---|---|---|---|---|---|---|---|---|---|---|
|||||**T**|**O-247 MECHANICAL DATA**|||||||
|||||||||||||
||**DIM.**||||**mm.**|||||**inch**||
|||**M**|**I**|**N.**<br>|**TYP**||**MAX.**||**MIN.**|**TYP.**|**MAX.**|
||A|4|.8|5|||5.15||0.19||0.20|
||A1|2|.2|0|||2.60||0.086||0.102|
||b||1.|0|||1.40||0.039||0.055|
||b1||2.|0|||2.40||0.079||0.094|
||b2||3.|0|||3.40||0.118||0.134|
||c|0|.4|0|||0.80||0.015||0.03|
||D|1|9.|85|||20.15||0.781||0.793|
||E|1|5.|45|||15.75||0.608||0.620|
||e|||5|.45|||||0.214||
||L|1|4.|20|||14.80||0.560||0.582|
||L1|3|.7|0|||4.30||0.14||0.17|
||L2|||1|8.50|||||0.728||
||øP|3|.5|5|||3.65||0.140||0.143|
||øR|4|.5|0|||5.50||0.177||0.216|
||S|||5|.50|||||0.216||
|||||||||||||
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**Revision history** 

## **5 Revision history** 

## **Table 9. Revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|09-Sep-2004|2|Complete version|
|17-Aug-2006|3|New template, no content change|
|20-Apr-2007|4|Typo errors on_Table 6_|
|02-Jul-2007|5|_Table 2_has been updated|



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15/15 



## Links

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