# Power MOSFET, N Channel, 650 V, 58 A, 0.037 ohm, TO-247, Through Hole

![Product image](https://novapart.co/image/farnell:2341734/)

**URL**: https://novapart.co/products/STW69N65M5/power-mosfet-n-channel-650-v-58-a-0037-ohm-to-247
**SKU**: STW69N65M5
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €5.3200
**Stock**: 10+
**Lead Time**: 126 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:58A; Drain Source Voltage Vds:650V; On Resistance Rds(on):0.037ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 330W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-247 |
| Drain Source Voltage Vds | 650V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 58A |
| Drain Source On State Resistance | 0.037ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2341734/)

## **STFW69N65M5 STW69N65M5** N-channel 650 V, 0.037 Ω typ., 58 A MDmesh™ V Power MOSFET in TO-3PF and TO-247 packages 

**Datasheet** − **production data** 

## **Features** 

|**Order codes**|**VDSS@ TJmax **|**RDS(on) max**|**ID**|
|---|---|---|---|
|STFW69N65M5|710 V|< 0.045Ω|58 A|
|STW69N65M5||||



- Worldwide best R * area DS(on) 

- Higher VDSS rating and high dv/dt capability 

- Excellent switching performance 

- 100% avalanche tested 

**==> picture [196 x 105] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>3<br>3<br>2 2<br>1 1<br>TO-3PF TO-247<br>**----- End of picture text -----**<br>


## **Applications** 

- Switching applications 

## **Description** 

These devices are N-channel MDmesh™ V Power MOSFETs based on an innovative proprietary vertical process technology, which  is combined with STMicroelectronics’ well-known PowerMESH™ horizontal layout structure. The resulting product has extremely low onresistance, which is unmatched among siliconbased Power MOSFETs, making it especially suitable for applications which require superior power density and outstanding efficiency. 

## **Figure 1. Internal schematic diagram** 

**==> picture [208 x 161] intentionally omitted <==**

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**Table 1. Device summary** 

|**Order codes**|**Marking**|**Package**|**Packaging**|
|---|---|---|---|
|STFW69N65M5|69N65M5|TO-3PF|Tube|
|STW69N65M5||TO-247||



_www.st.com_ 

September 2012 

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Doc ID 022906 Rev 2 

This is information on a product in full production. 

|**Contents**|**STFW69N65M5, STW69N65M5**|
|---|---|
|**Contents**||
|**1**|**Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3**|
|**2**|**Electrical characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4**|
||2.1<br>Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6|
|**3**|**Test circuits     . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9**|
|**4**|**Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10**|
|**5**|**Revision history  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15**|



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**Electrical ratings** 

## **1 Electrical ratings** 

## **Table 2. Absolute maximum ratings** 

|**Table 2.**|**Absolute maximum ratings**||||
|---|---|---|---|---|
|**Symbol**|**Parameter**|**Value**||**Unit**|
|||**TO-3PF**|**TO-247**||
|VGS|Gate-source voltage|± 25||V|
|ID|Drain current (continuous) at TC= 25 °C|58(1)|58|A|
|ID|Drain current (continuous) at TC= 100 °C|36.5(1)|36.5|A|
|IDM<br>(2)|Drain current (pulsed)|232(1)|232|A|
|PTOT|Total dissipation at TC= 25 °C|79|330|W|
|dv/dt(3)|Peak diode recovery voltage slope|15||V/ns|
|VISO|Insulation withstand voltage (RMS) from all<br>three leads to external heat sink<br>(t=1s; Tc=25°C)|3500||V|
|Tstg|Storage temperature|- 55 to 150||°C|
|Tj|Max. operating junction temperature|150||°C|



1. Limited by maximum junction temperature. 

2. Pulse width limited by safe operating area 

3. ISD ≤  58 A, di/dt  ≤ 400 A/µs; VDS peak < V(BR)DSS, VDD=400 V 

## **Table 3. Thermal data** 

|**Table 3.**|**Thermal data**||||
|---|---|---|---|---|
|**Symbol**|**Parameter**|**Value**||**Unit**|
|||**TO-3PF**|**TO-247**||
|Rthj-case|Thermal resistance junction-case max|1.58|0.38|°C/W|
|Rthj-amb|Thermal resistance junction-ambient max|50||°C/W|



## **Table 4. Avalanche characteristics** 

|**Table 4.**|**Avalanche characteristics**|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|IAR|Avalanche current, repetetive or not repetetive<br>(pulse width limited by Tjmax)|12|A|
|EAS|Single pulse avalanche energy (starting tj=25°C,<br>Id= IAR; Vdd=50)|1410|mJ|



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**Electrical characteristics** 

## **2 Electrical characteristics** 

(TC = 25 °C unless otherwise specified) 

## **Table 5. On /off states** 

|**Table 5.**|**On /off states**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|V(BR)DSS|Drain-source<br>breakdown voltage|ID= 1 mA, VGS= 0|650|||V|
|IDSS|Zero gate voltage<br>drain current (VGS= 0)|VDS= 650 V<br>VDS= 650 V, TC=125 °C|||1<br>100|µA<br>µA|
|IGSS|Gate-body leakage<br>current (VDS= 0)|VGS= ± 25 V|||± 100|nA|
|VGS(th)|Gate threshold voltage|VDS= VGS, ID= 250 µA|3|4|5|V|
|RDS(on)|Static drain-source<br>on-resistance|VGS= 10 V, ID= 29 A||0.037|0.045|Ω|



## **Table 6. Dynamic** 

|**Table 6.**|**Dynamic**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|Ciss<br>Coss<br>Crss|Input capacitance<br>Output capacitance<br>Reverse transfer<br>capacitance|VDS= 100 V, f = 1 MHz,<br>VGS= 0|-|6420<br>170<br>11|-|pF<br>pF<br>pF|
|Co(tr)<br>(1)|Equivalent<br>capacitance time<br>related|VDS= 0 to 520 V, VGS= 0|-|536|-|pF|
|Co(er)<br>(2)|Equivalent<br>capacitance energy<br>related||-|146|-|pF|
|RG|Intrinsic gate<br>resistance|f = 1 MHz open drain|-|1.2|-|Ω|
|Qg<br>Qgs<br>Qgd|Total gate charge<br>Gate-source charge<br>Gate-drain charge|VDD= 520 V, ID= 29 A,<br>VGS= 10 V<br>(see_Figure 18_)|-|143<br>38<br>64|-|nC<br>nC<br>nC|



1. Time related is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS 

2. Energy related is defined as a constant equivalent capacitance giving the same stored energy as Coss when VDS increases from 0 to 80% VDSS 

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**Electrical characteristics** 

**Table 7. Switching times** 

|**Table 7.**|**Switching times**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max**|**Unit**|
|td(v)<br>tr(v)<br>tf(i)<br>tc(off)|Voltage delay time<br>Voltage rise time<br>Current fall time<br>Crossing time|VDD= 400 V, ID= 38 A,<br>RG= 4.7Ω,VGS= 10 V<br>(see_Figure 19_and<br>_Figure 22_)|-|102<br>13.5<br>10<br>19|-|ns<br>ns<br>ns<br>ns|



## **Table 8. Source drain diode** 

|**Table 8.**|**Source drain diode**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|ISD<br>ISDM (1)|Source-drain current<br>Source-drain current (pulsed)||-||58<br>232|A<br>A|
|VSD (2)|Forward on voltage|ISD= 58 A, VGS= 0|-||1.5|V|
|trr<br>Qrr<br>IRRM|Reverse recovery time<br>Reverse recovery charge<br>Reverse recovery current|ISD= 58 A, di/dt = 100 A/µs<br>VDD= 100 V (see_Figure 19_)|-|480<br>11<br>46||ns<br>µC<br>A|
|trr<br>Qrr<br>IRRM|Reverse recovery time<br>Reverse recovery charge<br>Reverse recovery current|ISD= 58 A, di/dt = 100 A/µs<br>VDD= 100 V, Tj= 150 °C<br>(see_Figure 19_)|-|592<br>16<br>53||ns<br>µC<br>A|



1. Pulse width limited by safe operating area. 

2. Pulsed: pulse duration = 300 µs, duty cycle 1.5% 

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**Electrical characteristics** 

## **2.1 Electrical characteristics (curves)** 

**Figure 2. Safe operating area  for TO-3PF** 

## **Figure 3. Thermal impedance for TO-3PF** 

**==> picture [173 x 167] intentionally omitted <==**

**----- Start of picture text -----**<br>
TO3PF<br>K A ne<br>δ=0.5<br>Se eee imal Lf<br>0.2<br>a fae<br>|aeaymalAIAeyLA||PTT TTT<br>0.1<br>10-1 fl. il 0.05<br>Pea /Allon HC<br>7 4VV 0.02<br>CageAWAl| rsll CTTE TT<br>0.01<br>20 i AT<br>/ Single pulse<br>SETAE ETT<br>10-2<br>10-5 10-4 10-3 10-2 10-1 tp [(s)]<br>**----- End of picture text -----**<br>


**Figure 4. Safe operating area  for TO-247** 

**Figure 5. Thermal impedance for TO-247** 

## **Figure 6. Output characteristics** 

**Figure 7. Transfer characteristics** 

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**Electrical characteristics** 

**Figure 8. Gate charge vs gate-source voltage Figure 9.** 

**Static drain-source on-resistance** 

## **Figure 10. Capacitance variations** 

## **Figure 11. Output capacitance stored energy** 

**Figure 12. Normalized gate threshold voltage vs temperature** 

**==> picture [204 x 168] intentionally omitted <==**

**----- Start of picture text -----**<br>
VGS(th) AM05459v2<br>(norm)<br>1.10 Pt | | ID=250 µA<br>VDS=VGS<br>1.00 SaNee<br>0.90<br>Se eeeNee<br>SeeeeeNe<br>0.80<br>0.70 PtnNtT ET TN<br>-50 -25 0 25 50 75 100 TJ(°C)<br>**----- End of picture text -----**<br>


**Figure 13. Normalized on-resistance vs temperature** 

**==> picture [203 x 168] intentionally omitted <==**

**----- Start of picture text -----**<br>
RDS(on) AM05460v2<br>(norm)<br>VGS=10V<br>2.1 Pt<br>ID=29A<br>tT | dy<br>1.9<br>1.7 EySCE EE<br>1.5<br>1.3<br>1.1 FEE : EE<br>pLAt<br>0.9<br>0.70.5 PiaZann| tt| tt<br>-50 -25 0 25 50 75 100 TJ(°C)<br>**----- End of picture text -----**<br>


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**Electrical characteristics** 

## **Figure 14. Source-drain diode forward characteristics** 

## **Figure 15. Normalized BVDSS vs temperature** 

**==> picture [423 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
VSD AM05461v1 VDS AM10399v1<br>(V) TJ=-50°C (norm)<br>Te 1.08 TTT<br>1.2 ID = 1mA<br>1.06<br>ee Pt ft. LULA<br>1.0<br>Lo 1.04 PTET<br>Lo<br>0.8 1.02<br>LO TJ=25°C PTT TY<br>1.00<br>0.6 24a PTT yt<br>TJ=150°C<br>0.98<br>EE PA<br>0.4<br>0.96<br>0.2 CEE SAE7 | |ttt<br>0.94<br>0 Ft tt | | 0.92 YELLE LLL,i<br>0 10 20 30 40 50 ISD(A) -50 -25 0 25 50 75 100 TJ(°C)<br>**----- End of picture text -----**<br>


**Figure 16. Switching losses vs gate resistance[(1)]** 

1. Eon including reverse recovery of a SiC diode 

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**STFW69N65M5, STW69N65M5** 

**Test circuits** 

## **3 Test circuits** 

**Figure 17. Switching times test circuit for Figure 18. Gate charge test circuit resistive load** 

**Figure 19. Test circuit for inductive load Figure 20. Unclamped inductive load test switching and diode recovery times circuit** 

## **Figure 21. Unclamped inductive waveform Figure 22. Switching time waveform** 

**==> picture [217 x 152] intentionally omitted <==**

**----- Start of picture text -----**<br>
Inductive Load Turn - off<br>Id : i i<br>90%Vds 90%Id<br>td(v)<br>Vgs<br>90%Vgs on<br>Vgs(I(t ))<br>10%Vds | | 10%Id<br>Vds<br>tr(v) tf(i)<br>-<br>tc(off) AM05540v1<br>**----- End of picture text -----**<br>


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**Package mechanical data** 

## **4 Package mechanical data** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _www.st.com_ . ECOPACK[®] is an ST trademark. 

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**Package mechanical data** 

**Table 9. TO-3PF mechanical data** 

|**Dim.**|**mm**|**mm**|**mm**|
|---|---|---|---|
||**Min.**|**Typ.**|**Max.**|
|A|5.30||5.70|
|C|2.80||3.20|
|D|3.10||3.50|
|D1|1.80||2.20|
|E|0.80||1.10|
|F|0.65||0.95|
|F2|1.80||2.20|
|G|10.30||11.50|
|G1||5.45||
|H|15.30||15.70|
|L|9.80|10|10.20|
|L2|22.80||23.20|
|L3|26.30||26.70|
|L4|43.20||44.40|
|L5|4.30||4.70|
|L6|24.30||24.70|
|L7|14.60||15|
|N|1.80||2.20|
|R|3.80||4.20|
|Dia|3.40||3.80|



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**Package mechanical data** 

**==> picture [405 x 297] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 23. TO-3PF drawing<br>L3<br>L D<br>E<br>A<br>C<br>D1<br>Dia<br>L2<br>L6 L7<br>F2(3x)<br>F(3x)<br>G1<br>H<br>G<br>R<br>L5 N<br>L4<br>7627132_C<br>**----- End of picture text -----**<br>


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**Package mechanical data** 

**Table 10. TO-247 mechanical data** 

|**Dim.**|**mm.**|**mm.**|**mm.**|
|---|---|---|---|
||**Min.**|**Typ.**|**Max.**|
|A|4.85||5.15|
|A1|2.20||2.60|
|b|1.0||1.40|
|b1|2.0||2.40|
|b2|3.0||3.40|
|c|0.40||0.80|
|D|19.85||20.15|
|E|15.45||15.75|
|e|5.30|5.45|5.60|
|L|14.20||14.80|
|L1|3.70||4.30|
|L2||18.50||
|∅P|3.55||3.65|
|∅R|4.50||5.50|
|S|5.30|5.50|5.70|



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**Package mechanical data** 

## **Figure 24. TO-247 drawing** 

**==> picture [401 x 394] intentionally omitted <==**

**----- Start of picture text -----**<br>
0075325_G<br>**----- End of picture text -----**<br>


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**Revision history** 

## **5 Revision history** 

**Table 11. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|27-Feb-2012|1|First release.|
|28-Sep-2012|2|– Modified:note _3_of_Table 2_, values in_Table 4_, typ. values in<br>_Table 6_,_7_and_8_<br>– Curves inserted<br>– Minor text changes|



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## Links

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