# Power MOSFET, N Channel, 650 V, 48 A, 0.058 ohm, TO-247, Through Hole

![Product image](https://novapart.co/image/farnell:2522904/)

**URL**: https://novapart.co/products/STW58N65DM2AG/power-mosfet-n-channel-650-v-48-a-0058-ohm-to-247
**SKU**: STW58N65DM2AG
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €6.6800
**Stock**: 10+
**Lead Time**: 35 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:48A; Drain Source Voltage Vds:650V; On Resistance Rds(on):0.058ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; Power

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 360W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-247 |
| Drain Source Voltage Vds | 650V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 48A |
| Drain Source On State Resistance | 0.058ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2522904/)

**STW58N65DM2AG** 

Datasheet 

Automotive-grade N-channel 650 V, 0.058 Ω typ., 48 A, MDmesh™ DM2 Power MOSFET in a TO-247 package 

## **Features** 

|**Order code**|**VDS**|**RDS(on) max.**|**ID**|**PTOT**|
|---|---|---|---|---|
|STW58N65DM2AG|650 V|0.065 Ω|48 A|360 W|



**==> picture [119 x 156] intentionally omitted <==**

**----- Start of picture text -----**<br>
3<br>2<br>1<br>TO-247<br>D(2)<br>G(1)<br>S(3)<br>NG1D2S3Z<br>**----- End of picture text -----**<br>


- AEC-Q101 qualified 

- Fast-recovery body diode 

- Extremely low gate charge and input capacitance 

- Low on-resistance 

- 100% avalanche tested 

- Extremely high dv/dt ruggedness 

- Zener-protected 

## **Applications** 

- Switching applications 

## **Description** 

|**Product summary**<br>~~a~~|**Product summary**<br>~~a~~|
|---|---|
|**Order code**|STW58N65DM2AG|
|**Marking**|58N65DM2|
|**Package**|TO-247|
|**Packing**|Tube|



This high-voltage N-channel Power MOSFET is part of the MDmesh™ DM2 fastrecovery diode series. It offers very low recovery charge (Qrr) and time (trr) combined with low RDS(on), rendering it suitable for the most demanding high-efficiency converters and ideal for bridge topologies and ZVS phase-shift converters. 

**DS11265** - **Rev 3** - **July 2018** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STW58N65DM2AG Electrical ratings** 

**1** 

## **Electrical ratings** 

## **Table 1. Absolute maximum ratings** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VGS|Gate-source voltage|±25|V|
|ID|Drain current (continuous) at Tcase= 25 °C|48|A|
||Drain current (continuous) at Tcase= 100 °C|30||
|IDM(1)|Drain current (pulsed)|150|A|
|PTOT|Total dissipation at Tcase= 25 °C|360|W|
|dv/dt(2)|Peak diode recovery voltage slope|50|V/ns|
|dv/dt(3)|MOSFET dv/dt ruggedness|50||
|Tstg|Storage temperature range|-55 to 150|°C|
|TJ|Operating junction temperature range|||



_1. Pulse width is limited by safe operating area._ 

_2. ISD ≤ 48 A, di/dt=800 A/μs, VDS peak < V(BR)DSS, VDD = 80% V(BR)DSS_ 

_3. VDS ≤ 520 V_ 

## **Table 2. Thermal data** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|Rthj-case|Thermal resistance junction-case|0.35|°C/W|
|Rthj-amb|Thermal resistance junction-ambient|50||



**Table 3. Avalanche characteristics** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|IAR(1)|Avalanche current, repetitive or not repetitive|7|A|
|EAS(2)|Single pulse avalanche energy|1300|mJ|



_1. Pulse width is limited by TJmax._ 

_2. Starting TJ = 25 °C, ID = IAR, VDD = 50 V_ 

**DS11265** - **Rev 3** 

**page 2/13** 

**STW58N65DM2AG Electrical characteristics** 

## **2** 

## **Electrical characteristics** 

(Tcase = 25 °C unless otherwise specified) 

## **Table 4. Static** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|V(BR)DSS|Drain-source breakdown voltage|VGS= 0 V, ID= 1 mA|650|||V|
|IDSS|Zero gate voltage drain current|VGS= 0 V, VDS= 650 V|||10|µA|
|||VGS= 0 V, VDS= 650 V,<br>Tcase= 125 °C(1)|||100||
|IGSS|Gate-body leakage current|VDS= 0 V, VGS= ±25 V|||±5|µA|
|VGS(th)|Gate threshold voltage|VDS= VGS, ID= 250 µA|3|4|5|V|
|RDS(on)|Static drain-source on-resistance|VGS= 10 V, ID= 24 A||0.058|0.065|Ω|



_1. Defined by design, not subject to production test._ 

**Table 5. Dynamic** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Ciss|Input capacitance|VDS= 100 V, f = 1 MHz, VGS= 0 V|-|4100|-|pF|
|Coss|Output capacitance||-|160|-||
|Crss|Reverse transfer capacitance||-|2.5|-||
|Coss eq.(1)|Equivalent output capacitance|VDS= 0 to 520 V, VGS= 0 V|-|375|-|pF|
|RG|Intrinsic gate resistance|f = 1 MHz, ID= 0 A|-|4.1|-|Ω|
|Qg|Total gate charge|VDD= 520 V, ID= 48 A,<br>VGS= 0 to 10 V<br>(seeFigure 14. Test circuit for gate<br>charge behavior)|-|88|-|nC|
|Qgs|Gate-source charge||-|22|-||
|Qgd|Gate-drain charge||-|37|-||



_1. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS_ 

## **Table 6. Switching times** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|td(on)|Turn-on delay time|VDD= 325 V, ID= 24 A,<br>RG= 4.7 Ω, VGS= 10 V<br>(seeFigure 13. Test circuit for<br>resistive load switching timesand<br>Figure 18. Switching time<br>waveform)|-|28|-|ns|
|tr|Rise time||-|31|-||
|td(off)|Turn-off delay time||-|157|-||
|tf|Fall time||-|7.7|-||



**DS11265** - **Rev 3** 

**page 3/13** 

**STW58N65DM2AG Electrical characteristics** 

## **Table 7. Source-drain diode** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|ISD|Source-drain current||-||48|A|
|ISDM(1)|Source-drain current (pulsed)||-||150|A|
|VSD(2)|Forward on voltage|VGS= 0 V, ISD= 48 A|-||1.6|V|
|trr|Reverse recovery time|ISD= 48 A, di/dt = 100 A/µs,<br>VDD= 100 V<br>(seeFigure 15. Test circuit for<br>inductive load switching and diode<br>recovery times)|-|135||ns|
|Qrr|Reverse recovery charge||-|0.68||µC|
|IRRM|Reverse recovery current||-|10||A|
|trr|Reverse recovery time|ISD= 48 A, di/dt = 100 A/µs,<br>VDD= 100 V, TJ= 150 °C<br>(seeFigure 15. Test circuit for<br>inductive load switching and diode<br>recovery times)|-|260||ns|
|Qrr|Reverse recovery charge||-|2.75||µC|
|IRRM|Reverse recovery current||-|21||A|



_1. Pulse width is limited by safe operating area._ 

_2. Pulse test: pulse duration = 300 µs, duty cycle 1.5%._ 

**DS11265** - **Rev 3** 

**page 4/13** 

**STW58N65DM2AG Electrical characteristics (curves)** 

## **2.1 Electrical characteristics (curves)** 

**Figure 1. Safe operating area** 

**==> picture [187 x 149] intentionally omitted <==**

**----- Start of picture text -----**<br>
ID GADG270620181145SOA<br>(A)<br>10  [2 ] Operation in this area tp =10 µs<br>is limited by RDS(on)<br>10  [1 ] tp =100 µs<br>10  [0 ]<br>Single pulse tp =1 ms<br>10  [-1 ] T j ≤ 150 °C<br>T c = 25°C<br>10  [-2 ] tp =10 ms<br>10  [-1 ] 10  [0 ] 10  [1 ] 10  [2 ] VDS (V)<br>**----- End of picture text -----**<br>


**Figure 2. Thermal impedance** 

**==> picture [162 x 149] intentionally omitted <==**

**----- Start of picture text -----**<br>
K TO247EZx8<br>10  [-1]<br>Z th =k*R thj-c<br>10  [-2]<br>10  [-3]<br>10  [-5] 10  [-4] 10  [-3] 10  [-2] 10  [-1] tp (s)<br>**----- End of picture text -----**<br>


**==> picture [513 x 178] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 3. Output characteristics Figure 4. Transfer characteristics<br>I D GIPG090915FQFBWOCH I D GIPG090915FQFBWTCH<br>(A) (A)<br>140 V GS = 9,10 V 140 V DS = 20 V<br>120 V GS = 8 V 120<br>100 V GS = 7 V 100<br>80 80<br>60 60<br>40 40<br>V GS = 6 V<br>20 20<br>0 V GS = 5 V 0<br>0 4 8 12 16 V DS (V) 2 4 6 8 V GS (V)<br>**----- End of picture text -----**<br>


**==> picture [513 x 178] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 5. Gate charge vs gate-source voltage Figure 6. Static drain-source on-resistance<br>V GS GIPG090915FQFBWQVG V DS R DS(on) GIPG090915FQFBWRID<br>(V) (V) (Ω)<br>12 VDD = 520 V, ID = 48 A 600 V GS = 10 V<br>0.066<br>10 V DS 500<br>0.062<br>8 400<br>6 300<br>0.058<br>4 200<br>0.054<br>2 100<br>0 0 0.050<br>0 20 40 60 80 100 Q g (nC) 0 8 16 24 32 40 I D (A)<br>**----- End of picture text -----**<br>


**DS11265** - **Rev 3** 

**page 5/13** 

**STW58N65DM2AG Electrical characteristics (curves)** 

**==> picture [513 x 195] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 8. Normalized gate threshold voltage vs<br>Figure 7. Capacitance variations<br>temperature<br>C  GIPG090915FQFBWCVR<br>(pF) V GS(th) GIPG090915FQFBWVTH<br>(norm.)<br>I D = 250 µA<br>10  [4] 1.1<br>C ISS<br>1.0<br>10  [3]<br>0.9<br>10  [2] C OSS<br>0.8<br>f = 1 MHz<br>10  [1] C RSS<br>0.7<br>10  [0]<br>10  [-1] 10  [0] 10  [1] 10  [2] V DS (V) 0.6<br>-75 -25 25 75 125 T j (°C)<br>**----- End of picture text -----**<br>


**==> picture [513 x 186] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 9. Normalized on-resistance vs temperature Figure 10. Normalized V(BR)DSS vs temperature<br>R DS(on) GIPG090915FQFBWRON V (BR)DSS GIPG090915FQFBWBDV<br>(norm.) (norm.)<br>2.2 V GS = 10 V 1.12 I D = 1 mA<br>1.08<br>1.8<br>1.04<br>1.4<br>1.00<br>1.0<br>0.96<br>0.6<br>0.92<br>0.2 0.88<br>-75 -25 25 75 125 T j (°C) -75 -25 25 75 125 T j (°C)<br>**----- End of picture text -----**<br>


**==> picture [513 x 184] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 11. Output capacitance stored energy Figure 12. Source- drain diode forward characteristics<br>E OSS GIPG090915FQFBWEOS V SD GIPG090915FQFBWSDF<br>(µJ) (V)<br>28 T j = -50 °C<br>1.1<br>24<br>20 T j = 25 °C<br>0.9<br>16<br>T j = 150 °C<br>0.7<br>12<br>8<br>0.5<br>4<br>0 0.3<br>0 100 200 300 400 500 600 V DS (V) 0 8 16 24 32 40 I SD (A)<br>**----- End of picture text -----**<br>


**DS11265** - **Rev 3** 

**page 6/13** 

**STW58N65DM2AG Test circuits** 

## **3 Test circuits** 

**==> picture [513 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 13. Test circuit for resistive load switching times Figure 14. Test circuit for gate charge behavior<br>VDD<br>12 V 47 kΩ<br>1 kΩ<br>100 nF<br>RL 2200 3.3<br>+ μF μF VDD<br>VD VGS IG= CONST 100 Ω D.U.T.<br>VGS RG D.U.T. pulse width 2200 + 2.7 kΩ VG<br>pulse width μF<br>47 kΩ<br>1 kΩ<br>AM01468v1 AM01469v1<br>**----- End of picture text -----**<br>


**==> picture [513 x 184] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 15. Test circuit for inductive load switching and<br>Figure 16. Unclamped inductive load test circuit<br>diode recovery times<br>A A A L<br>G D D.U.T. fastdiode 100 µH VD 2200 3.3<br>25 Ω S B B B D µF3.3 + 1000µF VDD ID + µF µF VDD<br>G D.U.T.<br>+ RG S Vi D.U.T.<br>_ pulse width<br>AM01471v1<br>AM01470v1<br>**----- End of picture text -----**<br>


**==> picture [513 x 172] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 18. Switching time waveform<br>Figure 17. Unclamped inductive waveform<br>ton toff<br>V(BR)DSS<br>td(on) tr td(off) tf<br>VD<br>90% 90%<br>IDM<br>ID 0 10% VDS 10%<br>VDD VDD VGS 90%<br>AM01472v1 0 10%<br>AM01473v1<br>**----- End of picture text -----**<br>


**DS11265** - **Rev 3** 

**page 7/13** 

**STW58N65DM2AG Package information** 

**4 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

**DS11265** - **Rev 3** 

**page 8/13** 

**STW58N65DM2AG TO-247 package information** 

## **4.1 TO-247 package information** 

**Figure 19. TO-247 package outline** 

**==> picture [34 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
0075325_9<br>**----- End of picture text -----**<br>


**DS11265** - **Rev 3** 

**page 9/13** 

**STW58N65DM2AG TO-247 package information** 

**Table 8. TO-247 package mechanical data** 

|**Di**|**mm**|**mm**|**mm**|
|---|---|---|---|
|**m.**|**Min.**|**Typ.**|**Max.**|
|A|4.85||5.15|
|A1|2.20||2.60|
|b|1.0||1.40|
|b1|2.0||2.40|
|b2|3.0||3.40|
|c|0.40||0.80|
|D|19.85||20.15|
|E|15.45||15.75|
|e|5.30|5.45|5.60|
|L|14.20||14.80|
|L1|3.70||4.30|
|L2||18.50||
|ØP|3.55||3.65|
|ØR|4.50||5.50|
|S|5.30|5.50|5.70|



**DS11265** - **Rev 3** 

**page 10/13** 

**STW58N65DM2AG** 

## **Revision history** 

**Table 9. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|09-Sep-2015|1|Initial release.|
|15-Sep-2015|2|In section_Electrical characteristics (curves)_:<br>- updated figure_Safe operating area_|
|02-Jul-2018|3|Removed maturity status indication from cover page. The document status is<br>production data.<br>UpdatedTable 1. Absolute maximum ratingsandTable 7. Source-drain diode.<br>UpdatedFigure 1. Safe operating area.<br>Minor text changes|



**DS11265** - **Rev 3** 

**page 11/13** 

**STW58N65DM2AG Contents** 

## **Contents** 

|**1**|**Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2**|
|---|---|
|**2**|**Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3**|
||**2.1**<br>Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
|**3**|**Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7**|
|**4**|**Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8**|
||**4.1**<br>TO-247 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8|
|**Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11**||



**DS11265** - **Rev 3** 

**page 12/13** 

**STW58N65DM2AG** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2018 STMicroelectronics – All rights reserved 

**DS11265** - **Rev 3** 

**page 13/13** 



## Links

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- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/stmicroelectronics/stw58n65dm2ag/mosfet-n-ch-650v-48a-to247/dp/2522904)
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