# Fast / Ultrafast Diode, 600 V, 8 A, Single, 3.4 V, 18 ns, 60 A

![Product image](https://novapart.co/image/farnell:2806753/)

**URL**: https://novapart.co/products/STTH8S06FP/fast-ultrafast-diode-600-v-8-a-single-34-18-ns-60
**SKU**: STTH8S06FP
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.3150
**Stock**: 200+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:600V; Forward Current If(AV):8A; Diode Configuration:Single; Forward Voltage VF Max:3.4V; Reverse Recovery Time trr Max:18ns; Forward Surge Cur

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2 Pin |
| Product Range | - |
| Qualification | - |
| Diode Case Style | TO-220FPAC |
| Diode Configuration | Single |
| Forward Voltage Max | 3.4V |
| Forward Surge Current | 60A |
| Reverse Recovery Time | 18ns |
| Average Forward Current | 8A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 600V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2806753/)

## **STTH8S06** 

## Turbo 2 ultrafast high voltage rectifier 

Datasheet - production data 

**==> picture [155 x 184] intentionally omitted <==**

**----- Start of picture text -----**<br>
A i K<br>K a *<br>A<br>TO-220AC K<br>A<br>K<br>TO-220FPAC<br>**----- End of picture text -----**<br>


## **Features** 

- Ultrafast recovery 

- Low reverse recovery current 

- Low thermal resistance 

- Higher frequency operation 

## **Description** 

This device is an ultrafast diode based on 600 V Pt doping planar technology. 

It can be used in hard switching conditions for power factor corrections. Its extremely low reverse recovery current reduces the switching power losses of the MOSFET and thus increases the overall application efficiency. 

This diode is also intended for applications in power supplies and power conversions systems, and all sorts of power switching. 

**Table 1: Device summary** 

|**Symbol**|**Value**|
|---|---|
|IF(AV)|8 A|
|VRRM|600 V|
|IRM(typ.)|4.4 A|
|VF(typ.)|1.5 V|
|Tj(max.)|175 °C|
|trr(typ.)|12 ns|



- Reduces switching and conduction losses 

- Insulated TO-220FPAC: 

   - Insulating voltage = 2000 VRMS 

   - Package capacitance = 12 pF 

February 2017 

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This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**STTH8S06** 

## **1 Characteristics** 

**Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VRRM|Repetitivepeak reverse voltage||600|V|
|IF(AV)|Average forward current δ = 0.5 square wave||8|A|
|IFSM|Surge non repetitive forward current|tp= 10 ms|60|A|
|Tstg|Storage temperature range||-65 to +175|°C|
|Tj|Maximum operating junction temperature||175||



**Table 3: Thermal parameters** 

|**Symbol**|**Parameter**||**Max. value**|**Unit**|
|---|---|---|---|---|
|Rth(j-c)|Junction to case|TO-220AC,<br>DPAK|3.0|°C/<br>W|
|||TO-220FPAC|5.5||



**Table 4: Static electrical characteristics (per diode)** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR|Reverse leakage current|Tj= 25 °C|VR= 600 V|-||20|µA|
|||Tj= 125 °C||-|25|200||
|VF|Forward voltage drop|Tj= 25 °C|IF= 8 A|-||3.4|V|
|||Tj= 150 °C||-|1.5|1.9||



To evaluate the maximum conduction losses, use the following equation: 

P = 1.20 x IF(AV) + 0.087 x IF[2] (RMS) 

**Table 5: Dynamic electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|<br>**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|trr|Reverse recovery time|Tj= 25 °C|IF= 1 A,<br>dIF/dt = - 200 A/μs,<br>VR= 30 V|-|12|18|ns|
|IRM|Reverse recovery<br>current||IF= 8 A,<br>dIF/dt = - 200 A/μs,<br>VR= 200 V|-|1.6|2.2|A|
|Sfactor|Softness factor|||-|1||-|
|Qrr|Reverse recovery<br>charges|||-|17||nC|
|IRM|Reverse recovery<br>current|Tj= 125 °C|IF= 8 A,<br>dIF/dt = - 200 A/μs,<br>VR= 200 V|-|4.4|6.0|A|
|Sfactor|Softness factor|||-|0.3||-|
|Qrr|Reverse recovery<br>charges|||-|90||nC|



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**Characteristics** 

## **1.2 Characteristics (curves)** 

**==> picture [448 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1: Forward voltage drop versus forward  Figure 2: Relative variation of thermal impedance<br>current junction to case versus pulse duration (TO-220AC)<br>Zth(j-c) /Rth(j-c)<br>1.0<br>0.9<br>0.8<br>0.7<br>0.6<br>0.5<br>0.4<br>0.3<br>0.2<br>Single pulse<br>0.1 tp(s)<br>0.0<br>1.E-03 1.E-02 1.E-01 1.E+00<br>**----- End of picture text -----**<br>


**==> picture [462 x 401] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 3: Relative variation of thermal impedance<br>Figure 4: Relative variation of thermal impedance<br>junction to case versus pulse duration<br>junction to case versus pulse duration(DPAK)<br>(TO-220FPAC)<br>1.0 Zth(j-c) /Rth(j-c) 1.0 Zth(j-c) /Rth(j-c)<br>0.9 0.9<br>0.8 0.8<br>0.7<br>0.7<br>0.6<br>0.6 δ = 0.5<br>0.5<br>0.5<br>0.4<br>0.4<br>δ = 0.2 0.3<br>0.3 Single pulse<br>0.2 δ = 0.1 T 0.2<br>0.1 t P (s)<br>0.1 Single pulse tp(s) δ [=tp/T] tp 0.0<br>0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>1.E-03 1.E-02 1.E-01 1.E+00 1.E+01<br>Figure 5: Peak reverse recovery current versus  Figure 6: Reverse recovery time versus dIF/dt<br>dIF/dt (typical values) (typical values)<br>16 IRM(A) 70 trr(ns)<br>1514 VTRj = 125= 200°CV IF=2 x I F(AV ) 60 VTjR= 125= 200°CV<br>13 IF=I F(AV )<br>1211 IF=0.5 x I F(AV ) 50<br>10 IF=2 x I F(AV )<br>9 40 IF=I F(AV ) IF=0.5 x I F(AV )<br>8<br>7 30<br>6<br>5<br>4 20<br>3<br>2 10<br>1 dlF/dt(A/µs) dlF/dt(A/µs)<br>0 0<br>0 200 400 600 800 1000 0 200 400 600 800 1000<br>**----- End of picture text -----**<br>


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**Characteristics** 

**STTH8S06** 

**==> picture [455 x 195] intentionally omitted <==**

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Figure 7: Reverse recovery charges versus dIF/dt  Figure 8: Junction capacitance versus reverse<br>(typical values)  voltage applied (typical values)<br>240220 QrrV(nC)R = 200 V IF=2 x I F(AV ) 100 C(pF) F = 1 MHz<br>200 Tj = 125 °C IF=I F(AV ) VOSC = 30 VRMSTj = 25 °C<br>180<br>160<br>140 IF=0.5 x I F(AV )<br>120 10<br>100<br>80<br>60<br>40<br>20 dlF/dt(A/µs) VR(V)<br>0 1<br>0 200 400 600 800 1000 1 10 100 1000<br>**----- End of picture text -----**<br>


**==> picture [452 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 9: Thermal resistance junction to ambient versus copper surface under tab (DPAK, typical values)<br>Rth(j-a) (°C/W)<br>100<br>DPAK<br>90<br>80<br>70<br>60<br>50<br>40<br>30<br>20 Epoxy printed board FR4, e Cu = 35 µm<br>10<br>SCu(cm²)<br>0<br>0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br>


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**Package** information 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _**www.st.com**_ . ECOPACK[®] is an ST trademark. 

- Cooling method: by conduction (C) 

- Epoxy meets UL 94,V0 

- Recommended torque value: 0.55 N·m 

- Maximum torque value: 0.7 N·m 

## **2.1 TO-220AC package information** 

**Figure 10: TO-220AC package outline** 

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**Package** information 

**Table 6: TO-220AC package mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|4.40|4.60|0.173|0.181|
|C|1.23|1.32|0.048|0.051|
|D|2.40|2.72|0.094|0.107|
|E|0.49|0.70|0.019|0.027|
|F|0.61|0.88|0.024|0.034|
|F1|1.14|1.70|0.044|0.066|
|G|4.95|5.15|0.194|0.202|
|H2|10.00|10.40|0.393|0.409|
|L2|16.40 typ.||0.645 typ.||
|L4|13.00|14.00|0.511|0.551|
|L5|2.65|2.95|0.104|0.116|
|L6|15.25|15.75|0.600|0.620|
|L7|6.20|6.60|0.244|0.259|
|L9|3.50|3.93|0.137|0.154|
|M|2.6|typ.|0.102 typ.||
|Diam|3.75|3.85|0.147|0.151|



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**Package** information 

## **2.2 TO-220FPAC package information** 

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**----- Start of picture text -----**<br>
Figure 11: TO-220FPAC package outline<br>**----- End of picture text -----**<br>


**==> picture [406 x 454] intentionally omitted <==**

**----- Start of picture text -----**<br>
A<br>H B<br>Dia<br>L6<br>L2 L7<br>L3<br>L5<br>D<br>F1<br>L4<br>F<br>E<br>G1<br>G<br>**----- End of picture text -----**<br>


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**Package** information 

**Table 7: TO-220FPAC package mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|4.40|4.60|0.173|0.181|
|B|2.50|2.70|0.098|0.106|
|D|2.50|2.75|0.098|0.108|
|E|0.45|0.70|0.018|0.027|
|F|0.75|1.00|0.030|0.039|
|F1|1.15|1.70|0.045|0.067|
|G|4.95|5.20|0.195|0.205|
|G1|2.40|2.70|0.094|0.106|
|H|10.00|10.40|0.393|0.409|
|L2|16.00 typ.||0.630 typ.||
|L3|28.60|30.60|0.126|1.205|
|L4|9.80|10.60|0.386|0.417|
|L5|2.90|3.60|0.114|0.142|
|L6|15.90|16.40|0.626|0.646|
|L7|9.00|9.30|0.354|0.366|
|Dia.|3.00|3.20|0.118|0.126|



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**Package** information 

## **2.3 DPAK package information** 

**Figure 12: DPAK package outline** 

**==> picture [406 x 439] intentionally omitted <==**

**----- Start of picture text -----**<br>
0068772_A_21<br>**----- End of picture text -----**<br>


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**Package** information 

|formation||||||**STTH8S06**|
|---|---|---|---|---|---|---|
|||**Table 8: DPAK mechanical data**|||||
|**Dim.**||**Dimensions**|||||
|||**Millimeters**|||**Inches**||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|2.20||2.40|0.087||0.094|
|A1|0.90||1.10|0.035||0.043|
|A2|0.03||0.23|0.001||0.009|
|b|0.64||0.90|0.025||0.035|
|b4|5.20||5.40|0.205||0.213|
|c|0.45||0.60|0.018||0.024|
|c2|0.48||0.60|0.019||0.024|
|D|6.00||6.20|0.236||0.244|
|D1|4.95|5.10|5.25|0.201|0.195|0.207|
|E|6.40||6.60|0.252||0.260|
|E1|4.60|4.70|4.80|0.181|0.185|0.189|
|e|2.16|2.28|2.40|0.085|0.090|0.094|
|e1|4.40||4.60|0.173||0.181|
|H|9.35||10.10|0.368||0.398|
|L|1.00||1.50|0.039||0.059|
|(L1)|2.60|2.80|3.00|0.102|0.110|0.118|
|L2|0.65|0.80|0.95|0.026|0.031|0.037|
|L4|0.60||1.00|0.024||0.039|
|R||0.20|||0.008||
|V2|0°||8°|0°||8°|



**Figure 13: DPAK recommended footprint (dimensions are in mm)** 

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**Ordering** information 

## **3 Ordering information** 

**Table 9: Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STTH8S06D|STTH8S06D|TO-220AC|1.9g|50|Tube|
|STTH8S06FP|STTH8S06FP|TO-220FPAC|1.64g|50|Tube|
|STTH8S06B-TR|STTH8 S06B|DPAK|0.35g|2500|Tape and reel|



## **4 Revision history** 

**Table 10: Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|18-Dec-2007|1|first issue|
|10-Feb-2017|2|Added DPAK package.<br>Updated_Section "Features"_.|



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## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2017 STMicroelectronics – All rights reserved 

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## Links

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