# Fast / Ultrafast Diode, 200 V, 6 A, Dual Common Cathode, 1.25 V, 20 ns, 60 A

![Product image](https://novapart.co/image/farnell:4860866RL/)

**URL**: https://novapart.co/products/STTH602CBY-TR/fast-ultrafast-diode-200-v-6-a-dual-common-cathode
**SKU**: STTH602CBY-TR
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.3470
**Stock**: 10+
**Lead Time**: 319 days (indicative)

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4860866RL/)

## **STTH602C-Y** 

## Automotive ultrafast recovery diode 

Datasheet - production data 

**==> picture [89 x 132] intentionally omitted <==**

**----- Start of picture text -----**<br>
A1<br>K<br>A2<br>A2<br>K<br>A1<br>DPAK<br>**----- End of picture text -----**<br>


## **Features** 

- AEC-Q101 qualified 

- Suited for SMPS 

- Low losses 

## **Description** 

This dual center tap diode is suited for switch mode power supplies and high frequency DC to DC converters. 

Packaged in DPAK, this device is intended for use in low voltage high frequency inverters, freewheeling and polarity protection for automotive applications. 

**Table 1: Device summary** 

**Symbol Value** IF(AV) 2 x 3 A VRRM 200 V VF(typ.) 0.80 V Tj(max.) 175 °C Trr(typ.) 14 ns : ~~———~~ 

- Low forward and reverse recovery time 

- High surge current capability 

- High junction temperature 

- PPAP capable 

March 2017 

DocID023250 Rev 2 

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This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**STTH602C-Y** 

## **1 Characteristics** 

**Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**||**Value**|**Unit**|
|---|---|---|---|---|
|VRRM|Repetitivepeak reverse voltage||200|V|
|IF(RMS)|Forward rms current||11|A|
|IF(AV)|Average forward current<br>δ = 0.5, square wave|Tc= 160 °C|3|A|
|||Tc= 155 °C|6||
|IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal|60|A|
|Tstg|Storage temperature range||-65 to +175|°C|
|Tj|Operating junction temperature range||-40 to +175|°C|



**Table 3: Thermal parameters** 

|**Symbol**|**Parameter**||**Max. value**|**Unit**|
|---|---|---|---|---|
|Rth(j-c)|Junction to case|Per diode|5|°C/W|
|||Per device|3||
|Rth(c)|Coupling||1||



When the two diodes 1 and 2 are used simultaneously: 

ΔTj(diode 1) = P (diode 1) x Rth(j-c) (Per diode) + P (diode 2) x Rth(c) 

**Table 4: Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR_(1)_|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||3|µA|
|||Tj= 125 °C||-|3|30||
|VF_(2)_|Forward voltage drop|Tj= 25 °C|IF= 3 A|-|0.98|1.1|V|
|||Tj= 150 °C||-|0.8|0.95||
|||Tj= 25 °C|IF= 6 A|-|1.1|1.25||
|||Tj= 150 °C||-|0.9|1.05||



## **Notes:** 

(1)Pulse test: tp = 5 ms, δ < 2% 

(2)Pulse test: tp = 380 µs, δ < 2% 

To evaluate the conduction losses, use the following equation: 

P = 0.85 x IF(AV) + 0.033 x IF[2] (RMS) 

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**STTH602C-Y** 

**Characteristics** 

## **Table 5: Dynamic characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|trr|Reverse recovery time|IF= 1 A,<br>dIF/dt = -100 A/μs,<br>VR= 30 V, Tj= 25 °C|-|14|20|ns|
|||IF= 1 A,<br>dIF/dt = -50 A/μs,<br>VR= 30 V, Tj= 25 °C|-|21|30||
|IRM|Reverse recovery current|IF= 3 A,<br>dIF/dt = 200 A/μs,<br>VR= 160 V, Tj= 125 °C|-|4|5.5|A|
|tfr|Forward recovery time|IF= 3 A,<br>dIF/dt = 200 A/μs<br>VFR= 1.1 x VFmax, Tj= 25 °C|-|24||ns|
|VFP|Forward recovery voltage|IF= 3 A,<br>dIF/dt = 200 A/μs, Tj= 25 °C|-|3.7||V|



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**Characteristics** 

**STTH602C-Y** 

## **1.1 Characteristics (curves)** 

**Figure 1: Peak current versus duty cycle (per diode)** 

**Figure 2: Forward voltage drop versus forward current (typical values, per diode)** 

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**----- Start of picture text -----**<br>
IM(A)<br>100<br>T<br>|| ee ee ee IM<br>80 Woo|. S δ [= tp/T] TL tp<br>60 WEEg e<br>\\ P = 10 W rT | | yy<br>40 Whe, Popef<br>P = 5 W<br>P = 3 W<br>20 Ae ro feo<br>δ<br>AS ee E |<br>0 DSSS<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0<br>**----- End of picture text -----**<br>


**Figure 3: Forward voltage drop versus forward current (maximum values, per diode)** 

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**----- Start of picture text -----**<br>
current (maximum values, per diode)  Figure 4: Relative variation of thermal impedance<br>junction to case versus pulse duration (per diode)<br>IFA) 1.0 Zth(j-c)/Rth(j-c) _<br>Single pulse-<br>FF80 r] | | | i ttt ootL TAL eetHeteeeeeeat ttt —cemmetit<br>10ee ee ee ee<br>wo fk a<br>0}fit ttt t ZAcceoeT) a a ll<br>i 4<br>oi ttttT va PTET)<br>o Pt tt Ke Py<br>JL LLDe tp(s)<br>0.1<br>0 . 0 0 . 5 1 . 0 1 . 5 2 . 0 2 . 5 3 . 0 3 . 5<br>1.E-03 1.E-02 1.E-01 1.E+00<br>**----- End of picture text -----**<br>


**Figure 5: Junction capacitance versus reverse applied voltage (typical values, per diode)** 

**Figure 6: Reverse recovery charges versus dIF/dt (typical values, per diode)** 

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100 C(pF)<br>a F = 1 MHz 5<br>Vosc = 30 mVRMS<br>Tj = 25 °C<br>fta>cE Py<br>10 re TTT)Sess<br>ee ee a er<br>LtCeTT yy yyMit<br>VR(V)<br>1 crit Icom)<br>1 10 100 1000<br>**----- End of picture text -----**<br>


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**Characteristics** 

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Figure 7: Reverse recovery time versus dIF/dt  Figure 8: Reverse recovery current versus dIF/dt<br>(typical values, per diode)  (typical values, per diode)<br>**----- End of picture text -----**<br>


**Figure 9: Dynamic parameters versus junction Figure 10: Thermal resistance junction to ambient temperature versus copper surface under tab for DPAK package (typical values)** 

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Rth(j-a) (°C/W)<br>100<br>DPAK<br>90<br>80<br>70<br>60<br>50<br>40<br>30<br>20 Epoxy printed board FR4, e Cu = 35 µm<br>10<br>SCu(cm²)<br>0<br>0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br>


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**STTH602C-Y** 

**Package** information 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _**www.st.com**_ . ECOPACK[®] is an ST trademark. 

- Epoxy meets UL94, V0 

- Cooling method: by conduction (C) 

## **2.1 DPAK package information** 

**Figure 11: DPAK package outline** 

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**Package** information 

|||**Table 6: DPAK mechanical data**|**Table 6: DPAK mechanical data**|**Table 6: DPAK mechanical data**|||
|---|---|---|---|---|---|---|
|**Dim.**||**Dimensions**|||||
|||**Millimeters**|||**Inches**||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|2.20||2.40|0.087||0.094|
|A1|0.90||1.10|0.035||0.043|
|A2|0.03||0.23|0.001||0.009|
|b|0.64||0.90|0.025||0.035|
|b4|5.20||5.40|0.205||0.213|
|c|0.45||0.60|0.018||0.024|
|c2|0.48||0.60|0.019||0.024|
|D|6.00||6.20|0.236||0.244|
|D1|4.95|5.10|5.25|0.195|0.201|0.207|
|E|6.40||6.60|0.252||0.260|
|E1|5.10|5.20|5.30|0.201|0.205|0.209|
|e|2.16|2.28|2.40|0.085|0.090|0.094|
|e1|4.40||4.60|0.173||0.181|
|H|9.35||10.10|0.368||0.398|
|L|1.00||1.50|0.039||0.059|
|(L1)|2.60|2.80|3.00|0.102|0.110|0.118|
|L2|0.65|0.80|0.95|0.026|0.031|0.037|
|L4|0.60||1.00|0.024||0.039|
|R||0.20|||0.008||
|V2|0°||8°|0°||8°|



**Figure 12: DPAK recommended footprint (dimensions are in mm)** 

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**Ordering** information 

**STTH602C-Y** 

## **3 Ordering information** 

**Table 7: Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STTH602CBY-TR|STTH6 02CBY|DPAK|0.30g|2500|Tape and reel|



## **4 Revision history** 

**Table 8: Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|24-Oct-2012|1|First issue.|
|16-Mar-2017|2|Updated_Table 3: "Thermal parameters"_.<br>Minor text changes.|



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## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2017 STMicroelectronics – All rights reserved 

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