# Fast / Ultrafast Diode, 300 V, 50 A, Dual Common Cathode, 1.8 V, 27 ns, 200 A

![Product image](https://novapart.co/image/farnell:2806738/)

**URL**: https://novapart.co/products/STTH50W03CW/fast-ultrafast-diode-300-v-50-a-dual-common
**SKU**: STTH50W03CW
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.8170
**Stock**: 10+
**Lead Time**: 127 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:300V; Forward Current If(AV):50A; Diode Configuration:Dual Common Cathode; Forward Voltage VF Max:1.8V; Reverse Recovery Time trr Max:27ns; Forward

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3 Pin |
| Product Range | - |
| Qualification | - |
| Diode Case Style | TO-247 |
| Diode Configuration | Dual Common Cathode |
| Forward Voltage Max | 1.8V |
| Forward Surge Current | 200A |
| Reverse Recovery Time | 27ns |
| Average Forward Current | 50A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 300V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2806738/)

## **STTH50W03C** 

## Turbo 2 ultrafast high voltage rectifier 

 **Datasheet production data** 

## **Description** 

A1 The STTH50W03C uses ST Turbo 2 300 V K technology. It is especially suited to be used for A2 DC/DC and DC/AC converters in the secondary stage of MIG/MMA/TIG welding machines. Housed in ST's TO-247, this device offers high power integration for all welding machines and industrial applications. **Table 1. Device summary Symbol Value** A2 I 2 x 25 A K F(AV) A1 VRRM 300 V TO-247 trr (typ) 20 ns STTH50W03CW T 175 °C j VF (typ) 1 V ~~==~~ **Features**  Ultrafast switching  Low reverse recovery current  Low thermal resistance  Reduces switching losses  ECOPACK[®] 2 compliant component 

August 2013 

DocID024734 Rev1 

1/9 

This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**STTH50W03C** 

## **1 Characteristics** 

**Table 2. Absolute ratings (limiting values per diode, at 25 °C, unless otherwise specified)** 

||**specified)**|**specified)**|**specified)**|||
|---|---|---|---|---|---|
|**Symbol**|**Parameter**|||**Value**|**Unit**|
|VRRM|Repetitive peak reverse voltage|||300|V|
|IF(RMS)|Forward rms current|||40|A|
|IF(AV)|Average forward current,= 0.5|Tc= 105 °C|Per diode|25|A|
|||Tc= 100°C|Per device|50||
|IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal||200|A|
|Tstg|Storage temperature range|||-65 to + 175|° C|
|Tj|Maximum operating junction temperature|||+ 175|° C|



**Table 3. Thermal resistance** 

|**Symbol**|**Parameter**||**Value**|**Unit**|
|---|---|---|---|---|
|Rth(j-c)|Junction to case|Per diode|1.8|°C / W|
|||Total|1||
|Rth(c)|Coupling||0.2||



When diodes 1 and 2 are used simultaneously: 

Tj(diode 1) = P(diode 1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) 

**Table 4. Static electrical characteristics per diode** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR (1)|Reverse leakage<br>current|Tj= 25 °C|VR= VRRM|||15|µA|
|||Tj= 125° C|||15|150||
|VF (2)|Forward voltage drop|Tj= 25° C|IF= 25 A|||1.5|V|
|||Tj= 150 °C|||1.0|1.2||
|||Tj= 25° C|IF= 50 A|||1.8||
|||Tj= 150° C|||1.25|1.5||



1. Pulse test: tp = 5 ms,  < 2% 

2. Pulse test: tp = 380 µs,  < 2% 

To evaluate the conduction losses use the following equation: 

P = 0.9 x IF(AV) + 0.012 IF[2] (RMS) 

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DocID024734 Rev1 

**STTH50W03C** 

**Characteristics** 

**Table 5. Dynamic electrical characteristics per diode** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IRM<br>Reverse recovery current|Reverse recovery current|Tj= 125 °C|IF= 25 A, VR= 200 V<br>dIF/dt = -200 A/µs||7|9|A|
|QRR<br>Reverse recovery charge|Reverse recovery charge||||170||nC|
|Sfactor<br>Softness factor|Softness factor||||0.3|||
|trr<br>Reverse recovery time|Reverse recovery time|Tj= 25 °C|IF= 1 A, VR= 30 V<br>dIF/dt = -100 A/µs||20|27|ns|
|tfr<br>Forward recovery time|Forward recovery time|Tj= 25 °C|IF= 25 A, VFR= 1.2 V<br>dIF/dt = 400 A/µs|||120|ns|
|VFP<br>Forward recovery voltage|Forward recovery voltage||||2.5|3.6|V|



**Figure 1. Average forward power dissipation versus average forward current (per diode)** 

**Figure 2. Forward voltage drop versus forward current (typical values, per diode)** 

**==> picture [438 x 136] intentionally omitted <==**

**----- Start of picture text -----**<br>
45 PFA(V) [(W)] 1000.0 I F (A)<br>40 = 0.5 = 1<br>= 0.2<br>35 BEER 100.0<br>= 0.1 Ee ee | ERR<br>30 = 0.05<br>25 esey2AA A 10.0 to_ T j = 150 °C ZtA Tj = 25 °C 1a+ | 1<br>20<br>FEROS EE | = S4SeeS===—=<br>15 A ral Z| eS A SY A SS SS SS<br>A) A ee<br>10 SIE T 1.0 Lj] f | | |_| | | |_| _<br>5 Ir I F(AV) (A) =tp/T tp Sf V F (V)<br>0 Aor eo 0.1 Eteet ert<br>0 5 10 15 20 25 30 35 0.0 0.5 1.0 1.5 2.0 2.5 3.0<br>**----- End of picture text -----**<br>


**Figure 3. Forward voltage drop versus forward current (maximum values, per diode)** 

**Figure 4. Relative variation of thermal impedance junction to case versus pulse duration** 

**==> picture [439 x 136] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000.0 SS I F (A) 1.0 Zth(j-c)/Rth(j-c) aOe<br>0.9<br>[<br>==ee | 0.8 SIH ee<br>100.0<br>SE]ee Tj = 150 °C ee | 0.7 aSEH ere<br>aSeeee | 0.6 E EEn<br>10.0 ee ee ee Tj = 25 °C | | | | | 0.5 Coe ryea oe<br>0.4<br>esse—36 _=§3332 () GSHAHHH<br>0.3<br>1.0 Seee eee eee a 0.2 seen Single pulse Cetoe ae ettio)ee<br>Ff ee HEE<br>V F (V) 0.1 tp(s)<br>0.1 iSERSee eee |  ee 0.0 REE EE TH<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>**----- End of picture text -----**<br>


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**Characteristics** 

**STTH50W03C** 

**Figure 5. Peak reverse recovery current versus dI** F **/dt (typical values, per diode)** 

**Figure 6. Reverse recovery time versus dI** F **/dt (typical values, per diode)** 

**==> picture [462 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
IRM (A) tRR(ns)<br>16 100<br>14 V T IjR F = I = = 200 V  125 F(AV)°C 9080 VTI FRj  = I == 200 V 125 F(AV) °C<br>12<br>70<br>10 60<br>8 50<br>6 40<br>30<br>4<br>20<br>2<br>dIF/dt(A/µs) 10 dIF/dt(A/µs)<br>0 0<br>0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


**Figure 7. Reverse recovery charges versus dI** F **/dt (typical values, per diode)** 

**==> picture [215 x 135] intentionally omitted <==**

**----- Start of picture text -----**<br>
300 QRR(nC)<br>I F =I F(AV)<br>250 T VjR =125 °C =200 V<br>200<br>150<br>100<br>50<br>dI F /dt(A/µs)<br>0<br>0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


**Figure 8. Reverse recovery softness factor versus dI** F **/dt (typical values, per diode)** 

**==> picture [204 x 134] intentionally omitted <==**

**----- Start of picture text -----**<br>
S FACTOR<br>0.8<br>IF=IF(AV)<br>0.7 TVjR=125 °C=200 V<br>0.6<br>0.5<br>0.4<br>0.3<br>0.2<br>0.1<br>dI F /dt(A/µs)<br>0.0<br>0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


**Figure 9. Relative variations of dynamic parameters versus junction temperature** 

**==> picture [203 x 137] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.0<br>S FACTOR IF=IF(AV)<br>1.5 Reference: TVjR=125 °C=200 V<br>1.0<br>IRM<br>0.5<br>QRR<br>0.0<br>25 50 75 100 125<br>Tj(°C)<br>**----- End of picture text -----**<br>


**Figure 10. Transient peak forward voltage versus dI** F **/dt (typical values, per diode)** 

**==> picture [204 x 131] intentionally omitted <==**

**----- Start of picture text -----**<br>
VFP(V)<br>5<br>IF= IF(AV)<br>T j = 125°C<br>4<br>3<br>2<br>1<br>dIF/dt(A/µs)<br>0<br>200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


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**STTH50W03C** 

**Characteristics** 

**Figure 11. Forward recovery time versus dI** F **/dt Figure 12. Junction capacitance versus reverse (typical values, per diode) voltage applied (typical values, per diode)** 

**==> picture [462 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
140 tFR(ns) 100 C(pF)<br>I F = I  F(AV) F = 1 MHz<br>120 V R = 1.2 V V OSC = 30 mV RMS<br>Tj= 125°C T j  = 25°C<br>100<br>80<br>60<br>40<br>20<br>dIF/dt(A/µs) VR(V)<br>0 10<br>200 250 300 350 400 450 500 1 10 100 1000<br>**----- End of picture text -----**<br>


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**STTH50W03C** 

**Package information** 

## **2 Package information** 

- Epoxy meets UL94, V0 

- Cooling method: by conduction (C) 

- Recommended torque value: 0.5 N·m 

- Maximum torque value: 1.0 N·m 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _www.st.com_ . ECOPACK[®] is an ST trademark. 

## **Figure 13. TO-247 dimension definitions** 

**==> picture [212 x 252] intentionally omitted <==**

**----- Start of picture text -----**<br>
V<br>V Dia.<br>A<br>H<br>L5<br>L<br>L2 L4<br>F1 F2 L1<br>F3<br>D<br>V2 L3<br>F4<br>F(x3)<br>M E<br>G<br>=      =<br>**----- End of picture text -----**<br>


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**Package information** 

**Table 6. TO-247 dimension values** 

||**Table 6. TO-247 dimension values**|**Table 6. TO-247 dimension values**|**Table 6. TO-247 dimension values**|**Table 6. TO-247 dimension values**|**Table 6. TO-247 dimension values**|**Table 6. TO-247 dimension values**|
|---|---|---|---|---|---|---|
|**Ref.**|**Dimensions**||||||
||**Millimeters**|||**Inches**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ**|**Max.**|
|A|4.85||5.15|0.191||0.203|
|A1|2.20||2.60|0.086||0.102|
|b|1.00||1.40|0.039||0.055|
|b1|2.00||2.40|0.078||0.094|
|b2|3.00||3.40|0.118||0.133|
|c|0.40||0.80|0.015||0.031|
|D(1)|19.85||20.15|0.781||0.793|
|E|15.45||15.75|0.608||0.620|
|e|5.30|5.45|5.60|0.209|0.215|0.220|
|L|14.20||14.80|0.559||0.582|
|L1|3.70||4.30|0.145||0.169|
|L2|18.50 typ.|||0.728 typ.|||
|P(2)|3.55||3.65|0.139||0.143|
|R|4.50||5.50|0.177||0.217|
|S|5.30|5.50|5.70|0.209|0.216|0.224|



1. Dimension D plus gate protrusion does not exceed 20.5 mm. 

2. Resin thickness around the mounting hole is not less than 0.9 mm. 

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**Ordering information** 

**STTH50W03C** 

## **3 Ordering information** 

**Table 7. Ordering information** 

|**Ordering type**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|STTH50W03CW|STTH50W03CW|TO-247|4.46 g|50|Tube|



## **4** 

## **Revision history** 

**Table 8. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|09-Aug-2013|1|First issue.|



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