# Fast / Ultrafast Diode, 600 V, 3 A, Single, 1.7 V, 35 ns, 45 A

![Product image](https://novapart.co/image/farnell:2341611/)

**URL**: https://novapart.co/products/STTH3R06S/fast-ultrafast-diode-600-v-3-a-single-17-35-ns-45
**SKU**: STTH3R06S
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.1980
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 2 Pin |
| Product Range | STTH3 |
| Diode Case Style | DO-214AB (SMC) |
| Diode Configuration | Single |
| Forward Voltage Max | 1.7V |
| Forward Surge Current | 45A |
| Reverse Recovery Time | 35ns |
| Average Forward Current | 3A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 600V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2341611/)

## ® **STTH3R06** ~~To~~ TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER **Table 1: Main Product Characteristics** 

**IF(AV) 3 A VRRM 600 V IR (max) 100 µA T 175°C j VF (typ) 1.0 V trr (typ) 35 ns** ~~a7~~ **FEATURES AND BENEFITS** 

- Ultrafast switching 

- Low forward voltage drop 

- Low thermal resistance 

- Low leakage current (platinium doping) 

## **DESCRIPTION** 

The STTH3R06, which is using ST Turbo 2 600V technology, is specially suited for use in switching power supplies, inverters and as a free wheeling diode. 

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A K<br>**----- End of picture text -----**<br>


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DO-201AD<br>STTH3R06<br>SMB SMC<br>STTH3R06U STTH3R06S<br>**----- End of picture text -----**<br>


**Table 2: Order Codes** 

|**Part Number**<br>~~a~~|**Marking**|
|---|---|
|STTH3R06<br>~~a~~|STTH3R06|
|STTH3R06RL<br>~~a~~|STTH3R06|
|STTH3R06U<br>~~a~~|3R6U|
|STTH3R06S<br>~~a~~|R6S|



September 2005 

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REV. 3 

**STTH3R06** 

**Table 3: Absolute Ratings** (limiting values) 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||600|V|
|IF(RMS)|RMS forward current|||10|A|
|IF(AV)|Average forward current<br>δ= 0.5|DO-201AD|Tl = 80°C|3|A|
|||SMB|Tl = 55°C|||
|||SMC|Tl = 80°C|||
|IFSM|Surge non repetitive forward current|DO-201AD|tp = 10ms<br>sinusoidal|55|A|
|||SMB / SMC||45||
|Tstg|Storage temperature range|||-65 to + 175|°C|
|Tj|Maximum operating junction temperature|||175|°C|



**Table 4: Thermal Parameters** 

|**Symbol**|**Parameter**||**Maximum**|**Unit**|
|---|---|---|---|---|
|Rth(j-l)|Junction to lead|DO-201AD    L = 10 mm|20|°C/W|
|||SMB|25||
|||SMC|20||
|Rth(j-a)|Junction to ambient (see fig. 13)|DO-201AD    L = 10 mm|75|°C/W|



**Table 5: Static Electrical Characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR|Reverse leakage current|Tj= 25°C|VR= VRRM|||3|µA|
|||Tj= 150°C|||15|100||
|VF|Forward voltage drop|Tj= 25°C|IF= 3A|||1.7|V|
|||Tj= 150°C|||1.0|1.25||



2 To evaluate the conduction losses use the following equation: P = 1.03 x IF(AV) + 0.09 IF (RMS) 

**Table 6: Dynamic Characteristics** 

|**Symbol**|**Parameter**||**Test conditions**|**Min.**|**Typ**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|trr|Reverse recovery<br>time|Tj= 25°C|IF= 0.5A   IRR= 0.25A  IR= 1A|||30|ns|
||||IF= 1A   dIF/dt = -50 A/µs  VR=30V||35|||
|tfr|Forward recovery<br>time|Tj= 25°C|IF= 3A      dIF/dt = 100 A/µs<br>VFR= 1.1 x VFmax|||100|ns|
|VFP|Forward recovery<br>voltage||IF= 3A      dIF/dt = 100 A/µs|||10|V|



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**STTH3R06** 

**Figure 1: Conduction losses versus average current** 

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**----- Start of picture text -----**<br>
P(W)<br>5.0<br>δ = 0.1 δ = 0.2 δ = 0.5<br>4.5 δ = 0.05<br>4.0 δ = 1<br>3.5<br>3.0<br>2.5<br>2.0<br>1.5<br>T<br>1.0<br>0.5 IF(AV)(A) δ [=tp/T] tp<br>0.0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0<br>**----- End of picture text -----**<br>


**Figure 3: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy printed circuit FR4, Lleads = 10mm, SCU=1cm[2] )** 

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Zth(j-a)/Rth(j-a)<br>1.0<br>0.9<br>0.8<br>0.7<br>0.6<br>SMC<br>0.5 SCu = 1cm2<br>0.4 SMB<br>SCu = 1cm2<br>0.3 DO-201AD<br>0.2 Single pulse Lleads = 10mm<br>0.1 tp(s)<br>0.0<br>1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>Figure 5: Reverse recovery time versus dIFF/dt<br>(typical values)<br>trr(ns)<br>160<br>150 VT =125°CjR=400V<br>140<br>130<br>120 IF=2 x IF(AV)<br>110<br>10090 IF=IF(AV) IF=0.5 x IF(AV)<br>80<br>70<br>60<br>50<br>40<br>30<br>20<br>10 dIF/dt(A/µs)<br>0<br>0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


**Figure 5: Reverse recovery time versus dIFF/dt (typical values)** 

**Figure 2: Forward voltage drop versus forward current** 

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IFM(A)<br>50<br>45<br>T =150°Cj<br>40 (maximum values)<br>35<br>30 T =150°Cj<br>(typical values)<br>25 T =25°Cj<br>(maximum values)<br>20<br>15<br>10<br>5<br>VFM(V)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0<br>**----- End of picture text -----**<br>


**Figure 4: Peak reverse recovery current versus dIF/dt (typical values)** 

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IRM(A)<br>13<br>12 VR=400V<br>11 T =125°Cj IF=2 x IF(AV)<br>10<br>9 IF=IF(AV)<br>8 IF=0.5 x IF(AV)<br>7<br>6 IF=0.25 x IF(AV)<br>5<br>4<br>3<br>2<br>1 dIF/dt(A/µs)<br>0<br>0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


**Figure 6: Reverse recovery charges versus dIF/dt (typical values)** 

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Qrr(nC)<br>450<br>VR=400V<br>400 T =125°Cj<br>350 IF=2 x IF(AV)<br>300<br>250 IF=IF(AV)<br>200<br>IF=0.5 x IF(AV)<br>150<br>100<br>50<br>dIF/dt(A/µs)<br>0<br>0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


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**Figure 7: Softness factor versus dIF/dt (typical values)** 

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S factor<br>3.0<br>IF=IF(AV)<br>VR=400V<br>2.5 T =125°Cj<br>2.0<br>1.5<br>1.0<br>0.5<br>dIF/dt(A/µs)<br>0.0<br>0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


**Figure 9: Transient peak forward voltage versus dIF/dt (typical values)** 

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VFP(V)<br>20<br>18 IT =125°CFj=IF(AV)<br>16<br>14<br>12<br>10<br>8<br>6<br>4<br>2 dIF/dt(A/µs)<br>0<br>0 20 40 60 80 100 120 140 160 180 200<br>**----- End of picture text -----**<br>


**Figure 11: Junction capacitance versus reverse voltage applied (typical values)** 

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C(pF)<br>100<br>F=1MHz<br>VOSC=30mVRMS<br>T =25°Cj<br>10<br>VR(V)<br>1<br>1 10 100 1000<br>**----- End of picture text -----**<br>


**Figure 8: Relative variations of dynamic parameters versus junction temperature** 

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1.0<br>0.9 S factor<br>0.8 IRM<br>0.7<br>0.6 QRR<br>0.5<br>0.4<br>0.3<br>IF=IF(AV)<br>0.2 VR=400V<br>Reference: T =125°Cj<br>0.1 T (°C)j<br>0.0<br>25 50 75 100 125<br>Figure 10: Forward recovery time versus dIF/dtF/dt/dt<br>(typical values)<br>tfr(ns)<br>200<br>IF=IF(AV)<br>180 VFR=1.1 x VF max.<br>T =125°Cj<br>160<br>140<br>120<br>100<br>80<br>60<br>40<br>20 dIF/dt(A/µs)<br>0<br>0 20 40 60 80 100 120 140 160 180 200<br>Figure 12: Thermal resistance junction to<br>ambient versus copper surface under lead<br>(epoxy FR4, eCU=35µm) (DO-201AD)CU=35µm) (DO-201AD)=35µm) (DO-201AD)<br>Rth(j-a)(°C/W)<br>80<br>70<br>60<br>DO-201AD<br>50<br>40<br>30<br>20<br>10<br>SCU(cm²)<br>0<br>0 1 2 3 4 5 6 7 8 9 10<br>**----- End of picture text -----**<br>


**Figure 10: Forward recovery time versus dIF/dtF/dt/dt (typical values)** 

**Figure 12: Thermal resistance junction to ambient versus copper surface under lead (epoxy FR4, eCU=35µm) (DO-201AD)CU=35µm) (DO-201AD)=35µm) (DO-201AD)** 

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**Figure 13** : **Thermal resistance junction to ambient versus copper surface under lead (epoxy FR4, eCU=35µm) (SMB / SMC)** 

## **Figure 14** : **Thermal resistance versus lead length** 

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Rth(j-a)(°C/W) Rth(°C/W)<br>110 100<br>DO-201AD<br>100 90<br>90 80 Rth(j-a)<br>80<br>70<br>SMB<br>70<br>60<br>60 SMC 50<br>50<br>40<br>40 Rth(j-l)<br>30<br>30<br>20 20<br>10 SCU(cm²) 10 Llead(mm)<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 10 15 20 25<br>**----- End of picture text -----**<br>


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**STTH3R06** 

**Figure 15: SMB Package Mechanical Data** 

||||||||||b|b|b|**REF.**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||||||||**Millimeters**||**Inches**||
|C||E1||||L<br>D<br>A<br>A2|||||||||||
||||||||||||||**Min.**|**Max.**|**Min.**|**Max.**|
||||||||||||||||||
|||||||||||||A1|1.90|2.45|0.075|0.096|
|||||||||||||A2|0.05|0.20|0.002|0.008|
|||E||||||||||b|1.95|2.20|0.077|0.087|
|||||||||||||c|0.15|0.41|0.006|0.016|
||||||||||||||||||
||||||||1|||||E|5.10|5.60|0.201|0.220|
|||||||||||||E1|4.05|4.60|0.159|0.181|
||||||||||||||||||
|||||||||||||D|3.30|3.95|0.130|0.156|
||||||||||||||||||
|||||||||||||L|0.75|1.60|0.030|0.063|



**Figure 16: SMB Foot Print Dimensions** (in millimeters) 

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2.3<br>1.52 2.75 1.52<br>**----- End of picture text -----**<br>


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**Figure 17: SMC Package Mechanical Data** 

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E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br>


|**REF.**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|**DIMENSIONS**|
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.075|0.096|
|A2|0.05|0.20|0.002|0.008|
|b|2.90|3.2|0.114|0.126|
|c|0.15|0.41|0.006|0.016|
|E|7.75|8.15|0.305|0.321|
|E1<br>|6.60|7.15|0.260|0.281|
|E2|4.40|4.70|0.173|0.185|
|D|5.55|6.25|0.218|0.246|
|L|0.75|1.60|0.030|0.063|



**Figure 18: SMC Foot Print Dimensions** (in millimeters) 

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3.3<br>2.0 4.2 2.0<br>**----- End of picture text -----**<br>


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## **Figure 19: DO-201AD Package Mechanical Data** 

**==> picture [448 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
DIMENSIONS<br>B A B ØC<br>REF. Millimeters Inches<br>note 1 E E note 1 Min. Max. Min. Max.<br>A 9.50 0.374<br>B 25.40 1.000<br>C 5.30 0.209<br>D 1.30 0.051<br>ØD ØD E 1.25  0.049<br>1 - The lead diameter ø D is not  controlled over zone E<br>note 2 NOTES 2 - The minimum axial length within which the device<br>may be placed with its leads bent at right angles is<br>0.59"(15 mm)<br>**----- End of picture text -----**<br>


In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 

**Table 7: Ordering Information** 

|**Ordering type**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery**<br>**mode**|
|---|---|---|---|---|---|
|STTH3R06|STTH3R06|DO-201AD|1.12g|600|Ammopack|
|STTH3R06-RL|STTH3R06|DO-201AD|1.12g|1900|Tape & reel|
|STTH3R06U|3R6U|SMB|0.11g|2500|Tape & reel|
|STTH3R06S|R6S|SMC|0.243g|2500|Tape & reel|



- Epoxy meets UL94, V0 

- Band indicated cathode (DO-201AD) 

- Bending method: see application note **AN1471** (DO-201AD) 

**Table 8: Revision History** 

|**Date**|**Revision**|**Description of Changes**|
|---|---|---|
|March-2003|1|First issue|
|07-Sep-2004|2|SMB and SMC packages added|
|14-Oct-2005|3|Changed marking of STTH3R06U from R06U to 3R6U on<br>page 1. Added ECOPACK statement.|



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**STTH3R06** 

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners 

© 2005 STMicroelectronics - All rights reserved 

**STMicroelectronics group of companies** 

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**www.st.com** 

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- [Supplier page](https://es.farnell.com/en-ES/stmicroelectronics/stth3r06s/diode-fast-3a-600v-do-214ab-2/dp/2341611)
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