# Fast / Ultrafast Diode, 400 V, 3 A, Single, 1.5 V, 35 ns, 60 A

![Product image](https://novapart.co/image/farnell:3214518/)

**URL**: https://novapart.co/products/STTH3R04QRL/fast-ultrafast-diode-400-v-3-a-single-15-35-ns-60
**SKU**: STTH3R04QRL
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.0500
**Stock**: 10+

## Description

Repetitive Reverse Voltage Vrrm Max:400V; Forward Current If(AV):3A; Diode Configuration:Single; Forward Voltage VF Max:1.5V; Reverse Recovery Time trr Max:35ns; Forward Surge Current

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2 Pin |
| Product Range | - |
| Qualification | - |
| Diode Case Style | DO-15 (DO-204AC) |
| Diode Configuration | Single |
| Forward Voltage Max | 1.5V |
| Forward Surge Current | 60A |
| Reverse Recovery Time | 35ns |
| Average Forward Current | 3A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 400V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3214518/)

**==> picture [61 x 39] intentionally omitted <==**

## **STTH3R04** 

## Ultrafast recover diode y 

## **Features** 

- Negligible switching losses 

- Low forward and reverse recovery times 

- High junction temperature 

## **Description** 

The STTH3R04 series uses ST's new 400 V planar Pt doping technology. The STTH3R04 is specially suited for switching mode base drive and transistor circuits. 

Packaged in axial and surface mount packages, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. 

**==> picture [151 x 168] intentionally omitted <==**

**----- Start of picture text -----**<br>
A K<br>DO-15 DO-201AD<br>STTH3R04Q STTH3R04<br>Band indicates cathode side.<br>SMB SMC<br>STTH3R04U STTH3R04S<br>**----- End of picture text -----**<br>


## **Table 1. Device summary** 

|IF(AV)|3 A|
|---|---|
|VRRM|400 V|
|Tj (max)|175 °C|
|VF(typ)|0.9 V|
|trr(typ)|18 ns|



1/10 

May 2008 

Rev 1 

_www.st.com_ 

**Characteristics** 

**STTH3R04** 

## **1 Characteristics** 

**Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||400|V|
|IF(AV)|Average forward current,δ= 0.5|DO-15|Tlead= 70 °C|3.0|A|
|||DO-201AD|Tlead= 80 °C|||
|||SMB|Tlead= 70 °C|||
|||SMC|Tlead= 100 °C|||
|IFSM|Surge non repetitive forward current|tp= 10 ms Sinusoidal||60|A|
|Tstg|Storage temperature range|||-65 to +175|°C|
|Tj|Maximum operating junction temperature(1)|||175|°C|



1. On infinite heatsink with 10 mm lead length 

## **Table 3. Thermal parameters** 

|**Symbol**|**Parameter**|**Parameter**||**Value**|**Unit**|
|---|---|---|---|---|---|
|Rth(j-l)|Junction to lead|Lead length = 10 mm<br>on infinite heatsink|DO-15|25|°C/W|
||||DO-201AD|22||
|Rth(j-l)|Junction to lead||SMB|25||
||||SMC|17||



## **Table 4. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR<br>(1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|||5|µA|
|||Tj= 125 °C|||5|50||
|VF<br>(2)|Forward voltage drop|Tj= 25 °C|IF= 3.0 A|||1.5|V|
|||Tj= 100 °C|||1.0|1.25||
|||Tj= 150 °C|||0.9|1.15||



1. Pulse test: tp = 5 ms, δ < 2 % 

2. Pulse test: tp = 380 µs, δ < 2 % 

To evaluate the conduction losses use the following equation: P = 0.9 x IF(AV) + 0.083 x IF[2] (RMS) 

2/10 

**STTH3R04** 

**Characteristics** 

**Table 5. Dynamic characteristics (Tj = 25 °C unless otherwise stated)** 

|**Symbol**<br>**Parameter**|**Parameter**<br>**Test conditions**<br>**Min**|**Typ**<br>**Max**|**Unit**|
|---|---|---|---|
|trr<br>Reverse recovery time|Reverse recovery time<br>IF= 1 A, dIF/dt = -50 A/µs,<br>VR= 30 V, Tj= 25 °C<br>IF= 1 A, dIF/dt = -100 A/µs,<br>VR= 30 V, Tj= 25 °C|35|ns|
|||18<br>25||
|IRM<br>Reverse recovery current|Reverse recovery current<br>IF= 3.0 A, dIF/dt = -200 A/µs,<br>VR= 320 V, Tj= 125 °C|4<br>5.5|A|
|tfr<br>Forward recovery time|Forward recovery time<br>IF= 3.0 A      dIF/dt = 100 A/µs<br>VFR= 1.1 x VFmax, Tj= 25 °C|75|ns|
|VFP<br>Forward recovery voltage|Forward recovery voltage<br>IF= 3.0 A      dIF/dt = 100 A/µs|2.5|V|



## **Figure 1. Conduction losses versus average forward current** 

**Figure 2. Forward voltage drop versus forward current** 

**==> picture [441 x 134] intentionally omitted <==**

**----- Start of picture text -----**<br>
P(W) IFM(A)<br>4.5 50<br>COT δ=0.05 δ=0.1 δ=0.2 - δ=0.5 δ=1 CTE EEE<br>4.0 EFFFEYa Ay | fig iti id7 45 e a Y e e Ae a<br>3.5 ira| | | | 7YAYt A AY| Vin A | a | | f 4035 atoooo A (Maximum values)TJ=150°C enCo eP e<br>3.0 rot | | [7] A TAT TY ry) tT tT a Poop t<br>30<br>2.5 Ate a RS SS SS SS AOYESEoP<br>25<br>2.01.5 1ec| | [7( 7A yr] | tt 20 aTT| (TypicalTJ=150°Cvalues) aa aaa<br>15<br>1.0 T 10 (Maximum values)TJ=25°C<br>0.5 IF(AV)(A) δ [=tp/T] tp 5 VFM(V)<br>0.0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2<br>**----- End of picture text -----**<br>


**Figure 3. Relative variation of thermal impedance junction to lead versus pulse duration, DO-15 (epoxy FR4, copper thickness = 35 µm)** 

**Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration, DO-201AD (epoxy FR4, copper thickness = 35 µm)** 

**==> picture [442 x 133] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-l)/Rth(j-l) Zth(j-a)/Rth(j-a)<br>1.00.9 LleadsDO-15=10mm ono aA 1.00.9 LDO-201ADleads=10mm a Ct A<br>0.8 Eee oo ee 0.8 A<br>eo oon oe a<br>0.7 aEen ot ee 0.7 aeco otooh<br>0.6 CeoCeo othoot on 0.6 ecoa oeoh<br>0.5 Een oth A 0.5 econ<br>A Aoot ooh<br>0.4 CeoEe ooEoZoo 0.4 Aee<br>0.3 2 0.3 A<br>7 a<br>0.2 CE eae Ee oo 0.2 ec<br>0.1 Paa Single pulse 0 tP(s) mi 0.1 ecoCert Single pulse Coteenoo [oo] tP(s) nmmt<br>0.0 oo oot ot Cit 0.0 Seti cont oh i<br>1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br>


3/10 

**Characteristics** 

**STTH3R04** 

**Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration, SMB (epoxy FR4, copper thickness = 35 µm)** 

**Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration, SMC** 

**==> picture [462 x 150] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0 Zth(j-a)/Rth(j-a) 1.0 Zth(j-a)/Rth(j-a)<br>SMB SMC<br>0.9 SCu=1cm² 0.9 SCu=1cm²<br>0.8 0.8<br>0.7 0.7<br>0.6 0.6<br>0.5 0.5<br>0.4 0.4<br>0.3 0.3<br>0.2 0.2<br>0.1 Single pulse tP(s) 0.1 Single pulse tP(s)<br>0.0 0.0<br>1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br>


**Figure 7. Junction capacitance versus reverse voltage applied (typical values)** 

**Figure 8. Reverse recovery charges versus dIF/dt (typical values)** 

**==> picture [462 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 C(pF) 100 QRR(nC)<br>VOSCF=1MHz=30mVRMS 90 VIRF=320 V= 3 A<br>Tj=25°C 80<br>70 Tj=125 °C<br>60<br>10 50<br>40<br>30<br>20 Tj=25 °C<br>VR(V) 10 dIF/dt(A/µs)<br>1 0<br>1 10 100 1000 10 100 1000<br>**----- End of picture text -----**<br>


**Figure 9. Reverse recovery time versus dIF/dt (typical values)** 

**Figure 10. Peak reverse recovery current versus dI** F **/dt (typical values)** 

**==> picture [462 x 148] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 tRR(ns) 8 IRM(A)<br>90 VIRF=320 V= 3 A 7 VIRF=320 V= 3 A<br>80<br>6<br>70<br>60 5<br>50 4 Tj=125 °C<br>40 Tj=125 °C 3<br>30 Tj=25 °C 2 Tj=25 °C<br>20<br>1<br>10 dIF/dt(A/µs) dIF/dt(A/µs)<br>0 0<br>10 100 1000 10 100 1000<br>**----- End of picture text -----**<br>


4/10 

**STTH3R04** 

**Characteristics** 

## **Figure 11. Relative variations of dynamic parameters versus junction temperature** 

**==> picture [210 x 137] intentionally omitted <==**

**----- Start of picture text -----**<br>
QRR; IRM [Tj] / QRR; IRM [Tj=125°C]<br>1.4<br>IF= 3 A<br>1.2 VR=320 V<br>1.0<br>IRM<br>0.8<br>0.6 QRR<br>0.4<br>0.2<br>Tj(°C)<br>0.0<br>25 50 75 100 125 150<br>**----- End of picture text -----**<br>


## **Figure 12. Transient peak forward voltage versus dIF/dt (typical values)** 

**==> picture [209 x 135] intentionally omitted <==**

**----- Start of picture text -----**<br>
VFp(V)<br>25<br>IF=3 A<br>Tj=125 °C<br>20<br>15<br>10<br>5<br>dIF/dt(A/µs)<br>0<br>0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


## **Figure 13. Forward recovery time versus dIF/dt (typical values)** 

**==> picture [210 x 135] intentionally omitted <==**

**----- Start of picture text -----**<br>
130 tFR(ns)<br>120 IF=3 A<br>110 Tj=125 °C<br>100<br>90<br>80<br>70<br>60<br>50<br>40<br>30<br>20<br>10 dIF/dt(A/µs)<br>0<br>0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


## **Figure 14. Thermal resistance versus lead length, DO-15** 

**==> picture [209 x 137] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a)(°C/W)<br>120<br>DO-15<br>100<br>80<br>60<br>40<br>20<br>Lleads(mm)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**Figure 15. Thermal resistance junction to ambient versus copper surface under each lead, DO-201AD (epoxy FR4, copper thickness = 35 µm)** 

**Figure 16. Thermal resistance versus lead length, DO-201AD** 

**==> picture [462 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
80 Rth(j-a)(°C/W) 100 Rth(°C/W)<br>DO-201AD 90 DO-201AD<br>70<br>80 Rth(j-a)<br>60<br>70<br>50 60<br>40 50<br>40<br>30 Rth(j-l)<br>30<br>20<br>20<br>10 10 Lleads(mm)<br>SCu(cm²)<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 10 15 20 25<br>**----- End of picture text -----**<br>


5/10 

**STTH3R04** 

**Package information** 

**Figure 17. Thermal resistance junction to ambient versus copper surface under each lead, SMB, SMC (epoxy FR4, copper thickness = 35 µm)** 

**==> picture [209 x 137] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a)(°C/W)<br>120<br>100<br>SMB<br>80<br>60 SMC<br>40<br>20<br>SCU(cm²)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


## **2 Package information** 

- Epoxy meets UL94, V0 

- Cooling method: by conduction (C) 

In order to meet environmental requirements, ST offers these devices in ECOPACK[®] packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at _www.st.com_ . 

|**Table 6.**|**Table 6.**|**Table 6.**|**DO201AD dimensions**|**DO201AD dimensions**|**DO201AD dimensions**|**DO201AD dimensions**|**DO201AD dimensions**|**DO201AD dimensions**|**DO201AD dimensions**||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||||**Ref.**|**Dimensions**||||
||||||||||||**Millimeters**||**Inches**||
||||||||||||**Min.**|**Max.**|**Min.**|**Max.**|
|||**B**||||**A**||**B**|||||||
|||||||||||A||9.50||0.374|
||||**Note**|**1**||**E**<br>**E**||**Note 1**|||||||
|||||||||||B|25.40||1.000||
||||**ØD**||||||||||||
|||||||**Note 2**||||C||5.30||0.209|
|||||**Ø**||**C**|||||||||
|||||||||||D||1.30||0.051|
|||||||||||E||1.25||0.049|
|||||||||||**Notes**|1 - The lead diameter ø D is not<br>controlled over zone E<br>2 - The minimum length which must stay<br>straight between the right angles after<br>bending is 0.59"(15mm)||||
||||||||||||||||



6/10 

**STTH3R04** 

**Package information** 

## **Table 7. DO-15 dimensions** 

||||||**C**|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|---|---|---|---|
||||||||**Millimeters**||**Inches**||
||**C**||**A**||**C**||||||
||||||||||||
||||||||**Min.**|**Max.**|**Min.**|**Max.**|
|||||||A|6.05|6.75|0.238|0.266|
||||||||||||
||**D**|||||B|2.95|3.53|0.116|0.139|
|||||**B**|||||||
|||||||C|26|31|1.024|1.220|
||||||||||||
|||||||D|0.71|0.88|0.028|0.035|



**==> picture [139 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
Table 8. SMB dimensions<br>**----- End of picture text -----**<br>


|**C**||||||**b**|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||**Millimeters**||**Inches**||
||||**E1**||**L**<br>**D**<br>**A1**<br>**A2**|||||||
|||||||||**Min.**|**Max.**|**Min.**|**Max.**|
|||||||||||||
||||||||A1|1.90|2.45|0.075|0.096|
||||||||A2|0.05|0.20|0.002|0.008|
||||**E**||||b|1.95|2.20|0.077|0.087|
||||||||c|0.15|0.40|0.006|0.016|
|||||||||||||
|||||||||||||
||||||||D<br>|3.30<br>|3.95<br>|0.130<br>|0.156<br>|
|||||||||||||
||||||||E|5.10|5.60|0.201|0.220|
||||||||E1|4.05|4.60|0.159|0.181|
|||||||||||||
||||||||L|0.75|1.50|0.030|0.059|



## **Figure 18. Footprint, dimensions in mm (inches)** 

**==> picture [125 x 80] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.62 2.60 1.62<br>(0.064) (0.102) (0.064)<br>2.18<br>(0.086)<br>5.84<br>(0.300)<br>**----- End of picture text -----**<br>


7/10 

**STTH3R04** 

**Package information** 

|**Table 9.**|**Table 9.**|**Table 9.**|**SMC dimensions**|**SMC dimensions**|**SMC dimensions**||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**C**||||||||**b**||**Ref.**|**Dimensions**||||
||||||||||||**Millimeters**||**Inches**||
||||||||||||**Min.**|**Max.**|**Min.**|**Max.**|
||||**E1**||**L**<br>**D**<br>**A1**<br>**A2**||||||||||
|||||||||||A1|1.90|2.45|0.075|0.096|
|||||||||||A2|0.05|0.20|0.002|0.008|
|||||||||||b|2.90|3.20|0.114|0.126|
||||**E**||||||||||||
|||||||||||c|0.15|0.40|0.006|0.016|
|||||||||||D|5.55|6.25|0.218|0.246|
||||||||||||||||
|||||||||||E|7.75|8.15|0.305|0.321|
||||||**L**||||||||||
||||**E2**|||||**b**||E1|6.60|7.15|0.260|0.281|
|||||||||||E2|4.40|4.70|0.173|0.185|
|||||||||||L|0.75|1.50|0.030|0.059|



## **Figure 19. Footprint, dimensions in mm (inches)** 

**==> picture [172 x 105] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.54 5.11 1.54<br>(0.061) (0.201) (0.061)<br>3.14<br>(0.124)<br>8.19<br>(0.322)<br>**----- End of picture text -----**<br>


8/10 

**STTH3R04** 

**Ordering information** 

## **3 Ordering information** 

## **Table 10. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|STTH3R04|STTH3R04|DO-201AD|1.16 g|600|Ammopack|
|STTH3R04RL|STTH3R04|DO-201AD|1.16g|1900|Tape and reel|
|STTH3R04Q|STTH3R04Q|DO-15|0.4 g|1000|Ammopack|
|STTH3R04QRL|STTH3R04Q|DO-15|0.4 g|6000|Tape and reel|
|STTH3R04S|R4S|SMC|0.243 g|2500|Tape and reel|
|STTH3R04U|3R4U|SMB|0.12 g|2500|Tape and reel|



## **4 Revision history** 

## **Table 11. Document revision history** 

|**Date**|**Revision**|**Description of changes**|
|---|---|---|
|30-May-2008|1|First issue|



9/10 

**STTH3R04** 

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10/10 



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