# Fast / Ultrafast Diode, 600 V, 3 A, Single, 1.3 V, 85 ns, 60 A

![Product image](https://novapart.co/image/farnell:2341583/)

**URL**: https://novapart.co/products/STTH3L06S/fast-ultrafast-diode-600-v-3-a-single-13-85-ns-60
**SKU**: STTH3L06S
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.0700
**Stock**: 10+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:600V; Forward Current If(AV):3A; Diode Configuration:Single; Forward Voltage VF Max:1.3V; Reverse Recovery Time trr Max:85ns; Forward Surge Curre

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2 Pin |
| Product Range | STTH3 |
| Qualification | - |
| Diode Case Style | DO-214AB (SMC) |
| Diode Configuration | Single |
| Forward Voltage Max | 1.3V |
| Forward Surge Current | 60A |
| Reverse Recovery Time | 85ns |
| Average Forward Current | 3A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 600V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2341583/)

## **STTH3L06** 

## Turbo 2 ultrafast high voltage rectifier 

Datasheet - production data 

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A K<br>A A<br>K<br>SMB K<br>SMC<br>DO-201AD<br>**----- End of picture text -----**<br>


## **Features** 

- Ultrafast switching 

- Low forward voltage drop 

- Low thermal resistance 

- Low leakage current (platinum doping) 

## **Description** 

This device uses ST Turbo 2 600 V technology, and is particularly suited as boost diode in discontinuous or critical mode power factor corrections. 

It is also intended for use as a freewheeling diode in power supplies and other power switching applications. 

**Table 1: Device summary** 

|**Symbol**|**Value**|
|---|---|
|IF(AV)|3 A|
|VRRM|600 V|
|IR(max.)|100µA|
|Tj(max.)|175 °C|
|VF(typ.)|0.85 V|
|trr(typ.)|60 ns|



**Table 2: Order codes** 

|**Part number**|**Marking**|
|---|---|
|STTH3L06|STTH3L06|
|STTH3L06U|3L6U|
|STTH3L06S|S06|



April 2016 

DocID8322 Rev 4 

1/11 

This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**STTH3L06** 

## **1 Characteristics** 

**Table 3: Absolute ratings (limiting values at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**||**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitivepeak reverse voltage|||600|V|
|IF(RMS)|Forward rms current|||10|A|
|IF(AV)|Average forward current δ =<br>0.5, square wave|DO-201AD/SMC|TI = 100 °C|3|A|
|||SMB|TI = 80 °C|||
|IFSM|Surge non repetitive forward current, tp= 10 ms<br>sinusoidal||DO-201AD|70|A|
||||SMB/SMC|60|A|
|Tstg|Storage temperature range|||-65 to +175|°C|
|Tj|Maximum operating junction temperature|||+175|°C|



**Table 4: Thermal parameters** 

|**Symbol**|**Parameter**|**Parameter**|**Maximum**|**Unit**|
|---|---|---|---|---|
|Rth(j-l)|Junction to lead|DO-201AD L = 10 mm|20<br>25<br>20<br>75|°C/W|
|||SMB|||
|||SMC|||
|Rth(j-a)|Junction to ambient|DO-201AD L = 10 mm|||



**Table 5: Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||3|µA|
|||Tj= 150 °C||-|15|100||
|VF|Forward voltage drop|Tj= 25 °C|IF= 3 A|-||1.3|V|
|||Tj= 150 °C||-|0.85|1.05||



To evaluate the conduction losses use the following equation: 

P = 0.89 x IF(AV) + 0.055 IF[2] (RMS) 

**Table 6: Dynamic characteristics** 

|**Symbol**|**Parameters**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|trr|Reverse<br>recovery time|Tj= 25 °C|IF= 1 A; dIF/dt = -50 A/μs;<br>VR= 30 V|-|60|85|ns|
|tfr|Forward<br>recovery time|Tj= 25 °C|IF= 3 A; dIF/dt = 100<br>A/μs; VFR= 1.1 x VFmax|-||100||
|VFP|Forward<br>recovery<br>voltage||IF= 3 A; dlF/dt = 100 A/µs|-||7.5|V|



2/11 

DocID8322 Rev 4 

**STTH3L06** 

**Characteristics** 

## **1.1 Characteristics (curves)** 

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**----- Start of picture text -----**<br>
Figure 1: Conduction losses versus average  Figure 2: Forward voltage drop versus forward<br>current  current<br>IFM(A)<br>1.E+02<br>4.5 P(W)<br>4.0 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 δ = 1 (MaximumT j = 150values)°C<br>3.5 1.E+01 Tj = 150 °C<br>3.0 (Typical values)<br>2.5<br>2.0 1.E+00 Tj = 25 °C<br>(Maximum values)<br>1.5<br>1.0 T<br>1.E-01<br>0.5 I F(AV) (A) δ = tp/T tp<br>0.00.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 V FM (V)<br>1.E-02<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5<br>**----- End of picture text -----**<br>


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Figure 3: Relative variation of thermal impedance  Figure 4: Peak reverse recovery current versus<br>junction ambient versus pulse duration  dIF/dt (typical values)<br> (epoxy printed circuit FR4, eCU = 35 µm)<br>IRM(A)<br>20<br>1.0 Zth(j-a)/Rth(j-a) 18 TV jR  ==125°400 CV<br>0.9 LDO-201AD leads =10mm 16 IF = 2 x IF(AV)<br>0.8<br>14 I F  = I F(AV)<br>0.7<br>0.6 12 I F = 0.5 x I F(AV)<br>0.5 10<br>0.4 8 IF = 0.25 x IF(AV)<br>0.3 6<br>0.2<br>Single pulse 4<br>0.1 tP(s)<br>0.0 2 dI F /dt(A/µs)<br>1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0<br>0 50 100 150 200 250 300 350 400 450 500<br>Figure 5: Reverse recovery time versus dIF/dt  Figure 6: Reverse recovery charges versus dIF/ dt<br>(typical values)  (typical values)<br>700 tRR(ns) 500 QRR(nC)<br>600 T V j R  =  = 125 400 °C V 450 TV jR ==125400°CV I F = 2 x I F(AV)<br>400<br>500 350 I F = I F(AV)<br>400 IF = 2 x IF(AV) 300 IF = 0.5 x IF(AV)<br>I F = I F(AV) 250<br>300 IF = 0.5 x IF(AV) 200<br>200 150<br>100<br>100<br>50 dIF/dt(A/µs)<br>dIF/dt(A/µs)<br>0 0<br>0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200<br>**----- End of picture text -----**<br>


DocID8322 Rev 4 

3/11 

**Characteristics** 

**STTH3L06** 

**Figure 7: Softness factor versus dIF/dt (typical values)** 

**Figure 8: Relative variations of dynamic parameters versus junction temperature** 

**==> picture [444 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
Sfactor<br>2.0<br>I F = I F(AV)<br>1.8 TVj R  = =125400 ° CV<br>1.6 Fo aEERE RRRESEEEEES | we= ><br>1.4 ESE =<br> EeEEEECEEPRSSER |  a<br>1.2 ERE | eeee<br>1.00.80.6 [eaaaa |  a | | PtOOtT tt Pp ye tt dce||a [bev[ | FT[| | [|[TT| |]<br>0.4 a a aK)<br>a | T°) Retorence: 1) = 125°C<br>0.2 a dIF/dt(A/µs) | os co 7 soo<br>0.0 FEEPEREEPEPE rE I oe !<br>0 20 40 60 80 100 120 140 160 180 200<br>**----- End of picture text -----**<br>


**Figure 9: Transient peak forward voltage versus dIF/dt (typical values)** 

**Figure 10: Forward recovery time versus dIF/dt (typical values)** 

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**----- Start of picture text -----**<br>
VFP(V) tfr(ns)<br>10 200<br>I F = I F(AV) a IF = IF(AV)<br>9 BSE T j = 125 °C 180 a VFR = 1.1 x VF max.<br>8 a EEEEEEEEEEEEES | 160  FREERa Tj = 125 °C<br>7 a = 140 a<br>6 aa 120 eSSS<br>5 See eee 100 a<br>a a<br>4 a cl 80 a<br>3 aa 60 aa a<br>2 40<br>EYEE eet ot ES EEEEEEEEER<br>1 dIF/dt(A/µs) 20 a dlF/dt(A/µs) a<br>0 a PCP 0 FERRERa EERa E  EEEEREEE<br>0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200<br>**----- End of picture text -----**<br>


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Figure 11: Thermal resistance junction to ambient  Figure 12: Thermal resistance versus lead length<br>versus copper surface under lead<br>(epoxy FR4, eCU = 35 μm) (SMB / SMC)<br>100 Rth(j-a)(C°/W) 100 Rth(°C/W)<br>90 90 DO-201AD<br>80 SSREEPEEEEEENEEL SMB PEEP ET PEE ET tT 80 | R th(j-a)<br>70 EEE ETE |  err 70<br>60 PC PERSE SMC 60<br>50 ECECCo PEP CeeeEEE eeeEES 50 eea e e e e eeee eeee<br>40 PITTETTTTT TTT Tit tity } 40 Ef | } R fl th(j-l)<br>30 SERRE 30 UR<br>20 ee ee 20 pf ofee| edee<br>10 S Cu (cm²) 10 Lleads(mm)<br>0 PEESeETT ETE ET PTT} ) 0 epLet| ft ft<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 10 15 20 25<br>**----- End of picture text -----**<br>


4/11 

DocID8322 Rev 4 

**STTH3L06** 

**Package** information 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _**www.st.com**_ . ECOPACK[®] is an ST trademark. 

- Epoxy meets UL94, V0 

- Band indicated cathode (DO-201AD) 

- Bending method: see application note AN1471 (DO-201AD) 

## **2.1 DO-201AD package information** 

**Figure 13: DO-201AD package outline** 

**Table 7: DO-201AD package mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A||9.5||0.3740|
|B|25.4||1.000||
|C||5.3||0.2087|
|D||1.3||0.0512|
|E||1.25||0.0492|



DocID8322 Rev 4 

5/11 

**STTH3L06** 

**Package** information 

## **2.2 SMC package information** 

**Figure 14: SMC package outline** 

**Table 8: SMC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max.** ~~——~~ A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 ~~———~~ b 2.90 3.20 0.1142 0.1260 c 0.15 0.40 0.0059 0.0157 ~~————~~ D 5.55 6.25 0.2185 0.2461 E 7.75 8.15 0.3051 0.3209 E1 6.60 7.15 0.2598 0.2815 ~~—————~~ E2 4.40 4.70 0.1732 0.1850 L 0.75 1.50 0.0295 0.0591 ~~——————~~ 

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Package  information<br>**----- End of picture text -----**<br>


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Figure 15: SMC recommended footprint<br>1.54 5.11 1.54<br>(0.061) (0.201) (0.061)<br>3.14<br>(0.124)<br>8.19<br>(0.323)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


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**STTH3L06** 

## **Package** information 

## **2.3 SMB package information** 

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**----- Start of picture text -----**<br>
Figure 16: SMB package outline<br>**----- End of picture text -----**<br>


|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.0748|0.0965|
|A2|0.05|0.20|0.0020|0.0079|
|b|1.95|2.20|0.0768|0.0867|
|c|0.15|0.40|0.0059|0.0157|
|D|3.30|3.95|0.1299|0.1556|
|E|5.10|5.60|0.2008|0.2205|
|E1|4.05|4.60|0.1594|0.1811|
|L|0.75|1.50|0.0295|0.0591|



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**----- Start of picture text -----**<br>
STTH3L06  Package  information<br>Figure 17: SMB recommended footprint<br>1.62 2.60 1.62<br>0.064 (0.102) 0.064<br>2.18<br>(0.086)<br>5.84<br>(0.230)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


DocID8322 Rev 4 

9/11 

**Ordering** information 

**STTH3L06** 

## **3 Ordering information** 

**Table 10: Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STTH3L06|STTH3L06|DO-201AD|1.12 g|600|Ammopack|
|STTH3L06-RL|STTH3L06|||1900|Tape and reel|
|STTH3L06U|3L6U|SMB|0.11g|2500|Tape and reel|
|STTH3L06S|S06|SMC|0.243 g|2500|Tape and reel|



## **4 Revision history** 

**Table 11: Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|October-2001|1|First issue|
|07-Sep-2004|2|SMB, SMC and DPAKpackages added.|
|14-Oct-2005|3|Changed marking of STTH3L06U from 3L06U to 3L6U.<br>Added ECOPACK statement.|
|29-Apr-2016|4|Removed DPAK package information.<br>Minor text changes|



10/11 

DocID8322 Rev 4 

**STTH3L06** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2016 STMicroelectronics – All rights reserved 

DocID8322 Rev 4 

11/11 



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---

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