# Fast / Ultrafast Diode, 600 V, 30 A, Single, 2.95 V, 55 ns, 200 A

![Product image](https://novapart.co/image/farnell:3528416/)

**URL**: https://novapart.co/products/STTH30RQ06WL/fast-ultrafast-diode-600-v-30-a-single-295-55-ns
**SKU**: STTH30RQ06WL
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €1.1700
**Stock**: 10+
**Lead Time**: 127 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2 Pin |
| Product Range | - |
| Qualification | - |
| Diode Case Style | DO-247LL |
| Diode Configuration | Single |
| Forward Voltage Max | 2.95V |
| Forward Surge Current | 200A |
| Reverse Recovery Time | 55ns |
| Average Forward Current | 30A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 600V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3528416/)

**STTH30RQ06** 

Datasheet 

## 600 V, 30 A ultrafast high voltage rectifier 

## **Features** 

**==> picture [117 x 195] intentionally omitted <==**

**----- Start of picture text -----**<br>
K A<br>K K<br>K A A A<br>D²PAK  NC D²PAK HV NC<br>K K<br>A<br>DO-247 A K<br>K TO-220AC<br>K<br>DO-247 LL A<br>K<br>**----- End of picture text -----**<br>


- High junction temperature capability 

- Ultrafast with soft recovery behavior 

- Low reverse current 

- Low thermal resistance 

- Reduce switching and conduction losses 

- D²PAK HV creepage distance (anode to cathode) = 5.38 mm min. (with top coating) 

- ECOPACK2 compliant (DO-247, TO-220AC, DO-247 LL) 

## **Applications** 

- Output rectification 

- PFC 

- UPS 

- Air conditioning 

- Charging station 

## **Description** 

The STTH30RQ06 has been developed to be used in application requiring a highvoltage secondary rectification for LLC full bridge topology. 

**Product status link** STTH30RQ06 

It is also suited for use in switching power supplies, industrial applications, as rectification, freewheeling and clamping diode. 

|**Product summary**|**Product summary**|
|---|---|
|**IF(AV)**|30 A|
|**VRRM**|600 V|
|**VF (typ.)**|1.45 V|
|**trr (max.)**|30 ns|
|**Tj**|175 °C|



**DS12164** - **Rev 5** - **March 2020** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STTH30RQ06 Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||600|V|
|IF(RMS)|Forward rms current|||50|A|
|IF(AV)|Average forward current|TC= 103 °C, δ = 0.5 square||30|A|
|IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal|D²PAK, D²PAK HV|180|A|
||||TO-220AC, DO-247, DO-247 LL|200||
|Tstg|Storage temperature range|||-65 to<br>+175|°C|
|Tj|Maximum operating junction temperature|||175|°C|



**Table 2. Thermal parameters** 

|**Symbol**|**Parameter**|**Max.**<br>**value**|**Unit**|
|---|---|---|---|
|Rth(j-c)|Junction to case|0.70|°C/W|
|Rth(j-c)|Junction to case DO-247 LL|0.90|°C/W|



For more information, please refer to the following application note: 

- AN5088: Rectifiers thermal management, handling and mounting recommendation 

**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR (1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||40|µA|
|||Tj= 150 °C||-|80|800||
|VF (2)|Forward voltage drop|Tj= 25 °C|IF= 15 A|-||2.45|V|
|||Tj= 150 °C||-|1.15|1.45||
|||Tj= 25 °C|IF= 30 A|-||2.95||
|||Tj= 150 °C||-|1.45|1.85||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: 

P = 1.05 x IF(AV) + 0.026 x IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses: 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

- AN5028: Calculation of turn-off power losses generated by an ultrafast diode 

**DS12164** - **Rev 5** 

**page 2/20** 

**STTH30RQ06 Characteristics** 

**Table 4. Dynamic electrical characteristics** 

|**Symbol**|**Parameter**||**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|trr|Reverse recovery time|Tj= 25 °C|IF= 0.5 A, IR= 1 A, Irr= 0.25 A|-||30|ns|
||||IF= 1 A, VR= 30 V, dlF/dt = -50 A/µs|-|40|55||
|IRM|Reverse recovery current|Tj= 125 °C|IF= 30 A, VR= 400 V, dlF/dt = -200 A/µs|-|8|11|A|
|QRR|Reverse recovery charge|||-|485||nC|
|trr|Reverse recovery time|||-|95||ns|



**DS12164** - **Rev 5** 

**page 3/20** 

**STTH30RQ06 Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**==> picture [481 x 394] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1. Average forward power dissipation versus Figure 2. Average forward power dissipation versus<br>average forward current (square waveform) average forward current (sinusoidal waveform)<br>PF(AV)         )(W PF( AV )(W)<br>100 100<br>δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.1 δ = 0.2 δ = 0.5 δ = 1<br>δ = 0.05<br>80 δ = 0.5 80<br>TUTTEoasnwasaneceera HE Ad aptpete<br>δ = 1<br>60 ST 60 SEE eo<br>Oe aes ayenyae7ene<br>40 ST LZ 40 STDSOO  LOKAA<br>TLL T anv ee“ee C<br>20 VE 20 AZT TE pty<br>IF(AV)(A) δ =tp/T tp IF( AV ) (A)<br>0 Ye>_aann 7 a iL 0 Yeraan - -<br>0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40<br>Figure 4. Average forward power dissipation versusAverage forward power dissipation versus<br>Figure 3. Average forward power dissipation versusAverage forward power dissipation versus<br>average forward current (sinusoidal waveform, DO-247<br>average forward current (square waveform, DO-247 LL)<br>LL)<br>PF(AV)         )(W<br>100 PF( AV )(W)<br>δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 100 δ = 0.1 δ = 0.2 δ = 0.5 δ = 1<br>80 SS 80 eee δ = 0.05<br>SN Ee YY<br>δ = 1<br>60 He LES AHH Coy Ye<br>H+ eee 60 Eee<br>OAL<br>40 HH eee<br>HY 40<br>+A Aer T eee ae<br>20<br>Lane 20 CLAEZETECE pp<br>IF(AV)(A) δ =tp/T tp I F( AV ) (A)<br>0 ay aepgeees 2 See, aneeeee<br>0 oo 5 10 15 20 25 _ 30 35 40 0 BS<br>0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br>


**Figure 4. Average forward power dissipation versusAverage forward power dissipation versus average forward current (sinusoidal waveform, DO-247 LL)** 

**Figure 3. Average forward power dissipation versusAverage forward power dissipation versus average forward current (square waveform, DO-247 LL)** 

**Figure 5. Forward voltage drop versus forward current (typical values)** 

**Figure 6. Forward voltage drop versus forward current (maximum values)** 

**==> picture [467 x 137] intentionally omitted <==**

**----- Start of picture text -----**<br>
100.0 I F(A) T jJ = 150 175°°CC 100.0 I F(A) T jJ = 150 175°°CC<br>2. T jJ = 150°C 150°C T Jj = 150°C 150°C =<br>T Jj = 150°C 25°C<br>10.0 T Jj = 150 25°°CC 10.0<br>1.0 S517 4neeeeeeE8 1.0 YZ<br>VF (V) VF (V)<br>0.1 ITE 0.1 ro<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5<br>0.0 1.0 2.0 3.0 4.0<br>**----- End of picture text -----**<br>


**DS12164** - **Rev 5** 

**page 4/20** 

**STTH30RQ06 Characteristics (curves)** 

**Figure 7. Relative variation of thermal impedance junction Figure 8. Peak reverse recovery current versus dIF/dt to case versus pulse duration (typical values)** 

**==> picture [480 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth (j-c)/Rth(j-c) IRM(A)<br>1.0<br>20<br>0.9 Single pulse T V j R  = 125    = 400 V° C<br>0.8<br>15<br>0.7<br>0.6<br>0.5 10 IF = 30 A<br>0.4 IF = 15 A<br>0.3<br>0.2 5 I F  = 7.5 A<br>0.1 tp( s) dI F / dt(A/µs)<br>0.0 0<br>1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


**Figure 9. Reverse recovery time versus dIF/dt (typical Figure 10. Reverse recovery charges versus dIF/dt (typical values) values)** 

**==> picture [227 x 143] intentionally omitted <==**

**----- Start of picture text -----**<br>
tRR(ns)<br>240<br>V R  = 400 V<br>200 Tj = 125  °C<br>160<br>IF = 30 A<br>120<br>80<br>IF = 15 A<br>40<br>I F  = 7.5 A dI F /dt(A/µs)<br>0<br>0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


**==> picture [227 x 140] intentionally omitted <==**

**----- Start of picture text -----**<br>
QRR(nC)<br>800<br>VR = 400 V<br>T j  = 125  °C<br>600<br>IF = 30 A<br>I F  = 15 A<br>400<br>200 IF = 7.5 A<br>dI F /dt(A/µs)<br>0<br>0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


**==> picture [513 x 192] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 11. Reverse recovery softness factor versus dIF/dt Figure 12.  Relative variations of dynamic parameters<br>(typical values) versus junction temperature<br>Sfactor<br>2.0<br>2.0 IF = IF(AV)<br>VR = 400 V V R  = 400 V<br>Tj = 125  °C 1.6 Reference :Tj = 125 °C<br>1.6<br>1.2 1.2 SFACTOR<br>0.8<br>0.8 IRM<br>0.4<br>0.4<br>dI F /dt(A/µs) 0.0 Q RR Tj(°C)<br>0.0 25 50 75 100 125<br>0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


**DS12164** - **Rev 5** 

**page 5/20** 

**STTH30RQ06 Characteristics (curves)** 

**==> picture [513 x 203] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 14.  Thermal resistance junction to ambient versus<br>Figure 13. Junction capacitance versus reverse voltage<br>copper surface under tab (typical values, epoxy printed<br>applied (typical values)<br>board FR4, eCu = 35 µm)(D²PAK and D²PAK HV)<br>C(pF)<br>1000 Rth(j-a) (°C/W)<br>F=1MHz 80<br>V OSC =30mV RMS<br>T j =25°C 70<br>60<br>50<br>100<br>40<br>30<br>20<br>10<br>VR(V) S Cu (cm²)<br>10 0<br>1 10 100 1000 0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br>


**==> picture [513 x 202] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 15. Relative variation of non-repetitive peak surge Figure 16.  Relative variation of non-repetitive peak surge<br>forward current versus pulse duration (sinusoidal forward current versus initial junction temperature<br>waveform) (sinusoidal waveform)<br>IFSM(tp) / IFSM(10 ms) IFSM(Tj) / IFSM(25 °C)<br> 4.0  1.2<br> 3.5  1.0<br> 3.0  0.8<br> 2.5  0.6<br> 2.0  0.4<br> 1.5  0.2<br>tp(ms) Tj(°C)<br> 1.0  0.0<br> 0.1  1.0  10.0  25  50  75  100  125  150  175<br>**----- End of picture text -----**<br>


**DS12164** - **Rev 5** 

**page 6/20** 

**STTH30RQ06 Package information** 

**2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1 DO-247 package information** 

- Epoxy meets UL94, V0 

- Cooling method: by conduction (C) 

- Recommended torque value: 0.8 N·m (DO-247) 

- Maximum torque value: 1.0 N·m (DO-247) 

## **Figure 17. DO-247 package outline** 

**==> picture [282 x 316] intentionally omitted <==**

**----- Start of picture text -----**<br>
V<br>V Dia<br>A<br>H<br>0.10<br>L5<br>L<br>L2<br>L4<br>F2 L1<br>F3<br>L3<br>D<br>V2<br>F<br>M E<br>G<br>**----- End of picture text -----**<br>


**DS12164** - **Rev 5** 

**page 7/20** 

**STTH30RQ06 DO-247 package information** 

## **Table 5. DO-247 package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|4.85|5.15|0.191|0.203|
|D|2.20|2.60|0.086|0.102|
|E|0.40|0.80|0.015|0.031|
|F|1.00|1.40|0.039|0.055|
|F2|2.00 typ.||0.078 typ.||
|F3|2.00|2.40|0.078|0.094|
|G|10.90 typ.||0.429 typ.||
|H|15.45|15.75|0.608|0.620|
|L|19.85|20.15|0.781|0.793|
|L1|3.70|4.30|0.145|0.169|
|L2|18.50 typ.||0.728 typ.||
|L3|14.20|14.80|0.559|0.582|
|L4|34.60 typ.||1.362 typ.||
|L5|5.50 typ.||0.216 typ.||
|M|2.00|3.00|0.078|0.118|
|V|5°||5°||
|V2|60°||60°||
|Dia.|3.55|3.65|0.139|0.143|



**DS12164** - **Rev 5** 

**page 8/20** 

**STTH30RQ06 D²PAK package information** 

## **2.2 D²PAK package information** 

- Epoxy meets UL94, V0 

- Cooling method: by conduction (C) 

## **Figure 18. D²PAK package outline** 

**==> picture [34 x 49] intentionally omitted <==**

_Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed._ 

**DS12164** - **Rev 5** 

**page 9/20** 

**STTH30RQ06 D²PAK package information** 

## **Table 6. D²PAK package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|4.36|4.60|0.172|0.181|
|A1|0.00|0.25|0.000|0.010|
|b|0.70|0.93|0.028|0.037|
|b2|1.14|1.70|0.045|0.067|
|c|0.38|0.69|0.015|0.027|
|c2|1.19|1.36|0.047|0.053|
|D|8.60|9.35|0.339|0.368|
|D1|6.90|8.00|0.272|0.311|
|D2|1.10|1.50|0.043|0.060|
|E|10.00|10.55|0.394|0.415|
|E1|8.10|8.90|0.319|0.346|
|E2|6.85|7.25|0.266|0.282|
|e|2.54 typ.||0.100||
|e1|4.88|5.28|0.190|0.205|
|H|15.00|15.85|0.591|0.624|
|J1|2.49|2.90|0.097|0.112|
|L|1.90|2.79|0.075|0.110|
|L1|1.27|1.65|0.049|0.065|
|L2|1.30|1.78|0.050|0.070|
|R|0.4 typ.||0.015||
|V2|0°|8°|0°|8°|
|**Figure 19.D²PAK recommended footprint (dimensions in mm)**<br>16.90<br>12.20<br>9.75<br>3.50<br>5.08<br>1.60<br>2.54|||||



**DS12164** - **Rev 5** 

**page 10/20** 

**STTH30RQ06 TO-220AC package information** 

## **2.3 TO-220AC package information** 

- Epoxy meets UL 94,V0 

- Cooling method: by conduction (C) 

- Recommended torque value: 0.55 N·m 

- Maximum torque value: 0.70 N·m 

**Figure 20. TO-220AC package outline** 

**==> picture [372 x 352] intentionally omitted <==**

**----- Start of picture text -----**<br>
H2 A<br>0.10<br>C<br>Ø I<br>Gate note (1)(2)<br>L5<br>L7<br>L6<br>L2<br>D<br>F1 L9<br>Gate note (1)(2)  L4<br>F<br>M<br>E<br>G<br>**----- End of picture text -----**<br>


- (1) : Max resin gate protusion 0.5 mm 

(2) : Resin gate position is accepted in each of the two positions shown on the drawings or their symmetrical 

**DS12164** - **Rev 5** 

**page 11/20** 

**STTH30RQ06 TO-220AC package information** 

## **Table 7. TO-220AC package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|4.40|4.60|0.173|0.181|
|C|1.23|1.32|0.048|0.051|
|D|2.40|2.72|0.094|0.107|
|E|0.49|0.70|0.019|0.027|
|F|0.61|0.88|0.024|0.034|
|F1|1.14|1.70|0.044|0.066|
|G|4.95|5.15|0.194|0.202|
|H2|10.00|10.40|0.393|0.409|
|L2|16.40 typ.||0.645 typ.||
|L4|13.00|14.00|0.511|0.551|
|L5|2.65|2.95|0.104|0.116|
|L6|15.25|15.75|0.600|0.620|
|L7|6.20|6.60|0.244|0.259|
|L9|3.50|3.93|0.137|0.154|
|M|2.60 typ.||0.102 typ.||
|Diam|3.75|3.85|0.147|0.151|



**DS12164** - **Rev 5** 

**page 12/20** 

**STTH30RQ06 D²PAK high voltage package information** 

## **2.4 D²PAK HV package information** 

**Figure 21. D²PAK high voltage package outline** 

**DS12164** - **Rev 5** 

**page 13/20** 

**STTH30RQ06 D²PAK high voltage package information** 

**Table 8. D²PAK high voltage package mechanical data** 

|**Rf**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|
|**e.**|**Min.**|**Typ.**|**Max.**|
|A|4.30||4.70|
|A1|-0.05||0.08|
|C|1.17||1.37|
|D|8.95||9.35|
|e|4.98||5.18|
|E|0.50||0.90|
|F|0.78||0.85|
|F2|1.20||1.60|
|H|10.00||10.40|
|H1|7.40||7.80|
|J1|2.49||2.69|
|L|15.30||15.80|
|L1|1.27||1.40|
|L2|4.93||5.23|
|L3|6.85||7.25|
|L4|1.5||1.7|
|M|2.6||2.9|
|R|0.20||0.60|
|V|0°||8°|



**Figure 22. D²PAK High Voltage footprint in mm** 

**==> picture [162 x 162] intentionally omitted <==**

**----- Start of picture text -----**<br>
10,58<br>7,46<br>15,95<br>5,10<br>3,40<br>1,20<br>5,08<br>**----- End of picture text -----**<br>


**DS12164** - **Rev 5** 

**page 14/20** 

**STTH30RQ06 D²PAK high voltage package information** 

## **2.4.1 Creepage distance between anode and cathode** 

## **Table 9. Creepage distance between anode and cathode** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|CdA-K1|Minimum creepage distance between A and K1 (with top coating)|D²PAK HV|5.38|mm|
|CdA-K2|Minimum creepage distance between A and K2 (without top coating)||3.48||



_Note:_ 

_D²PAK HV creepage distance (anode to cathode) = 5.38 mm min. (refer to IEC 60664-1)_ 

## **Figure 23. Creepage with top coating** 

## **Figure 24. Creepage without top coating** 

**DS12164** - **Rev 5** 

**page 15/20** 

**STTH30RQ06 DO-247 LL package information** 

## **2.5 DO-247 LL package information** 

- Epoxy meets UL94, V0 

- Cooling method: by conduction (C) 

- Recommended torque value: 0.8 N·m 

- Maximum torque value: 1.0 N·m 

## **Figure 25. DO-247 LL package outline** 

**==> picture [67 x 62] intentionally omitted <==**

**----- Start of picture text -----**<br>
10°<br>3°<br>**----- End of picture text -----**<br>


**==> picture [289 x 195] intentionally omitted <==**

**----- Start of picture text -----**<br>
E A<br>E/2 A2<br>Ø P1 Ø P<br>20°<br>Q S<br>E2<br>D D1<br>3° 3°<br>L1<br>W<br>L<br>e 2× b c A1 E1<br>2× b2<br>**----- End of picture text -----**<br>


**DS12164** - **Rev 5** 

**page 16/20** 

**STTH30RQ06 DO-247 LL package information** 

## **Table 10. DO-247 LL package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|4.70|5.31|0.185|0.209|
|A1|2.21|2.59|0.087|0.102|
|A2|1.50|2.49|0.059|0.098|
|b|0.99|1.40|0.039|0.055|
|b2|1.65|2.39|0.065|0.094|
|c|0.38|0.89|0.015|0.035|
|D|20.80|21.46|0.819|0.845|
|D1|13.08||0.515||
|E|15.49|16.26|0.610|0.640|
|e|5.44 typ.||0.214||
|E1|13.46||0.530||
|E2|3.43|3.99|0.135|0.157|
|L|19.81|20.32|0.780|0.800|
|L1||4.50||0.177|
|P|3.56|3.66|0.140|0.144|
|P1|7.06|7.39|0.278|0.291|
|Q|5.38|6.20|0.219|0.244|
|S|6.17 typ.||0.243||
|W||0.15||0.006|



**DS12164** - **Rev 5** 

**page 17/20** 

**STTH30RQ06 Ordering information** 

## **3 Ordering information** 

**Table 11. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STTH30RQ06G-TR|STTH30RQ06G|D²PAK|1.48 g|1000|Tape and reel|
|STTH30RQ06D|STTH30RQ06D|TO-220AC|1.86 g|50|Tube|
|STTH30RQ06W|STTH30RQ06W|DO-247|4.40 g|30|Tube|
|STTH30RQ06G2-TR|TH30RQ06G2|D²PAK HV|1.48 g|1000|Tape and reel|
|STTH30RQ06WL|STTH30RQ06WL|DO-247 LL|5.9 g|30|Tube|



**DS12164** - **Rev 5** 

**page 18/20** 

**STTH30RQ06** 

## **Revision history** 

**Table 12. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|12-Jun-2017|1|Initial release.|
|11-Oct-2018|2|Added D²PAK HV package.|
|20-Nov-2018|3|Updated Features andTable 9. Creepage distance between anode and<br>cathode.<br>AddedFigure 24. Creepage without top coating.|
|02-Mar-2020|4|Added DO-247 LL package information.|
|30-Mar-2020|5|UpdatedFigure 1andFigure 2. AddedFigure 3andFigure 4.|



**DS12164** - **Rev 5** 

**page 19/20** 

**STTH30RQ06** 

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© 2020 STMicroelectronics – All rights reserved 

**DS12164** - **Rev 5** 

**page 20/20** 



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