# Fast / Ultrafast Diode, 600 V, 30 A, Penta Common Anode, 2.95 V, 30 ns, 215 A

![Product image](https://novapart.co/image/farnell:4860856/)

**URL**: https://novapart.co/products/STTH30RQ06L2-TR/fast-ultrafast-diode-600-v-30-a-penta-common-anode
**SKU**: STTH30RQ06L2-TR
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €2.2400
**Stock**: 10+
**Lead Time**: 319 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 7 Pin |
| Product Range | - |
| Qualification | - |
| Diode Case Style | HU3PAK |
| Diode Configuration | Penta Common Anode |
| Forward Voltage Max | 2.95V |
| Forward Surge Current | 215A |
| Reverse Recovery Time | 30ns |
| Average Forward Current | 30A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 600V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4860856/)

**STTH30RQ06L2** 

Datasheet 

## 600 V, 30 A ultrafast high voltage rectifier 

**==> picture [77 x 107] intentionally omitted <==**

**----- Start of picture text -----**<br>
K<br>A A [A A A]<br>NC<br>NC<br>K<br>HU [3] PAK<br>A<br>A<br>A<br>A<br>A<br>**----- End of picture text -----**<br>


## **Features** 

- High junction temperature capability 

- Ultrafast switching 

- Low reverse current 

- Low thermal resistance 

- Reduce switching and conduction losses 

## **Applications** 

- DC/DC converter 

- EV charging station 

## **Description** 

Housed in a HU[3] PAK package, this 600 V, 30 A device uses ST 600 V technology. STTH30RQ06L2 is ideal for application use as secondary rectification diode. 

|**Product status link**|**Product status link**|
|---|---|
|STTH30RQ06L2||
|||
|**Product summary**||
|**IF(AV)**|30 A|
|**VRRM**|600 V|
|**VF (typ.)**|1.45 V|
|**trr (max.)**|30 ns|
|**Tj(max.)**|+175 °C|



**DS13275** - **Rev 3** - **December 2021** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STTH30RQ06L2 Characteristics** 

## **1 Characteristics** 

**Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage||600|V|
|IF(RMS)|Forward rms current||45|A|
|IF(AV)|Average forward current δ = 0.5, square wave|TC= 120 °C|30|A|
|IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal|215|A|
|Tstg|Storage temperature range||-65 to +175|°C|
|Tj|Maximum operating junction temperature||175|°C|



**Table 2. Thermal resistance parameters** 

|**Symbol**|**Parameter**|**Max. value**|**Unit**|
|---|---|---|---|
|Rth(j-c)|Junction to case|0.7|°C/W|



For more information, please refer to the following technical note: 

- TN1378:HU[3] PAK package mounting and thermal behaviour 

**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR (1)|Reverse leakage current|Tj= 25 °C|VR= 600 V|-||40|µA|
|||Tj= 150 °C||-|80|800||
|VF (2)|Forward voltage drop|Tj= 25 °C|IF=15 A|-||2.45|V|
|||Tj= 150 °C||-|1.15|1.45||
|||Tj= 25 °C|IF= 30 A|-|2.25|2.95||
|||Tj= 150 °C||-|1.45|1.85||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: 

- P = 1.05 x IF(AV) + 0.026 x IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses : 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

**DS13275** - **Rev 3** 

**page 2/12** 

**STTH30RQ06L2 Characteristics** 

**Table 4. Dynamic electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|trr|Reverse recovery time|Tj= 25 °C|IF= 0.5 A, IR= 1 A,<br>Irr= 0.25 A|-||30|ns|
||||IF= 1 A, VR= 30 V,<br>dlF/dt = -50 A/µs|-|40|55||
|IRM|Reverse recovery current|Tj= 125 °C|IF= 30 A, VR= 400 V,<br>dlF/dt = -100 A/µs|-|5|7|A|
|Qrr|Reverse recovery charge|||-|360||nC|



**DS13275** - **Rev 3** 

**page 3/12** 

**STTH30RQ06L2 Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**==> picture [513 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1. Average forward power dissipation versus Figure 2. Forward voltage drop versus forward current<br>average forward current (square waveform) (typical values)<br>PF( AV )(W) I F(A)<br>100 100.0 T jJ = 150 175°°CC<br>80 δ = 0.1 δ = 0.2 δ = 0.5 δ = 1 T jJ = 150°C 150°C<br>δ = 0.05<br>10.0 T Jj = 150 25°°CC<br>60<br>40<br>1.0<br>T<br>20<br>0 IF( AV ) (A) δ [=tp/T] tp 0.1 VF (V)<br>0 5 10 15 20 25 30 35 40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5<br>**----- End of picture text -----**<br>


**Figure 3. Forward voltage drop versus forward current Figure 4. Relative variation of thermal impedance junction (maximum values) to case versus pulse duration** 

**==> picture [223 x 137] intentionally omitted <==**

**----- Start of picture text -----**<br>
I F(A)<br>100.0<br>T jJ = 150 175°°CC<br>T Jj = 150°C 150°C<br>T Jj = 150°C 25°C<br>10.0<br>1.0<br>VF (V)<br>0.1<br>0.0 1.0 2.0 3.0 4.0<br>**----- End of picture text -----**<br>


**==> picture [225 x 143] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-c)/Rth(j-c)<br>1.0<br>0.9<br>Single pulse<br>0.8<br>0.7<br>0.6<br>0.5<br>0.4<br>0.3<br>0.2<br>0.1 t P (s)<br>0.0<br>1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>**----- End of picture text -----**<br>


**==> picture [513 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 5. Peak reverse recovery current versus dIF/dt Figure 6. Reverse recovery time versus dIF/dt (typical<br>(typical values) values)<br>IRM(A) tRR(ns)<br>20 240<br>T V j R  = 125    = 400 V° C 200 TVj R  = 125  °C = 400 V<br>15<br>160<br>IF = 30 A<br>IF = 30 A<br>10 120<br>IF = 15 A<br>80<br>5 I F  = 7.5 A IF = 15 A<br>40<br>0 dI F / dt(A/µs) I F  = 7.5 A dI F /dt(A/µs)<br>0<br>0 50 100 150 200 250 300 350 400 450 500<br>0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


**DS13275** - **Rev 3** 

**page 4/12** 

**STTH30RQ06L2 Characteristics (curves)** 

**==> picture [513 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Reverse recovery charges versus dIF/dt (typical Figure 8. Reverse recovery softness factor versus dIF/dt<br>values) (typical values)<br>QRR(nC) Sfactor<br>800<br>T VjR  = 125  °C  = 400 V 2.0 TVjR = 125  °C = 400 V<br>600 1.6<br>IF = 30 A<br>I F  = 15 A<br>1.2<br>400<br>0.8<br>200 IF = 7.5 A<br>0.4<br>0 dI F /dt(A/µs) dI F /dt(A/µs)<br>0 50 100 150 200 250 300 350 400 450 500 0.0<br>0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


**==> picture [513 x 412] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 9.  Relative variation of dynamic parameters Figure 10. Junction capacitance versus reverse voltage<br>versus junction temperature applied (typical values)<br>2.0 C(pF)<br>IF = IF(AV) 1000<br>1.6 Reference :T V R  = 400 V j = 125 °C V OSC F=1MHzT=30mV j =25°C RMS<br>1.2 Sfactor<br>100<br>0.8<br>IRM<br>0.4<br>Q rr Tj(°C) VR(V)<br>0.0 10<br>25 50 75 100 125 1 10 100 1000<br>Figure 11. Relative variation of non-repetitive peak Figure 12.  Relative variation of non-repetitive peak<br>surge forward current versus pulse duration (sinusoidal surge forward current versus initial junction temperature<br>waveform) (sinusoidal waveform)<br>IFSM(tp) / IFSM(10 ms) IFSM(Tj) / IFSM(25 °C)<br> 4.0  1.2<br> 3.5  1.0<br> 3.0  0.8<br> 2.5  0.6<br> 2.0  0.4<br> 1.5  0.2<br>tp(ms) Tj(°C)<br> 1.0  0.0<br> 0.1  1.0  10.0  25  50  75  100  125  150  175<br>**----- End of picture text -----**<br>


**DS13275** - **Rev 3** 

**page 5/12** 

**STTH30RQ06L2 Package information** 

## **2** 

## **Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1** 

## **HU[3] PAK package information** 

- Epoxy meets UL94, V0 

**Figure 13. HU[3] PAK package outline** 

**DS13275** - **Rev 3** 

**page 6/12** 

**STTH30RQ06L2 HU3PAK package information** 

## **Table 5. HU[3] PAK package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|
|**Ref.**|**mm**|||
||**Min.**|**Typ.**|**Max.**|
|A|3.40|3.50|3.60|
|A1||0.05||
|b|0.50|0.60|0.70|
|b2|0.50|0.70|1.00|
|b3|0.80|0.90|1.00|
|c|0.40|0.50|0.60|
|c2|0.40|0.50|0.60|
|D|11.70|11.80|11.90|
|D1|8.80|8.955|9.10|
|E|13.90|14.00|14.10|
|E1|12.30|12.40|12.50|
|E2|7.75|7.80|7.85|
|e|BSC 1.27|||
|H|18.00|18.58|19.00|
|L|2.40|2.52|2.60|
|L1||3.05||
|L2|0.90|1.00|1.10|
|L3|BSC 0.26|||
|L4|0.075|0.125|0.175|
|L5|1.83|1.93|2.03|
|L6|2.14|2.24|2.34|
|L7|4.44|4.54|4.64|
|aaa||0.10||
|F1|2.90|3.00|3.10|
|F2|2.40|2.50|2.60|
|F3|0.25|0.35|0.45|
|N1|3.80|3.90|4.00|
|N2|0.25|0.30|0.45|
|N3|0.80|0.90|1.00|
|T|0.50|0.67|0.70|
|T2|9.18|9.38|9.43|
|θ1||0°|8°|
|θ2||0°|8°|



1. Package outline exclusive of any mold flashes dimensions. 

2. Package outline exclusive of burr dimensions. 

3. Max resin gate protrusion: 0.25 mm. 

4. The planarity of the package backside 50 micron max. 

5. BSC: basic spacing between centers 

**DS13275** - **Rev 3** 

**page 7/12** 

**STTH30RQ06L2 HU3PAK package information** 

**Figure 14. HU[3] PAK recommended footprint (dimensions are in mm)** 

**==> picture [224 x 172] intentionally omitted <==**

**----- Start of picture text -----**<br>
3.00 1.50<br>19.00<br>2.<br>4<br>6 X 1.2 5<br>7<br>14.70<br>7 X 0.90<br>**----- End of picture text -----**<br>


**DS13275** - **Rev 3** 

**page 8/12** 

**STTH30RQ06L2 HU3PAK packing information** 

## **2.2** 

## **HU[3] PAK packing information** 

**Figure 15. HU[3] PAK carrier tape outline** 

**Table 6. HU[3] PAK carrier tape mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|
||**mm**|||
||**Min.**|**Typ.**|**Max.**|
|A0|14.30|14.40|14.50|
|B0||19.70||
|D|1.40|1.50|1.60|
|E|1.65|1.75|1.85|
|F|15.55|15.65|15.75|
|I0||11.00||
|I1|11.50|11.60|11.70|
|I2||8.00||
|I3||7.00||
|K0||4.20||
|P0|3.90|4.00|4.10|
|P1|19.90|20.00|20.10|
|P2|1.90|2.00|2.10|
|T|0.00|0.40|0.90|
|W|31.70|32.00|32.30|



**DS13275** - **Rev 3** 

**page 9/12** 

**STTH30RQ06L2 Ordering information** 

**3 Ordering information** 

**Table 7. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STTH30RQ06L2-TR|STTH30RQ06L2|HU3PAK|2.32 g|600|Tape and reel|



**DS13275** - **Rev 3** 

**page 10/12** 

**STTH30RQ06L2** 

## **Revision history** 

**Table 8. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|30-Mar-2020|1|Initial release.|
|07-Apr-2020|2|UpdatedTable 3.|
|03-Dec-2021|3|Inserted more information references onSection  1  Characteristics. Updated<br>Table 5.|



**DS13275** - **Rev 3** 

**page 11/12** 

**STTH30RQ06L2** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2021 STMicroelectronics – All rights reserved 

**DS13275** - **Rev 3** 

**page 12/12** 



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---

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