# Fast / Ultrafast Diode, 200 V, 2 A, Single, 1 V, 17 ns, 180 A

![Product image](https://novapart.co/image/farnell:1295256RL/)

**URL**: https://novapart.co/products/STTH2R02U/fast-ultrafast-diode-200-v-2-a-single-1-17-ns-180
**SKU**: STTH2R02U
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.1140
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:200V; Forward Current If(AV):2A; Diode Configuration:Single; Forward Voltage VF Max:1V; Reverse Recovery Time trr Max:17ns; Forward Surge Current Ifsm Max:1

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2 Pin |
| Product Range | STTH2 |
| Qualification | - |
| Diode Case Style | DO-214AA (SMB) |
| Diode Configuration | Single |
| Forward Voltage Max | 1V |
| Forward Surge Current | 180A |
| Reverse Recovery Time | 17ns |
| Average Forward Current | 2A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 200V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1295256RL/)

**STTH2R02** 

Datasheet 

200 V - 2 A ultrafast recovery diode 

## **Features** 

- Very low conduction losses 

- Negligible switching losses 

- Low forward voltage drop 

- High junction temperature 

- ECOPACK[®] 2 compliant 

## **Applications** 

- Switching diode 

- LED Lighting 

- Auxiliary power supply 

- Flyback diode 

## **Description** 

The STTH2R02 uses ST's patented 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. 

Packaged in SMA, SMB, the STTH2R02 is optimized for use low voltage, high frequency inverters, free wheeling and polarity protection 

## **Product status** 

STTH2R02 

|**Product summary**|**Product summary**|
|---|---|
|**Symbol**|**Value**|
|**IF(AV)**|2 A|
|**VRRM**|200 V|
|**T j(max.)**|175 °C|
|**VF(typ.)**|0.7 V|
|**trr(typ.)**|15 ns|



**DS4744** - **Rev 3** - **December 2018** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STTH2R02 Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|||**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||200|V|
|IF(AV)|Average forward current δ = 0.5, square wave|SMA|TL= 90 °C|2|A|
|||SMB|TL= 90 °C|||
|IFSM|Surge non repetitive forward current||tp= 10 ms sinusoidal|75|A|
|Tstg|Storage temperature range|||-65 to +175|°C|
|Tj|Operating junction temperature|||+175|°C|



**Table 2. Thermal resistance parameter** 

|**Symbol**|**Parameter**|**Parameter**|**Max. value**|**Unit**|
|---|---|---|---|---|
|Rth(j-l)|Junction to lead|SMA / SMB|30|°C/W|



For more information, please refer to the following application note : 

- AN5088 : Rectifiers thermal management, handling and mounting recommendations 

**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**||**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||3|µA|
|||Tj= 125 °C||-|2|20||
|VF(2)|Forward voltage drop|Tj= 25 °C|IF= 6 A|-||1.20|V|
|||Tj= 25 °C|IF= 2 A|-|0.89|1.00||
|||Tj= 100 °C||-|0.76|0.85||
|||Tj= 150 °C||-|0.70|0.80||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: 

P = 0.68 x IF(AV) + 0.06 x IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses : 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

**DS4744** - **Rev 3** 

**page 2/13** 

**STTH2R02 Characteristics** 

**Table 4. Dynamic characteristics (Tj = 25 °C unless otherwise specified)** 

|**Symbol**|**Parameters**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|trr|Reverse recovery time|IF= 1 A, dIF/dt = -50 A/μs, VR= 30 V|-|23|30|ns|
|||IF= 1 A, dIF/dt = -100 A/μs, VR= 30 V|-|15|20||
|IRM|Reverse recovery current|IF= 2 A, dIF/dt = -200 A/μs, VR= 160 V, Tj= 125 °C|-|3|4|A|
|tfr|Forward recovery time|IF= 2 A, dIF/dt = 100 A/μs, VFR= 1.1 VF(max.)|-|40||ns|
|VFP|Forward recovery voltage|IF= 2 A, dIF/dt = 100 A/μs|-|2.0||V|



**DS4744** - **Rev 3** 

**page 3/13** 

**STTH2R02 Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**Figure 1. Peak current versus duty cycle** 

**Figure 2. Forward voltage drop versus forward current (typical values)** 

**==> picture [473 x 155] intentionally omitted <==**

**----- Start of picture text -----**<br>
IM(A)<br>100<br>T IF (A)<br>IM 50<br>80 δd [=tp/T] tp<br>re 40 Pot | | | | TA<br>60 ze Ff | | | | PFT ft ft<br>P = 5 W 30<br>Keo Tome Ee<br>40 a a P = 2 a W eeI ee 20 eero T j =150°C P7T LL<br>P = 1 W<br>20 ee 10 FS AEE Tj=25°C<br>ee ee a EE<br>V F (V)<br>δ<br>0 SSE SS 0 EES4<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0<br>0.0 0.5 1.0 1.5 2.0 2.5<br>**----- End of picture text -----**<br>


**Figure 3. Forward voltage drop versus forward current (maximum values)** 

**Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration (SMA)** 

**==> picture [474 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
IFM(A) Zth(j-a)/Rth(j-a)<br>50 1.0<br>SMA<br>rf | | ft ft | fF ft] 0.9 Scu=1cm² “HFT EE +e<br>40 0.8<br>0.7<br>30 0.6<br>0.5<br>20 Tj=150 ° C 0.4<br>Se 0.3 See et ee AH ee eae<br>Tj=25°C<br>10 0.2<br>Single pulse<br>V FM (V) 0.1 t P(s)<br>0 eyTEE TE 0.0 deS e re|ad<br>0.0 0.5 1.0 1.5 2.0 2.5 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br>


**DS4744** - **Rev 3** 

**page 4/13** 

**STTH2R02 Characteristics (curves)** 

**Figure 5. Relative variation of thermal impedance junction Figure 6. Junction capacitance versus reverse voltage to lead versus pulse duration (SMB) applied (typical values)** 

**==> picture [474 x 145] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-a)/Rth(j-a) C(pF)<br>1.0 100<br>SM B F=1MHz<br>0.9 Scu=1cm² Vosc=30mVRMS<br>Tj=25°C<br>0.8<br>0.7<br>0.6<br>0.5 10<br>0.4<br>0.3<br>0.2<br>0.1 Single pulse t P (s) VR(V)<br>0.0 1<br>1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1 10 100 1000<br>**----- End of picture text -----**<br>


**==> picture [513 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Reverse recovery charges versus dIF/dt (typical Figure 8. Reverse recovery time versus dIF/dt (typical<br>values) values)<br>QRR (nC) t RR(ns)<br>60 60<br>50 V I FR = 2 A =160V 50 VIFR== 160V2 A<br>40 40<br>30 Tj=125°C 30 Tj=125°C<br>20 20<br>10 10 Tj=25°C<br>Tj=25°C<br>dI F /dt(A/µs) dI F /dt(A/µs)<br>0 0<br>10 100 1000 10 100 1000<br>**----- End of picture text -----**<br>


**==> picture [513 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 9. Peak reverse recovery current versus dIF/dt Figure 10. Relative variations of dynamic parameters<br>(typical values) versus junction temperature<br>IRM (A) QRR ; IRM [T j] / QRR ; IRM [T j=125°C]<br>6 1.4<br>V IFR= 2 A =160V 1.2 VIFR= 2=160VA<br>5<br>1.0<br>4<br>0.8 IRM<br>3<br>Tj=125°C 0.6 QRR<br>2 0.4<br>1 Tj=25°C 0.2<br>dI F /dt(A/µs) Tj(°C)<br>0.0<br>0<br>25 50 75 100 125 150<br>10 100 1000<br>**----- End of picture text -----**<br>


**DS4744** - **Rev 3** 

**page 5/13** 

**STTH2R02 Characteristics (curves)** 

**Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (typical values)** 

**==> picture [225 x 149] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a) (°C/W)<br>200<br>Epoxy printed circuit board FR4,copper thickness: 35 µm SMA<br>150<br>100<br>50<br>S(Cu)(cm²)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (typical values)** 

**==> picture [219 x 148] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a) (°C/W)<br>200<br>Epoxy p rinted circuit board FR4, copper t hickness: 35 µm SMB<br>150<br>100<br>50<br>S (Cu) (cm²)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**DS4744** - **Rev 3** 

**page 6/13** 

**STTH2R02 Package information** 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

## **2.1 SMA package information** 

- Epoxy meets UL94, V0 

- Cooling method : by conduction (C) 

## **Figure 13. SMA package outline** 

**==> picture [303 x 223] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br>


**Table 5. SMA package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.074|0.097|
|A2|0.05|0.20|0.001|0.008|
|b|1.25|1.65|0.049|0.065|
|c|0.15|0.40|0.005|0.016|
|D|2.25|2.90|0.088|0.115|
|E|4.80|5.35|0.188|0.211|
|E1|3.95|4.60|0.155|0.182|
|L|0.75|1.50|0.029|0.060|



**DS4744** - **Rev 3** 

**page 7/13** 

**STTH2R02 SMA package information** 

## **Figure 14. SMA recommended footprint in mm (inches)** 

**==> picture [226 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.4 2.63 1.4<br>(0.055) (0.104) (0.055)<br>1.64<br>(0.065)<br>5.43<br>(0.214)<br>**----- End of picture text -----**<br>


**DS4744** - **Rev 3** 

**page 8/13** 

**STTH2R02 SMB package information** 

## **2.2 SMB package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

**Figure 15. SMB package outline** 

**==> picture [326 x 254] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br>


**DS4744** - **Rev 3** 

**page 9/13** 

**STTH2R02 SMB package information** 

**Table 6. SMB package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.074|0.097|
|A2|0.05|0.20|0.001|0.008|
|b|1.95|2.20|0.076|0.087|
|c|0.15|0.40|0.005|0.016|
|D|3.30|3.95|0.129|0.156|
|E|5.10|5.60|0.200|0.221|
|E1|4.05|4.60|0.159|0.182|
|L|0.75|1.50|0.029|0.060|



**Figure 16. SMB recommended footprint** 

**==> picture [226 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.62 2.60 1.62<br>(0.064) (0.102) (0.064)<br>2.18<br>(0.086)<br>5.84<br>(0.230)<br>**----- End of picture text -----**<br>


**DS4744** - **Rev 3** 

**page 10/13** 

**STTH2R02 Ordering information** 

## **3 Ordering information** 

**Table 7. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STTH2R02A|R2A|SMA|0.068 g|5000|Tape and reel|
|STTH2R02U|R2U|SMB|0.107 g|2500|Tape and reel|



**DS4744** - **Rev 3** 

**page 11/13** 

**STTH2R02** 

## **Revision history** 

**Table 8. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|03-May-2006|1|First issue.|
|13-Oct-2006|2|Maximum Tjset to 175° C for all packages in Table 1.|
|11-Dec-2018|3|Removed DO-15 package information.|



**DS4744** - **Rev 3** 

**page 12/13** 

**STTH2R02** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2018 STMicroelectronics – All rights reserved 

**DS4744** - **Rev 3** 

**page 13/13** 



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