# Fast / Ultrafast Diode, 600 V, 25 A, Single, 3.4 V, 50 ns, 170 A

![Product image](https://novapart.co/image/farnell:3581076/)

**URL**: https://novapart.co/products/STTH25M06FP/fast-ultrafast-diode-600-v-25-a-single-34-50-ns
**SKU**: STTH25M06FP
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.5380
**Stock**: 200+
**Lead Time**: 120 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2 Pin |
| Product Range | - |
| Qualification | - |
| Diode Case Style | TO-220FPAC |
| Diode Configuration | Single |
| Forward Voltage Max | 3.4V |
| Forward Surge Current | 170A |
| Reverse Recovery Time | 50ns |
| Average Forward Current | 25A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 600V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3581076/)

**STTH25M06** 

Datasheet 

600 V, 25 A ultrafast high voltage diode 

**==> picture [75 x 137] intentionally omitted <==**

**----- Start of picture text -----**<br>
A K<br>K K<br>A<br>A<br>NC<br>NC<br>DPAK<br>A<br>K<br>TO220FPAC<br>**----- End of picture text -----**<br>


## **Features** 

- Ultrafast recovery, soft recovery 

- Low power losses at high switching frequency operations 

- Low leakage current 

- High junction temperature 

- High overcurrent capability 

- ECOPACK2 compliant 

## **Applications** 

- PFC 

- Boost diode 

- LLC clamping diode 

## **Description** 

The STTH25M06 is an ultrafast recovery power rectifier especially suited for boost or LLC clamping circuits working at high switching frequencies in heavy duty applications such as air conditioning equipment or telecom power supplies. 

Designed with the latest ST’s ultrafast technology, this 600 V 25 A diode in DPAK and TO-220FPAC has a robust behavior against electrostatic discharge and high overcurrent capability. 

## **Product status** ~~[Lo~~ STTH25M06 

|**Product summary**<br>~~Po~~|**Product summary**<br>~~Po~~|
|---|---|
|**Symbol**<br>~~ee~~|**Value**<br>~~e~~|
|**IF(AV)**|25 A|
|**VRRM**|600 V|
|**trr(typ.)**|25 ns|
|**T j(max.)**|175 °C|
|**VF(typ.)**|1.6 V|



**DS13169** - **Rev 2** - **February 2020** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STTH25M06 Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage||600|V|
|IF(AV)|Average forward current||25|A|
|IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal|170|A|
|Tstg|Storage temperature range||-65 to +175|°C|
|Tj|Maximum operating junction temperature||+175|°C|



**Table 2. Thermal resistance parameter** 

|**Symbol**|**Parameter**|**Parameter**|**Typ.**<br>**value**|**Unit**|
|---|---|---|---|---|
|Rth(j-c)|Junction to case|DPAK|0.5|°C/W|
|||TO-220FPAC|2.45||



For more information, please refer to the following application note : 

- AN5088 : Rectifiers thermal management, handling and mounting recommendations 

**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**||**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 25 °C|VR= 600 V|-||60|µA|
|||Tj= 125 °C||-|70|800||
|VF(2)|Forward voltage drop|Tj= 25 °C|IF= 15 A|-|2.1||V|
|||Tj= 150 °C||-|1.3|||
|||Tj= 25 °C|IF= 25 A|-|2.5|3.4||
|||Tj= 150 °C||-|1.6|2.0||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: P = 1.04 x IF(AV) + 0.0385 x IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses : 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4058: Calculation of turn-off power losses generated by an ultrafast diode 

**DS13169** - **Rev 2** 

**page 2/13** 

**STTH25M06 Characteristics** 

**Table 4. Dynamic electrical characteristics** 

|**Symbol**|**Parameters**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|trr|Reverse recovery time|Tj= 25 °C|IF= 1 A<br>dIF/dt = -50 A/µs<br>VR= 30 V|-||50|ns|
||||IF= 1 A<br>dIF/dt = -100 A/µs<br>VR= 30 V|-|25|35||
|||Tj= 125 °C|IF= 15 A<br>dIF/dt = -200 A/µs<br>VR= 400 V|-|55|||
||||IF= 25 A<br>dIF/dt = -200 A/µs<br>VR= 400 V|-|60|||
|IRM|Reverse recovery current|Tj= 125 °C|IF= 25 A<br>dIF/dt = -200 A/µs<br>VR= 400 V|-|7||A|
|Qrr|Reverse recovery charge|||-|250||nC|



**DS13169** - **Rev 2** 

**page 3/13** 

**STTH25M06 Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**==> picture [513 x 194] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1. Average forward power dissipation versus Figure 2. Forward voltage drop versus forward current<br>average forward current (square waveform) (typical values)<br>P(W) IF(A)<br>100 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 1000.0<br>80<br>δ = 1 100.0<br>60 T j =150 °C<br>10.0<br>40 Tj=25  ° C<br>T 1.0<br>20<br>IF(AV)(A) δ [=tp/T] tp VF (V)<br>0 0.1<br>0 8 16 24 32 40 0.0 1.0 2.0 3.0 4.0 5.0<br>**----- End of picture text -----**<br>


**Figure 3. Forward voltage drop versus forward current (maximum values)** 

**==> picture [225 x 142] intentionally omitted <==**

**----- Start of picture text -----**<br>
IF(A)<br>1000.0<br>100.0<br>T j =150 °C<br>10.0<br>Tj=25 °C<br>1.0<br>VF (V)<br>0.1<br>0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0<br>**----- End of picture text -----**<br>


**Figure 4. Relative variation of thermal impedance, junction to case versus pulse duration (DPAK)** 

**==> picture [224 x 138] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-c)/Rth(j-c)<br>1.0<br>Single pulse<br>0.9<br>0.8<br>0.7<br>0.6<br>0.5<br>0.4<br>0.3<br>0.2<br>0.1 t p (s)<br>0.0<br>1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>**----- End of picture text -----**<br>


**==> picture [513 x 192] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 5. Relative variation of thermal impedance, Figure 6. Peak reverse recovery current versus dIF/dt<br>junction to case versus pulse duration (TO-220FPAC) (typical values)<br>Zth(j-c)/Rth(j-c) IRM(A)<br>1.0 16<br>0.90.8 Single pulse TO-220FPAC TVIFj = 125 °CR = I=400VF(AV)<br>12<br>0.7<br>0.6<br>0.5 8<br>0.4<br>0.3 4<br>0.2<br>0.1 t p (s) 0 dIF/dt(A/µs)<br>0.0<br>0 50 100 150 200 250 300 350 400 450 500<br>1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br>


**DS13169** - **Rev 2** 

**page 4/13** 

**STTH25M06 Characteristics (curves)** 

**==> picture [513 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Reverse recovery time versus dIF/dt (typical Figure 8. Reverse recovery charges versus dIF/dt (typical<br>values) values)<br>t RR(ns) QRR(nC)<br>120 400<br>VIFR = I=400VF(AV) VIFR = I=4F(AV)00V<br>Tj=125°C Tj=125°C<br>90 300<br>60 200<br>30 100<br>dIF/dt(A/µs) dIF/dt(A/µs)<br>0 0<br>0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500<br>**----- End of picture text -----**<br>


**==> picture [513 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 9. Reverse recovery softness factor versus dIF/dt Figure 10. Relative variations of dynamic parameters<br>(typical values) versus junction temperature<br>SFACTOR<br>0.8 2.0<br>0.6 VITF R j = I=125°C=400VF(AV) 1.6 S FACTOR Reference: T V I R F =400 V =IF(AV)j=125 °C<br>1.2<br>0.4<br>0.8<br>I RM<br>0.2<br>0.4<br>0.0 dIF/dt(A/µs) 0.0 QRR Tj(°C)<br>0 50 100 150 200 250 300 350 400 450 500 25 50 75 100 125<br>**----- End of picture text -----**<br>


**==> picture [513 x 217] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 12. Thermal resistance junction to ambient versus<br>Figure 11. Junction capacitance versus reverse voltage copper surface under tab (typical values, epoxy printed<br>applied (typical values) board FR4, eCu = 70 µm)<br>C(pF)<br>1000 Rth(j-a) (°C/W)<br>F=1MHz 100<br>VoscT=30mVj=25 ° CRMS 90 Epoxy printed circuit board, copper thickness: 35 µm DPAK<br>80<br>70<br>60<br>100<br>50<br>40<br>30<br>20<br>VR(V) 10<br>10 S Cu (cm²)<br>1 10 100 1000 0<br>0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br>


**DS13169** - **Rev 2** 

**page 5/13** 

**STTH25M06 Characteristics (curves)** 

**==> picture [513 x 202] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 13. Relative variation of non-repetitive peak surge Figure 14. Relative variation of non-repetitive peak surge<br>forward current versus pulse duration (sinusoidal forward current versus initial junction temperature<br>waveform) (sinusoidal waveform)<br>IFSM(t p) / IFSM(10ms)  1.2 IFSM(Tj) / IFSM(25 °C)<br> 4.0<br> 3.5  1.0<br> 3.0  0.8<br> 2.5  0.6<br> 2.0<br> 0.4<br> 1.5<br> 0.2<br> 1.0 tp(ms)<br> 0.1  1.0  10.0  0.0 Tj(°C)<br> 25  50  75  100  125  150  175<br>**----- End of picture text -----**<br>


**DS13169** - **Rev 2** 

**page 6/13** 

**STTH25M06 Package information** 

## **2** 

## **Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1** 

## **DPAK package information** 

- Epoxy meets UL 94,V0 

- Cooling method: by conduction (C) 

## **Figure 15. DPAK package outline** 

**==> picture [353 x 315] intentionally omitted <==**

**----- Start of picture text -----**<br>
E<br>A<br>b4<br>c2<br>Thermal pad<br>E1<br>L2<br>D1<br>D<br>H R<br>L4<br>A1<br>b R<br>e<br>e1 c<br>A2<br>L1<br>L<br>V2<br>G auge<br>0.25 plane<br>**----- End of picture text -----**<br>


_Note:_ 

_This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed._ 

**DS13169** - **Rev 2** 

**page 7/13** 

**STTH25M06 DPAK package information** 

**Table 5. DPAK package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|2.18|2.40|0.085|0.094|
|A1|0.90|1.10|0.035|0.043|
|A2|0.03|0.23|0.001|0.009|
|b|0.64|0.90|0.025|0.035|
|b4|4.95|5.46|0.194|0.215|
|c|0.46|0.61|0.018|0.024|
|c2|0.46|0.60|0.018|0.023|
|D|5.97|6.22|0.235|0.244|
|D1|4.95|5.60|0.194|0.220|
|E|6.35|6.73|0.250|0.265|
|E1|4.32|5.50|0.170|0.216|
|e|2.286 typ.||0.090 typ.||
|e1|4.40|4.70|0.173|0.185|
|H|9.35|10.40|0.368|0.409|
|L|1.0|1.78|0.039|0.070|
|L2||1.27||0.050|
|L4|0.60|1.02|0.023|0.040|
|V2|-8°|+8°|-8°|+8°|



**Figure 16. DPAK recommended footprint (dimensions in mm)** 

**==> picture [296 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
12.7<br>6.7 3.0 3.0<br>A<br>4.572<br>6.7<br>B<br>1.6<br>The device must be positioned within 0.05 AB<br>**----- End of picture text -----**<br>


**DS13169** - **Rev 2** 

**page 8/13** 

**STTH25M06 TO-220FPAC package information** 

## **2.2 TO-220FPAC package information** 

- Epoxy meets UL 94,V0 

- Cooling method: by conduction (C) 

- Recommended torque value: 0.55 N·m 

- Maximum torque value: 0.70 N·m 

## **Figure 17. TO-220FPAC package outline** 

**==> picture [389 x 478] intentionally omitted <==**

**----- Start of picture text -----**<br>
A<br>B<br>H<br>Di a<br>L6<br>L2 L7<br>L3<br>D<br>F1<br>L4<br>F<br>E<br>G1<br>G<br>**----- End of picture text -----**<br>


**DS13169** - **Rev 2** 

**page 9/13** 

**STTH25M06** 

**TO-220FPAC package information** 

**Table 6. TO-220FPAC package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|4.40|4.60|0.173|0.181|
|B|2.5|2.7|0.098|0.106|
|D|2.5|2.75|0.098|0.108|
|E|0.45|0.70|0.018|0.027|
|F|0.75|1|0.030|0.039|
|F1|1.15|1.70|0.045|0.067|
|G|4.95|5.20|0.195|0.205|
|G1|2.4|2.7|0.094|0.106|
|H|10|10.4|0.393|0.409|
|L2|16 typ.||0.63 typ.||
|L3|28.6|30.6|1.126|1.205|
|L4|9.8|10.6|0.386|0.417|
|L6|15.9|16.4|0.626|0.646|
|L7|9.00|9.30|0.354|0.366|
|Diam|3.00|3.20|0.118|0.126|



**DS13169** - **Rev 2** 

**page 10/13** 

**STTH25M06 Ordering information** 

## **3** 

## **Ordering information** 

**Table 7. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STTH25M06B-TR|TH25 M06B|DPAK|0.32 g|2500|Tape and reel|
|STTH25M06FP|STTH25M06FP|TO-220FPAC|1.90 g|50|Tube|



**DS13169** - **Rev 2** 

**page 11/13** 

**STTH25M06** 

## **Revision history** 

**Table 8. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|09-Dec-2019|1|Initial release.|
|10-Feb-2020|2|Added TO-220FPAC package information.|



**DS13169** - **Rev 2** 

**page 12/13** 

**STTH25M06** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2020 STMicroelectronics – All rights reserved 

**DS13169** - **Rev 2** 

**page 13/13** 



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- [Supplier page](https://es.farnell.com/stmicroelectronics/stth25m06fp/rectifier-600v-25a-to-220fpac/dp/3581076)
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