# Fast / Ultrafast Diode, 1.2 kV, 2 A, Single, 1.75 V, 75 ns, 40 A

![Product image](https://novapart.co/image/farnell:1295254/)

**URL**: https://novapart.co/products/STTH212U/fast-ultrafast-diode-12-kv-2-a-single-175-v-75-ns
**SKU**: STTH212U
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.1750
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:1.2kV; Forward Current If(AV):2A; Diode Configuration:Single; Forward Voltage VF Max:1.75V; Reverse Recovery Time trr Max:75ns; Forward Surge Current Ifsm

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2 Pin |
| Product Range | STTH2 |
| Qualification | - |
| Diode Case Style | DO-214AA (SMB) |
| Diode Configuration | Single |
| Forward Voltage Max | 1.75V |
| Forward Surge Current | 40A |
| Reverse Recovery Time | 75ns |
| Average Forward Current | 2A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 1.2kV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1295254/)

## **STTH212** 

## High voltage ultrafast diode 

Datasheet - production data 

## **Description** 

**==> picture [131 x 101] intentionally omitted <==**

**----- Start of picture text -----**<br>
A K<br>A A<br>K<br>22 K<br>SMB<br>SMC<br>**----- End of picture text -----**<br>


## **Features** 

- Low forward voltage drop 

- High reliability 

- High surge current capability 

This device is an ultrafast diode based on a high voltage planar technology, it is perfectly suited for freewheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. 

Housed in SMB and SMC packages, this diode reduces the losses in high switching frequency operations. 

**Table 1: Device summary** 

|**Symbol**|**Value**|
|---|---|
|IF(AV)|2 A|
|VRRM|1200 V|
|Tj|175 °C|
|VF(typ.)|1.0 V|
|trr(max.)|75 ns|



- Soft switching for reduced EMI disturbances 

- Planar technology 

June 2017 

DocID11497 Rev 2 

1/11 

This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**STTH212** 

## **1 Characteristics** 

**Table 2: Absolute ratings (limiting values per diode at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|||**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||1200|V|
|V(RMS)|RMS voltage|||850|V|
|IF(AV)|Average forward current δ = 0.5,<br>square wave|SMB|Tlead= 90 °C|2|A|
|||SMC|Tlead= 105 °C|||
|IF(RMS)|RMS forward current|||10|A|
|IFSM|Forward surge current tp= 8.3 ms|||40||
|Tstg|Storage temperature range|||-50 to +175|°C|
|Tj|Maximum operating junction temperature|||175|°C|



**Table 3: Thermal parameters** 

|**Symbol**|**Parameter**||**Maximum**|**Unit**|
|---|---|---|---|---|
|Rth(j-l)|Junction to lead|SMB|25<br>20|°C/W|
|||SMC|||



**Table 4: Static electrical characteristics (per diode)** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||10|µA|
|||Tj= 125 °C||-||100||
|VF|Forward voltage drop|Tj= 25 °C|IF= 2 A|-||1.75|V|
|||Tj= 125 °C||-|1.07|1.50||
|||Tj= 150 °C||-|1.0|-||



To evaluate the conduction losses, use the following equation: 

P = 1.26 x IF(AV) + 0.12 x IF[2] (RMS) 

**Table 5: Dynamic characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|trr|Reverse recovery<br>time|Tj= 25 °C|IF= 1 A;<br>dIF/dt = -100 A/μs;<br>VR= 30 V|-|-|75|ns|
|tfr|Forward recovery<br>time|Tj= 25 °C|IF= 2 A;<br>dIF/dt = 50 A/μs;<br>VFR= 1.1 x VFmax|-|-|500||
|VFP|Forward recovery<br>voltage|||-|-|30|V|



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**STTH212** 

**Characteristics** 

## **1.1 Characteristics (curves)** 

**Figure 1: Conduction losses versus average forward current** 

**==> picture [212 x 125] intentionally omitted <==**

**----- Start of picture text -----**<br>
P(W)<br>4.0<br>δ =0.05 δ =0.1 δ =0.2 δ =0.5 δ =1<br>3.5<br>3.0<br>2.5<br>2.0<br>1.5<br>1.0 T<br>0.5<br>IF(AV)(A) δ = tp/T tp<br>0.0<br>0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50<br>**----- End of picture text -----**<br>


**Figure 2: Forward voltage drop versus forward current** 

**==> picture [132 x 58] intentionally omitted <==**

**==> picture [462 x 437] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 4: Relative variation of thermal impedance<br>junction to ambient versus pulse duration (Epoxy<br>Figure 3: Relative variation of thermal impedance<br>printed circuit board FR4, SCU = 1 cm2)<br>junction to ambient versus pulse duration (Epoxy<br>printed circuit board FR4, SCU = 1 cm2)<br>1.0 Zth(j-a)/Rth(j-a) 1.0 Zth(j-a)/Rth(j-a)<br>0.9 ScuSMB= 1 cm² 0.9 ScuSMC= 1 cm²<br>0.8 0.8<br>0.7 0.7<br>0.6 0.6<br>0.5 0.5<br>0.4 0.4<br>0.3 0.3<br>0.2 0.2<br>0.1<br>0.0 t p (s) 0.1 tp(s)<br>0.0<br>1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>Figure 5: Reverse recovery current versus dIF/dt  Figure 6: Reverse recovery time versus dIF/dt<br>(typical values)  (typical values)<br>IRM(A) t RR(ns)<br>11 900<br>10 T VjR =  = 125 600 °C V IF = 2 x IF(AV) 800 TV jR  = 125 °C = 600 V<br>9<br>700<br>8 I F = I F(AV) 600<br>7 I F = 0.5 x I F(AV)<br>6 500 I F = 2 x I F(AV)<br>5 400<br>4 300 I F = I F(AV)<br>3<br>200<br>2<br>1 dI F /dt(A/µs) 100 I F  = 0.5 x I F(AV) dI F /dt(A/µs)<br>0 0<br>0 20 40 60 80 100 120 140 160 180 200 0 50 100 150 200 250 300 350 400 450 500<br>DocID11497 Rev 2  3/11<br>**----- End of picture text -----**<br>


**Characteristics** 

**STTH212** 

**==> picture [456 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7: Reverse recovery charges versus dIF/dt  Figure 8: Softness factor versus dIF/dt<br>(typical values)  (typical values)<br>QRR(nC) SFACTOR<br>1400 6.0<br>1200 T Vj R=  = 600 V  125 °C I F = 2 x I F(AV) 5.55.0 T VI jR = 125  F = I= 600 VF(AV)° C<br>4.5<br>1000<br>4.0<br>800 IF = IF(AV) 3.53.0<br>600 2.5<br>400 IF = 0.5 x IF(AV) 2.0<br>1.5<br>1.0<br>200<br>dI F /dt(A/µs) 0.5 dI F /dt(A/µs)<br>0 0.0<br>0 50 100 150 200 250 300 350 400 450 500 0 25 50 75 100 125 150 175 200 225 250<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Figure 9: Relative variations of dynamic<br>parameters versus junction temperature  Figure 10: Transient peak forward voltage versus<br>dIF/dt (typical values)<br>VFP(V)<br>30<br>2826 TIj F = = I 125  F(AV) °C<br>24<br>22<br>20<br>18<br>16<br>14<br>12<br>10<br>8<br>6<br>4<br>2 dIF/dt(A/µs)<br>0<br>0 10 20 30 40 50 60 70 80 90 100<br>**----- End of picture text -----**<br>


**==> picture [456 x 178] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 11: Forward recovery time versus dIF/dt  Figure 12: Junction capacitance versus reverse<br>(typical values)  voltage applied (typical values)<br>t FR(ns) C(pF)<br>420 100<br>400380 VFR = 1.1 x VTI j  = 125 °CF = IF(AV)F max. V osc F = 1 MHz T = 30 mV j = 25 °CRMS<br>360<br>340<br>320<br>10<br>300<br>280<br>260<br>240<br>220 dI F /dt(A/µs) VR(V)<br>200 1<br>0 20 40 60 80 100 1 10 100 1000<br>**----- End of picture text -----**<br>


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**STTH212** 

**Characteristics** 

**==> picture [389 x 174] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 13: Thermal resistance junction to ambient versus copper surface under each lead<br>(Epoxy printed circuit board FR4, eCU = 35 μm)<br>110 Rth(j-a) (°C/W)<br>100<br>90<br>80<br>SMB<br>70<br>60 SMC<br>50<br>40<br>30<br>20<br>10 S Cu (cm²)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


DocID11497 Rev 2 

5/11 

**STTH212** 

**Package** information 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _**www.st.com**_ . ECOPACK[®] is an ST trademark. 

- Epoxy meets UL94, V0 

## **2.1 SMB package information** 

**Figure 14: SMB package outline** 

~~©~~ 6/11 DocID11497 Rev 2 

**STTH212** 

**Package** information 

## **Table 6: SMB package mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.0748|0.0965|
|A2|0.05|0.20|0.0020|0.0079|
|b|1.95|2.20|0.0768|0.0867|
|c|0.15|0.40|0.0059|0.0157|
|D|3.30|3.95|0.1299|0.1556|
|E|5.10|5.60|0.2008|0.2205|
|E1|4.05|4.60|0.1594|0.1811|
|L|0.75|1.50|0.0295|0.0591|



**Figure 15: SMB recommended footprint** 

**==> picture [406 x 230] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.62 2.60 1.62<br>0.064 (0.102) 0.064<br>2.18<br>(0.086)<br>5.84<br>(0.230)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


DocID11497 Rev 2 

7/11 

**STTH212** 

**Package** information 

## **2.2 SMC package information** 

**Figure 16: SMC package outline** 

**==> picture [407 x 286] intentionally omitted <==**

**Table 7: SMC package mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.0748|0.0965|
|A2|0.05|0.20|0.0020|0.0079|
|b|2.90|3.20|0.1142|0.1260|
|c|0.15|0.40|0.0059|0.0157|
|D|5.55|6.25|0.2185|0.2461|
|E|7.75|8.15|0.3051|0.3209|
|E1|6.60|7.15|0.2598|0.2815|
|E2|4.40|4.70|0.1732|0.1850|
|L|0.75|1.50|0.0295|0.0591|



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**----- Start of picture text -----**<br>
Package  information<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Figure 17: SMC recommended footprint<br>1.54 5.11 1.54<br>(0.061) (0.201) (0.061)<br>3.14<br>(0.124)<br>8.19<br>(0.323)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


DocID11497 Rev 2 

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**Ordering** information 

**STTH212** 

## **3 Ordering information** 

**Table 8: Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STTH212U|U22|SMB|0.110g|2500|Tape and reel|
|STTH212S|S12|SMC|0.243g|2500|Tape and reel|



## **4 Revision history** 

**Table 9: Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|28-Jun-2005|1|First issue|
|12-Jun-2017|2|Updated cover image.<br>Removed DO-201AD package.|



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**STTH212** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2017 STMicroelectronics – All rights reserved 

DocID11497 Rev 2 

11/11 



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- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/stmicroelectronics/stth212u/diode-ultrafast-2a-1200v/dp/1295254)
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