# Fast / Ultrafast Diode, 800 V, 2 A, Single, 1.65 V, 75 ns, 45 A

![Product image](https://novapart.co/image/farnell:2354479/)

**URL**: https://novapart.co/products/STTH208./fast-ultrafast-diode-800-v-2-a-single-165-75-ns-45
**SKU**: STTH208.
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.1390
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:800V; Forward Current If(AV):2A; Diode Configuration:Single; Forward Voltage VF Max:1.65V; Reverse Recovery Time trr Max:75ns; Forward Surge Current

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2 Pin |
| Product Range | STTH2 |
| Qualification | - |
| Diode Case Style | DO-204AC |
| Diode Configuration | Single |
| Forward Voltage Max | 1.65V |
| Forward Surge Current | 45A |
| Reverse Recovery Time | 75ns |
| Average Forward Current | 2A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 800V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2354479/)

**STTH208** 

Datasheet 

## 2 A, 800 V ultrafast recovery diode 

**==> picture [135 x 125] intentionally omitted <==**

**----- Start of picture text -----**<br>
K —\<—. A<br>A<br>A<br>fo<br>K<br>/<br>K<br>DO-15 SMB<br>**----- End of picture text -----**<br>


## **Features** 

- Low forward voltage drop 

- High reliability 

- High surge current capability 

- Soft switching for reduced EMI disturbances 

- Planar technology 

- ECOPACK compliant 

## **Applications** 

- Switching diode 

- Power swiching applications 

## **Description** 

The STTH208, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. 

|**Product summary**<br>~~——~~|**Product summary**<br>~~——~~|
|---|---|
|**Symbol**<br>~~—~~|**Value**<br>~~——~~|
|**IF(AV)**|2 A|
|**VRRM**|800 V|
|**T j(max.)**|175 °C|
|**VF(typ.)**|0.89 V|
|trr(max.)|75 ns|



**DS3068** - **Rev 2** - **April 2020** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STTH208 Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|||**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||800|V|
|VRMS|RMS voltage|||560|V|
|IF(AV)|Average forward current δ = 0.5, square wave|DO-15|TL= 60 °C|2|A|
|||SMB|TL= 100 °C|||
|IFSM|Surge non repetitive forward current|DO-15|tp= 8.3 ms sinusoidal|45|A|
|||SMB||35||
|Tstg|Storage temperature range|||-50 to +175|°C|
|Tj|Maximum operating junction temperature|||+175|°C|



**Table 2. Thermal resistance parameter** 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Max. value**|**Unit**|
|---|---|---|---|---|---|
|Rth(j-l)|Junction to lead||SMB|25|°C/W|
||Junction to lead|Lead length = 10 mm on infinite heatsink|DO-15|40||
|Rth(j-a)|Junction to ambient|||110||



For more information, please refer to the following application note : 

- AN5088 : Rectifiers thermal management, handling and mounting recommendations 

**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**||**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 25 °C|VR= 800 V|-||5|µA|
|||Tj= 125 °C||-|5|50|µA|
|VF(2)|Forward voltage drop|Tj= 25 °C|IF= 2 A|-||1.65|V|
|||Tj= 150 °C||-|0.89|1.25||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: 

P = 0.5 x IF(AV) + 0.10 x IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses : 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

**DS3068** - **Rev 2** 

**page 2/10** 

**STTH208 Characteristics** 

**Table 4. Dynamic characteristics (Tj = 25 °C unless otherwise stated)** 

|**Symbol**|**Parameters**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|trr|Reverse recovery time|IF= 0.5 A, Irr= 0.25 A, IF= 1 A|-|-|75|ns|
|tfr|Forward recovery time|IF= 2 A, dIF/dt = 50 A/μs, VFR= 1.1 x VF(max.)|-|-|200|ns|
|VFP|Forward recovery voltage||-|-|9|V|



**DS3068** - **Rev 2** 

**page 3/10** 

**STTH208 Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**Figure 1. Average forward power dissipation versus Figure 2. Forward voltage drop versus forward current average forward current** 

**==> picture [479 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
IFM(A)<br>P(W) 100.0<br>3.5<br>3.0 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 (maximum values) T =150°Cj<br>2.5 10.0<br>δ = 1<br>2.0<br>T =150°Cj<br>(typical values)<br>1.5<br>1.0 T =25j ° C<br>(maximum values)<br>1.0<br>T<br>0.5<br>IF(AV)(A) δ [=][tp/T] tp 0.1 VFM(V)<br>0.0<br>0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4<br>**----- End of picture text -----**<br>


**Figure 3. Relative variation of thermal impedance junction Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration (DO-15) to lead versus pulse duration (SMB)** 

**==> picture [480 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a)<br>1.0 1.0<br>0.9 DO-15 0.9 SMB<br>0.8 L leads = 10mm 0.8 S = 1 cm²<br>0.7 0.7<br>0.6 δ = 0.5 0.6 δ = 0.5<br>0.5 0.5<br>0.4 0.4<br>0.3 δ = 0.2 0.3 δ = 0.2<br>0.2 δ = 0.1 T 0.2 δ = 0.1 T<br>0.1 Single pulse tp(s) δ = tp/T tp 0.1 Single pulse tp(s) δ = tp/T tp<br>0.0 0.0<br>1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br>


**Figure 5. Thermal resistance junction to ambient versus Figure 6. Thermal resistance junction to ambient versus copper surface under each lead (typical values) lead length, DO-15** 

**==> picture [476 x 137] intentionally omitted <==**

**----- Start of picture text -----**<br>
200 Rth(j-a)(°C/W) 120 Rth(j-a)(°C/W)<br>DO-15<br>SMB<br>100<br>150<br>80<br>100 60<br>50 Epoxy printed board FR4, eCu = 35 µm 40<br>20<br>SCu (cm²)<br>Lleads (mm)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**DS3068** - **Rev 2** 

**page 4/10** 

**STTH208 Package information** 

**2** 

## **Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1** 

## **SMB package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

**Figure 7. SMB package outline** 

**==> picture [303 x 237] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br>


**DS3068** - **Rev 2** 

**page 5/10** 

**STTH208 SMB package information** 

**Table 5. SMB package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.074|0.097|
|A2|0.05|0.20|0.001|0.008|
|b|1.95|2.20|0.076|0.087|
|c|0.15|0.40|0.005|0.016|
|D|3.30|3.95|0.129|0.156|
|E|5.10|5.60|0.200|0.221|
|E1|4.05|4.60|0.159|0.182|
|L|0.75|1.50|0.029|0.060|



**Figure 8. SMB recommended footprint** 

**==> picture [226 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.62 2.60 1.62<br>(0.064) (0.102) (0.064)<br>2.18<br>(0.086)<br>5.84<br>(0.230)<br>**----- End of picture text -----**<br>


**DS3068** - **Rev 2** 

**page 6/10** 

**STTH208 DO-15 package information** 

## **2.2 DO-15 package information** 

- Epoxy meets UL 94, V0 

**==> picture [138 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 9. DO-15 package outline<br>**----- End of picture text -----**<br>


**==> picture [427 x 178] intentionally omitted <==**

**----- Start of picture text -----**<br>
C A C<br>ØD<br>ØB<br>**----- End of picture text -----**<br>


**Table 6. DO-15 package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches (for reference only)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|6.05|-|6.75|0.238|-|0.266|
|B|2.95|-|3.53|0.116|-|0.139|
|C|26.00|-|31.00|1.024|-|1.220|
|D|0.71|-|0.88|0.028|-|0.0035|



**DS3068** - **Rev 2** 

**page 7/10** 

**STTH208 Ordering information** 

## **3 Ordering information** 

**Table 7. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STTH208U|U08|SMB|0.107 g|2500|Tape and reel|
|STTH208|STTH208|DO-15|0.400 g|6000|Tape and reel|



**DS3068** - **Rev 2** 

**page 8/10** 

**STTH208** 

## **Revision history** 

**Table 8. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|2003|1|First issue.|
|01-Apr-2020|2|UpdatedFigure 4andFigure 3. Minor text changes.|



**DS3068** - **Rev 2** 

**page 9/10** 

**STTH208** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2020 STMicroelectronics – All rights reserved 

**DS3068** - **Rev 2** 

**page 10/10** 



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