# Fast / Ultrafast Diode, 200 V, 1.5 A, Single, 1 V, 30 ns, 60 A

![Product image](https://novapart.co/image/farnell:2353664RL/)

**URL**: https://novapart.co/products/STTH1R02A/fast-ultrafast-diode-200-v-15-a-single-1-30-ns-60
**SKU**: STTH1R02A
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.0940
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:200V; Forward Current If(AV):1.5A; Diode Configuration:Single; Forward Voltage VF Max:1V; Reverse Recovery Time trr Max:30ns; Forward Surge Current Ifsm Max:60A; O

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2 Pin |
| Product Range | STTH1 |
| Qualification | - |
| Diode Case Style | DO-214AC (SMA) |
| Diode Configuration | Single |
| Forward Voltage Max | 1V |
| Forward Surge Current | 60A |
| Reverse Recovery Time | 30ns |
| Average Forward Current | 1.5A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 200V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2353664RL/)

**STTH1R02** 

Datasheet 

200 V - 1.5 A ultrafast recovery diode 

**==> picture [120 x 208] intentionally omitted <==**

**----- Start of picture text -----**<br>
K A<br>A<br>K a A K<br>SMA SMB<br>A<br>A<br>K<br>K<br>Sf<br>DO-15 DO-41<br>**----- End of picture text -----**<br>


## **Features** 

- Very low conduction losses 

- Negligible switching losses 

- Low forward voltage drop 

- High junction temperature 

- ECOPACK[®] 2 

## **Applications** 

- Switching diode 

- LED Lighting 

- Auxiliary power supply 

- Flyback diode 

## **Description** 

The STTH1R02 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. 

Packaged in SMA, SMB, DO-41 and DO-15, the STTH1R02 is ideal for use low voltage, high frequency inverters, free wheeling and polarity protection 

## ~~—_—~~ 

|**Product summary**<br>~~——~~|**Product summary**<br>~~——~~|
|---|---|
|**Symbol**<br>~~—~~|**Value**<br>~~——~~|
|**IF(AV)**|1.5 A|
|**VRRM**|200 V|
|**T j(max.)**|175 °C|
|**VF(typ.)**|0.7 V|
|**trr(typ.)**|15 ns|



**DS4743** - **Rev 4** - **December 2018** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STTH1R02 Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||200|V|
|IF(AV)|Average forward current δ = 0.5, square wave|SMA, SMB|TL= 150 °C|1.5|A|
|||DO-41, DO-15|TL= 135 °C|||
|IFSM|Surge non repetitive forward current||tp= 10 ms sinusoidal|60|A|
|Tstg|Storage temperature range|||-65 to +175|°C|
|Tj|Operating junction temperature|||+175|°C|



**Table 2. Thermal resistance parameter** 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Max. value**|**Unit**|
|---|---|---|---|---|---|
|Rth(j-l)|Junction to lead||SMA, SMB|30|°C/W|
|Rth(j-l)|Junction to lead|Lead length = 10 mm on infinite heatsink|DO-15, DO-41|45||



For more information, please refer to the following application note : 

- AN5088 : Rectifiers thermal management, handling and mounting recommendations 

**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**||**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||3|µA|
|||Tj= 125 °C||-|2|20||
|VF(2)|Forward voltage drop|Tj= 25 °C|IF= 1.5 A|-|0.89|1.00|V|
|||Tj= 100 °C||-|0.76|0.85||
|||Tj= 150 °C||-|0.70|0.80||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: 

P = 0.68 x IF(AV) + 0.08 x IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses : 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

**DS4743** - **Rev 4** 

**page 2/15** 

**STTH1R02 Characteristics** 

**Table 4. Dynamic characteristics (Tj = 25 °C unless otherwise stated)** 

|**Symbol**|**Parameters**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|trr|Reverse recovery time|IF= 1 A, dIF/dt = -50 A/μs,VR= 30 V|-|23|30|ns|
|||IF= 1 A, dIF/dt = -100 A/μs, VR= 30 V|-|15|20||
|IRM|Reverse recovery current|IF= 1.5 A, dIF/dt = -200 A/μs, VR= 160 V, Tj= 125 °C|-|3|4|A|
|tfr|Forward recovery time|IF=1.5 A, dIF/dt = 100 A/μs, VFR= 1.1 VF(max.)|-|50||ns|
|VFP|Forward recovery voltage|IF=1.5 A, dIF/dt = 100 A/μs|-|2.1||V|



**DS4743** - **Rev 4** 

**page 3/15** 

**STTH1R02 Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**Figure 2. Forward voltage drop versus forward current (typical values)** 

**Figure 1. Peak current versus duty cycle** 

**==> picture [219 x 154] intentionally omitted <==**

**----- Start of picture text -----**<br>
IM(A)<br>50<br>T<br>45 [| +++ +++ IMM<br>40 δdd [[=tp/T]] tp<br>SSE EES r i- e<br>35 haaaSSE -<br>30<br>P = 5 W<br>25 ————————————WAGWe\efTaWAGWe\efTaWe\efTa ee<br>20 0 a a<br>P = 2 W<br>15 ———S————————<br>WEN a P = 1 W<br>10<br>Wes SSS<br>5<br>δ<br>0 SSeeSSeeSSSS<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0<br>**----- End of picture text -----**<br>


**==> picture [475 x 356] intentionally omitted <==**

**----- Start of picture text -----**<br>
T IF(A)<br>45 [| +++ +++ IMM 50<br>40 δdd [[=tp/T]] tp<br>35 haaaSSE EES r i- e 40 |Ff| || || || || |tf |Ty¥ |<br>30<br>P = 5 W 30<br>25 fTaa ee i ee ee [|ee<br>————————————WAGWe\efTaWAGWe\efTaWe\efTa<br>20 0 a a 20 rf | | | tf eY<br>P = 2 W<br>15 ———S———————— Tj=150°C tt<br>WEN a P = 1 W Pf | | YTA [TT]<br>10 10 Tj=25°C<br>Wes SSS es<br>5 δ VF (V)<br>0 SSeeSSeeSSSS 0 ai | e<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 0.5 1.0 1.5 2.0 2.5<br>Figure 3. Forward voltage drop versus forward currentForward voltage drop versus forward current Figure 4. Relative variation of thermal impedance junctionRelative variation of thermal impedance junction<br>(maximum values) to lead versus pulse duration (SMA)<br>IFM(A) Zth(j-a)/Rth(j-a)<br>50 1.0 SMA Le<br>0.9 Scu=1cm²<br>4030 eea ee ee ee eeee 0.80.70.6 HEa a HH A EHH<br>L fe et tf te tes<br>0.5<br>20 P| | ft tt YT 0.4 Conon<br>P| | fe Tj=150°C Tj=25°C | 0.3 HE HE Ht<br>10 0.2<br>Single pulse<br>VFM(V) 0.1 t P(s)<br>0 aP| Leet |] 0.0 Spudeetn<TH LL TTEI TlTH}<br>0.0 0.5 1.0 1.5 2.0 2.5 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br>


**Figure 3. Forward voltage drop versus forward currentForward voltage drop versus forward current (maximum values)** 

**Figure 4. Relative variation of thermal impedance junctionRelative variation of thermal impedance junction to lead versus pulse duration (SMA)** 

**DS4743** - **Rev 4** 

**page 4/15** 

**STTH1R02 Characteristics (curves)** 

**Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction to lead versus pulse duration (SMB) to lead versus pulse duration (DO-41)** 

**==> picture [477 x 142] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a)<br>1.0 1.0<br>SM B DO-41<br>0.9 Scu=1cm² 0.9 Lleads=10mm<br>0.8 0.8<br>0.7 0.7<br>0.6 0.6<br>0.5 0.5<br>0.4 0.4<br>0.3 0.3<br>0.2 0.2<br>Single pulse<br>0.1 t P(s) 0.1 Single pulse t P(s)<br>0.0 0.0<br>1.E -02 1.E -01 1.E +00 1.E +01 1.E +02 1.E +03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br>


**==> picture [513 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Relative variation of thermal impedance junction Figure 8. Junction capacitance versus reverse voltage<br>to lead versus pulse duration (DO-15) applied (typical values)<br>Zth(j-a)/Rth(j-a) C(pF)<br>1. 0 100<br>0. 9 Leads =10mmDO-15 VoscF=1MHz=30mVRMS<br>0. 8 Tj=25°C<br>0. 7<br>0. 6<br>0. 5 10<br>0. 4<br>0. 3<br>0. 2<br>0. 1 Single pulse t P(s) VR(V)<br>0. 0 1<br>1. E- 03 1. E- 02 1. E- 01 1. E+ 00 1. E+ 01 1. E+ 02 1. E+ 03 1 10 100 1000<br>**----- End of picture text -----**<br>


**==> picture [513 x 192] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 9. Reverse recovery charges versus dIF/dt (typical Figure 10. Reverse recovery time versus dIF/dt (typical<br>values) values)<br>QRR(nC) t RR(ns)<br>80 80<br>70 VIFR=1.5A=160V 70 VIFR=1.5A=160V<br>60 60<br>50 50<br>40 40 Tj=125°C<br>30 Tj=125°C 30<br>20 20 Tj=25°C<br>10 Tj=25°C 10<br>dIF/dt(A/µs) dIF/dt(A/µs)<br>0 0<br>10 100 1000 10 100 1000<br>**----- End of picture text -----**<br>


**DS4743** - **Rev 4** 

**page 5/15** 

**STTH1R02 Characteristics (curves)** 

**==> picture [513 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 11. Peak reverse recovery current versus dIF/dt Figure 12. Relative variations of dynamic parameters<br>(typical values) versus junction temperature<br>IRM(A) QRR; IRM [T j] / QRR; IRM [T j=125°C]<br>8 1.4<br>7 VIFR=1.5A=160V 1.2 VIFR=1.5A=160V<br>6<br>1.0<br>5 0.8 IRM<br>4<br>0.6<br>3 QRR<br>Tj=125°C 0.4<br>2<br>1 Tj=25°C 0.2<br>dIF/dt(A/µs) Tj(°C)<br>0 0.0<br>10 100 1000 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**Figure 13. Thermal resistance junction to ambient versus Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (typical values) copper surface under each lead (typical values)** 

**==> picture [472 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
200 Rth(j-a)(°C/W) 200 Rth(j-a)(°C/W)<br>SMB SMA<br>150 150<br>100 100<br>Epoxy printed board FR4, eCu = 35 µm<br>Epoxy printed board FR4, eCu = 35 µm<br>50 50<br>SCu (cm²) SCu (cm²)<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**Figure 15. Thermal resistance junction to ambient versus Figure 16. Thermal resistance junction to ambient versus lead length (DO-41) lead length (DO-15)** 

**==> picture [481 x 152] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a)(°C/W) Rth(j-a)(°C/W)<br>100 100<br>DO-41<br>90 DO-15<br>80 80<br>70<br>60 60<br>50<br>40 40<br>30<br>20 20<br>10 Lleads (mm)<br>Lleads (mm)<br>0 0<br>0 1 2 3 4 5 6 7 8 9 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**DS4743** - **Rev 4** 

**page 6/15** 

**STTH1R02 Package information** 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

## **2.1 SMB package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

**Figure 17. SMB package outline** 

**==> picture [326 x 254] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br>


**DS4743** - **Rev 4** 

**page 7/15** 

**STTH1R02 SMB package information** 

**Table 5. SMB package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.074|0.097|
|A2|0.05|0.20|0.001|0.008|
|b|1.95|2.20|0.076|0.087|
|c|0.15|0.40|0.005|0.016|
|D|3.30|3.95|0.129|0.156|
|E|5.10|5.60|0.200|0.221|
|E1|4.05|4.60|0.159|0.182|
|L|0.75|1.50|0.029|0.060|



**Figure 18. SMB recommended footprint** 

**==> picture [226 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.62 2.60 1.62<br>(0.064) (0.102) (0.064)<br>2.18<br>(0.086)<br>5.84<br>(0.230)<br>**----- End of picture text -----**<br>


**DS4743** - **Rev 4** 

**page 8/15** 

**STTH1R02 SMA package information** 

## **2.2 SMA package information** 

- Epoxy meets UL94, V0 

- Cooling method : by conduction (C) 

## **Figure 19. SMA package outline** 

**==> picture [303 x 223] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br>


**Table 6. SMA package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.074|0.097|
|A2|0.05|0.20|0.001|0.008|
|b|1.25|1.65|0.049|0.065|
|c|0.15|0.40|0.005|0.016|
|D|2.25|2.90|0.088|0.115|
|E|4.80|5.35|0.188|0.211|
|E1|3.95|4.60|0.155|0.182|
|L|0.75|1.50|0.029|0.060|



**DS4743** - **Rev 4** 

**page 9/15** 

**STTH1R02 SMA package information** 

## **Figure 20. SMA recommended footprint in mm (inches)** 

**==> picture [226 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.4 2.63 1.4<br>(0.055) (0.104) (0.055)<br>1.64<br>(0.065)<br>5.43<br>(0.214)<br>**----- End of picture text -----**<br>


**DS4743** - **Rev 4** 

**page 10/15** 

**STTH1R02 DO-41 package information** 

## **2.3 DO-41 package information** 

- Epoxy meets UL 94, V0 

## **Figure 21. DO-41 package outline** 

**==> picture [309 x 131] intentionally omitted <==**

**----- Start of picture text -----**<br>
C A C<br>ØD<br>ØB<br>**----- End of picture text -----**<br>


**Table 7. DO-41 package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches (for reference only)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|4.07|-|5.20|0.160|-|0.205|
|B|2.04|-|2.71|0.080|-|0.107|
|C|25.40|-||1.000|-||
|D|0.71|-|0.86|0.028|-|0.0034|



**DS4743** - **Rev 4** 

**page 11/15** 

**STTH1R02 DO-15 package information** 

## **2.4 DO-15 package information** 

- Epoxy meets UL 94, V0 

## **Figure 22. DO-15 package outline** 

**==> picture [309 x 131] intentionally omitted <==**

**----- Start of picture text -----**<br>
C A C<br>ØD<br>ØB<br>**----- End of picture text -----**<br>


**Table 8. DO-15 package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches (for reference only)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|6.05|-|6.75|0.238|-|0.266|
|B|2.95|-|3.53|0.116|-|0.139|
|C|26.00|-|31.00|1.024|-|1.220|
|D|0.71|-|0.88|0.028|-|0.0035|



**DS4743** - **Rev 4** 

**page 12/15** 

**STTH1R02 Ordering information** 

**3 Ordering information** 

**Table 9. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STTH1R02A|R1A|SMA|0.068 g|5000|Tape and reel|
|STTH1R02U|1R2S|SMB|0.107 g|2500|Tape and reel|
|STTH1R02|STTH1R02|DO-41|0.34 g|2000|Ammopack|
|STTH1R02RL|STTH1R02|DO-41|0.34 g|5000|Tape and reel|
|STTH1R02Q|STTH1R02Q|DO-15|0.40 g|1000|Ammopack|
|STTH1R02QRL|STTH1R02Q|DO-15|0.40 g|6000|Tape and reel|



**DS4743** - **Rev 4** 

**page 13/15** 

**STTH1R02** 

## **Revision history** 

**Table 10. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|03-May-2006|1|First issue.|
|13-Oct-2006|2|Added DO-15 and SMB packages.|
|08-Mar-2007|3|Replaced Figure 8. Replaced ecu with copper thickness.|
|05-Dec-2018|4|UpdatedSection Applications. Minor text changes.|



**DS4743** - **Rev 4** 

**page 14/15** 

**STTH1R02** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2018 STMicroelectronics – All rights reserved 

**DS4743** - **Rev 4** 

**page 15/15** 



## Links

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- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/stmicroelectronics/stth1r02a/026003000-discretes/dp/2353664RL)
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