# Fast / Ultrafast Diode, 1.2 kV, 1 A, Single, 1.9 V, 75 ns, 18 A

![Product image](https://novapart.co/image/farnell:2454715/)

**URL**: https://novapart.co/products/STTH112UFY/fast-ultrafast-diode-12-kv-1-a-single-19-v-75-ns
**SKU**: STTH112UFY
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.2220
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:1.2kV; Forward Current If(AV):1A; Diode Configuration:Single; Forward Voltage VF Max:1.9V; Reverse Recovery Time trr Max:75ns; Forward Surge Current Ifsm M

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2 Pin |
| Product Range | STTH1 |
| Qualification | AEC-Q101 |
| Diode Case Style | DO-221AA |
| Diode Configuration | Single |
| Forward Voltage Max | 1.9V |
| Forward Surge Current | 18A |
| Reverse Recovery Time | 75ns |
| Average Forward Current | 1A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 1.2kV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2454715/)

**STTH112-Y** 

Datasheet 

Automotive 1 A - 1200 V ultrafast rectifier 

## **Features** 

- A • AEC-Q101 qualified • Very low conduction losses • Negligible switching losses 

- ~ • Low forward and reverse recovery times 

- SMB Flat SMB Flat Wettable leads • High junction temperature 

   - ECOPACK2 or ECOPACK3 compliant component on demand 

## **Description** 

The STTH112-Y, which is using ST’s new 1200 V planar technology, is especially suited for switching mode base drive and transistor circuits. 

The device is also intended for use as a free-wheeling diode in power supplies and 

other power switching applications in automotive K functions. 

## **Product status link** ~~ea~~ 

**Product status link** STTH112-Y 

|**Product summary**<br>~~ea~~|**Product summary**<br>~~ea~~|
|---|---|
|**IF(AV)**|1 A|
|**VRRM**|1200 V|
|**Tj (max.)**|175 °C|
|**VF (typ.)**|1.1 V|
|**Trr (typ.)**|53 ns|



**DS10171** - **Rev 2** - **March 2022** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STTH112-Y Characteristics** 

**1 Characteristics** 

**Table 1. Absolute ratings (limiting values at Tj= 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage||1200|V|
|IF(AV)|Average forward<br>current|TL= 135 °C δ = 0.5|1|A|
|IFSM|Forward surge current|tp= 8.3 ms|18|A|
|Tstg|Storage temperature range||-65 to + 175|°C|
|Tj(1)|Operating temperature range||-40 to + 175|°C|



_1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink._ 

**Table 2. Thermal resistance** 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|Rth(j-l)|Junction to lead|20|°C/W|



**Table 3. Static electrical characteristic** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||5|µA|
|||Tj= 125 °C||-|1|50||
|VF(2)|Forward voltage drop|Tj= 25 °C|IF= 1 A|-||1.9|V|
|||Tj= 150 °C||-|1.10|1.55||



_1. Pulsetest: tp = 5 ms, δ < 2%_ 

_2. Pulsetest: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses use the following equation: P = 1.25 x I + 0.330 I F(AV) F²(RMS) 

**Table 4. Dynamic electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|trr|Reverse recovery time|Tj= 25 °C|IF= 0.5 A; Irr= 0.25 A; IR= 1 A|-|53|75|ns|
|tfr|Forward recovery time|Tj= 25 °C|IF= 1 A; dIF/dt= 50 A/µs; VFR= 4.50 V|-||500||
|VFP|Forward recovery voltage|||-|20|30|V|



**DS10171** - **Rev 2** 

**page 2/8** 

**STTH112-Y Electrical characteristics (curves)** 

## **1.1 Electrical characteristics (curves)** 

**Figure 1. Average forward power dissipation versus average forward current** 

**==> picture [222 x 145] intentionally omitted <==**

**----- Start of picture text -----**<br>
PF(AV)(W)<br>2.4<br>2.0 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 δ = 1<br>1.6<br>1.2<br>0.8<br>T<br>0.4<br>IF(AV)(A) δ [=tp/T] tp<br>0.0<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>**----- End of picture text -----**<br>


**Figure 3. Forward voltage drop versus forward current (maximum values)** 

**==> picture [223 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
IF(A)<br>10.00<br>Tj = 150 °C<br>1.00 Tj = 25 °C<br>0.10<br>V F (V)<br>0.01<br>0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6<br>**----- End of picture text -----**<br>


**Figure 5. Junction capacitance versus reverse voltage applied (typical values)** 

**==> picture [224 x 149] intentionally omitted <==**

**----- Start of picture text -----**<br>
C(pF)<br>100<br>F = 1 MHz<br>V OSCT j= 30 mV = 25 °C RMS<br>10<br>VR(V)<br>1<br>1 10 100 1000 10000<br>**----- End of picture text -----**<br>


**Figure 2. Forward voltage drop versus forward current (typical values)** 

**==> picture [222 x 142] intentionally omitted <==**

**----- Start of picture text -----**<br>
IF(A)<br>10.00<br>Tj = 150 °C<br>1.00<br>Tj = 25 °C<br>0.10<br>VF(V)<br>0.01<br>0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8<br>**----- End of picture text -----**<br>


**Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration** 

**==> picture [223 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-l)/Rth(j-l)<br>1.0<br>SMBflat<br>0.9<br>0.8<br>0.7<br>0.6<br>0.5<br>0.4<br>0.3<br>0.2 Single pulse<br>0.1 tp(s)<br>0.0<br>1. E-04 1. E-03 1. E-02 1. E-01 1. E+00 1. E+01<br>**----- End of picture text -----**<br>


**Figure 6. Thermal resistance junction to ambient versus copper surface under each lead** 

**==> picture [222 x 147] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a)(°C/W)<br>150<br>Epoxy printed board FR4, copper thickness: 70 μm SMB-Flat<br>120<br>90<br>60<br>30<br>S Cu (cm²)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**DS10171** - **Rev 2** 

**page 3/8** 

**STTH112-Y Package information** 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1 SMB Flat package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

**Figure 7. SMB Flat package outline** 

**Table 5. SMB Flat mechanical data** 

|**Ref.**<br>~~——~~|**Dimensions**<br>~~ee~~<br>~~——~~|**Dimensions**<br>~~ee~~<br>~~——~~|**Dimensions**<br>~~ee~~<br>~~——~~|**Dimensions**<br>~~ee~~<br>~~——~~|**Dimensions**<br>~~ee~~<br>~~——~~|**Dimensions**<br>~~ee~~<br>~~——~~|
|---|---|---|---|---|---|---|
||**Millimeters**<br>~~es~~<br>~~——~~|||**Inches**<br>~~es~~<br>~~——~~|||
||**Min.**<br>~~——~~|**Typ.**<br>~~——~~|**Max.**<br>~~——~~|**Min.**<br>~~——~~|**Typ.**|**Max.**|
|A<br>~~——~~|0.90<br>~~——~~|~~——~~|1.10<br>~~——~~|0.035<br>~~——~~||0.043|
|b|1.95||2.20|0.077||0.087|
|c|0.15||0.40|0.006||0.016|
|D|3.30||3.95|0.130||0.156|
|E|5.10||5.60|0.200||0.220|
|E1|4.05||4.60|0.159||0.181|
|L|0.75||1.50|0.030||0.060|
|L2||0.60|||0.024||



**DS10171** - **Rev 2** 

**page 4/8** 

**STTH112-Y SMB Flat package information** 

**Figure 8. Footprint recommendations, dimensions in mm (inches)** 

**==> picture [154 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.20 3.44 1.20<br>(0.047) (0.136) (0.047)<br>2.07<br>(0.082)<br>5.84<br>(0.230)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


**DS10171** - **Rev 2** 

**page 5/8** 

**STTH112-Y Ordering information** 

## **3 Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STTH112UFY|F112Y|SMBflat|50 mg|5000|Tape and reel|



**DS10171** - **Rev 2** 

**page 6/8** 

**STTH112-Y** 

## **Revision history** 

**Table 6. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|04-Feb-2014|1|Initial release.|
|18-Mar-2022|2|UpdatedSection 2.1  SMB Flat package information.|



**DS10171** - **Rev 2** 

**page 7/8** 

**STTH112-Y** 

## **IMPORTANT NOTICE – READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2022 STMicroelectronics – All rights reserved 

**DS10171** - **Rev 2** 

**page 8/8** 



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