# Dual MOSFET, N Channel, 30 V, 30 V, 10 A, 10 A, 0.019 ohm

![Product image](https://novapart.co/image/farnell:2807225/)

**URL**: https://novapart.co/products/STS10DN3LH5/dual-mosfet-n-channel-30-v-10-a-0019-ohm
**SKU**: STS10DN3LH5
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || FETs || Dual MOSFETs
**Price**: €0.3240
**Stock**: 1000+
**Lead Time**: 127 days (indicative)

## Description

Transistor Polarity:Dual N Channel; Continuous Drain Current Id:10A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.019ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1V

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | STripFET V Series |
| Qualification | - |
| Transistor Case Style | SOIC |
| Operating Temperature Max | 150°C |
| Power Dissipation N Channel | 2.5W |
| Power Dissipation P Channel | 2.5W |
| Drain Source Voltage Vds N Channel | 30V |
| Drain Source Voltage Vds P Channel | 30V |
| Continuous Drain Current Id N Channel | 10A |
| Continuous Drain Current Id P Channel | 10A |
| Drain Source On State Resistance N Channel | 0.019ohm |
| Drain Source On State Resistance P Channel | 0.019ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2807225/)

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## **STS10DN3LH5** Dual N-channel 30 V, 0.019 Ω , 10 A, SO-8 STripFET™ V Power MOSFET 

## **Features** 

|**Features**||||
|---|---|---|---|
|**Type**|**VDSS**|**RDS(on)max**|**ID**|
|STS10DN3LH5|30 V|0.021Ω|10 A|



- RDS(on) * Qg industry benchmark 

- Extremely low on-resistance RDS(on) 

- Very low switching gate charge 

- High avalanche ruggedness 

- Low gate drive power losses 

## **Application** 

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**----- Start of picture text -----**<br>
SO-8<br>**----- End of picture text -----**<br>


- Switching applications 

## **Description** 

This  STripFET™V  Power MOSFET technology is among the latest improvements, which have been especially tailored to achieve very low  on-state resistance providing also one of the  best-in-class FOM. 

## **Figure 1. Internal schematic diagram** 

**==> picture [130 x 126] intentionally omitted <==**

**Table 1. Device summary** 

|**Order codes**|**Marking**|**Package**|**Packaging**|
|---|---|---|---|
|STS10DN3LH5|10DD3L|SO-8|Tape and reel|



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_www.st.com_ 

**Contents** 

**STS10DN3LH5** 

|**Contents**|**Contents**|
|---|---|
|**1**|**Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3**|
|**2**|**Electrical characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4**|
||2.1<br>Electrical characteristics (curves)           . . . . . . . . . . . . . . . . . . . . . . . . . . . 6|
|**3**|**Test circuits     . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8**|
|**4**|**Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10**|
|**5**|**Revision history  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12**|



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**Electrical ratings** 

## **1 Electrical ratings** 

## **Table 2. Absolute maximum ratings** 

|**Table 2.**|**Absolute maximum ratings**|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|VDS|Drain-source voltage (VGS= 0)|30|V|
|VGS|Gate-Source voltage|± 22|V|
|ID<br>(1)|Drain current (continuous) at TC= 25 °C|10|A|
|ID|Drain current (continuous) at TC= 100 °C|7|A|
|IDM<br>(2)|Drain current (pulsed)|40|A|
|PTOT|Total dissipation at TC= 25 °C|2.5|W|
||Derating factor|0.02|W/°C|
|EAS<br>(3)|Single pulse avalanche energy|50|mJ|
|TJ<br>Tstg|Operating junction temperature<br>Storage temperature|- 55 to 150|°C|



1. Limited by wire bonding 

2. Pulse width limited by safe operating area 

3. Starting TJ = 25 °C, ID = 21 A, L= 0.2 mH 

## **Table 3. Thermal resistance** 

|**Table 3.**|**Thermal resistance**|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|RthJC|Thermal resistance junction-case max|50|°C/W|
|RthJA|Thermal resistance junction-case max|100|°C/W|
|TJ|Maximum lead temperature for soldering<br>purpose|275|°C|



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**Electrical characteristics** 

## **2 Electrical characteristics** 

(TCASE = 25 °C unless otherwise specified) 

## **Table 4. Static** 

|**Table 4.**|**Static**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|V(BR)DSS|Drain-source<br>breakdown Voltage|ID= 250 µA, VGS= 0|30|||V|
|IDSS|Zero gate voltage<br>drain current (VGS= 0)|VDS= 30 V<br>VDS= 30 V, Tc = 125 °C|||1<br>10|µA<br>µA|
|IGSS|Gate body leakage<br>current<br>(VDS= 0)|VGS= ± 22 V|||±100|nA|
|VGS(th)|Gate threshold voltage|VDS= VGS, ID= 250 µA|1|||V|
|RDS(on)|Static drain-source on<br>resistance|VGS= 10 V, ID= 5 A||0.019|0.021|Ω|
|||VGS= 4.5 V, ID= 5 A||0.023|0.028|Ω|



## **Table 5. Dynamic** 

|**Table 5.**|**Dynamic**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min**|**Typ.**|**Max.**|**Unit**|
|Ciss<br>Coss<br>Crss|Input capacitance<br>Output capacitance<br>Reverse transfer<br>capacitance|VDS= 25 V, f = 1 MHz,<br>VGS= 0|-|475<br>97<br>19|-|pF<br>pF<br>pF|
|Qg<br>Qgs<br>Qgd|Total gate charge<br>Gate-source charge<br>Gate-drain charge|VDD= 15 V, ID= 10 A<br>VGS= 5 V<br>_(Figure 14)_|-|4.6<br>1.7<br>1.9|-|nC<br>nC<br>nC|
|Qgs1<br>Qgs2|Pre Vthgate-to-source<br>charge<br>Post Vthgate-to-<br>source charge|VDD= 15 V, ID= 10A<br>VGS= 5 V<br>_(Figure 19)_|-|0.67<br>0.84|-|nC<br>nC|
|RG|Gate input resistance|f = 1 MHz gate bias<br>Bias = 0 test signal<br>level = 20 mV<br>open drain|-|2.5|-|Ω|



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**Electrical characteristics** 

**Table 6. Switching on/off (resistive load)** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|td(on)<br>tr|Turn-on delay time<br>Rise time|VDD= 15 V, ID= 5 A,<br>RG= 4.7Ω,VGS= 10 V<br>_(Figure 13 and Figure 18)_|-|4<br>22|-|ns<br>ns|
|td(off)<br>tf|Turn-off delay time<br>Fall time|VDD= 15 V, ID= 5 A,<br>RG= 4.7Ω,VGS= 10 V<br>_(Figure 13 and Figure 18)_|-|13<br>2.8|-|ns<br>ns|



## **Table 7. Source drain diode** 

|**Table 7.**|**Source drain diode**||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|ISD<br>ISDM<br>(1)|Source-drain current<br>Source-drain current<br>(pulsed)||-||10<br>40|A<br>A|
|VSD|Forward on voltage|ISD= 5 A, VGS= 0|-||1.1|V|
|trr<br>Qrr<br>IRRM|Reverse recovery time<br>Reverse recovery charge<br>Reverse recovery current|ISD= 10 A, VDD= 25 V<br>di/dt = 100 A/µs,<br>_(Figure 15)_|-|16.2<br>7.8<br>1||ns<br>nC<br>A|



1. Pulsed: pulse duration = 300 µs, duty cycle 1.5 % 

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**Electrical characteristics** 

## **2.1 Electrical characteristics (curves)** 

## **Figure 2. Safe operating area Figure 3. Thermal impedance** 

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**----- Start of picture text -----**<br>
ID AM03899v1<br>(A) Tj=150°C<br>Tc=25°C<br>100 Sinlge<br>pulse<br>10<br>100ms<br>1<br>10ms<br>1s<br>0.1<br>0.01<br>0.1 1 10 VDS(V)<br>Figure 4. Output characteristics  Figure 5. Transfer characteristics<br>ID AM03900v1 ID AM03901v1<br>(A) (A)<br>VGS=10V<br>70 70 VDS=5V<br>6V<br>60 60<br>5V<br>50 50<br>40 40<br>4V<br>30 30<br>20 20<br>3V<br>10 10<br>0 0<br>0 1 2 3 4 VDS(V) 0 2 4 6 8 VGS(V)<br>DS(on)<br>Operation in this area is<br>Limited by max R<br>**----- End of picture text -----**<br>


**Figure 6. Normalized BVDSS vs temperature Figure 7. Static drain-source on resistance** 

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**----- Start of picture text -----**<br>
BVDSS AM03902v1 RDS(on) AM03903v1<br>(norm) (Ω)<br>ID=13.5A<br>35<br>VGS=10V<br>1.10<br>30<br>1.05<br>25<br>1.00 20<br>15<br>0.95<br>10<br>0.90<br>5<br>0.85 0<br>-55 -30 -5 20 45 70 95 120 TJ(°C) 0 5 10 15 20 25 ID(A)<br>**----- End of picture text -----**<br>


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**Electrical characteristics** 

**Figure 8. Gate charge vs gate-source voltage Figure 9. Capacitance variations** 

**==> picture [463 x 176] intentionally omitted <==**

**----- Start of picture text -----**<br>
VGS AM03904v1 C AM03905v1<br>(V) (pF)<br>VDD=15V<br>12 810 TJ=25°C<br>ID=27A<br>710 f=1MHz<br>10<br>610<br>8<br>510<br>Ciss<br>6 410<br>310<br>4<br>210 Crss<br>2<br>110 Coss<br>0 10<br>0 2 4 6 Qg(nC) 0 10 20 VDS(V)<br>**----- End of picture text -----**<br>


**Figure 10. Normalized gate threshold voltage vs temperature** 

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**----- Start of picture text -----**<br>
VGS(th) AM03906v1<br>(norm)<br>1.1<br>1.0<br>0.9<br>0.8<br>0.7<br>0.6<br>0.5<br>0.4<br>-55 -30 -5 20 45 70 95 120 145 TJ(°C)<br>**----- End of picture text -----**<br>


**Figure 11. Normalized on resistance vs temperature** 

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**----- Start of picture text -----**<br>
RDS(on) AM03907v1<br>(norm)<br>1.8<br>1.6<br>1.4<br>1.2<br>1.0<br>0.8<br>0.6<br>0.4<br>-55 -30 -5 20 45 70 95 120 TJ(°C)<br>**----- End of picture text -----**<br>


## **Figure 12. Source-drain diode forward characteristics** 

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**----- Start of picture text -----**<br>
VSD AM03908v1<br>(V)<br>TJ=-55°C<br>1.1<br>1.0<br>0.9<br>0.8<br>TJ=175°C<br>TJ=25°C<br>0.7<br>0.6<br>0.5<br>0.4<br>0 5 10 15 20 25 ISD(A)<br>**----- End of picture text -----**<br>


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**Test circuits** 

## **3 Test circuits** 

## **Figure 13. Switching times test circuit for Figure 14. Gate charge test circuit resistive load** 

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**----- Start of picture text -----**<br>
VDD<br>12V 47kΩ<br>1kΩ<br>100nF<br>RL 2200 3.3<br>µF µF<br>VDD IG=CONST<br>VD Vi=20V=VGMAX 100Ω D.U.T.<br>VGS<br>2200<br>RG D.U.T. µF 2.7kΩ VG<br>PW<br>47kΩ<br>1kΩ<br>PW<br>AM01468v1 AM01469v1<br>**----- End of picture text -----**<br>


**Figure 15. Test circuit for inductive load Figure 16. Unclamped inductive load test switching and diode recovery times circuit** 

**==> picture [463 x 162] intentionally omitted <==**

**----- Start of picture text -----**<br>
L<br>A A A<br>D<br>G D.U.T. FASTDIODE L=100µH VD 2200 3.3<br>S B 3.3 1000 µF µF VDD<br>25 Ω B B D µF µF VDD ID<br>G<br>RG S<br>Vi D.U.T.<br>Pw<br>AM01470v1 AM01471v1<br>**----- End of picture text -----**<br>


## **Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform** 

**==> picture [463 x 162] intentionally omitted <==**

**----- Start of picture text -----**<br>
V(BR)DSS ton toff<br>VD tdon tr tdoff tf<br>90% 90%<br>IDM<br>10%<br>ID 0 10% VDS<br>VDD VDD 90%<br>VGS<br>AM01472v1 0 10% AM01473v1<br>**----- End of picture text -----**<br>


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**Test circuits** 

## **Figure 19. Gate charge waveform** 

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**Package mechanical data** 

## **4 Package mechanical data** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

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**Package mechanical data** 

## **SO-8 MECHANICAL DATA** 

|**DIM.**|**mm.**|**mm.**|**mm.**|**inch**|**inch**|**inch**|
|---|---|---|---|---|---|---|
||**MIN.**|**TYP**|**MAX.**|**MIN.**|**TYP.**|**MAX.**|
|A|||1.75|||0.068|
|a1|0.1||0.25|0.003||0.009|
|a2|||1.65|||0.064|
|a3|0.65||0.85|0.025||0.033|
|b|0.35||0.48|0.013||0.018|
|b1|0.19||0.25|0.007||0.010|
|C|0.25||0.5|0.010||0.019|
|c1|45 (typ.)||||||
|D|4.8||5.0|0.188||0.196|
|E|5.8||6.2|0.228||0.244|
|e||1.27|||0.050||
|e3||3.81|||0.150||
|F|3.8||4.0|0.14||0.157|
|L|0.4||1.27|0.015||0.050|
|M|||0.6|||0.023|
|S|8 (max.)||||||



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**Revision history** 

## **5 Revision history** 

**Table 8.** 

**Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|12-May-2009|1|First release|



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- [Supplier page](https://es.farnell.com/stmicroelectronics/sts10dn3lh5/mosfet-dual-n-ch-30v-10a-soic/dp/2807225)
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