# Power MOSFET, N Channel, 800 V, 300 mA, 16 ohm, TO-92, Through Hole

![Product image](https://novapart.co/image/farnell:2344082/)

**URL**: https://novapart.co/products/STQ1NK80ZR-AP/power-mosfet-n-channel-800-v-300-ma-16-ohm-to-92
**SKU**: STQ1NK80ZR-AP
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2750
**Stock**: 1000+
**Lead Time**: 106 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:300mA; Drain Source Voltage Vds:800V; On Resistance Rds(on):13ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3.75V; Po

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 3W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-92 |
| Drain Source Voltage Vds | 800V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 300mA |
| Drain Source On State Resistance | 16ohm |
| Gate Source Threshold Voltage Max | 3.75V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2344082/)

**STQ1NK80ZR-AP - STN1NK80Z STD1NK80Z - STD1NK80Z-1** N-CHANNEL 800V - 13 Ω - 1 A TO-92 /SOT-223/DPAK/IPAK Zener - Protected Su erMESH™ MOSFET p 

**Table 1: General Features** 

**Figure 1: Package** 

**TYPE VDSS RDS(on) ID Pw** STQ1NK80ZR-AP 800 V < 16 Ω 0.3 A 3 W STN1NK80Z 800 V < 16 Ω 0.25A 2.5 W STD1NK80Z 800 V < 16 Ω 1.0 A 45 W STD1NK80Z-1 800 V < 16 Ω 1.0 A 45 W ~~TH~~ 

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2<br>3<br>2<br>1<br>SOT-223<br>TO-92 (Ammopack)<br>3 3<br>ee 2<br>1 1<br>DPAK<br>IPAK<br>**----- End of picture text -----**<br>


- TYPICAL RDS(on) = 13Ω 

- EXTREMELY HIGH dv/dt CAPABILITY 

- ESD IMPROVED CAPABILITY 

- 100% AVALANCHE TESTED 

- NEW HIGH VOLTAGE BENCHMARK 

- GATE CHARGE MINIMIZED 

## **DESCRIPTION** 

The SuperMESH™ series is obtained through an extreme optimization of ST’s well established strip-based PowerMESH™ layout. In addition to pushing on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the most demanding applications. Such series complements ST full range of high voltage MOSFETs including revolutionary MDmesh™ products. 

## **Figure 2: Internal Schematic Diagram** 

## **APPLICATIONS** 

- AC ADAPTORS AND BATTERY CHARGERS 

- SWITH MODE POWER SUPPLIES (SMPS) 

**Table 2: Order Codes** 

|**Table 2: Order Codes**||||
|---|---|---|---|
|**SALES TYPE**|**MARKING**|**PACKAGE**|**PACKAGING**|
|STQ1NK80ZR-AP|Q1NK80ZR|TO-92|AMMOPAK|
|STN1NK80Z|N1NK80Z|SOT-223|TAPE & REEL|
|STD1NK80ZT4|D1NK80Z|DPAK|TAPE & REEL|
|STD1NK80Z-1|D1NK80Z|IPAK|TUBE|



Rev. 3 

January 2006 

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**Table 3: Absolute Maximum ratings** 

|**Symbol**|**Parameter**|**Value**|**Value**|**Value**|**Unit**|
|---|---|---|---|---|---|
|||**TO-92**|**SOT-223**|**DPAK/IPAK**||
|VDS|Drain-source Voltage (VGS= 0)|800|||V|
|VDGR|Drain-gate Voltage (RGS= 20 kΩ)|800|||V|
|VGS|Gate- source Voltage|± 30|||V|
|ID|Drain Current (continuous) at TC= 25°C|0.3|0.25|1.0|A|
|ID|Drain Current (continuous) at TC= 100°C|0.19|0.16|0.63|A|
|IDM(�)|Drain Current (pulsed)|5<br>A||||
|PTOT|Total Dissipation at TC= 25°C|3|2.5|45|W|
||Derating Factor|0.025|0.02|0.36|W /°C|
|VESD(G-S)|Gate source ESD (HBM-C= 100pF, R= 1.5KΩ)|1000|||V|
|dv/dt (1)|Peak Diode Recovery voltage slope|4.5|||V/ns|
|Tj<br>Tstg|Operating Junction Temperature<br>Storage Temperature|-55 to 150|||°C|



(�) Pulse width limited by safe operating area 

(1) ISD ≤ 1 A, di/dt ≤ 200 A/µs, VDD ≤ 640 

**Table 4: Thermal Data** 

|||**TO-92**|**SOT-223**|**DPAK/IPAK**|**Unit**|
|---|---|---|---|---|---|
|Rthj-case|Thermal Resistance Junction-case Max|--|--|2.78|°C/W|
|Rthj-amb(#)|Thermal Resistance Junction-ambient Max|120|50|100|°C/W|
|Rthj-lead|Thermal Resistance Junction-lead Max|40|--|--|°C/W|
|Tl|Maximum Lead Temperature For Soldering<br>Purpose|260|--|300|°C|



(#) When mounted on 1inch² FR-4 BOARD, 2 oz Cu 

**Table 5: Avalanche Characteristics** 

|**Symbol**|**Parameter**|**Max Value**|**Unit**|
|---|---|---|---|
|IAR|Avalanche Current, Repetitive or Not-Repetitive<br>(pulse width limited by Tjmax)|1|A|
|EAS|Single Pulse Avalanche Energy<br>(starting Tj= 25 °C, ID= IAR, VDD= 50 V)|50|mJ|



**Table 6: GATE-SOURCE ZENER DIODE** 

|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|BVGSO|Gate-Source Breakdown<br>Voltage|Igs=± 1mA (Open<br>Drain)|30|||V|



## **PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES** 

The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components. 

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## **ELECTRICAL CHARACTERISTICS** (TCASE =25°C UNLESS OTHERWISE SPECIFIED) **Table 7: On/Off** 

|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|V(BR)DSS|Drain-source<br>Breakdown Voltage|ID= 1 mA, VGS= 0|800|||V|
|IDSS|Zero Gate Voltage<br>Drain Current (VGS= 0)|VDS= Max Rating<br>VDS= Max Rating, TC= 125 °C|||1<br>50|µA<br>µA|
|IGSS|Gate-body Leakage<br>Current (VDS= 0)|VGS= ± 20V|||±10|µA|
|VGS(th)|Gate Threshold Voltage|VDS= VGS, ID= 50 µA|3|3.75|4.5|V|
|RDS(on)|Static Drain-source On<br>Resistance|VGS= 10V, ID= 0.5 A||13|16|Ω|



## **Table 8: Dynamic** 

|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|gfs(1)|Forward Transconductance|VDS= 15 V,ID= 0.5 A||0.8||S|
|Ciss<br>Coss<br>Crss|Input Capacitance<br>Output Capacitance<br>Reverse Transfer<br>Capacitance|VDS= 25 V,f = 1 MHz, VGS= 0||160<br>26<br>6.7||pF<br>pF<br>pF|
|Coss eq.(3)|Equivalent Output<br>Capacitance|VGS= 0V, VDS= 0V to 640V||9.5||pF|
|td(on)<br>tr<br>td(off)<br>tf|Turn-on Delay Time<br>Rise Time<br>Turn-off Delay Time<br>Fall Time|VDD= 400 V, ID= 0.5 A<br>RG= 4.7ΩVGS= 10 V<br>(see Figure 21)||8<br>30<br>22<br>55||ns<br>ns<br>ns<br>ns|
|Qg<br>Qgs<br>Qgd|Total Gate Charge<br>Gate-Source Charge<br>Gate-Drain Charge|VDD= 640V, ID= 1.0 A,<br>VGS= 10V<br>(see Figure 24)||7.7<br>1.4<br>4.5||nC<br>nC<br>nC|



## **Table 9: Source Drain Diode** 

|**Symbol**|**Parameter**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|ISD<br>ISDM(2)|Source-drain Current<br>Source-drain Current (pulsed)||||1.0<br>5|A<br>A|
|VSD(1)|Forward On Voltage|ISD= 1.0 A, VGS= 0|||1.6|V|
|trr<br>Qrr<br>IRRM|Reverse Recovery Time<br>Reverse Recovery Charge<br>Reverse Recovery Current|ISD= 1.0 A, di/dt = 100 A/µs<br>VDD= 50 V, Tj= 25°C<br>(see Figure 22)||365<br>802<br>4.4||ns<br>nC<br>A|
|trr<br>Qrr<br>IRRM|Reverse Recovery Time<br>Reverse Recovery Charge<br>Reverse Recovery Current|ISD= 1.0 A, di/dt = 100 A/µs<br>VDD= 50 V, Tj= 150°C<br>(see Figure 22)||388<br>802.7<br>4.6||ns<br>nC<br>A|



- Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. 

   2. Pulse width limited by safe operating area. 

   3. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS 

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**Figure 3: Safe Operating Area for SOT-223** 

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**Figure 4: Safe Operating Area for TO-92** 

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**Figure 5: Safe Operating Area for IPAK-DPAK** 

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**Figure 6: Thermal Impedance for SOT-223** 

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**Figure 7: Thermal Impedance for TO-92** 

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**Figure 8: Thermal Impedance for DPAK-IPAK** 

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**Figure 9: Output Characteristics** 

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**Figure 10: Transconductance** 

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**Figure 11: Gate Charge vs Gate-source Voltage** 

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**Figure 12: Transfer Characteristics** 

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**Figure 13: Static Drain-source On Resistance** 

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**Figure 14: Capacitance Variations** 

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**Figure 15: Normalized Gate Thereshold Voltage vs Temperature** 

**==> picture [179 x 178] intentionally omitted <==**

**Figure 16: Source-Drain Diode Forward Characteristics** 

**==> picture [179 x 179] intentionally omitted <==**

**Figure 18: Normalized On Resistance vs Temperature** 

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**Figure 19: Normalized BVdss vs Temperature** 

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**Figure 17: Avalanche Energy vs Starting Tj** 

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**Figure 20: Unclamped Inductive Load Test Circuit** 

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**Figure 21: Switching Times Test Circuit For Resistive Load** 

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**Figure 23: Unclamped Inductive Wafeform** 

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**Figure 24: Gate Charge Test Circuit** 

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**Figure 22: Test Circuit For Inductive Load Switching and Diode Recovery Times** 

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In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 

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## **DPAK FOOTPRINT** 

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**----- Start of picture text -----**<br>
All dimensions are in millimeters<br>**----- End of picture text -----**<br>


## **TAPE AND REEL SHIPMENT** 

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**----- Start of picture text -----**<br>
REEL MECHANICAL DATA<br>- mm inch<br>polat slot locationhee | . T DIM.<br>MIN. MAX. MIN. MAX.<br>B A 330 12.992<br>| i ge TW"IF Cc ry B 1.5 0.059<br>C 12.8 13.2 0.504 0.520<br>{of AY oes<br>D 20.2 0.795<br>}\ FSX TTI 4 G 16.4 18.4 0.645 0.724<br>Full radius = / Tape = —G measured N 50 1.968<br>tae bet OF at hub<br>width25mm min. T 22.4 0.881<br>BASE QTY BULK QTY<br>TAPE MECHANICAL DATA<br>2500 2500<br>mm inch<br>DIM. ee ———<br>a MIN. MAX. MIN. MAX. |<br>A0 6.8 7 0.267 0.275<br>a B0 10.4 ee 10.6 ee 0.409 0.417 en i Li,<br>B1 12.1 0.476<br>ee| D 1.5 ee 1.6 ee 0.059 0.063 Sp presserSoo ; ro<br>D1 1.5 0.059 LT sbi”<br>a [| ff] B 5 © -}--0--l1-o oj}<br>E 1.65 1.85 0.065 0.073<br>F 7.4 7.6 0.291 0.299<br>__|__|__|__|___ K0 2.55 2.75 0.100 0.108 |aa User Direction<br>P0 3.9 4.1 0.153 0.161<br>ee ee ee ee ———TRL of Feed<br>P1 7.9 8.1 0.311 0.319<br>P2 1.9 2.1 0.075 0.082 |<br>a—— R a 40 ee 1.574 | (BBB: =<br>a W 15.7 16.3 eee 0.618 0.641 FEED DIRECTION, Bending radius<br>**----- End of picture text -----**<br>


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## **TO-92 MECHANICAL DATA** 

|**TO-92 MECHANICAL DATA**|**TO-92 MECHANICAL DATA**|**TO-92 MECHANICAL DATA**|**TO-92 MECHANICAL DATA**|**TO-92 MECHANICAL DATA**|**TO-92 MECHANICAL DATA**|**TO-92 MECHANICAL DATA**|
|---|---|---|---|---|---|---|
||||||||
|**DIM.**|**mm.**|||**inch**|||
||**MIN.**|**TYP**|**MAX.**|**MIN.**|**TYP.**|**MAX.**|
|A|4.32||4.95|0.170||0.194|
|b|0.36||0.51|0.014||0.020|
|D|4.45||4.95|0.175||0.194|
|E|3.30||3.94|0.130||0.155|
|e|2.41||2.67|0.094||0.105|
|e1|1.14||1.40|0.044||0.055|
|L|12.70||15.49|0.50||0.610|
|R|2.16||2.41|0.085||0.094|
|S1|0.92||1.52|0.036||0.060|
|W|0.41||0.56|0.016||0.022|
|V||5°|||5°||



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## **SOT-223 MECHANICAL DATA** 

|**DIM.**|**mm**|**mm**|**mm**|**inch**|**inch**|**inch**|
|---|---|---|---|---|---|---|
||**MIN.**|**TYP.**|**MAX.**|**MIN.**|**TYP.**|**MAX.**|
|A|||1.80|||0.071|
|B|0.60|0.70|0.80|0.024|0.027|0.031|
|B1|2.90|3.00|3.10|0.114|0.118|0.122|
|c|0.24|0.26|0.32|0.009|0.010|0.013|
|D|6.30|6.50|6.70|0.248|0.256|0.264|
|e||2.30|||0.090||
|e1||4.60|||0.181||
|E|3.30|3.50|3.70|0.130|0.138|0.146|
|H|6.70|7.00|7.30|0.264|0.276|0.287|
|V|||10o|||10o|
|A1||0.02|||||



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P008B 

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## **TO-252 (DPAK) MECHANICAL DATA** 

|**DIM**|**mm**|**mm**|**mm**|**inch**|**inch**|**inch**|
|---|---|---|---|---|---|---|
|**.**|**MIN.**|**TYP.**|**MAX.**|**MIN.**|**TYP.**|**MAX.**|
|A|2.20||2.40|0.087||0.094|
|A1|0.90||1.10|0.035||0.043|
|A2|0.03||0.23|0.001||0.009|
|B|0.64||0.90|0.025||0.035|
|B2|5.20||5.40|0.204||0.213|
|C|0.45||0.60|0.018||0.024|
|C2|0.48||0.60|0.019||0.024|
|D|6.00||6.20|0.236||0.244|
|E|6.40||6.60|0.252||0.260|
|G|4.40||4.60|0.173||0.181|
|H|9.35||10.10|0.368||0.398|
|L2||0.8|||0.031||
|L4|0.60||1.00|0.024||0.039|
|V2|0o||8o|0o||0o|



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## **TO-251 (IPAK) MECHANICAL DATA** 

|**DIM.**|**mm**|**mm**|**mm**|**inch**|**inch**|**inch**|
|---|---|---|---|---|---|---|
||**MIN.**|**TYP.**|**MAX.**|**MIN.**|**TYP.**|**MAX.**|
|A|2.2||2.4|0.086||0.094|
|A1|0.9||1.1|0.035||0.043|
|A3|0.7||1.3|0.027||0.051|
|B|0.64||0.9|0.025||0.031|
|B2|5.2||5.4|0.204||0.212|
|B3|||0.85|||0.033|
|B5||0.3|||0.012||
|B6|||0.95|||0.037|
|C|0.45||0.6|0.017||0.023|
|C2|0.48||0.6|0.019||0.023|
|D|6||6.2|0.236||0.244|
|E|6.4||6.6|0.252||0.260|
|G|4.4||4.6|0.173||0.181|
|H|15.9||16.3|0.626||0.641|
|L|9||9.4|0.354||0.370|
|L1|0.8||1.2|0.031||0.047|
|L2||0.8|1||0.031|0.039|



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H<br>L2 D L<br>L1<br>0068771-E<br>C<br>A<br>C2  A3<br>A1<br>B3  B6<br>B  B5<br>3<br>= = =<br>E  B2  2  G<br>= = =<br>1<br>**----- End of picture text -----**<br>


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## **Table 10: Revision History** 

|**Date**|**Revision**|**Description of Changes**|
|---|---|---|
|08-Jun-2005|1|First Release|
|06-Sep-2005|2|Inserted Ecopack indication|
|16-Jan-2006|3|Corrected value on Table 3|



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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 

The ST logo is a registered trademark of STMicroelectronics 

All other names are the property of their respective owners 

© 2006 STMicroelectronics - All Rights Reserved 

STMicroelectronics group of companies 

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15/15 



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