# Schottky Rectifier, 100 V, 3 A, Single, DO-221AA (SMB Flat), 2 Pins, 755 mV

![Product image](https://novapart.co/image/farnell:4349875RL/)

**URL**: https://novapart.co/products/STPST3H100UF/schottky-rectifier-100-v-3-a-single-do-221aa-smb
**SKU**: STPST3H100UF
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.1320
**Stock**: 1000+
**Lead Time**: 127 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 2Pins |
| Product Range | ECOPACK2 Series |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | DO-221AA (SMB Flat) |
| Diode Configuration | Single |
| Forward Voltage Max | 755mV |
| Forward Surge Current | 55A |
| Average Forward Current | 3A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 100V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4349875RL/)

**STPST3H100** 

Datasheet 

## 100 V - 3 A power Schottky trench rectifier 

**==> picture [102 x 85] intentionally omitted <==**

**----- Start of picture text -----**<br>
K —q— A<br>A<br>K K<br>SOD128Flat SMB Flat<br>**----- End of picture text -----**<br>


## **Features** 

- High junction temperature capability 

- Low forward voltage drop 

- Low recovery charges 

- Reduces conduction, reverse and switching losses 

- Avalanche tested 

- Flat packages 

- ECOPACK2 compliant 

## **Applications** 

- DC/DC converter 

- LED lighting 

- Flyback topology 

- Auxiliary power supply 

- Switch mode power supply (SMPS) 

## **Product label** 

## **Description** 

This 3 A, 100 V rectifier is based on ST trench technology that achieves the best-inclass VF/IR trade-off for a given silicon surface. 

## **Product status link** 

STPST3H100 

Integrated in flat and space-saving packages, this STPST3H100 trench rectifier is intended to be used in high frequency miniature switched mode power supplies. It is also an ideal candidate for auxiliary power supply in telecom, server, or smart metering. ST trench rectifiers are adapted to freewheeling, OR-ring or reverse polarity protection applications, and can be the perfect companion device to our transistors, drivers, or ST VIPer products. 

|**Product summary**|**Product summary**|
|---|---|
|**IF(AV)**|3 A|
|**VRRM**|100 V|
|**Tj (max.)**|175 °C|
|**VF (typ.)**|0.600 V|



**DS13610** - **Rev 4** - **July 2023** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STPST3H100 Characteristics** 

**1 Characteristics** 

**Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||100|V|
|IF(AV)|Average forward current, δ = 0.5 square wave|SOD128Flat|Tl= 130 °C|3|A|
|||SMB Flat|Tl= 140 °C|||
|IFSM|Surge non repetitive forward current|SOD128Flat|tp= 10 ms<br>sinusoidal|50|A|
|||SMB Flat||55||
|IAS|Single pulse avalanche current(1)|Tj= 25°C, L = 300 µH, VDD= 15 V||5|A|
|Tstg|Storage temperature range|||-65 to +175|°C|
|Tj|Maximum operating junction temperature(2)|||+175|°C|



_1. Please refer to Figure 1 and Figure 2 for the unclamped inductive switching test circuit, and waveform._ 

_2. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink._ 

**Table 2. Thermal resistance parameter** 

|**Symbol**|**Parameter**||**Typ.**<br>**value**|**Unit**|
|---|---|---|---|---|
|Rth(j-l)|Junction to lead|SOD128Flat|13|°C/W|
|||SMB Flat|10||



For more information, please refer to the following application note: 

- AN5088: Rectifiers thermal management, handling and mounting recommendations 

**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 125 °C|VR= 70 V|-|0.45|1.4|mA|
|||Tj= 25 °C|VR= 100 V|-||5.7|µA|
|||Tj= 125 °C||-|0.8|3.0|mA|
|VF(2)|Forward voltage drop|Tj= 25 °C|IF= 1.5 A|-|0.565|0.625|V|
|||Tj= 125 °C||-|0.500|0.555||
|||Tj= 25 °C|IF= 3 A|-|0.685|0.755||
|||Tj= 125 °C||-|0.600|0.650||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: 

P = 0.46 x IF(AV) + 0.0633 x IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses: 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

**DS13610** - **Rev 4** 

**page 2/12** 

**STPST3H100 Characteristics** 

**Figure 1. Current and voltage waveforms for avalanche energy test across D.U.T (device under test)** 

**==> picture [273 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
i(t), v(t)<br>VCL_DUT<br>IAS<br>OY<br>IL IDUT<br>7Yo<br>t<br>tp<br>**----- End of picture text -----**<br>


**Figure 2. Unclamped inductive switching test circuit** 

**==> picture [204 x 41] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 VCLDUT 1<br>EAS = _ 2 [× L × I][AS][² ×] ( —_—_) VCLDUT −VDD ≅ _ 2 [× L × I][AS][²]<br>L × IAS<br>tp = (——_) VCLDUT −VDD<br>**----- End of picture text -----**<br>


**DS13610** - **Rev 4** 

**page 3/12** 

**STPST3H100 Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**Figure 3. Average forward current versus lead Figure 4. Relative variation of thermal impedance junction temperature (δ = 0.5) to lead versus pulse duration (SOD128Flat)** 

**==> picture [476 x 152] intentionally omitted <==**

**----- Start of picture text -----**<br>
12 IF(AV)(A) Zth(j-l ) /Rth(j-l )<br>1.0<br>Pt | tT te dP cP PP Pt 0.9 or ooo<br>10 Lr—| | | tf ft ft ft tt td] OEaATe<br>ee ee 0.8 een oeAo<br>8 eePSa SMB-Flat ee eee 0.70.6 aCohoaAT|nh<br>SOD128-Flat<br>6 Pe te EE 0.5 eee eee ef ee<br>fo PN F 0.4 eee eee ee cet<br>4 |} PAKSSEMANS 0.3 SseaTen AAa<br>Single pulse<br>2 roAwKS 0.20.1 enA aoA a 8<br>t P (s)<br>0.0<br>0 sere jtCEEEEEE SSS Tl(°C) 1.E-04 tTeT 1.E-03 Cr 1.E-02 1.E-01 1.E+00 1.E+01 ail<br>0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br>


**Figure 5. Relative variation of thermal impedance junction to lead versus pulse duration (SMB Flat)** 

**==> picture [217 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0 Loon Zth(j-l)/Rth(j-l)<br>0.90.8 aOna oo foeo<br>0.7<br>0.6 Becerra|Aase meena<br>0.5 0a<br>0.4 Zn|<br>0.3<br>ee ee ee<br>0.2 Single pulse<br>SN eZ<br>0.1 p = 0 e ed<br>0.0 oe tP(s)<br>1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01<br>**----- End of picture text -----**<br>


**Figure 6. Reverse leakage current versus reverse voltage applied (typical values)** 

**==> picture [223 x 140] intentionally omitted <==**

**----- Start of picture text -----**<br>
IR(µA)<br>1.E+04<br>==<br>Tj = 150 °C<br>1.E+03 SsasSse===8=2===n52ee Tj = 125 °C<br>1.E+02 Tj = 100 °C<br>CaaapnsGenSRSEEas===SSee<br>———— ——— T j = 75 °C<br>1.E+01 ee<br>eu T j = 50 °C<br>== SS Se = = =<br>1.E+00 Lierr<br>Tj = 25 °C<br>=== ee<br>1.E-01<br>eS<br>1.E-02 seS==SSSS===SSSeeaaaae V R (V)<br>0 10 20 30 40 50 60 70 80 90 100<br>**----- End of picture text -----**<br>


**Figure 7. Junction capacitance versus reverse voltage Figure 8. Forward voltage drop versus forward current applied (typical values) (typical values)** 

**==> picture [474 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000 C(pF) F = 1 MHz IF(A)<br>VOSC = 30 mVRMS 10.0<br>Tj = 25 °C<br>EFPTee et See Geese T j  = 25 °C eee<br>Ren oT ASEER REE T j = 75 °C =<br>Tj = 125 °C<br>100 LIM TTI ELI 1.0 CCEEeeA<br>a SA | ———— Tj = 150 °C LS<br>ee cece es 0 2 ee<br>a aYA<br>PTee ANT ptt ttt VyAA Att Tt Pt tt<br>VF(V)<br>VR(V) 0.1<br>10 0.1 a 1.0 10.0 100.0 0.0 SAARBRRE? 0.1 0.2 (7.2 0.3 0.4 AEREREEEEEES 0.5 0.6 eee 0.7 0.8 0.9 1.0<br>**----- End of picture text -----**<br>


**DS13610** - **Rev 4** 

**page 4/12** 

**STPST3H100 Characteristics (curves)** 

**==> picture [513 x 203] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 9. Thermal resistance junction to ambient versus  Figure 10. Thermal resistance junction to ambient versus<br>copper surface under each lead (typical values, epoxy  copper surface under each lead (typical values, epoxy<br>printed board FR4, eCu= 70 µm) printed board FR4, eCu= 70 µm)<br>Rth(j-a)(°C/W) Rth(j-a)(°C/W)<br>150<br>150<br>Epoxy printed board FR4, copper thickness: 70 μm SOD128flat Epoxy printed board FR4, copper thickness: 70 μm SMB-Flat<br>120 120<br>90 90<br>60 60<br>30 30<br>S Cu (cm²)<br>SCu(cm²)<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**DS13610** - **Rev 4** 

**page 5/12** 

**STPST3H100 Package information** 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1 SOD128Flat package information** 

_Note:_ 

**==> picture [440 x 297] intentionally omitted <==**

**----- Start of picture text -----**<br>
• Lead-free package<br>Figure 11. SOD128Flat package outline<br>A<br>b   c<br>D<br>ole<br>This package drawing may slightly differ from the physical package. However, all the specified dimensions are<br>guaranteed.<br>L<br>L1<br>E<br>E1<br>L2<br>**----- End of picture text -----**<br>


**Table 4. SOD128Flat package mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|0.93|1.03|0.037|0.041|
|b|1.69|1.81|0.067|0.071|
|c|0.10|0.22|0.004|0.009|
|D|2.30|2.50|0.091|0.098|
|E|4.60|4.80|0.181|0.189|
|E1|3.70|3.90|0.146|0.154|
|L|0.55|0.85|0.026|0.033|
|L1|0.30 typ.||0.012 typ.||
|L2|0.45 typ.||0.018 typ.||



**DS13610** - **Rev 4** 

**page 6/12** 

**STPST3H100 SOD128Flat package information** 

## **Figure 12. SOD128Flat footprint in mm (inches)** 

_Note: For package and tape orientation, reel and inner box dimensions and tape outline please check TN1173._ 

**DS13610** - **Rev 4** 

**page 7/12** 

**STPST3H100 SMB Flat package information** 

## **2.2 SMB Flat package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

**Figure 13. SMB Flat package outline** 

**==> picture [497 x 300] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>=<br>b<br>an<br>Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are<br>guaranteed.<br>A<br>C<br>L1 2x<br>L 2x<br>E<br>E1<br>L2 2x<br>**----- End of picture text -----**<br>


**Table 5. SMB Flat mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
||**Millimeters**|||**Inches**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.90||1.10|0.035||0.044|
|b|1.95||2.20|0.076||0.087|
|C|0.15||0.40|0.005||0.016|
|D|3.30||3.95|0.129||0.156|
|E|5.10||5.60|0.200||0.221|
|E1|4.05||4.60|0.159||0.182|
|L|0.75||1.50|0.029||0.060|
|L1||0.40|||0.016||
|L2||0.60|||0.024||



**DS13610** - **Rev 4** 

**page 8/12** 

**STPST3H100 SMB Flat package information** 

**Figure 14. Footprint recommendations, dimensions in mm (inches)** 

**==> picture [132 x 123] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.20 3.44 1.20<br>(0.047) (0.136) (0.047)<br>2.07<br>(0.082)<br>5.84<br>(0.230)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


_Note: For package and tape orientation, reel and inner box dimensions and tape outline please check TN1173._ 

**DS13610** - **Rev 4** 

**page 9/12** 

**STPST3H100 Ordering information** 

## **3 Ordering information** 

**Table 6. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STPST3H100AF|T3H1|SOD128Flat|26.4 mg|3000|Tape and reel|
|STPST3H100UF|T3H1|SMB Flat|50.0 mg|5000|Tape and reel|



**DS13610** - **Rev 4** 

**page 10/12** 

**STPST3H100** 

## **Revision history** 

**Table 7. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|25-Jan-2021|1|Initial release.|
|02-Jan-2023|2|Inserted SMB Flat package information. Minor text changes.|
|01-Jun-2023|3|UpdatedTable 1andFigure 11.|
|21-Jul-2023|4|Updated_Features_.|



**DS13610** - **Rev 4** 

**page 11/12** 

**STPST3H100** 

## **IMPORTANT NOTICE – READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2023 STMicroelectronics – All rights reserved 

**DS13610** - **Rev 4** 

**page 12/12** 



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