# Schottky Rectifier, 100 V, 2 A, Single, SOD-128FL, 2 Pins, 805 mV

![Product image](https://novapart.co/image/farnell:4349870RL/)

**URL**: https://novapart.co/products/STPST2H100AF/schottky-rectifier-100-v-2-a-single-sod-128fl-pins
**SKU**: STPST2H100AF
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.1000
**Stock**: 1000+
**Lead Time**: 127 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | ECOPACK2 Series |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | SOD-128FL |
| Diode Configuration | Single |
| Forward Voltage Max | 805mV |
| Forward Surge Current | 35A |
| Average Forward Current | 2A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 100V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4349870RL/)

**STPST2H100** 

Datasheet 

## 100 V - 2 A power Schottky trench rectifier 

**==> picture [136 x 111] intentionally omitted <==**

**----- Start of picture text -----**<br>
K —_q—. A<br>A<br>A<br>K K<br>SOD128Flat SOD123Flat<br>K K ~ A }<br>SMB Flat<br>**----- End of picture text -----**<br>


## **Features** 

- High junction temperature capability 

- Low forward voltage drop 

- Low recovery charges 

- Reduces conduction, reverse and switching losses 

- Avalanche tested 

- Flat packages 

- ECOPACK2 compliant 

## **Applications** 

- DC/DC converter 

- LED lighting 

- Flyback topology 

- Auxiliary power supply 

- Switch mode power supply (SMPS) 

**==> picture [73 x 125] intentionally omitted <==**

**----- Start of picture text -----**<br>
Product label<br>SUSTAINABLE<br>TECHNOLOGY<br>Product status link<br>STPST2H100<br>**----- End of picture text -----**<br>


## **Description** 

This 2 A, 100 V rectifier is based on ST trench technology that achieves the best-inclass VF/IR trade-off for a given silicon surface. 

Integrated in flat and space-saving packages, this STPST2H100 trench rectifier is intended to be used in high frequency miniature switched mode power supplies. It is also an ideal candidate for auxiliary power supply in telecom, server, or smart metering. ST trench rectifiers are adapted to freewheeling, OR-ring or reverse polarity protection applications, and can be the perfect companion device to our transistors, drivers, or ST VIPer products. 

|**Product summary**|**Product summary**|
|---|---|
|**IF(AV)**|2 A|
|**VRRM**|100 V|
|**Tj (max.)**|175 °C|
|**VF (typ.)**|0.620 V|



**DS14190** - **Rev 3** - **July 2023** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STPST2H100 Characteristics** 

## **1 Characteristics** 

**Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||100|V|
|IF(AV)|Average forward current, δ = 0.5, square<br>wave|SOD123Flat|TL= 140 °C|2|A|
|||SOD128Flat|TL= 140 °C|||
|||SMB Flat|TL= 150 °C|||
|IFSM|Surge non repetitive forward current|SOD123Flat|tp= 10 ms<br>sinusoidal|35|A|
|||SOD128Flat||||
|||SMB Flat||||
|IAS|Single pulse avalanche current(1)|Tj= 25°C, L = 300 µH, VDD= 15 V||3|A|
|Tstg|Storage temperature range|||-65 to +175|°C|
|Tj|Maximum operating junction temperature(2)|||+175|°C|



_1. Please refer to Figure 1 and Figure 2 for the unclamped inductive switching test circuit, and waveform._ 

_2. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink._ 

**Table 2. Thermal resistance parameter** 

|**Symbol**|**Parameter**||**Typ.**<br>**value**|**Unit**|
|---|---|---|---|---|
|Rth(j-l)|Junction to lead|SOD123Flat|15|°C/W|
|||SOD128Flat|14||
|||SMB Flat|11||



For more information, please refer to the following application note: 

- AN5088: Rectifiers thermal management, handling and mounting recommendations 

**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 125 °C|VR= 70 V|-|0.25|0.75|mA|
|||Tj= 25 °C|VR= 100 V|-||2.7|µA|
|||Tj= 125 °C||-|0.45|1.5|mA|
|VF(2)|Forward voltage drop|Tj= 25 °C|IF= 1 A|-|0.590|0.655|V|
|||Tj= 125 °C||-|0.520|0.575||
|||Tj= 25 °C|IF= 2 A|-|0.725|0.805||
|||Tj= 125 °C||-|0.620|0.670||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: P = 0.480 x IF(AV) + 0.095 x IF[2] (RMS) 

**DS14190** - **Rev 3** 

**page 2/14** 

**STPST2H100 Characteristics** 

For more information, please refer to the following application notes related to the power losses : 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

**Figure 1. Current and voltage waveforms for avalanche energy test across D.U.T (device under test)** 

**==> picture [273 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
i(t), v(t)<br>VCL_DUT<br>IAS —<br>IL IDUT<br>a<br>7<br>t<br>tp<br>**----- End of picture text -----**<br>


**Figure 2. Unclamped Inductive Switching Test circuit** 

1 VCLDUT 1 EAS = ~~_~~ 2[× L × I][AS][² ×] ~~(———)~~ VCLDUT −VDD ≅ ~~_~~ 2[× L × I][AS][²] L × IAS tp = ~~(———_)~~ VCLDUT −VDD 

**DS14190** - **Rev 3** 

**page 3/14** 

**STPST2H100 Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**Figure 3. Average forward current versus lead temperature (δ = 0.5)** 

**Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration (SOD123Flat)** 

**==> picture [470 x 358] intentionally omitted <==**

**----- Start of picture text -----**<br>
8 IF(AV)(A) 1.0 Zth(j-l)/Rth(j-l)<br>0.9<br>7 me SMB Flat |<br>~— | foe ed CoCr Ce CorAC<br>KW ENA 4 Pe 0.8 A|<br>6 ee e SOD128-Flat ee 0.7 ee eet ee eet em<br>5 a e SOD123-Flat -+—++++—+ 0.6 YA |<br>4 | a {| | |——easPAKS | | | | yt 0.5 A |<br>Poo oO SIT TT Oo |7<br>0.4<br>3 CoS _ TTT Lt TT TTA TT]<br>p {| | [| } | | f ft PSSSN 0.3 |IAT<br>2 I | {| | | | | TSASS TC POTaA<br>rt NT 0.2 12<br>1 NN 0.1 Single pulse WATT<br>SetplT I Tl(°C) NN 0: tP(s)<br>0 Ftp PTTL PTT TNN 0.0 Peer|<br>0 25 50 75 100 125 150 175 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01<br>Relative variation of thermal impedance junction  Figure 6. Relative variation of thermal impedance junction Relative variation of thermal impedance junction<br>to lead versus pulse duration (SOD128Flat) to lead versus pulse duration (SMB Flat)<br>1.0 Z o_o th(j-l)/Rth(j-l) ao 1.0 Zth(j-l)/Rth(j-l) a<br>0.9 ecPEerr er Ater 0.9 eeeeFee<br>0.8 PPa EAA 0.8 |0<br>0.7 |PR 0.7 0|<br>0.6 2a 0.6 rnAOo<br>0.5 LtPE SE A 0.5 CConZn<br>0.4 PEA| 0.4 a|<br>0.3 ME2tH 0.3 CIoAn<br>0.2 | TTT Single pulse TA PT PPP 0.2 Single pulse MIZELL<br>0.1 anePf ba REHE HHPpa | | t Tel P(s) 0.1 Caee L_LLTITI, ~LEITTToon tP(s)<br>0.0 meetCLIT TPE EYYET-_ 0.0 laaCECECCn on t nna<br>1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01<br>**----- End of picture text -----**<br>


**Figure 5. Relative variation of thermal impedance junction to lead versus pulse duration (SOD128Flat)** 

**Figure 6. Relative variation of thermal impedance junction Relative variation of thermal impedance junction to lead versus pulse duration (SMB Flat)** 

**Figure 7. Reverse leakage current versus reverse voltage applied (typical values)** 

**Figure 8. Junction capacitance versus reverse voltage applied (typical values)** 

**==> picture [471 x 153] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.E+04 ===—— IR(µA) ee | 1000 Fea C(pF) aaa VOSC F = 1 MHz= 30 mVRMS Ci<br>1.E+03 Tj = 150 °C Tj = 25 °C<br>Sa= {|_| SESE J<br>Tj = 125 °C<br>aa ee<br>1.E+02 aesaan oases Tj = 100 °C a=s=ee EHHPtEt<br>Tj = 75 °C<br>1.E+01 100<br>a2a Tj = 50 °C rree =a aii<br>1.E+00<br>= SSSeerere Tj = 25 °C eee| poa TT<br>SSS = a<br>1.E-01<br>_oS==———— o se POTTIITSU<br>1.E-02 a VR(V) 10 VR(V)<br>0 10 20 30 40 50 60 70 80 90 100 0.1 1.0 10.0 100.0<br>**----- End of picture text -----**<br>


**DS14190** - **Rev 3** 

**page 4/14** 

**STPST2H100 Characteristics (curves)** 

**Figure 9. Forward voltage drop versus forward current (typical values)** 

**==> picture [220 x 153] intentionally omitted <==**

**----- Start of picture text -----**<br>
IF(A)<br>10.0<br>Tj = 25 °C<br>1.0<br>Tj = 75 °C<br>Tj = 125 °C<br>Tj = 150 °C<br>VF(V)<br>0.1<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0<br>**----- End of picture text -----**<br>


**Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (typical values, epoxy printed board FR4, eCu= 70 µm)** 

**==> picture [225 x 147] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a)(°C/W)<br>150<br>Epoxy printed board FR4, copper thickness: 70 μm SOD128flat<br>120<br>90<br>60<br>30<br>SCu(cm²)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (typical values, epoxy printed board FR4, eCu= 70 µm)** 

**==> picture [222 x 147] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a)(°C/W)<br>200<br>Epoxy printed board FR4, copper thickness: 70 μm SOD123Flat<br>150<br>100<br>50<br>SCu(cm²)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (typical values, epoxy printed board FR4, eCu= 70 µm)** 

**==> picture [222 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a)(°C/W)<br>150<br>Epoxy printed board FR4, copper thickness: 70 μm SMB-Flat<br>120<br>90<br>60<br>30<br>S Cu (cm²)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**DS14190** - **Rev 3** 

**page 5/14** 

**STPST2H100 Package information** 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1 SOD123Flat package information** 

## **Figure 13. SOD123Flat package outline** 

**==> picture [171 x 231] intentionally omitted <==**

**----- Start of picture text -----**<br>
A<br>C1<br>L<br>HD D<br>L<br>b C<br>E<br>**----- End of picture text -----**<br>


_Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed._ 

**DS14190** - **Rev 3** 

**page 6/14** 

**STPST2H100 SOD123Flat package information** 

**Table 4. SOD123Flat package mechanical data** 

|**Ref.**<br>_~~_~~|**Dimensions**<br>~~_~~—~~_~~|**Dimensions**<br>~~_~~—~~_~~|**Dimensions**<br>~~_~~—~~_~~|**Dimensions**<br>~~_~~—~~_~~|**Dimensions**<br>~~_~~—~~_~~|**Dimensions**<br>~~_~~—~~_~~|
|---|---|---|---|---|---|---|
||**Millimeters**<br>~~_~~—~~_~~|||**Inches (for reference only)**|||
||**Min.**<br>~~_~~—~~_~~|**Typ.**<br>~~_~~|**Max.**|**Min.**|**Typ.**|**Max.**|
|A<br>_ ~~_~~|0.86<br>~~_~~—~~_~~|0.98<br>~~_~~|1.10|0.034|0.038|0.043|
|b|0.80|0.90|1.00|0.031|0.035|0.039|
|c|0.08|0.15|0.25|0.003|0.006|0.009|
|c1|0.00||0.10|0.000||0.004|
|D|2.50|2.60|2.70|0.098|0.102|0.106|
|E|1.50|1.60|1.80|0.059|0.063|0.070|
|HD|3.30|3.50|3.70|0.130|0.137|0.146|
|L|0.45|0.65|0.85|0.018|0.025|0.033|



**Figure 14. SOD123Flat footprint dimensions (mm)** 

**==> picture [473 x 140] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.30 1.60<br>oe<br>Note: For package and tape orientation, reel and inner box dimensions and tape outline please check TN1173.<br>1.40<br>**----- End of picture text -----**<br>


**DS14190** - **Rev 3** 

**page 7/14** 

**STPST2H100 SOD128Flat package information** 

## **2.2 SOD128Flat package information** 

_Note:_ 

**==> picture [440 x 297] intentionally omitted <==**

**----- Start of picture text -----**<br>
• Lead-free package<br>Figure 15. SOD128Flat package outline<br>A<br>b   c<br>D<br>ole<br>This package drawing may slightly differ from the physical package. However, all the specified dimensions are<br>guaranteed.<br>L<br>L1<br>E<br>E1<br>L2<br>**----- End of picture text -----**<br>


**Table 5. SOD128Flat package mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|0.93|1.03|0.037|0.041|
|b|1.69|1.81|0.067|0.071|
|c|0.10|0.22|0.004|0.009|
|D|2.30|2.50|0.091|0.098|
|E|4.60|4.80|0.181|0.189|
|E1|3.70|3.90|0.146|0.154|
|L|0.55|0.85|0.026|0.033|
|L1|0.30 typ.||0.012 typ.||
|L2|0.45 typ.||0.018 typ.||



**DS14190** - **Rev 3** 

**page 8/14** 

**STPST2H100 SOD128Flat package information** 

## **Figure 16. SOD128Flat footprint in mm (inches)** 

_Note: For package and tape orientation, reel and inner box dimensions and tape outline please check TN1173._ 

**DS14190** - **Rev 3** 

**page 9/14** 

**STPST2H100 SMB Flat package information** 

## **2.3 SMB Flat package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

**Figure 17. SMB Flat package outline** 

**==> picture [497 x 300] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>=<br>b<br>an<br>Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are<br>guaranteed.<br>A<br>C<br>L1 2x<br>L 2x<br>E<br>E1<br>L2 2x<br>**----- End of picture text -----**<br>


**Table 6. SMB Flat mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
||**Millimeters**|||**Inches**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.90||1.10|0.035||0.044|
|b|1.95||2.20|0.076||0.087|
|C|0.15||0.40|0.005||0.016|
|D|3.30||3.95|0.129||0.156|
|E|5.10||5.60|0.200||0.221|
|E1|4.05||4.60|0.159||0.182|
|L|0.75||1.50|0.029||0.060|
|L1||0.40|||0.016||
|L2||0.60|||0.024||



**DS14190** - **Rev 3** 

**page 10/14** 

**STPST2H100 SMB Flat package information** 

**Figure 18. Footprint recommendations, dimensions in mm (inches)** 

**==> picture [132 x 123] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.20 3.44 1.20<br>(0.047) (0.136) (0.047)<br>2.07<br>(0.082)<br>5.84<br>(0.230)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


_Note: For package and tape orientation, reel and inner box dimensions and tape outline please check TN1173._ 

**DS14190** - **Rev 3** 

**page 11/14** 

**STPST2H100 Ordering information** 

## **3 Ordering information** 

## **Table 7. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STPST2H100ZF|T02|SOD123 Flat|12.5 mg|3000|Tape and reel|
|STPST2H100AF|T2H1|SOD128 Flat|26.4 mg|3000||
|STPST2H100UF|T2H1|SMB Flat|50.0 mg|5000||



**DS14190** - **Rev 3** 

**page 12/14** 

**STPST2H100** 

## **Revision history** 

**Table 8. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|16-Dec-2022|1|Initial release.|
|26-May-2023|2|UpdatedFigure 15.|
|21-Jul-2023|3|Updated_Features_.|



**DS14190** - **Rev 3** 

**page 13/14** 

**STPST2H100** 

## **IMPORTANT NOTICE – READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2023 STMicroelectronics – All rights reserved 

**DS14190** - **Rev 3** 

**page 14/14** 



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