# Schottky Rectifier, 30 V, 8 A, Single, TO-252 (DPAK), 3 Pins, 630 mV

![Product image](https://novapart.co/image/farnell:3214519/)

**URL**: https://novapart.co/products/STPS8L30B-TR/schottky-rectifier-30-v-8-a-single-to-252-dpak-3
**SKU**: STPS8L30B-TR
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.2710
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:30V; Forward Current If(AV):8A; Diode Configuration:Single; Diode Case Style:TO-252; No. of Pins:3Pins; Forward Voltage VF Max:630mV; Forward Surge

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | TO-252 (DPAK) |
| Diode Configuration | Single |
| Forward Voltage Max | 630mV |
| Forward Surge Current | 75A |
| Average Forward Current | 8A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 30V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3214519/)

## **STPS8L30** 

## Low drop power Schottky rectifier 

Datasheet - production data 

**==> picture [152 x 119] intentionally omitted <==**

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A aa K<br>K K<br>;<br>CZ \ yy<br>A A<br>NC NC<br>DPAK<br>**----- End of picture text -----**<br>


## **Features** 

- Low cost device with low drop forward voltage for less power dissipation and reduced heatsink 

## **Description** 

Single Schottky rectifier suited to switched mode power supplies and high frequency DC to DC converters. 

Packaged in DPAK, this device is especially intended for use as a rectifier at the secondary of 3.3 V SMPS or DC/DC units, freewheeling and polarity protection applications. 

**Table 1: Device summary** 

|**Symbol**|**Value**|
|---|---|
|IF(AV)|8 A|
|VRRM|30 V|
|Tj(max.)|150 °C|
|VF(typ.)|0.35 V|



- Optimized conduction/reverse losses trade-off which leads to the highest yield in the application 

- High power surface mount miniature package 

- Avalanche capability specified 

- ECOPACK[®] 2 compliant component for DPAK on demand 

October 2016 

DocID5515 Rev 5 

1/9 

This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**STPS8L30** 

## **1 Characteristics** 

**Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VRRM|Repetitivepeak reverse voltage||30|V|
|IF(RMS)|Forward rms current||7|A|
|IF(AV)|Average forward current<br>δ = 0.5, square wave|TC= 135 °C|8|A|
|IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal|75|A|
|PARM|Repetitivepeak avalanchepower|tp= 10µs, Tj= 125 °C|215|W|
|Tstg|Storage temperature range||-65 to +150|°C|
|Tj|Maximum operating junction temperature_(1)_||150|°C|



## **Notes:** 

- (1)(dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. 

**Table 3: Thermal parameters** 

|**Symbol**|**Parameter**|**Max. value**|**Unit**|
|---|---|---|---|
|Rth(j-c)|Junction to case|2.5|°C/W|



**Table 4: Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR_(1)_|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||1|mA|
|||Tj= 100 °C||-|15|40||
|VF_(1)_|Forward voltage drop|Tj= 25 °C|IF= 8 A|-||0.49|V|
|||Tj= 125 °C||-|0.35|0.40||
|||Tj= 25 °C|IF= 16 A|-||0.63||
|||Tj= 125 °C||-|0.448|0.57||



## **Notes:** 

- (1)Pulse test: tp = 380 µs, δ < 2% 

To evaluate the conduction losses, use the following equation: 

P = 0.23 x IF(AV) + 0.021 x IF[2] (RMS) 

2/9 

DocID5515 Rev 5 

**STPS8L30** 

**Characteristics** 

## **1.1 Characteristics (curves)** 

**==> picture [450 x 167] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1: Average forward power dissipation  Figure 2: Average forward current versus ambient<br>versus average forward current  temperature (δ = 0.5)<br>PF (AV) (W) Ie(avy(A)<br>5.0 9<br>δ = 0.1 δ = 0.2 δ= 0.5 8 Rth(j-a) = Rth(j-c)<br>δ = 0.05<br>4.0 ep fy TTT TT TTT Ty yy oy TT TTT TT TT oy<br>1 | N/IZF] Z| A LA 7 PEPELeE eee PEE EPP<br>6<br>δ = 1<br>3.0 | | I/Y7 il YL FEEEEE EEE EEE EEE EEEEEE EEE<br>5<br>tf or | - RE<br>2.0 4 Rth(j-a) = 70 °C/W<br>PAA Ze | 3 EER Ep<br>| | Ye va | T Oe eeee<br>2<br>1.0<br>| ee ee |<br>0.0 |> VeterAder a | IF(AV ) | (A) | | i δ [=tp/T] t tp 10 eeeCePCEeFEEEEEEEEEEEEEeeReneeTameae; “PEEPSCCCCPRSSCeeTyeee eee<br>0 2 4 6 8 10 0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**==> picture [452 x 361] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 3: Normalized avalanche power derating  Figure 4: Relative variation of thermal impedance<br>versus pulse duration (Tj = 125 °C)  junction to case versus pulse duration<br>1 PARM(tP) / PARM(10 µs) Zth(j-c)/Rth(j-c)<br>1.0<br>a ee aiilll<br>0.8 ll<br>0.1 aa)el<br>0.6 δ = 0.5<br>PEI<br>ee |Aear TT<br>0.4<br>Z|<br>0.01<br>δ = 0.2<br>ees Ell T |<br>0.2 δ = 0.1<br>ee Z| | |<br>0.001 tP(µs) 0.0 ea PH Single pulse EEE tp(s ) Ball δ [=tp/T] g a tp ||<br>1 10 100 1000 1E-4 1E-3 1E-2 1E-1 1E+0<br>Figure 5: Reverse leakage current versus reverse  Figure 6: Junction capacitance versus reverse<br>voltage applied (typical values)  voltage applied (typical values)<br>IR(mA) C (pF)<br>3E+2 2000<br>1E+2 Tj = 150 °C F= 1 MHz<br>eeee Tj = 125 °C VOSC = 30 mVRMS<br>1000 Tj = 25 °C<br>1E+1<br>=Ss2SSS222.22 | .——_--::.———_—<br>1E+0 a 500 ee ee<br>SE SSeS a<br>1E-1 Tj = 25 °C<br>200<br>1E-2<br>1E-3 e e V e R (V ) e 100 TP| Mil V R (V) nn<br>0 5 10 15 20 25 30 1 10 40<br>**----- End of picture text -----**<br>


DocID5515 Rev 5 

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**Characteristics** 

**STPS8L30** 

**==> picture [203 x 18] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7: Forward voltage drop versus forward<br>current<br>**----- End of picture text -----**<br>


**Figure 8: Thermal resistance junction to ambient versus copper surface under tab** 

**==> picture [363 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a)(°C/W)<br>100<br>__ |] [|<br>90 Epoxy printed board FR4, copper thickness = 35 µm<br>SS i rt _i<br>80 et<br>a 70 a a a<br>tt | ii}ee} | ttt tt| 60 [PS\ SSS<br>eevalues) eee | 50 Ae<br>|paffen| [| | TE dT TT TT 40 NNeSCoeeeeeEEee<br>a a a GG CG<br>30<br>20 Oea OO<br>10 Scu (cm²)<br>08 10 12TE)14 16 18 20 | a es<br>0 A<br>0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br>


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**STPS8L30** 

**Package** information 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _**www.st.com**_ . ECOPACK[®] is an ST trademark. 

- Cooling method: by conduction (C) 

- Epoxy meets UL 94,V0 

DocID5515 Rev 5 

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**STPS8L30** 

**Package** information 

## **2.1 DPAK package information** 

**Figure 9: DPAK package outline** 

This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. 

~~IE~~ 6/9 DocID5515 Rev 5 

**STPS8L30** 

**Package** information 

|**Ref.**<br>~~Pea~~|**Dimensions**<br>~~Pea~~|**Dimensions**<br>~~Pea~~|**Dimensions**<br>~~Pea~~|**Dimensions**<br>~~Pea~~|
|---|---|---|---|---|
||**Millimeters**<br>~~PeaRe~~||**Inches**||
||**Min.**<br>~~aRe~~|**Max.**|**Min.**|**Max.**|
|A<br><br>~~se~~<br>~~es~~|2.18<br>~~Re~~<br>~~se~~|2.40<br>~~se~~|0.085<br>~~se~~|0.094<br>~~se~~|
|A1<br>~~es~~<br>~~Rs~~|0.90|1.10|0.035|0.043|
|A2<br>~~es~~<br>~~Rs~~|0.03|0.23|0.001|0.009|
|b<br>~~Rs~~<br>~~se~~<br>~~es~~|0.64<br>~~se~~|0.90<br>~~se~~|0.025<br>~~se~~|0.035<br>~~se~~|
|b4<br>~~es~~|4.95|5.46|0.194|0.215|
|c<br>~~es~~<br>~~se~~<br>~~es~~|0.46<br>~~se~~<br>~~es~~|0.61<br>~~se~~<br>~~es~~|0.018<br>~~se~~<br>~~es~~|0.024<br>~~se~~<br>~~es~~|
|c2<br>~~es~~<br>~~Rs~~|0.46<br>~~es~~|0.60<br>~~es~~|0.018<br>~~es~~|0.023<br>~~es~~|
|D<br>~~es~~<br>~~Rs~~<br>~~es~~|5.97<br>~~es~~|6.22<br>~~es~~|0.235<br>~~es~~|0.244<br>~~es~~|
|D1<br>~~Rs~~<br>~~es~~|4.95|5.60|0.194|0.220|
|E<br>~~es~~<br>~~se~~|6.35<br>~~se~~|6.73<br>~~se~~|0.250<br>~~se~~|0.265<br>~~se~~|
|E1<br>~~se~~<br>~~se~~|4.32<br>~~se~~<br>~~se~~|5.50<br>~~se~~<br>~~se~~|0.170<br>~~se~~<br>~~se~~|0.216<br>~~se~~<br>~~se~~|
|e<br>~~i~~|2.286 typ.||0.090 typ.||
|e1<br>~~i~~<br>~~Rs~~<br>~~es~~|4.40<br>~~Rs~~|4.70<br>~~Rs~~|0.173<br>~~Rs~~|0.185<br>~~Rs~~|
|H<br>~~es~~<br>~~Rs~~|9.35|10.40|0.368|0.409|
|L<br>~~es~~<br>~~Rs~~|1.0|1.78|0.039|0.070|
|L2<br>~~Rs~~<br>~~se~~<br>~~es~~|~~se~~|1.27<br>~~se~~|~~se~~|0.050<br>~~se~~|
|L4<br>~~es~~|0.60|1.02|0.023|0.040|
|V2<br>~~es~~<br>~~es~~|-8°<br>~~es~~|+8°<br>~~es~~|-8°<br>~~es~~|+8°<br>~~es~~|



## **Figure 10: DPAK recommended footprint (dimensions in mm)** 

DocID5515 Rev 5 

7/9 

**Ordering** information 

**STPS8L30** 

## **3 Ordering information** 

**Table 6: Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS8L30B-TR|LS 30|DPAK|0.32 g|2500|Tape and reel|



## **4 Revision history** 

**Table 7: Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|Jul-2002|2A|First issue|
|16-Apr-2005|3|IPAKpackage Added.|
|01-Mar-2006|4|IPAK connector identifiers corrected on page 1. ECOPACK statement<br>added. Document reformatted to current standard.|
|18-Oct-2016|5|Updated DPAK package information and reformatted to current<br>standard. Removed IPAK package.|



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**STPS8L30** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2016 STMicroelectronics – All rights reserved 

DocID5515 Rev 5 

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- [Supplier page](https://es.farnell.com/stmicroelectronics/stps8l30b-tr/schottky-rectifier-8a-30v-to-252/dp/3214519)
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