# Schottky Rectifier, 200 V, 4 A, Single, DO-214AA (SMB), 2 Pins, 870 mV

![Product image](https://novapart.co/image/farnell:2849669RL/)

**URL**: https://novapart.co/products/STPS4S200UF/schottky-rectifier-200-v-4-a-single-do-214aa-smb-2
**SKU**: STPS4S200UF
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.1470
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:200V; Forward Current If(AV):4A; Diode Configuration:Single; Diode Case Style:DO-214AA; No. of Pins:2Pins; Forward Voltage VF Max:870mV; Forward

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | ECOPACK |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | DO-214AA (SMB) |
| Diode Configuration | Single |
| Forward Voltage Max | 870mV |
| Forward Surge Current | 130A |
| Average Forward Current | 4A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 200V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2849669RL/)

**STPS4S200** 

Datasheet 

4 A - 200 V power Schottky rectifier 

## **Features** 

- Negligible switching losses 

- High junction temperature capability 

- Very small conduction losses 

- Low leakage current 

- Tj = -40 °C minimum operating 

- ECOPACK2 component 

## **Applications** 

- Inverter 

- Lighting 

- Battery charger 

- Telecom power 

- Home appliance 

## **Description** 

Single chip Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. 

**Product status** STPS4S200 

Packaged in SMB Flat Notch, SMB Flat, SMC and DPAK, the STPS4S200 is ideal for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. 

|**Product summary**|**Product summary**|
|---|---|
|**Symbol**|**Value**|
|**IF(AV)**|4 A|
|**VRRM**|200 V|
|**T j(max.)**|175 °C|
|**VF(typ.)**|0.64 V|



**DS10646** - **Rev 4** - **January 2020** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STPS4S200 Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)** 

|**Symbol **|**Parameter**|||**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||200|V|
|IF(RMS)|Forward rms current|||10|A|
|IF(AV)|Average forward current, δ = 0.5, square<br>wave|SMB Flat Notch, SMC, SMB<br>Flat|TL= 125 °C|4|A|
|||DPAK|Tc= 160°C|||
|IFSM|Surge non repetitive forward current||tp= 10 ms sinusoidal|130|A|
|Tstg|Storage temperature range|||-65 to +175|°C|
|Tj|Operating junction temperature range(1)|||-40 to +175|°C|



_1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink._ 

**Table 2. Thermal resistance parameter** 

|**Symbol**|**Parameter**|**Parameter**|**Max. value**|**Unit**|
|---|---|---|---|---|
|Rth(j-l)|Junction to lead (SMB Flat Notch, SMC, SMB Flat)||15|°C/W|
|Rth(j-c)|Junction to case|DPAK|3.2||



For more information, please refer to the following application note : 

- AN5088 : Rectifiers thermal management, handling and mounting recommendations 

**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||5|µA|
|||Tj= 125 °C||-|0.70|2.50|mA|
|VF(2)|Forward voltage drop|Tj= 25 °C|IF= 4 A|-||0.87|V|
|||Tj= 125 °C||-|0.64|0.71||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: P = 0.63 x IF(AV) + 0.020 x IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses : 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

**DS10646** - **Rev 4** 

**page 2/17** 

**STPS4S200 Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**==> picture [513 x 403] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient<br>average forward current temperature (δ = 0.5)<br>3.5 PF(AV)(W)  10 I F(AV) (A)<br>δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5<br>3.0<br>2.5 δ = 1 8 DPAK Rth(j-a)=Rth(j-c)<br>2.0 6<br>1.5<br>4<br>1.0 T SMB-Flat & SMC<br>2 T Rth(j-a)=Rth(j-l)<br>0.5<br>0.0 δ= tp/T tp IF (AV) (A) δ =tp/T tp Tamb(°C)<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 0 25 50 75 100 125 150 175<br>Figure 3. Normalized avalanche power derating versus<br>pulse duration (Tj = 125 °C) Figure 4. Relative variation of thermal impedance junction<br>PARM(tp) to case versus pulse duration (DPAK)<br>PARM(10 µs) Z /R<br>1 1.0 th(j-c) th(j-c)<br>0.9 DPAK<br>0.8<br>0.7<br>0.1 0.6<br>0.5<br>0.4<br>0.3<br>0.01<br>0.2 Single pulse<br>0.1<br>0 .0 t P (s)<br>t p(µs) 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>0.001<br>1 10 100 1000<br>**----- End of picture text -----**<br>


**==> picture [513 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction<br>to lead versus pulse duration (SMB flat, SMB flat Notch) to lead versus pulse duration (SMC)<br>1.0 Zth(j-l)/Rth(j-l) 1.0 Zth(j-l) /R th(j-l)<br>SMC<br>0.9 SMB Flat 0.9<br>0.8 SMB Flat Notch 0.8<br>0.7 0.7<br>0.6 0.6<br>0.5 0.5<br>0.4 0.4<br>0.3 0.3<br>Single pulse<br>0.2<br>0.2 Single pulse<br>0.1<br>t 0.1<br>0.0 P [(s)] t p(s)<br>1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 0.0<br>1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02<br>**----- End of picture text -----**<br>


**DS10646** - **Rev 4** 

**page 3/17** 

**STPS4S200 Characteristics (curves)** 

**==> picture [513 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Reverse leakage current versus reverse voltage Figure 8. Junction capacitance versus reverse voltage<br>applied (typical values) applied (typical values)<br>1.E+04IR(µA) 1000 C(pF)<br>Tj = 150 °C F = 1 MHz<br>1.E+03 V OSC  = 30 mV RMS<br>Tj = 125 °C T  = 25 °C<br>j<br>1.E+02 Tj = 100 °C<br>1.E+01 T j = 75 °C 100<br>1.E+00 Tj = 50  ° C<br>Tj = 25 °C<br>1.E-01<br>1.E-02 VR(V) 10 VR(V)<br>0 20 40 60 80 100 120 140 160 180 200 1 10 100 1000<br>**----- End of picture text -----**<br>


**==> picture [513 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 9. Forward voltage drop versus forward current Figure 10. Forward voltage drop versus forward current<br>(typical values) (maximum values)<br>10.00 IF(A) 10.00IF(A)<br>T j = 125 °C T j  = 125 °C<br>1.00 1.00<br>T  = 25 °C<br>j<br>T  = 25 °C<br>0.10 0.10 j<br>0.01 VF(V) 0.01 VF(V)<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0<br>**----- End of picture text -----**<br>


**==> picture [513 x 206] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 11. Thermal resistance junction to ambient versus Figure 12. Thermal resistance junction to ambient versus<br>copper surface under tab (DPAK) copper surface under each lead (SMB Flat, SMB Flat<br>Notch)<br>100 Rth(j-a) (°C/W) 200 Rth(j-a)(°C/W)<br>90 Epoxy printed circuit board, copper thickness: 35 µm DPAK Epoxy printed board FR4, copper thickness: 35 μm SMB flat NotchSMB flat<br>80<br>70 150<br>60<br>50<br>100<br>40<br>30<br>20 50<br>10<br>0 S Cu (cm²) SCu(cm²)<br>0 5 10 15 20 25 30 35 40 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**DS10646** - **Rev 4** 

**page 4/17** 

**STPS4S200 Characteristics (curves)** 

## **Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMC)** 

**==> picture [225 x 143] intentionally omitted <==**

**----- Start of picture text -----**<br>
160 Rth(j-a) (°C/W)<br>Epoxy p rinted circuit board FR4, copper t hickness: 35 µm<br>140 SMC<br>120<br>100<br>80<br>60<br>40<br>20<br>S Cu (cm²)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**DS10646** - **Rev 4** 

**page 5/17** 

**STPS4S200 Package information** 

**2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

**DS10646** - **Rev 4** 

**page 6/17** 

**STPS4S200 SMB Flat Notch package information** 

## **2.1 SMB Flat Notch package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

## **Figure 14. SMB Flat Notch package outline** 

**==> picture [351 x 186] intentionally omitted <==**

**----- Start of picture text -----**<br>
A<br>A1<br>G1<br>b c<br>D<br>V V1<br>L<br>L1<br>E E1 G<br>L3 L2<br>**----- End of picture text -----**<br>


**Table 4. SMB Flat Notch mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.90||1.10|0.035||0.043|
|A1||0.05|||0.002||
|b|1.95||2.20|0.077||0.087|
|c|0.15||0.40|0.006||0.016|
|D|3.30||3.95|0.130||0.156|
|E|5.20||5.60|0.205||0.220|
|E1|4.05||4.60|0.159||0.181|
|G||2.00|||0.079||
|G1||1.20|||0.047||
|L|0.75||1.20|0.030||0.047|
|L1||0.30|||0.012||
|L2||0.60|||0.024||
|L3|0.02|||0.001|||
|V|||8°|||8°|
|V1|||8°|||8°|



**DS10646** - **Rev 4** 

**page 7/17** 

**STPS4S200 SMB Flat Notch package information** 

## **Figure 15. Footprint recommendations, dimensions in mm (inches)** 

**==> picture [154 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.20 3.44 1.20<br>(0.047) (0.136) (0.047)<br>2.07<br>(0.082)<br>5.84<br>(0.230)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


**DS10646** - **Rev 4** 

**page 8/17** 

**STPS4S200 SMB Flat package information** 

## **2.2 SMB Flat package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

**Figure 16. SMB Flat package outline** 

**==> picture [304 x 204] intentionally omitted <==**

**----- Start of picture text -----**<br>
A<br>c<br>D<br>L 2x<br>L1  2x<br>E E1<br>L2  2x<br>b<br>**----- End of picture text -----**<br>


**Table 5. SMB Flat mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.90||1.10|0.035||0.044|
|b|1.95||2.20|0.076||0.087|
|c|0.15||0.40|0.005||0.016|
|D|3.30||3.95|0.129||0.156|
|E|5.10||5.60|0.200||0.221|
|E1|4.05||4.60|0.159||0.182|
|L|0.75||1.50|0.029||0.060|
|L1||0.40|||0.016||
|L2||0.60|||0.024||



**DS10646** - **Rev 4** 

**page 9/17** 

**STPS4S200 SMB Flat package information** 

## **Figure 17. Footprint recommendations, dimensions in mm (inches)** 

**==> picture [154 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.20 3.44 1.20<br>(0.047) (0.136) (0.047)<br>2.07<br>(0.082)<br>5.84<br>(0.230)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


**DS10646** - **Rev 4** 

**page 10/17** 

**STPS4S200 SMC package information** 

## **2.3 SMC package information** 

- Epoxy meets UL94, V0 

## **Figure 18. SMC package outline** 

**==> picture [244 x 194] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1<br>D<br>E<br>A1<br>A2<br>b<br>C<br>L<br>E2<br>**----- End of picture text -----**<br>


**Table 6. SMC package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.0748|0.0965|
|A2|0.05|0.20|0.0020|0.0079|
|b|2.90|3.20|0.1142|0.1260|
|c|0.15|0.40|0.0059|0.0157|
|D|5.55|6.25|0.2185|0.2461|
|E|7.75|8.15|0.3051|0.3209|
|E1|6.60|7.15|0.2598|0.2815|
|E2|4.40|4.70|0.1732|0.1850|
|L|0.75|1.50|0.0295|0.0591|



**DS10646** - **Rev 4** 

**page 11/17** 

**STPS4S200 SMC package information** 

**Figure 19. SMC recommended footprint** 

**==> picture [234 x 153] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.54 5.11 1.54<br>(0.061) (0.201) (0.061)<br>3.14<br>(0.124)<br>8.19<br>(0.323)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


**DS10646** - **Rev 4** 

**page 12/17** 

**STPS4S200 DPAK package information** 

## **2.4 DPAK package information** 

- Epoxy meets UL 94,V0 

- Cooling method: by conduction (C) 

## **Figure 20. DPAK package outline** 

**==> picture [353 x 315] intentionally omitted <==**

**----- Start of picture text -----**<br>
E<br>A<br>b4<br>c2<br>Thermal pad<br>E1<br>L2<br>D1<br>D<br>H R<br>L4<br>A1<br>b R<br>e<br>e1 c<br>A2<br>L1<br>L<br>V2<br>G auge<br>0.25 plane<br>**----- End of picture text -----**<br>


_Note:_ 

_This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed._ 

**DS10646** - **Rev 4** 

**page 13/17** 

**STPS4S200 DPAK package information** 

**Table 7. DPAK package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|2.18|2.40|0.085|0.094|
|A1|0.90|1.10|0.035|0.043|
|A2|0.03|0.23|0.001|0.009|
|b|0.64|0.90|0.025|0.035|
|b4|4.95|5.46|0.194|0.215|
|c|0.46|0.61|0.018|0.024|
|c2|0.46|0.60|0.018|0.023|
|D|5.97|6.22|0.235|0.244|
|D1|4.95|5.60|0.194|0.220|
|E|6.35|6.73|0.250|0.265|
|E1|4.32|5.50|0.170|0.216|
|e|2.286 typ.||0.090 typ.||
|e1|4.40|4.70|0.173|0.185|
|H|9.35|10.40|0.368|0.409|
|L|1.0|1.78|0.039|0.070|
|L2||1.27||0.050|
|L4|0.60|1.02|0.023|0.040|
|V2|-8°|+8°|-8°|+8°|



**Figure 21. DPAK recommended footprint (dimensions in mm)** 

**==> picture [296 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
12.7<br>6.7 3.0 3.0<br>A<br>4.572<br>6.7<br>B<br>1.6<br>The device must be positioned within 0.05 AB<br>**----- End of picture text -----**<br>


**DS10646** - **Rev 4** 

**page 14/17** 

**STPS4S200 Ordering Information** 

## **3 Ordering information** 

## **Table 8. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS4S200B-TR|S4 200B|D²PAK|0.032 g|10 000|Tape and reel|
|STPS4S200S|S42|SMC|0.250 g|2500|Tape and reel|
|STPS4S200UF|FG42|SMB Flat|0.050 g|5000|Tape and reel|
|STPS4S200UFN|B42|SMB Flat Notch|0.056 g|5000|Tape and reel|



**DS10646** - **Rev 4** 

**page 15/17** 

**STPS4S200** 

## **Revision history** 

**Table 9. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|17-Oct-2014|1|First release.|
|26-Aug-2015|2|Added device in SMC package.<br>Updated document accordingly.|
|15-May-2017|3|Updated DPAK package information and reformatted to current standard.|
|31-Jan-2019|4|AddedSection  2.1  SMB Flat Notch package information.|



**DS10646** - **Rev 4** 

**page 16/17** 

**STPS4S200** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2020 STMicroelectronics – All rights reserved 

**DS10646** - **Rev 4** 

**page 17/17** 



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- [Request a quote for this part](https://novapart.co/quote/)
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