# Schottky Rectifier, 100 V, 3 A, Single, DO-214AA (SMB), 2 Pins, 840 mV

![Product image](https://novapart.co/image/farnell:2353679/)

**URL**: https://novapart.co/products/STPS3H100UF/schottky-rectifier-100-v-3-a-single-do-214aa-smb-2
**SKU**: STPS3H100UF
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.1460
**Stock**: 25+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:100V; Forward Current If(AV):3A; Diode Configuration:Single; Diode Case Style:SMD; No. of Pins:2Pins; Forward Voltage VF Max:840mV; Forward Surg

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | STPS3 |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | DO-214AA (SMB) |
| Diode Configuration | Single |
| Forward Voltage Max | 840mV |
| Forward Surge Current | 75A |
| Average Forward Current | 3A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 100V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2353679/)

**STPS3H100** 

Datasheet 

3 A - 100 V power Schottky rectifier 

## **Features** 

- Negligible switching losses 

- High junction temperature capability 

- Low leakage current 

- Good trade-off between leakage current and forward voltage drop 

- Avalanche capability specified 

- ECOPACK2 compliant 

## **Applications** 

- Switching diode 

- SMPS 

- DC/DC converter 

- LED lighting 

## **Description** 

This 100 V power Schottky rectifier is ideal for switch mode power supplies, for 12 V rails and high frequency converters. 

Packaged in SMB and SMB Flat, the STPS3H100 is optimized for use in consumer and computer applications where low drop forward voltage is required to reduce power dissipation. 

## **Product status link** 

STPS3H100 

|**Product summary**|**Product summary**|
|---|---|
|**IF(AV)**|3 A|
|**VRRM**|100 V|
|**Tj (max.)**|175 °C|
|**VF (typ.)**|0.63 V|



**DS6597** - **Rev 3** - **January 2020** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STPS3H100 Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|||**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||100|V|
|IF(AV)|Average forward current, δ = 0.5 square wave|SMB|Tl= 115 °C|3|A|
|||SMB Flat|Tl= 140 °C|||
|IFSM|Surge non repetitive forward current||tp= 10 ms sinusoidal|75|A|
|PARM|Repetitive peak avalanche power||tp= 10 µs,<br>Tj= 125 °C|172|W|
|Tstg|Storage temperature range|||-65 to +175|°C|
|Tj|Maximum operating junction temperature(1)|||175|°C|



_1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink._ 

**Table 2. Thermal resistance parameter** 

|**Symbol**|**Parameter**||**Max. value**|**Unit**|
|---|---|---|---|---|
|Rth(j-l)|Junction to lead|SMB|25|°C/W|
|||SMB Flat|15||



For more information, please refer to the following application note: 

- AN5088: Rectifiers thermal management, handling and mounting recommendations 

**Table 3. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR(1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||1.00|µA|
|||Tj= 125 °C||-|0.40|1.00|mA|
|VF(2)|Forward voltage drop|Tj= 25 °C|IF= 3 A|-||0.84|V|
|||Tj= 125 °C||-|0.63|0.68||
|||Tj= 25 °C|IF= 6 A|-||0.92||
|||Tj= 125 °C||-|0.71|0.76||



_1. Pulse test: tp = 5 ms, δ < 2%_ 

_2. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses, use the following equation: 

P = 0.6 x IF(AV) + 0.027 x IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses : 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

**DS6597** - **Rev 3** 

**page 2/11** 

**STPS3H100 Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**Figure 1. Average forward power dissipation versus average forward current** 

**==> picture [214 x 137] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.6 PF(AV)(W)<br>2.42.2 eea δ =0.05 δ = 0.1 Jf | δ = 0.2 7 | A δ = 0.5 PYL δ = 1<br>2.0 a esee ee| aeA Aea Ya eea, aa aaAe|<br>1.8 th I I i Se<br>1.6<br>1.4<br>1.2<br>1.0<br>0.8<br>0.6 —>F T<br>0.4<br>0.2 =Kee IF(AV)(A) δ =tp/T ” a ca tp<br>0.0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5<br>**----- End of picture text -----**<br>


**Figure 3. Normalized avalanche power derating versus pulse duration (Tj = 125 °C)** 

**==> picture [193 x 142] intentionally omitted <==**

**----- Start of picture text -----**<br>
PARM(tp)<br>1 PARM(10 µs) =—=====: =====2:<br>0.1 ===:<br>0.01<br>t p(µs)<br>0.001<br>1 10 100 1000<br>**----- End of picture text -----**<br>


**Figure 2. Average forward current versus ambient temperature (δ = 0.5)** 

**==> picture [222 x 145] intentionally omitted <==**

**----- Start of picture text -----**<br>
3.5 IF(AV)(A)<br>3.0 ee Rth(j-a)=Rth(j-l) eee ee S MB flatMB flat<br>pf f | fT ft ft PP TN‘ AD<br>2.5 eeee Ge eC<br>2.0<br>S MBMB<br>1.5<br>1.0<br>T P| | | f ff tt UNA<br>0.5<br>δ [=tp/T] o tp ra Tamb (°C) LN<br>0.0<br>0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br>


**Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB)** 

**==> picture [224 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-a )/Rth(j-a)<br>1.0<br>0.9 Cr SMB a a|<br>A<br>0.8 AA<br>0.7 AA<br>0.6 CeCe Ze<br>Cee<br>0.5 LT ZZ<br>a  TTa)<br>0.4 AA<br>0.3 CoCo<br>a|SA Cr<br>0.2 A<br>Single pulse<br>0.1 CSee woeee a tp(s) CCC CC<br>0.0 ee COCCOO TCCCC<br>1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br>


**DS6597** - **Rev 3** 

**page 3/11** 

**STPS3H100 Characteristics (curves)** 

**Figure 5. Relative variation of thermal impedance junction Figure 6. Reverse leakage current versus reverse voltage to lead versus pulse duration (SMB Flat) applied (typical values)** 

**==> picture [479 x 147] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0 Zth(j-l)/ Rth(j-l) 1.E+04 IR(µA)<br>SMB flat<br>0.9<br>0.8 1.E+03 Tj =150 °C<br>0.7 Tj =125 °C<br>1.E+02<br>0.6 Tj =100 °C<br>0.5 1.E+01 Tj =75 °C<br>0.4 Tj =50 °C<br>0.3 1.E+00<br>0.2 Tj =25 °C<br>1.E-01<br>0.1 Single pulse tp(s) VR(V)<br>0.0 1.E-02<br>1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 0 20 40 60 80 100<br>**----- End of picture text -----**<br>


**==> picture [513 x 205] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Junction capacitance versus reverse voltage<br>Figure 8. Forward voltage drop versus forward current<br>applied (typical values)<br>100 C(pF) 6.0 IF(A)<br>F = 1 MHz 5.5<br>VOSCT = 30 mV = 25 °Cj RMS 5.04.5 (Maximum values)T jj =125 °C<br>4.0<br>3.53.0 (Typical values)T jj =125 °C (Maximum values)Tj=25 °C<br>2.5<br>2.0<br>1.5<br>1.0<br>0.5 VF(V)<br>VR(V) 0.0<br>10 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1<br>1 10 100<br>**----- End of picture text -----**<br>


**==> picture [513 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 10. Thermal resistance junction to ambient versus<br>Figure 9. Thermal resistance junction to ambient versus<br>copper surface under each lead (SMB flat)<br>copper surface under each lead (SMB)<br>200 Rth(j-a) (°C/W) 200 Rth(j-a)(°C/W)<br>Epoxy p rinted circuit board FR4, copper t hickness: 35 µm SMB Epoxy printed board FR4, copper thickness: 35 μm SMB flat<br>150 150<br>100 100<br>50 50<br>S (Cu) (cm²) SCu(cm²)<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


**DS6597** - **Rev 3** 

**page 4/11** 

**STPS3H100 Package information** 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1** 

## **SMB package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

**Figure 11. SMB package outline** 

**==> picture [282 x 220] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br>


**DS6597** - **Rev 3** 

**page 5/11** 

**STPS3H100 SMB package information** 

**Table 4. SMB package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
|**Ref.**|**Millimeters**||**Inches (for reference only)**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.0748|0.0965|
|A2|0.05|0.20|0.0020|0.0079|
|b|1.95|2.20|0.0768|0.0867|
|c|0.15|0.40|0.0059|0.0157|
|D|3.30|3.95|0.1299|0.1556|
|E|5.10|5.60|0.2008|0.2205|
|E1|4.05|4.60|0.1594|0.1811|
|L|0.75|1.50|0.0295|0.0591|



**Figure 12. SMB recommended footprint** 

**==> picture [260 x 129] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.62 2.60 1.62<br>(0.064) (0.102) (0.064)<br>2.18<br>(0.086)<br>5.84<br>(0.230)<br>**----- End of picture text -----**<br>


**DS6597** - **Rev 3** 

**page 6/11** 

**STPS3H100 SMB Flat package information** 

## **2.2 SMB Flat package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

**Figure 13. SMB Flat package outline** 

**==> picture [304 x 204] intentionally omitted <==**

**----- Start of picture text -----**<br>
A<br>c<br>D<br>L 2x<br>L1  2x<br>E E1<br>L2  2x<br>b<br>**----- End of picture text -----**<br>


**Table 5. SMB Flat mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches (for reference only)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.90||1.10|0.035||0.043|
|b|1.95||2.20|0.077||0.087|
|c|0.15||0.40|0.006||0.016|
|D|3.30||3.95|0.130||0.156|
|E|5.10||5.60|0.201||0.220|
|E1|4.05||4.60|0.159||0.181|
|L|0.75||1.50|0.030||0.059|
|L1||0.40|||0.016||
|L2||0.60|||0.024||



**DS6597** - **Rev 3** 

**page 7/11** 

**STPS3H100 SMB Flat package information** 

## **Figure 14. Footprint recommendations, dimensions in mm (inches)** 

**==> picture [154 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.20 3.44 1.20<br>(0.047) (0.136) (0.047)<br>2.07<br>(0.082)<br>5.84<br>(0.230)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


**DS6597** - **Rev 3** 

**page 8/11** 

**STPS3H100 Ordering Information** 

## **3** 

## **Ordering information** 

**Table 6. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS3H100U|G31|SMB|0.107 g|2500|Tape and reel|
|STPS3H100UF|FG31|SMB Flat|0.050 g|5000|Tape and reel|



**DS6597** - **Rev 3** 

**page 9/11** 

**STPS3H100** 

## **Revision history** 

**Table 7. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|15-Jan-2010|1|First issue.|
|27-Sept-2018|2|Updated cover page.<br>UpdatedTable 1. Absolute ratings (limiting values at 25 °C, unless otherwise<br>specified).<br>Removed figure 3, figure 4, figure 5 and figure 6.<br>Minor text changes to improve readability.|
|14-Janv-2020|3|UpdatedFigure 3. Minor text changes to improve readability.|



**DS6597** - **Rev 3** 

**page 10/11** 

**STPS3H100** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2020 STMicroelectronics – All rights reserved 

**DS6597** - **Rev 3** 

**page 11/11** 



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