# Schottky Rectifier, 150 V, 3 A, Single, DO-201AD, 2 Pins, 820 mV

![Product image](https://novapart.co/image/farnell:1702811/)

**URL**: https://novapart.co/products/STPS3150RL/schottky-rectifier-150-v-3-a-single-do-201ad-2
**SKU**: STPS3150RL
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.1090
**Stock**: 200+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:150V; Forward Current If(AV):3A; Diode Configuration:Single; Diode Case Style:DO-201AD; No. of Pins:2Pins; Forward Voltage VF Max:820mV; Forward Surge Current If

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | STPS3 |
| Qualification | - |
| Diode Mounting | Through Hole |
| Diode Case Style | DO-201AD |
| Diode Configuration | Single |
| Forward Voltage Max | 820mV |
| Forward Surge Current | 100A |
| Average Forward Current | 3A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 150V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1702811/)

## **STPS3150** 

## Power Schottky rectifier 

**Datasheet** - **production data** 

## **Description** 

**==> picture [138 x 131] intentionally omitted <==**

**----- Start of picture text -----**<br>
A<br>DO-201AD<br>f K<br>A<br>A<br>K<br>a K :<br>SMB SMBflat<br>**----- End of picture text -----**<br>


## **Features** 

- Negligible switching losses 

- Low forward voltage drop for higher efficiency and extended battery life 

150 V Power Schottky rectifier are suited for switch mode power supplies on up to 24 V rails and high frequency converters. 

Packaged in Axial, SMB, and low-profile SMB, this device is intended for use in consumer and computer applications like TV, STB, PC and DVD where low drop forward voltage is required to reduce power dissipation. 

**Table 1. Device summary** 

|**Symbol**|**Value**|
|---|---|
|IF(AV)|3 A|
|VRRM|150 V|
|Tj(max)|175 °C|
|VF(typ)|0.63 V|



- Low thermal resistance 

- ECOPACK[®] 2 compliant component 

August 2016 

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This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**STPS3150** 

## **1 Characteristics** 

**Table 2. Absolute Ratings (limiting values at 25 °C unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage|||150|V|
|IF(AV)|Average forward current,<br>δ= 0.5 square wave|SMB|TL= 130 °C|3|A|
|||DO-201AD|TL= 140 °C|||
|||SMB flat|TL= 150 °C|||
|IFSM|Surge non repetitive<br>forward current|SMB|tp= 10 ms sinusoidal|80|A|
|||DO-201AD||100||
|||SMB flat||80||
|PARM(1)|Repetitive peak avalanche power||Tj= 125 °C, tp= 10 µs|210|W|
|Tstg|Storage temperature range|||-65 to + 175|°C|
|Tj|Operating junction temperature(2)|||175|°C|



1. For pulse time duration deratings, please refer to _Figure 3_ . More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the STMicroelectronics Application notes AN1768, “Admissible avalanche power of Schottky diodes” and AN2025, “Converter improvement using Schottky rectifier avalanche specification”. 

2. dPtot---------------dTj < Rth-----------------------( 1j – a **-** ) condition to avoid thermal runaway for a diode on its own heatsink 

**Table 3. Thermal resistance** 

|**Symbol**||**Parameter**||**Value**|**Unit**|
|---|---|---|---|---|---|
|Rth(j-l)|Junction to lead||SMB flat|10|°C/W|
||||SMB|20||
|||Lead length = 10 mm|DO-201AD|15||



**Table 4. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Tests conditions**|**Tests conditions**|**Min.**|**Typ**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR (1)|Reverse leakage<br>current|Tj= 25 °C|VR= VRRM||0.4|2.0|µA|
|||Tj= 125 °C|||0.6|2.0|mA|
|VF (2)|Forward voltage drop|Tj= 25 °C|IF= 3 A||0.78|0.82|V|
|||Tj= 125 °C|||0.63|0.67||
|||Tj= 25 °C|IF= 6 A||0.85|0.89||
|||Tj= 125 °C|||0.70|0.75||



1. tp = 5 ms, δ < 2% 

2. tp = 380 µs, δ < 2% 

To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.027 IF[2] (RMS) 

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**STPS3150** 

**Characteristics** 

**Figure 1. Average forward power dissipation versus average forward current** 

**==> picture [205 x 136] intentionally omitted <==**

**----- Start of picture text -----**<br>
PF(AV)(W)<br>2.5<br>� = 0.05 � = 0.1 � = 0.2 � = 0.� � = 1<br>2.0<br>1.5<br>1.0<br>T<br>0.5<br>IF(AV)(A) � =tp/T tp<br>0.0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5<br>**----- End of picture text -----**<br>


**Figure 3. Normalized avalanche power derating versus pulse duration** 

**==> picture [183 x 136] intentionally omitted <==**

**----- Start of picture text -----**<br>
PARM(tp)<br>1 PARM(10 µs)<br>0.1<br>0.01<br>t p(µs)<br>0.001<br>1 10 100 1000<br>**----- End of picture text -----**<br>


**Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB)** 

**==> picture [215 x 138] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-a)/Rth(j-a)<br>1.0<br>SMB<br>0.9<br>0.8<br>0.7<br>0.6<br>0.5<br>0.4<br>0.3<br>T<br>0.2<br>Single pulse<br>0.1<br>tp(s) � =tp/T tp<br>0.0<br>1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br>


**Figure 2. Average forward current versus ambient temperature (** δ **= 0.5)** 

**==> picture [206 x 136] intentionally omitted <==**

**----- Start of picture text -----**<br>
IF(AV)(A)<br>3.5<br>Rth(j-a)=Rth(j-l)<br>3.0<br>SMB-Flat<br>2.5<br>DO-201AD<br>2.0 SMB<br>1.5<br>1.0 T<br>0.5<br>� =tp/T tp T amb (°C)<br>0.0<br>0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br>


**Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration (DO-201AD)** 

**==> picture [215 x 136] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0 Zth(j-a)/Rth(j-a)<br>DO-201AD<br>0.9<br>0.8<br>0.7<br>0.6<br>0.5<br>0.4<br>0.3<br>T<br>0.2<br>Single pulse<br>0.1<br>tp(s) � =tp/T tp<br>0.0<br>1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>**----- End of picture text -----**<br>


**Figure 6. Relative variation of thermal impedance junction to lead versus pulse duration (SMBflat)** 

**==> picture [216 x 137] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-l)/Rth(j-l)<br>1.0<br>SMBflat<br>0.9<br>0.8<br>0.7<br>0.6<br>0.5<br>0.4<br>0.3<br>T<br>0.2<br>Single pulse<br>0.1 tp(s) � =tp/T tp<br>0.0<br>1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01<br>**----- End of picture text -----**<br>


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**Characteristics** 

**STPS3150** 

**Figure 7. Reverse leakage current versus reverse voltage applied (typical values)** 

**Figure 8. Junction capacitance versus reverse voltage applied (typical values)** 

**==> picture [462 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
IR(µA) C(pF)<br>1.E+04 1000<br>F = 1 MHZ<br>1.E+03 T j  = 150 °C VOSCTj= 30 mV = 25 °CRMS<br>Tj = 125 °C<br>1.E+02 Tj = 100 °C<br>1.E+01 Tj = 75 °C 100<br>1.E+00 Tj = 50 °C<br>1.E-01 Tj = 25 °C<br>VR(V) VR(V)<br>1.E-02 10<br>0 25 50 75 100 125 150 1 10 100 1000<br>**----- End of picture text -----**<br>


**Figure 9. Forward voltage drop versus forward current** 

**Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (typical values)** 

**==> picture [462 x 340] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 IF(A) 200 Rth(j-a)(°C/W)<br>(maximum values) Tj = 125 °C 180 epoxy printed board FR4 copper thickness = 35 µm SMB<br>160<br>Tj = 125  ° C<br>(typical values) Tj = 25  ° C 140<br>(maximum values) 120<br>10 100<br>80<br>60<br>40<br>VF(V) 20 S Cu (cm²)<br>1 0<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>Figure 11. Thermal resistance junction to  Figure 12. Thermal resistance versus lead<br>ambient versus copper surface under each lead  length<br>(typical values)<br>200 Rth(j-a)(°C/W) 90 Rth(°C/W)<br>180 epoxy printed board FR4 copper thickness = 35 µm SMBflat 80 DO-201AD R th(j  - a)<br>160<br>70<br>140<br>60<br>120<br>50<br>100<br>40<br>80<br>60 30 Rth(j-l)<br>40 20<br>20 S Cu (cm²) 10 L leads (mm)<br>0 0<br>5 10 15 20 25<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br>


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**STPS3150** 

**Package information** 

## **2 Package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

**==> picture [192 x 11] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 13. SMB dimensions (definitions)<br>**----- End of picture text -----**<br>


**==> picture [171 x 119] intentionally omitted <==**

**----- Start of picture text -----**<br>
E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br>


**Table 5. SMB dimensions (values)** 

||**Table 5. SMB dimensions(values)**|**Table 5. SMB dimensions(values)**|**Table 5. SMB dimensions(values)**|**Table 5. SMB dimensions(values)**|
|---|---|---|---|---|
|**Ref.**|**Dimensions**||||
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A1|1.90|2.45|0.075|0.096|
|A2|0.05|0.20|0.002|0.008|
|b|1.95|2.20|0.077|0.087|
|c|0.15|0.40|0.006|0.016|
|E|5.10|5.60|0.201|0.220|
|E1|4.05|4.60|0.159|0.181|
|D|3.30|3.95|0.130|0.156|
|L|0.75|1.50|0.030|0.059|



## **Figure 14. SMB footprint (dimensions in mm)** 

**==> picture [160 x 100] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.62 2.60 1.62<br>(0.064) (0.102) (0.064)<br>2.18<br>(0.086)<br>5.84<br>(0.23)<br>**----- End of picture text -----**<br>


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**STPS3150** 

**Package information** 

## **Figure 15. SMBflat dimensions (definitions)** 

**==> picture [244 x 154] intentionally omitted <==**

**----- Start of picture text -----**<br>
A<br>c<br>D<br>L 2x<br>L2 2x<br>E E1<br>L<br>L1 2x<br>b<br>**----- End of picture text -----**<br>


**Table 6. SMBflat dimensions (values)** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
||**Millimeters**|||**Inches**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.90||1.10|0.035||0.043|
|b(1)|1.95||2.20|0.077||0.087|
|c(1)|0.15||0.40|0.006||0.016|
|D|3.30||3.95|0.130||0.156|
|E|5.10||5.60|0.200||0.220|
|E1|4.05||4.60|0.189||0.181|
|L|0.75||1.50|0.029||0.059|
|L1||0.40|||0.016||
|L2||0.60|||0.024||



1. Applies to plated leads 

## **Figure 16. SMB Flat footprint** 

**==> picture [139 x 153] intentionally omitted <==**

**----- Start of picture text -----**<br>
5.84<br>(0.230)<br>2.07<br>(0.082)<br>1.20 3.44 1.20<br>(0.047) (0.136) (0.047)<br>millimeters<br>(inches)<br>**----- End of picture text -----**<br>


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**Package information** 

## **Figure 17. DO-201AD dimensions (definitions)** 

**==> picture [350 x 167] intentionally omitted <==**

**----- Start of picture text -----**<br>
B A B<br>Note 1 E E Note 1<br>ØD<br>Note 2<br>ØC<br>**----- End of picture text -----**<br>


**Table 7. DO-201AD dimensions (values)** 

|**Ref.**|**Dimensions**||||
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A||9.50||0.374|
|B|25.40||1.000||
|C||5.30||0.209|
|D(1)||1.30||0.051|
|E||1.25||0.049|
|Note 2(2)|15||0.59||



1. The lead diameter D is not controlled over zone E 

2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”) 

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**Ordering information** 

**STPS3150** 

## **3 Ordering information** 

**Table 8. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS3150U|G315|SMB|107 mg|2500|Tape and reel|
|STPS3150UF|FG315|SMB flat|50 mg|5000|Tape and reel|
|STPS3150|STPS3150|DO-201AD|1.12 g|600|Ammopack|
|STPS3150RL|STPS3150|DO-201AD|1.12 g|1900|Tape and reel|



## **4 Revision history** 

**Table 9. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|May-2003|2A|Last update.|
|31-May-2006|3|Reformatted to current standard. Added ECOPACK statement.<br>Updated SMB footprint in Figure 12. Changed nF to pF in Figure 8.|
|08-Feb-2007|4|Added SMB flat and SMB flat e package.|
|20-Jul-2011|5|Updated_Table 2._|
|11-Aug-2016|6|Updated_Table 2_and all curves.|



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## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2016 STMicroelectronics – All rights reserved 

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