# Small Signal Schottky Diode, Single, 30 V, 30 A, 510 mV, 250 A, 150 °C

![Product image](https://novapart.co/image/farnell:2325825/)

**URL**: https://novapart.co/products/STPS30L30DJF-TR/small-signal-schottky-diode-single-30-v-a-510-mv
**SKU**: STPS30L30DJF-TR
**Manufacturer**: STMICROELECTRONICS
**Price**: €0.4650
**Stock**: 10+
**Lead Time**: 120 days (indicative)

## Description

Diode Configuration:Single; Repetitive Reverse Voltage Vrrm Max:30V; Forward Current If(AV):30A; Forward Voltage VF Max:510mV; Forward Surge Current Ifsm Max:250A; Operating Temperat

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Product Range | STPS3 |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | SMD |
| Diode Configuration | Single |
| Forward Voltage Max | 510mV |
| Forward Surge Current | 250A |
| Reverse Recovery Time | - |
| Average Forward Current | 30A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 30V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2325825/)

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## **STPS30L30DJF** 

## High efficiency power Schottky diode 

**Datasheet** − **production data** 

## **Features** 

- Low forward voltage drop 

- Very small conduction losses 

- Negligible switching losses 

- Avalanche rated 

- Extremely fast switching 

- Low thermal resistance 

- 1 mm package thickness 

- ECOPACK[®] 2 compliant component 

## **Description** 

Single Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. 

Packaged in PowerFLAT™ 5x6, this device is intended for use in low voltage high frequency inverters. 

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A<br>K<br>A<br>K K<br>A<br>A<br>PowerFLAT 5x6<br>STPS30L30DJF<br>**----- End of picture text -----**<br>


**Table 1.** 

## **Device summary** 

|**Symbol**|**Value**|
|---|---|
|IF(AV)|30 A|
|VRRM|30 V|
|Tj(max)|150 °C|
|VF(typ)|0.30 V|



TM: PowerFLAT is a trademark of STMicroelectronics 

1/7 

March 2012 

Doc ID 022946 Rev 1 

This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**STPS30L30DJF** 

## **1 Characteristics** 

**Table 2. Absolute ratings (limiting values with anode terminals short-circuited)** 

|**Symbol**|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM||Repetitive peak reverse voltage||30|V|
|IF(RMS)||Forward rms current||45|A|
|IF(AV)||Average forward currentδ= 0.5|Tc= 110 °C|30|A|
|IFSM||Surge non repetitive forward current|tp= 10 ms sinusoidal|250|A|
|PARM||Repetitive peak avalanche power|tp= 1 µs, Tj= 25 °C|1300|W|
|VARM||Maximum repetitive peak avalanche<br>voltage|tp<1 µs, Tj< 150 °C,<br>IAR< 11 A|35|V|
|Tstg||Storage temperature range||-65 to + 175|°C|
||Tj|Maximum operating junction temperature(1)||150|°C|
|1.<br>condition to avoid thermal runaway for a diode on its own heatsink<br>**Table 3.**<br>**Thermal resistance**<br>dPtot<br>dTj<br><<br>1<br>Rth(j-a)||||||
|**Symbol**||**Parameter**||**Value**|**Unit**|
|Rth(j-c)||Junction to case||2|°C/W|



**Table 4. Static electrical characteristics (anode terminals short-circuited)** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR<br>(1)|Reverse leakage<br>current|Tj= 25 °C|VR= 30 V|-|-|0.75|mA|
|||Tj= 125 °C||-|100|230|mA|
|VF<br>(1)|Forward voltage drop|Tj= 25 °C|IF= 15 A|-|-|0.44|V|
|||Tj= 125 °C|IF= 15 A|-|0.30|0.35||
|||Tj= 25 °C|IF= 30 A|-|-|0.51||
|||Tj= 125 °C|IF= 30 A|-|0.38|0.45||



1. Pulse test: tp = 380 µs, δ < 2% 

To evaluate the conduction losses use the following equation: 

P = 0.27 x IF(AV) + 0.006 x IF2(RMS) 

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**STPS30L30DJF** 

**Characteristics** 

**Figure 1. Average forward power dissipation Figure 2. Average forward current versus versus average forward current ambient temperature (** δ **= 0.5)** 

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PF(AV)(W) IF(AV)(A)<br>25 35<br>Piette δ=0.5 δ=1 30 a Rth(j -a)=Rth(j-c)<br>20 PEt; eT yeyeT tTyyy PT a<br>δ=0.2 7 7 25<br>δ=0.1<br>δ=0.05<br>15 SERCO an | LA et | | 20 eeA E<br>PITT IAYI AV AeA7 [7 es<br>15<br>10<br>Oe OLIL fixeLx | | EER 10 A;<br>5 mm444>Zaeeee T T a<br>EE ao 5 es<br>Lig Cf |<br>0 ALew | IF(AV)(A) a δ [=tp/T] io tp 0 δ [=tp/T] m: tp Re Tamb(°C)<br>0 5 10 15 20 25 30 35 40 0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**Figure 3. Normalized avalanche power derating versus pulse duration** 

**Figure 4. Normalized avalanche power derating versus junction temperature** 

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**----- Start of picture text -----**<br>
PARM(tp) PARM (Tj)<br>1 PARM(1µs) 1.2 PARM(25°C)<br>1 ING<br>SSH ™ i | 6 SE R E ESE GER See<br>0.1 UII | ETE INTE TTT 0.8 EASES EEE<br>eeeEARaca Od 0d cs 0.6 Npes<br>a | La OT EERE<br>0.01 an a | StI 0.4 EEREEe SEE<br>0.2<br>T (°C)j<br>0.001 SS coi ont tp(µs) Conon | 025 BEREEEEEeee 50 ERR 75 EERE 100 eeeEERE 125 150<br>0.01 0.1 1 10 100 1000<br>**----- End of picture text -----**<br>


**Figure 5. Relative variation of thermal impedance, junction to case, versus pulse duration** 

**Figure 6. Reverse leakage current versus reverse voltage applied (typical values)** 

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Zth(j-c)/Rth(j-c) IR(mA)<br>1.0 Cor Toon 1.E+03 SS SS SSSSS<br>0.9 Tj =150°C<br>ag ee<br>0.8 Te 2 ni ont 1.E+02 pee== Tj=125°C —————————<br>0.7<br>0.60.5 ETEorCT TU TTZn 1.E+01 SSaSS SS eS S TTj=100°Cj=75°C sS<br>0.4 O_oFETEa |voEton 1.E+00 pa_—————=——— see Tj=50°C<br>0.3 EE ——— — — Tj=25°C<br>0.2 1.E-01<br>ee oe a<br>0.1 Single pulse tp(s) VR(V)<br>0.0 Lot E  tereLT TT ET SrTTL TT TT) 1.E-02 LCSSS[| [| [~T [| {| SSS{[ | JT | [|<br>1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 0 5 10 15 20 25 30<br>**----- End of picture text -----**<br>


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**Characteristics** 

**STPS30L30DJF** 

## **Figure 7. Junction capacitance versus reverse voltage applied (typical values)** 

## **Figure 8. Forward voltage drop versus forward current** 

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10000C(pF) 100.0IFM(A)<br>VoscF=1MHzT=30mVj=25°CRMS (Maximum values)Tj=125°C<br>10.0<br>(Typical values)Tj=125°C<br>1000 (Maximum values)Tj=25°C<br>1.0<br>VR(V) VFM(V)<br>100 0.1<br>1 10 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7<br>Figure 9. Thermal resistance junction to  Figure 10. Reverse safe operating area<br>ambient versus copper surface  (tp < 1 µs and Tj < 150 °C)<br>under each tab<br>Rth(j-a)(°C/W)<br>250<br>Epoxy printed board FR4 Iarm (A)<br>copper thickness = 35 µm 15.0<br>200<br>13.0<br>150 11.0<br>9.0<br>100<br>7.0<br>50 5.0<br>Varm (V)<br>Scu (cm [2] ) 3.030 35 40 45 50 55 60 65 70<br>0<br>0 1 2 3 4 5 6 7 8 9 10<br>**----- End of picture text -----**<br>


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**Package information** 

## **2 Package information** 

- Epoxy meets UL94,V0 

- Lead-free package 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

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Table 5. PowerFLAT 5x6 dimensions<br>**----- End of picture text -----**<br>


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Dimensions<br>Ref. Millimeters Inches<br>D2 Min. Typ. Max. Min. Typ. Max.<br>E2 A 0.80 1.00 0.031 0.039<br>K A1 0.02 0.05 0.001 0.002<br>A2 0.25 0.010<br>e b L<br>b 0.30 0.50 0.012 0.020<br>A<br>A1 D A2 D 5.20 0.205<br>D2 4.11 4.31 0.162 0.170<br>e 1.27 0.050<br>E<br>E 6.15 0.242<br>E2 3.50 3.70 0.138 0.146<br>L 0.50 0.80 0.020 0.031<br>K 1.275 1.575 0.050 0.062<br>**----- End of picture text -----**<br>


## **Figure 11. Footprint (dimensions in mm)** 

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5.35<br>4.41<br>0.98<br>0.95<br>0.62<br>1.27<br>3.86 4.33 6.29<br>**----- End of picture text -----**<br>


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**Ordering information** 

**STPS30L30DJF** 

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Figure 12. Tape and reel specifications<br>Dot identifying Pin A1 location Ø 1.55<br>2.0 4.0<br>0.30<br>0.20<br>Ø 1.5<br>R 0.50<br>6.30<br>8.0<br>1.20<br>All dimensions are typical values in mm User direction of unreeling<br>1.75<br>5.5<br>12.0<br>5.30<br>**----- End of picture text -----**<br>


## **3 Ordering information** 

**Table 6. Ordering information** 

|**Order code**|**Marking**|**Package**<br>|**Weight **|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS30L30DJF-TR|PS30 L30|PowerFLAT 5x6<br>|0.095 g|3000|Tape and reel|



## **4 Revision history** 

## **Table 7. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|16-Mar-2012|1|First issue.|



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