# Schottky Rectifier, 45 V, 30 A, Single, PowerFLAT, 8 Pins, 640 mV

![Product image](https://novapart.co/image/farnell:2325823RL/)

**URL**: https://novapart.co/products/STPS3045DJF-TR/schottky-rectifier-45-v-30-a-single-powerflat-8
**SKU**: STPS3045DJF-TR
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.3840
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:45V; Forward Current If(AV):30A; Diode Configuration:Single; Diode Case Style:SMD; No. of Pins:8Pins; Forward Voltage VF Max:640mV; Forward Surge

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Product Range | STPS3 |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | PowerFLAT |
| Diode Configuration | Single |
| Forward Voltage Max | 640mV |
| Forward Surge Current | 200A |
| Average Forward Current | 30A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 45V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2325823RL/)

**STPS3045DJF** 

Datasheet 

45 V, 30 A power Schottky rectifier 

## **Features** 

- Very small conduction losses 

- Negligible switching losses 

- Extremely fast switching 

- Low forward voltage drop 

- Low thermal resistance 

- High avalanche capability specified 

- Thin package: 1 mm 

- ECOPACK[®] 2 compliant 

## **Applications** 

- Telecom power supply 

- Desktop power supply 

## **Description** 

This Schottky rectifier is ideally suited for switch mode power supply and high frequency DC to DC converters. 

Packaged in PowerFLAT™ 5x6, the STPS3045DJF is optimized for use in low voltage high frequency inverters, free-wheeling and polarity protection applications. 

## **Product status link** 

STPS3045DJF 

Its low profile was especially designed to be used in applications with space-saving constraints. 

PowerFLAT™ is a trademark of STMicroelectronics. 

|**Product summary**|**Product summary**|
|---|---|
|**Symbol**|**Value**|
|**IF(AV)**|30 A|
|**VRRM**|45 V|
|**Tj (max.)**|175 °C|
|**VF (typ.)**|0.50 V|



**DS6592** - **Rev 5** - **February 2019** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**STPS3045DJF Characteristics** 

**1** 

## **Characteristics** 

**Table 1. Absolute Ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short circuited)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VRRM|Repetitive peak reverse voltage||45|V|
|IF(RMS)|Forward rms current||45|A|
|IF(AV)|Average forward current, δ = 0.5, square wave|TC= 120 °C|30|A|
|IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal|380|A|
|PARM|Repetitive peak avalanche power|tp= 10 µs , Tj= 125 °C|900|W|
|Tstg|Storage temperature range||-65 to +175|°C|
|Tj|Maximum operating junction temperature(1)||175|°C|



_1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink._ 

**Table 2. Thermal resistance parameters** 

|**Symbol**|**Parameter**|**Max. value**|**Unit**|
|---|---|---|---|
|Rth(j-c)|Junction to case|2.5|°C/W|



For more information, please refer to the following application note : 

- AN5046 : Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT™ packages 

**Table 3. Static electrical characteristics (anode terminals short circuited)** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR (1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||300|µA|
|||Tj= 125 °C||-|20|80|mA|
|VF (1)|Forward voltage drop|Tj= 25 °C|IF= 15 A|-||0.56|V|
|||Tj= 125 °C||-|0.41|0.46||
|||Tj= 25 °C|IF= 30 A|-||0.64||
|||Tj= 125 °C||-|0.50|0.56||



_1. Pulse test: tp = 380 µs, δ < 2%_ 

To evaluate the conduction losses use the following equation: 

P = 0.43 x IF(AV) + 0.00433 IF[2] (RMS) 

For more information, please refer to the following application notes related to the power losses : 

- AN604: Calculation of conduction losses in a power rectifier 

- AN4021: Calculation of reverse losses on a power diode 

**DS6592** - **Rev 5** 

**page 2/9** 

**STPS3045DJF Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**==> picture [513 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient<br>average forward current temperature (δ = 0.5)<br>PF(AV)(W) IF(AV) (A)<br>24 35<br>Rth(j-a) = Rth(j-c)<br>20 30<br>25<br>16<br>20<br>12<br>15<br>8<br>10<br>T T<br>4 5<br>IF(AV)(A) δ [=tp/T] tp δ [=tp/T] tp T amb (°C)<br>0 0<br>0 5 10 15 20 25 30 35 40 0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br>


**==> picture [513 x 208] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 3. Normalized avalanche power derating versus<br>Figure 4. Relative variation of thermal impedance junction<br>pulse duration (Tj= 125 °C) to case versus pulse duration<br>PARMPARM(10 µs)(tp) 1.0 Zth(j-c)/Rth(j-c)<br>1<br>0.9<br>0.8<br>0.7<br>0.1 0.6<br>0.5<br>0.4<br>0.01 0.3<br>0.2<br>Single pulse<br>0.1<br>t p(µs) 0.0 tp(s)<br>0.001 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>1 10 100 1000<br>**----- End of picture text -----**<br>


**DS6592** - **Rev 5** 

**page 3/9** 

**STPS3045DJF Characteristics (curves)** 

**==> picture [513 x 192] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 5. Reverse leakage current versus reverse voltage Figure 6. Junction capacitance versus reverse voltage<br>applied (typical values) applied (typical values)<br>1.E+02 IR(mA) C(pF)<br>10000<br>Tj = 150 °C F = 1 MHz<br>1.E+01 Tj = 125 °C VoscT= 30 mV= 25 °CRMS<br>j<br>Tj = 100 °C<br>1.E+00<br>Tj = 75 °C<br>1000<br>1.E-01 Tj = 50 °C<br>Tj = 25 °C<br>1.E-02<br>VR(V)<br>1.E-03 0 5 10 15 20 25 30 35 40 45 100 VR(V)<br>1 1 0 100<br>**----- End of picture text -----**<br>


**==> picture [513 x 206] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7. Forward voltage drop versus forward current Figure 8. Thermal resistance junction to ambient versus<br>copper surface under tab<br>I  (A)F<br>60 Rth(j-a) (°C/W)<br>55 150<br>50 PowerFlat™_5X6<br>45 Tj = 125 °C 125 epoxy printed board FR4, eCu = 35 µm<br>(Maximum values)<br>40<br>100<br>35<br>30 Tj = 125 °C 75<br>25 (Typical v alues)<br>20<br>15 Tj = 25 °C 50<br>(Maximum values)<br>10<br>25<br>5<br>0 VF(V) SCu(cm²)<br>0<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8<br>0 1 2 3 4 5 6 7 8 9 10<br>**----- End of picture text -----**<br>


**DS6592** - **Rev 5** 

**page 4/9** 

**STPS3045DJF Package information** 

**2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

## **2.1 PowerFLAT™ 5x6 package information** 

- Epoxy meets UL 94,V0 

- Cooling method: by conduction (C) 

**Figure 9. PowerFLAT™ 5x6 package outline (non-contractual)** 

**==> picture [118 x 139] intentionally omitted <==**

**==> picture [66 x 292] intentionally omitted <==**

**----- Start of picture text -----**<br>
Bottom view<br>Side view<br>Top view<br>**----- End of picture text -----**<br>


**DS6592** - **Rev 5** 

**page 5/9** 

**STPS3045DJF PowerFLAT™ 5x6 package information** 

**Table 4. PowerFLAT™ 5x6 mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Rf**|**Millimeters**|||**Inches (for reference only)**|||
|**e**|**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.80||1.00|0.031||0.039|
|A1|0.00||0.05|0.000||0.002|
|b|0.30||0.50|0.01||0.02|
|c||0.25|||0.010||
|D|4.80||5.40|0.189||0.212|
|D2|3.91||4.45|0.154||0.175|
|e||1.27|||0.050||
|E|5.90||6.35|0.232||0.250|
|E2|3.34||3.70|0.138||0.146|
|L|0.50||0.80|0.020||0.031|
|K|1.10||1.575|0.015||0.023|
|L1|0.05|0.15|0.25|0.002|0.006|0.009|



**Figure 10. PowerFLAT™ 5x6 recommended footprint (dimensions are in mm)** 

**DS6592** - **Rev 5** 

**page 6/9** 

**STPS3045DJF Ordering information** 

**3 Ordering information** 

## **Table 5. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS3045DJF-TR|PS30 45|PowerFLAT™ 5x6|0.095 g|3000|Tape and reel|



**DS6592** - **Rev 5** 

**page 7/9** 

**STPS3045DJF** 

## **Revision history** 

**Table 6. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|09-Nov-2009|1|First issue.|
|05-Jul-2010|2|Replace Power QFN with PowerFLAT™.|
|20-May-2011|3|Updated package graphics and marking in Table 6. Added Figure 10.|
|12-Aug-2015|4|Updated cover image and Table 1 on cover page. Updated Table 2 and Section 1.1: Characteristics<br>(curves).|
|14-Feb-2019|5|UpdatedSection Cover image,Figure 9. PowerFLAT™ 5x6 package outline (non-contractual)and<br>Table 4. PowerFLAT™ 5x6 mechanical data. Minor text changes to improve readability.|



**DS6592** - **Rev 5** 

**page 8/9** 

**STPS3045DJF** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2019 STMicroelectronics – All rights reserved 

**DS6592** - **Rev 5** 

**page 9/9** 



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