# Schottky Rectifier, 170 V, 30 A, Dual Common Cathode, TO-263 (D2PAK), 3 Pins, 1 V

![Product image](https://novapart.co/image/farnell:3130013RL/)

**URL**: https://novapart.co/products/STPS30170CG-TR/schottky-rectifier-170-v-30-a-dual-common-cathode
**SKU**: STPS30170CG-TR
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.6030
**Stock**: 10+
**Lead Time**: 127 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:170V; Forward Current If(AV):30A; Diode Configuration:Dual Common Cathode; Diode Case Style:TO-263; No. of Pins:3Pins; Forward Voltage VF Max:1V

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | TO-263 (D2PAK) |
| Diode Configuration | Dual Common Cathode |
| Forward Voltage Max | 1V |
| Forward Surge Current | 220A |
| Average Forward Current | 30A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 170V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3130013RL/)

## **STPS30170C** 

## High voltage power Schottky rectifier 

Datasheet - production data 

## **Features** 

**==> picture [433 x 246] intentionally omitted <==**

**----- Start of picture text -----**<br>
A1<br>K<br>A2  High junction temperature capability<br>aa;  Good trade off between leakage current and<br>forward voltage drop<br> Low leakage current<br> Avalanche capability specified<br> ECOPACK [®] 2 compliant component for<br>D²PAK on demand<br>A2 Description<br>K<br>TO-247 A1 Dual center tap Schottky rectifier designed for<br>high frequency switch mode power supply.<br>Table 1: Device summary<br>K K Symbol  Value<br>IF(AV) 2 x 15 A<br>VRRM 170 V<br>A2 A2 Tj (max)  175 °C<br>A1 A1<br>oe D [2] PAK VF  (typ)  0.69 V<br>**----- End of picture text -----**<br>


May 2017 

DocID11640 Rev 2 

1/13 

This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**STPS30170C** 

## **1 Characteristics** 

**Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**||**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitivepeak reverse voltage|||170|V|
|IF(RMS)|Forward rms current|||30|A|
|IF(AV)|Average forward current<br>δ = 0.5, square wave|TC= 150 °C|Per diode|15|A|
||||Per device|30||
|IFSM|Surge non repetitive<br>forward current|tp = 10 ms sinusoidal||220|A|
|PARM|Repetitive peak<br>avalanchepower|tp= 10 µs, Tj= 125 °C||750|W|
|Tstg|Storage temperature range|||-65 to +175|°C|
|Tj|Maximum operating junction temperature_(1)_|||+175|°C|



## **Notes:** 

(1)(dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. 

**Table 3: Thermal parameter** 

|**Symbol**|**Parameter**|**Parameter**||**Max. value**|**Unit**|
|---|---|---|---|---|---|
|Rth(j-c)|Junction to case|D2PAK|Per diode|1.6|°C/W|
|||TO-247||1.5||
|||D2PAK|Total|0.95||
|||TO-247||0.9||
|Rth(c)|Coupling|D2PAK|Coupling|0.3|°C/W|
|||TO-247||||



When the diodes 1 and 2 are used simultaneously: 

ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) 

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**STPS30170C** 

**Characteristics** 

**Table 4: Static electrical characteristics (per diode)** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR_(1)_|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||20|µA|
|||Tj= 125 °C||-|5|20|mA|
|VF_(2)_|Forward voltage drop|Tj= 25 °C|IF= 15 A|-||0.92|V|
|||Tj= 125 °C||-|0.69|0.75||
|||Tj= 25 °C|IF= 30 A|-||1||
|||Tj= 125 °C||-|0.8|0.86||



## **Notes:** 

(1)Pulse test: tp = 5 ms, δ < 2% 

(2)Pulse test: tp = 380 µs, δ < 2% 

To evaluate the conduction losses use the following equation: 

P = 0.64 x IF(AV) + 0.0073 IF[2] (RMS) 

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**Characteristics** 

**STPS30170C** 

## **1.1 Characteristics (curves)** 

**Figure 2: Average forward current versus ambient temperature (δ = 0.5, per diode)** 

**==> picture [452 x 167] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 1: Average forward power dissipation  temperature (δ = 0.5, per diode)<br>versus average forward current (per diode)  IF(AV)(A)<br>PF(AV)(W) 18<br>14<br>LITT T TT TET TT =0.1 L] =0.2 | =0.5 Le =1 16 A a Ge GO<br>12 PSECPec ee =0.05 AnupEP LCLanuEpuaeralLa ee | 14 a  a a a a a a a<br>10 ECCCeCce aero | 12 RRS tt<br>LEIP TTT A 4 Ae |AA<br>8 HA A A ee 10 PopSet<br>A Ae PSR<br>6 8 Rth(j-a)=15 °C/W<br>LET TTT A A ee N L<br>HE A eer | | | PN<br>4 6<br>LTT TV eA TT TT EEE T +} + $f<br>COL gee COC i: 4 T e e<br>2 HA IF(AV) (A) =tp/T tp H 2 eam J TY<br>0 =tp/T tp Tamb(°C)<br>0 Deere 1 2 3 4 5 6 7 8 9 10 Poo 11 12 13 14 15 16 17 : 18 0 : a Pt Pot NN<br>0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br>


**Figure 4: Relative variation of thermal impedance junction to case versus pulse duration (D²PAK and TO-247)** 

**Figure 3: Normalized avalanche power derating versus pulse duration (Tj = 125 °C)** 

**==> picture [222 x 152] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-c)/Rth(j-c)th(j-c)/Rth(j-c)/Rth(j-c)th(j-c)<br>1.0<br>ee<br>0.9 Co ot ot<br>PE<br>0.8 [reDEDE<br>0.7 a eeldootldootoot<br>=0.5<br>0.6 D Sa avoee<br>EF et<br>0.5 Paroaa ot<br>0.4 =0.2<br>De eee<br>0.3 =0.1 eat<br>0.2 Sec= aSeeCaeSeeCaeCae ootttttttt toa T iHOlOl<br>a tt Ss eo<br>0.1 F Single pulse CoonSS tP(s)P(s)(s) oHitit 6 =t a p/T/T tpp iH<br>0.0 EF tre A<br>1.E-03 1.E-02 1.E-0 1.E+00<br>**----- End of picture text -----**<br>


**==> picture [450 x 341] intentionally omitted <==**

**----- Start of picture text -----**<br>
PARM(tp) Zth(j-c)/Rth(j-c)th(j-c)/Rth(j-c)/Rth(j-c)th(j-c)<br>1 PARM(10 µs) a 1.0 ee<br>0.9 Co ot ot<br>PE<br>0.8<br>[reDEDE<br>0.1 0.7 a eeldootldootoot<br>=0.5<br>EHH 0.6 D Sa avoee<br>EF et<br>0.5 ot<br>Paroaa<br>0.01 0.4 =0.2<br>De eee<br>0.3 =0.1 eat<br>= aSeeCaeSeeCaeCae tt T<br>0.2 Sec= ootttttttt toa iHOlOl<br>t p(µs) a tt Ss eo<br>0.001 0.1 F Single pulse CoonSS tP(s)P(s)(s) oHitit 6 =t a p/T/T tpp iH<br>1 10 100 1000<br>0.0 EF tre A<br>1.E-03 1.E-02 1.E-0 1.E+00<br>Figure 5: Reverse leakage current versus reverse  Figure 6: Junction capacitance versus reverse<br>voltage applied (typical values, per diode)  voltage applied (typical values, per diode)<br>IR(µA) C(pF)<br>1.E+06 1000<br>F=1MHz<br>1.E+05 BSSSSSSSSSSSS Tj=175°C SSS Sse eseeeeas= eee VOSCT=30mVj=25°CRMS<br>1.E+04 .==---- Tj=150°C reer<br>1.E+03 SSSFASSSS sen Tj=125°C SeisLCCC |—PKaf | EEi—<br>jp d n EEESe 100 mABane<br>1.E+02 Tj=75°C<br>1.E+01 BR Cet eto<br>PSS STS SS Ss = T SoS j=25°C oS SS SSIS a a a a<br>1.E+00<br>VR(V)<br>1.E-01 LETS [ETT][ TTT] ees [TT] [ey] [Pye] [tT] [eee] [eee] VR(V) LT TT [TTT] | | 10 LL Ti F TTHffl<br>0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 1 10 100 1000<br>**----- End of picture text -----**<br>


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**STPS30170C** 

**Characteristics** 

**==> picture [457 x 179] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 7: Forward voltage drop versus forward  Figure 8: Forward voltage drop versus forward<br>current (per diode, low level)  current (per diode, high level)<br>IF (A) IF (A)<br>15.0 100<br>12.5<br>Tj=125°C Tj=125°C<br>(Maximum values) (Maximum values)<br>10.0<br>Tj=125°C<br>7.5 Tj=125°C 10 (Typical values) Tj=25°C<br>(Typical values) (Maximum values)<br>5.0<br>Tj=25°C<br>2.5 (Maximum values)<br>VF (V)<br>VF (V)<br>0.0 1<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6<br>**----- End of picture text -----**<br>


**Figure 9: Thermal resistance junction to ambient versus copper surface under tab for D²PAK (typical values)** 

**==> picture [221 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
Rth(j-a) (°C/W)<br>80<br>70<br>60<br>50<br>40<br>30<br>20<br>Epoxy printed board FR4, eCU= 35 µm<br>10<br>SCu(cm²)<br>0<br>0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br>


DocID11640 Rev 2 

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**STPS30170C** 

**Package** information 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _**www.st.com**_ . ECOPACK[®] is an ST trademark. 

- Cooling method: by conduction (C) 

- Epoxy meets UL 94,V0 

- Recommended torque values: 0.55 N·m (for TO-247) 

- Maximum torque values: 1.0 N·m maximum (for TO-247) 

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**STPS30170C** 

**Package** information 

## **2.1 D²PAK package information** 

**Figure 10: D²PAK package outline** 

This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. 

~~ne~~ DocID11640 Rev 2 7/13 

**STPS30170C** 

**Package** information 

**Table 5: D²PAK package mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|4.36|4.60|0.172|0.181|
|A1|0.00|0.25|0.000|0.010|
|b|0.70|0.93|0.028|0.037|
|b2|1.14|1.70|0.045|0.067|
|c|0.38|0.69|0.015|0.027|
|c2|1.19|1.36|0.047|0.053|
|D|8.60|9.35|0.339|0.368|
|D1|6.90|8.00|0.272|0.311|
|D2|1.10|1.50|0.043|0.060|
|E|10.00|10.55|0.394|0.415|
|E1|8.10|8.90|0.319|0.346|
|E2|6.85|7.25|0.266|0.282|
|e|2.54 typ.||0.100||
|e1|4.88|5.28|0.190|0.205|
|H|15.00|15.85|0.591|0.624|
|J1|2.49|2.90|0.097|0.112|
|L|1.90|2.79|0.075|0.110|
|L1|1.27|1.65|0.049|0.065|
|L2|1.30|1.78|0.050|0.070|
|R|0.4|typ.|0.015||
|V2|0°|8°|0°|8°|



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**Package** information 

**Figure 11: D²PAK recommended footprint (dimensions in mm)** 

DocID11640 Rev 2 9/13 ~~a~~ 

**STPS30170C** 

**Package** information 

## **2.2 TO-247 package information** 

**Figure 12: TO-247 package outline** 

**==> picture [406 x 399] intentionally omitted <==**

**----- Start of picture text -----**<br>
0075325_8<br>**----- End of picture text -----**<br>


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DocID11640 Rev 2 

**STPS30170C Package** information 

|||**Table 6: TO-247package mechanical data**|**Table 6: TO-247package mechanical data**|**Table 6: TO-247package mechanical data**|**Table 6: TO-247package mechanical data**||
|---|---|---|---|---|---|---|
|**Ref.**|||**Dimensions**||||
|||**Millimeters**|||**Inches**||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|4.85||5.15|0.191||0.203|
|A1|2.20||2.60|0.086||0.102|
|b|1.00||1.40|0.039||0.055|
|b1|2.00||2.40|0.078||0.094|
|b2|3.00||3.40|0.118||0.133|
|c|0.40||0.80|0.015||0.031|
|D_(1)_|19.85||20.15|0.781||0.793|
|E|15.45||15.75|0.608||0.620|
|e|5.30|5.45|5.60|0.209|0.215|0.220|
|L|14.20||14.80|0.559||0.582|
|L1|3.70||4.30|0.145||0.169|
|L2||18.50|||0.728||
|ØP_(2)_|3.55||3.65|0.139||0.143|
|ØR|4.50||5.50|0.177||0.217|
|S|5.30|5.50|5.70|0.209|0.216|0.224|



## **Notes:** 

(1)Dimension D plus gate protusion does not exceed 20.5 mm 

(2)Resin thickness around the mounting hole is not less than 0.9 mm. 

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**Ordering** information 

**STPS30170C** 

## **3 Ordering information** 

**Table 7: Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS30170CW|STPS30170CW|TO-247|4.40g|30|Tube|
|STPS30170CG-TR|STPS30170CG|D2PAK|1.48g|1000|Tape and reel|



## **4 Revision history** 

**Table 8: Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|16-Sep-2005|1|First issue.|
|16-May-2017|2|Updated features, package silhouette and_Table 1: "Device_<br>_summary"_.<br>Updated_Section 1: "Characteristics"_,_Section 1.1: "Characteristics_<br>_(curves)"_,_Section 2: "Package information"_and_Table 7: "Ordering_<br>_information"_.|



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**STPS30170C** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

- © 2017 STMicroelectronics – All rights reserved 

DocID11640 Rev 2 

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## Links

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- [Supplier page](https://es.farnell.com/stmicroelectronics/stps30170cg-tr/schottky-rect-dual-30a-170v-to/dp/3130013RL)
---

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